HDI制程及设计介绍

1、COMPEQ華通電腦（惠州）Jan, 2002HDI制程及設計介紹COMPEQCOMPEQHDI PCB的應用的應用HDI: High Density InterconnectionHDI PCBHDI PCB用在商品上較大宗的有用在商品上較大宗的有3 3大類大類資訊類資訊類超大型電腦、筆記型電腦、IC Substructure（FCPGA-Flee Chip Pin Grid Area）等通訊類通訊類手機、通訊網絡系統、網際網絡等1.1.消費產品消費產品數碼相機COMPEQ HDI及一般PCB用的主要物料介紹Laminate Prepreg RCC Copper FoilLaminate:

2、銅箔基板, 由中間的FR4等材質加兩面銅箔組成,主要用來製作內層線路, 銅箔厚度主要有0.5 oz, 1oz等 (基材一般還有分一般FR4材質,High Tg材質,特殊用途材質)Prepreg(P/P): 玻璃纖維布+環氧樹脂膠片(未聚合),主要作為PCB內層間壓合用的絕緣層,有多種厚度規格RCC: Resin Coated Copper, 覆樹脂銅箔,一般銅箔厚度為0.5 oz,主要用於HDI產品增層用Copper Foil:銅箔,作為一般多層板壓合時外層銅層,主要有0.5 ozS/M: Solder Mask, 或稱Solder Resist, 主要分為一般/霧面(Matt)兩種,如Tai

3、yo PSR4000(一般)和Ciba PR77(霧面)COMPEQ一般PCB製作流程簡介1. 內層板製作: 影像轉移, 蝕刻出線路 (線寬間距)2. 將多個內層板壓合成多層板, 以鑽孔,電鍍來連通各層線路(板厚,層數,最小孔孔徑)3. 外層製作: 影像轉移,電鍍,蝕刻做出外層Pattern, 覆蓋S/M4. 成品處理: 對焊墊進行表面處理, 切出成品PCB, 進行檢驗及Open/Short的電性測試, 包裝出貨COMPEQ內層線路內層線路 裁板前處理壓干膜曝光顯影蝕銅去膜AOI檢驗PCB制造流程(1)壓板壓板 氧化鉚釘疊板壓合打靶切型磨邊鑽孔鑽孔 上PIN機械鑽孔 雷射鑽孔雷射鑽孔雷射鑽孔電

4、鍍電鍍Desmear PTH（化學銅） 電鍍銅（孔銅、面銅）外層線路（外層線路（1）前處理 壓干膜 曝光 顯影COMPEQ外層線路（外層線路（2）電鍍銅（Pattern）電鍍錫去膜蝕銅剝錫AOI檢驗PCB制造流程（2）綠漆（綠漆（S/M)前處理 CC2 曝光 顯影 後烘烤噴錫噴錫(HASL) 前處理 垂直噴錫 後續處理 （X-Ray 錫厚量測）印字（印字（S/S) 全自動網板印字 UV烘烤塞孔塞孔手動網板印刷塞孔 烘烤COMPEQ成形切外形成形切外形 V-cut 等 清洗 測孔機測孔PCB制造流程（3）目視檢驗目視檢驗100%目視檢驗 OQC抽檢O/S測試測試 100% 短斷路電性 板翹量測板

5、翹量測 100%板翹檢驗（大理石平台）包裝包裝小包裝 外包裝COMPEQMicro Via Design Rule ( HLC+ HDI)- Blind via Design rule and capability- Buried via Design rule and capabilityCOMPEQMINI PRINTERNOTE BOOKPCMCIA CARDPORTABLE TERM.PORT FAXPORT PHONEMOBIL PHONECAMCORDERCOMPACT VCRPORTABLE CDCOMPUTERCOMMUNICATIONCONSUMPTIONTECHNOLOGY

6、DEMANDThinnerLayerMoreLayerHigherDensityHDI PROCESSThin DielectricCoatingFlex-RegidCombitionBuried & BlindVia TechnologyVia On PadTechnologyELECTRONIC PRODUCTDEMANDFUNCTIONSMoreFunctionBetterQualityComplexUnionAPPEARANCESmallerLighterThinerCOMPEQCase IIIBAC. Dimension on Micro via(L1L2)ItemDescripti

7、onPreferred DimensionCapability DimensionAMicro Via Diameter410 4 10BCapture PadA+10 A+8 (Cpk: 1.00)CTarget PadA+12A+10.5 ( Cpk :1.00) Unit： milCOMPEQBADC Unit：um(mil)* Remark: To meet minimum Space 4 mil form inner layer cooper to via hole wallDimension on Micro via(L1L3)ItemDescriptionPreferred Di

8、mensionCapability DimensionAMicro Via Dia410410BCapture PadA+10A+8 (Cpk:1.00)CL2 ClearanceA+18*A+ 16( Cpk :1.00) DTarget PadA+12A+10.5 ( Cpk :1.00) COMPEQDBFECOuter layer(1+N+1)N ItemPreferred DimensionBBuried PTH Inner Layer (N) land DiameterA + 10CBuried PTH Outer Layer (N) land DiameterA + 8DPTH

9、Outer Layer (1+N+1) land DiameterA + 8EPTH Outer Layer (N) land DiameterA + 10FPTH Inner Layer (N) land DiameterA + 12“A” = Drill diameter ; * unit : milDimension on Buried via and PTH Stack-up(1+N+1)COMPEQCase IIIADUnit： (mil)Laser Drill & Aspect Ratio The Maximum aspect ratio(D/A) of Micro Via is

10、0.8The Preferred aspect ratio ( D/A) of Micro Via is 0.6 A=4A=5A=6A=7A=8D(Max.) 3.24 4.85.66.4D( Pre.)2.433.64.24.8COMPEQBenefit of HDI ProcessTrace capability of 6L which apply HDI may be equivalent to traditional 10L PTH board. SMD/SxGNDSySxVCCGNDSySxGNDSMD/SySMD/SxGNDSySxVCCSMD/SyReduce layer cou

11、nt- Cost downSolution of dense pad requirementSolution of dense trace requirement COMPEQRegistration Tooling System and Reliability TestCOMPEQ ：Alignment Pad：Tooling hole1.We design four alignment pads in all inner layers corner. After lamination process, we use Muraki 888(Tooling hole maker) to fig

12、ure out the alignment pad(all of inner layer alignment make up) center location data. 2.Muraki 888 will put it into calculate(or compensate) then identify the optima tooling hole center, then punch the tooling hole for follow-up process.3.Using X-ray measure board dimension change and feedback to AW

13、 compensation factor systemPanel SizeTooling hole producedMuraki 880Muraki 888(Two direction compensate )(Four direction compensate )COMPEQ1.We will design four ball pads in each inner layer corner(show like above figure).2. After lamination process, we will use Muraki 888(Tooling hole maker) to mea

14、sure the corner ball pads distance in each layers, and compare to original design pad to pad distance in different layers. 3.We will get the movement between real panel size and design panel size, and we can compensate the art work dimensions base on the data to get the true panel size.Design rule:D

15、iameter of pad size 50 mil, the pitch between L2 L3 is 100 mil , L3 L4 100 mil 1.Distance to length side 275 mil; distance to width 400 milContouring LinePanel SizeCOMPEQ疊板設計疊板設計盲埋孔層: 依雷射單面向板中心層打孔之特性,孔口是朝外,而孔底則為朝內. 故所謂之盲盲埋孔層埋孔層即為孔口孔口所在之層. 上下各一層RCCFR-4 corep/pp/pFR-4 corep/pp/pFR-4 coreM層,使用M/2張coreR

16、CCRCCS Si i= =N N/ /2 2- -1 1RCCRCCRCCRCCRCCRCCA A成成品品埋孔盲孔RCCRCCRCCRCCRCCRCCS Si i 版版序序( (傳傳統統F FR R- -4 4銅銅皮皮層層) )RCCRCC孔孔口口孔孔口口孔底孔底1324L-1LL-2L-3圖例: 2,3,L-2,L層為盲埋孔層孔底孔孔口口孔底孔口孔底孔孔口口COMPEQCOMPEQ發料Issue material內層線路Inner layer黑化Black oxide壓板MLB Lam.鑽孔Drilling除膠渣Desmear化學銅（PTH) Electricless Cu埋孔塞孔Buri

17、ed Via Plugs全板電鍍PNL plate線路電鍍Pat. plate線路蝕刻Etching外層檢驗Outer Layer AOI暫存倉Temporary StockHDI內層板制作流程內層板制作流程外層干膜Dry filmCOMPEQ黑化Black oxideRCC壓板 RCC Lam.鑽孔Drilling雷射鑽孔Laser Drill水平黑影Horizontal Shadow線路蝕刻Etching綠漆Solder mask浸金Immersion Gold成型Routing檢查測試OQC/FIT/ O/S包裝PackHDI 增層板制作流程增層板制作流程暫存倉Temporary StockConformal Mask Define水平去膠渣Horizontal Desmea