品质管理英语词汇分类大全复习课程

1、品质管理英语词汇大全Cosmetic Defect TermsPlastic PartsNo. No.中文名称 英文名称 中文名称 英文名称Black Streaking 21 Surface Haze黑条纹 成品表面模糊Brittleness 22 Torsion破碎 扭曲Burning 23 Under Cut烧焦 侧面低陷Color Fading 24 Unevenness褪色 表面不平坦Crater Pit; Sink Mark 25 Drag Mark表面陷痕 拖痕Discoloration 26 Shrink Mark未着色,异色缩水Flow lines( Mark); Tear

2、27 Ejector Mark流纹 (痕) 冲料痕Burrs; Sharp edge 28 Cold Variation毛边 冷流Fragile 29 Color Variation成品脆弱 变色Jetting Mark 30 Warping喷痕 反翘Lack of Gloss; Glossiness 31 Gate Mark表面无光泽 出料痕Scratches; Nicks; 32 Sticking of parts in the mold刮伤 成品离模不良Silver Streaking 33 Cold Flow银条 冷流Short Shot(Filling) 34 Warpage填充不足

3、翘曲Surface Peeling 35 Flash Mark表面剥落亮斑Void 36 Color stain气泡 异色点Weld Line; Knit Line 37 Oil; Grease;结合线 油污Finger Prints(Marks) 38 White Spot(Mark)指印 （痕） 白点 （斑）19 Paint Adhesion 39粘漆 变形20 Color Mismatch 40色不匹配Metal PartsNo. No.中文名称 英文名称 中文名称 英文名称Corrosion 5 Poor Coating腐蚀 ,铁锈外被不良Scratches 6 Sharp Edges

4、（saw burrs）刮伤 毛刺Bumps 7 Poor Plating蹦伤电镀不良Stains污点Cable PartsNo. No.中文名称 英文名称 中文名称 英文名称Grease; Oils 7 Obvious Burrs at the Sleeves油污 套子毛边Overstressed Curls 8 Unclear Letter, Pictograms卷曲 印字图案不清Unfunctional Bandages 9 Skew绑带过松印刷歪斜Damaged Plugs 10 Color Stain插头损坏色斑Poor Vulcanization of SR 11 Finger Pr

5、ints(Marks)SR硫化不良指痕12 Incomplete Casing Poor Crimping of conn.外被不完整Conn 缝合不良Manuals, Packages, Printed Information and Type Lables No. No.中文名称 英文名称 中文名称 英文名称7 Folds Uncompleteness折皱 内容不完整8 Flaws Wrong Tint裂纹 色彩错误Coverage Unclear Letter, Pictograms 9覆盖 印字图案不清10 Poor Printing Skew印刷不良印刷歪斜11 Incorrect

6、Font Poor Layer Congruence字体错误一致性不佳12 Bubble Burrs and grains from cutting起泡 裁边毛边及纸屑Process Defect TermsSoldering QualityNo. No.中文名称 英文名称 中文名称 英文名称Excess Solder 7 Split Solder包焊 锡裂Cold Solder 8 Solder Bridge冷焊 锡桥Floating Solder 9 Open浮焊 开路Empty Solder 10 Short空焊 短路Icing 11 Missing Component冰柱 掉件 ,漏件

7、Solder Tip 12 Inveracious Soldering锡尖突出 虚焊Operational Defect TermsNo. No.中文名称 英文名称 中文名称 英文名称Missing Parts(component) 6 Bumps漏插蹦伤Wrong Part 7 Paint Adhesion错件 粘胶Backward Part 8 Misaligned Part零件插反 零件错位Foreign Part 9 Broken Part异物 零件损坏Scratches 10 Open Solder刮伤 漏焊ICT Fail Cause and Repair ActionsNo. N

8、o.中文名称 英文名称 中文名称 英文名称Short 11 Solder Bridge短路 桥焊Wrong Part 12 Solder Added错件 加锡Backward Part 13 Solder Removed零件插反 去锡Missing Part 14 Part Replaced掉件 换零件PCB Defect 15 Part AddedPCB 缺陷 加零件Broken Part 16 Part Repaired零件损坏零件修复Defective Part 17 Board Sent For Analysis零件缺陷板送去分析PCB Open 18 Board RepairedPC

9、B 开路 板修复Broken Part 19 Board Scrapped零件损坏 板报废Open Solder 20 Board Lost漏焊 板丢失Tools, Jigs, and EquipmentNo. No.中文名称 英文名称 中文名称 英文名称1 Soldering Iron 12 Ultrasonic Welding Machine电铬铁 超声波焊接机De-solder Gun 13 Sliding Callipers吸锡枪 游标卡尺Wave Soldering Machine 14 Micro Meter Callipers波峰炉螺旋测微器Reflow Oven 15 Digi

10、tal Torque Meter回焊炉数字扭力器Screw Driver 16 Ground Continuity Tester电锁 接地阻抗测试仪AC/DC Withstanding VoltageSmart Electronic Load 17电子负载 高压测试仪TesterOscilloscope 18 Electroacoustic Analyzer示波器 电声分析仪Multimeter 19 Temperature/Humidity Chamber万用表恒温恒湿机Power Meter 20 Oven功率表烤箱10 21 Function Generator Leakage Curr

11、ent Meter信号发生器漏电流测试仪11 Push-Pull Scale 22 Hot Stamping Machine推拉力器 烫金机Safety and EMCNo.简称 英文名称 中文名称EMC Electro-Magnetic Compatibility电磁兼容EMI Electro-Magnetic Interference电磁干扰EMS Electro-Magnetic Susceptibility电磁耐受EMP Electro-Magnetic Pulse电磁脉冲ESD Electro-Static Discharge静电放电UL Underwriters Laborator

12、ies Inc.美国安规（担保实验室）CSA Canadian Standards Association加拿大标准协会FCC Federal Communication Commission美国联邦通讯委员会IEC International Electrotechnical Commission国际电工委员会TUV德国技术监护委员会（莱茵公司）CE欧洲共同市场标准CCEE/CCIB中国电工产品安全认证委员会VDE德国电气标准CB Certification Body全球性相互认证体系NCB National Certification Body国家认证机构QA TestNo. No.中文名

13、称 英文名称 中文名称 英文名称Cold Test 9 Cord/Strain Relief Durability冷藏实验 吊重测试Dry Heat Test 10 Drop Test干热实验落下实验Damp Heat Test 11 Sweep Vibration Test湿热实验扫频振动实验12 Random Vibration Test Temp. Cycling Test随机振动实验温度循环实验temp./humidity Storage储藏温湿循环13 Power on/off Test开/关冲击实验Cycling Test实验Operating temp./humidity工作温湿

14、循环14 Switch Durability Test开关寿命测试cycling Test实验Thermal Shock Test 15 Label Durability Test温度冲击实验标签耐磨测试Burn in Test 16 Printing Durability Test烧机实验 印字耐磨测试六 . AbbreviationNo.简称 英文名称 中文名称MTBF Mean Time Between Failure平均失效间隔时间FMEA Failure Mode and Effects Analysis失效模式与效应分析GR&R Gauge Repeatability and Re

15、producibility 量规仪器重复性与再现性APQP Advanced Product Quality Planning前期产品质量规划Ca Capability of Accuracy制程准确度Cp Capability of Precision制程精密度EIA Electronic Industries Association电子工作协会ISO International Organization for Standard国际标准组织SMT Surface Mounting Technology表面组装技术SMD Surface Mounting Device表面组装设备PDP Pr

16、oduct Development Procedure产品开发流程DVT Design Verification Test设计验证测试MVT Manufacturing Verification Test生产验证测试MBO Management By Object目标管理RMA Returned Merchandise Access退货MDR Material Defect Report材料不良报告DPMO Defect Per Million Opportunities每百万机会的不良次数KPI Key Performance Indicating主要绩效指标BSC Balanced Sco

17、re Card平衡绩分卡OOBA Out Of Box Audit开箱检验PPM Pieces Per Million每百万中的不良数RPN Risk Priority Number风险优先指数ESG Energy Systems GroupMotorola 的一个事业部的名称ESP Employee Suggestion Program 员工提案制度BOM Bill of Material料单QII Quality Inspection Instruction质量检验说明书MOI Manufacturing Operation Instruction作业指导书 MI Manual In Pr

18、ocess手插件ICT In Circuit Test在线测试MSDS Material Safety Data Sheet材料安全数据表SPC Statistical Process Control统计制程管制DOE Design of Experiments实验设计.缺件( MISSING PARTS ) 2.错件(WRONG PARTS ) 3.多件( EXCESSIVE PARTS ) 4.短路(SHORT ) 5.断路(OPEN ) 6.线短( WIRE SHORT ) 7.线长(WIRE LONG ) 8.拐线(WIREPOOR DDRESS) 9.冷焊(COLD SOLDER )

19、 10.包焊(EXCESSSOLDER) 11.空焊(MISSING SOLDER ) 12.锡尖( SOLDERICICLE ) 13.锡渣( SOLDER SPLASH ) 14.锡裂(SODERCRACK ) 15.锡洞(PIN HOLE ) 16.锡球( SOLDER BALL ) 17.锡桥( SOLDER BRIDGE ) 18.滑牙(SCREW LOOSE ) 19.氧化(RUST) 20.异物(FOREIGNER MATERIAL ) 21.溢胶( EXCESSIVE GLUE ) 22.锡短路( SOLDER BRIDGE ) 23.锡不足( SOLDER INSUFFICI

20、ENT ) 24.极性反(WRONGPOLARITY ) 25.脚未入( PIN UNSEATED ) 26.脚未出(PINUNVISIBLE ) 27.脚未剪(PIN NO CUT ) 28.脚未弯( PIN NOTBENT) 29.缺盖章(MISSING STAMP ) 30.缺标签(MISSINGLABEL ) 31.缺序号(MISSING S/N ) 32.序号错( WRONGS/N) 33.标签错(WRONG LABEL ) 34.标示错(WRONGMARK ) 35.脚太短(PIN SHORT ) 36.J1 不洁(J1 DIRTY ) 37.锡凹陷( SOLDER SCOOPED

21、) 38.线序错(W/L OF WIRE ) 39.未测试( NO TEST ) 40.VR 变形( VR DEFORMED )41.PCB 翘皮(PCB PEELING ) 42.PCB 弯曲(PCB TWIST ) 43. 零件沾胶( GLUE ON PARTS ) 44.零件脚长( PARTS PINLONG ) 45.浮件(PARTS LIFT ) 46.零件歪斜(PARTS TILT )47.零件相触(PARTS TOUCH ) 48.零件变形( PARTSDEFORMED ) 49.零件损坏(PARTS DAMAGED ) 50.零件脚脏(PIN DIRTY ) 51.零件多装(P

22、ARTS EXCESS) 52.零件沾锡(SOLDER ON PARTS ) 53.零件偏移( PARTS SHIFT ) 54.包装错误( WRONG PACKING ) 55.印章错误(WRONG STAMPS )56.尺寸错误(DIMENSION WRONG ) 57.二极管坏( DIODENG ) 58.晶体管坏( TRANSISTOR NG ) 59.振荡器坏( XTL NG) 60.管装错误( TUBES WRONG ) 61.阻值错误(IMPEDANCE WRONG ) 62.版本错误(REV WRONG ) 63.电测不良( TEST FAILURE ) 64.版本未标(NON

23、 REV LEBEL )65.包装损坏(PACKING DAMAGED ) 66.印章模糊(STAMPSDEFECTIVE ) 67.标签歪斜( LABEL TILT ) 68.外箱损坏(CARTON DAMAGED ) 69.点胶不良( POOR GLUE) 70.IC 座 氧化( SOCKET RUST ) 71.缺 UL 标签( MISSING UL LABEL ) 72.线材不良( WIRE FAILURE ) 73.零件脚损坏( PIN DAMAGED ) 74.金手指沾锡( SOLDER ON GOLDENFINGERS ) 75.包装文件错( RACKING DOC WRONG

24、) 76.包装数量错( PACKING QTY WRONG ) 77.零件未定位(PARTSUNSEATED ) 78.金手指沾胶(GLUE ON GOLDEN FINGERS )79.垫片安装不良(WASHER UNSEATED ) 80.线材安装不良( WIRE UNSEATED )81.立碑(TOMBSTONE )SMT 不良描述中英文对照露底材 Base material expose偏位 Shift短路 /连锡 Short少锡 Insufficient solder多锡 /包焊 Excess solder漏印 Missing print反白 Upside down少件 Missing

25、 component反向 Wrong orientation错件 Wrong component多件 /残件 Extra component空焊No solder立碑Tombstoning锡珠Solder balls侧立Side termination零件氧化 Parts oxidation锡尖Solder projection浮高Float翘脚Lifted leadPAD 不上锡 PAD discoloration针洞Pinholes压件Cover component残异物Residues助焊剂残留 Flux residues少胶 Insufficient glue溢胶Overflow gl

26、ue误判No Fail其它Other印刷不良 Print Defect上盖脱落/断裂Top cover missing/crack掉件 /撞件 Drop componentLifted inside-pin内PIN翘起（缺 PIN/短PIN/翘PIN）版本混装Mixed edition线路偏移Circuit shift错位 Error position脚歪 /变形 Lead deformed/deformation混料 Mixed material胶未固化 Glue not be solidified烫伤Scald堵孔Obstacle on viaPCB 白化 /分层 PCB Delamina

27、tion漏洞Exposed copper无极性Missing polarity压伤 Crush漏点胶Missing glue气泡 Air bubble屏蔽架变形Shield Deformation 49 屏蔽架毛刺 Shield Burr2 零件偏移component4 坏件 damaged6装插不良improper8 线脚长lead protrusion10漏标示missing12无线尾no lead14 极性反polarity16 锡桥 solder bridge18 锡尖 solder icicle刮伤 Scraped弹片翘起Spring lifted弹片失效Spring failure

28、t replace弹片无法复位Spring can零件沾锡Solder on parts焊锡质量类序号 汉语意义 英文翻译1 冷焊 cold solder shifted3 污损 contamination component5 锡多 excessive solder insertion7 绝缘不良 insulation damaged out of spec9 漏点胶 missing glue marking11 近似短路 near short protruded翘皮 peeling off reversed成型不良 poor preforming锡裂 solder crack19 锡少 s

29、older insufficient mask peeling off21 锡渣solder spatter23 错件wrong partICT Fail Cause and Repair Actions1 短路 ShortPart3 板丢失Board Lost5 板报废Board ScrappedFor Analysis7 零件损坏 Broken PartPart9 掉件 Missing part11 零件修复 Part Repaired13 PCB 缺陷 PCB Defect15 加锡Solder Added17 去锡Solder RemovedSolding quality1 空焊Emp

30、ty Solder3 浮焊Floating Solder5 虚焊Inveracious Soldering20 防焊漆胶落solder22锡洞solder void2零件插反Backward4 板修复Board Repaired6板送去分析BoardSent8 零件缺陷Defective10加零件Part Added12换零件Part Replaced14 PCB 开路 PCB Open16 桥焊Solder Bridge2 包焊 Excess Solder4 冰柱 Icing6 掉件，漏件MissingComponent7 开路 Open9 锡桥 Solder Bridge11 锡裂 Spl

31、it SolderOperational defect terms1 零件插反Backward Part3 碰伤 Bumps5 零件错位Misaligned Part(component)7 粘胶 Paint Adhesion9 错件 Wrong PartOthers1 不正常 Abnormal3 外观 Apperance5 附着，贴附Attached7 束线 Bind9 接 Bridge11 毛边Burrs13 夹住Clip15 腐蚀Corrosion8漏焊Open Solder10锡尖突出Solder Tip2 零件损坏Broken Part4 异物 Foreign Part6 漏件Mis

32、sing Parts8 刮伤Scratches2 附件Accessory4装配 Assembling6 弯曲Bent8 翘皮Blister/peeling10 破损 Broken12 裂纹 Chip / crack14 污染Contamination16 交叉Cross18减少Decrease20缺点Defect22 凹痕Dent24 尺寸Dimension26 化状箱 Display28 脱落Drop , Tall off30假焊False Solder32塞住Fill Up34 异物 Foreign36胶 Glue38 重 Heavy40 不完全Incomplete42确认Indentif

33、y44 不合治具 Ingagued46 插配 Insertion48 干扰Interference50 杂物 Junk52 布置，配置Layout17 损坏Damage19 深刮伤 Deep Scratch21 变形Deformed23 偏差Deviation25 变色 (白化 ) Discoloration box27 双重Double29 超过Excess(Cold)31 频率 Fequency33 浮 Float Material35 碎片塞 Fragement37 溢胶 Glue overflow39 不清楚illegible41 增加 Increase43 指示灯Indicate L

34、amp45 未固定Insecurely47 内部 Inside49 间断，不安定Intermittent51 纠缠 Kink53555759616365676971737577798183858789LeadLiftedLocationMisorientationMissingMultipleOff centerOutsidPartialPoorResidueRustSinkSlipSolder FlowStainThicknessTransparentUnsmooth54 浅音 Leakage Sound56 轻 Light58 松 Loose60 未镀表层 Misplating62 混 M

35、ix64 不良 No Good (NG)66 振荡 Oscillation68 脱漆Paint drop70 铜箔 Pattem (PAD)72 凸 Protrude74粗糙Roughness76 LED 数字分节 Segment78 滑动 Slide80 锡珠 Solder Ball82 分开，分隔 Sparation84 粘 Stick86 紧 Tight88不平Uneven90上下颠倒 Upside down91 漆 Varnish Paint92 缺洞 Void （Holes）93 弱 WeakSMT 中英文对照Fundamentals of Solders and Soldering

36、 （焊料及焊接基础知识）Soldering Theory （焊接理论）Microstructure and Soldering （显微结构及焊接）Effect of Elemental Constituents on Wetting （焊料成分对润湿的影响）Effect of Impurities on Soldering （杂质对焊接的影响）Solder Paste Technology （焊膏工艺）Solder Powder （ 锡粉 ）Solder Paste Rheology （锡膏流变学）Solder Paste Composition & Manufacturing （锡膏成分和制

37、造）SMT Problems Occurred Prior to Reflow （回流前 SMT 问题）Flux Separation （助焊剂分离）Paste Hardening （焊膏硬化）Poor Stencil Life （网板寿命问题）Poor Print Thickness （印刷厚度不理想）Poor Paste Release From Squeege e 锡膏脱离舌 U刀问题）Smear （印锡模糊）Insufficiency （印锡不足）Needle Clogging （针孔堵塞）Slump （塌落）Low Tack （低粘性）Short Tack Time （粘性时间短）SMT Problems Occurred During Reflow （回流过程中的 SMT 问 题）Cold Joints （冷焊）Nonwetting （不润湿）Dewetting （反润湿）Leaching （浸析）Intermetallics （金属互化物）Tombstoning （立碑）Skewing （歪斜）Wicking