PCB工程咨询中英文对照总结

1、常见工程咨询中英文对照问题：客户未告知采用什么标准进行制作与检查。建议：我们按IPC-6012BClass2与IPC-A-600GClass2做。Question1:Customerdoesnttelluswhatstandardsweshouldtaketomanufactureandinspect.Suggestion:WewillfollowIPC-6012BClass2&IPC-A-600GClass2.问题：客户未告知板料类型。建议：我们将使用FR4.Question:Customerdoesnttellusmaterialtype.Suggestion:WewilluseFR4.问

2、题：客户要求成品厚度为1.60+/-0.10mm，此公差对六层板而言太紧，难以控制。建议：将公差放松到+/-0.15mm.Question:Customerrequires“1.60+/-0.10mm”finishedboardthickness,thetoleranceistootightforsix-layerboard.,itshardtocontrolforus.Suggestion：Relaxthetolerancetobe+/-0.15mm.问题：客户未规定使用何种类型的阻焊油及颜色。建议：我们采用普通感光绿色湿油.Question:Customerdoesntspecifysol

3、dermasktypeandcolor.Suggestion：WeusenormalgreenLPI.问题：客户未指定UL标记与Datecode加于何处及以何种方式显示。建议：见下图，我们将其加于TOP面，以白字显示。Question:CustomerdoesntspecifywhereandbywhatdisplayformweshouldaddULlogoanddatecode.Suggestion：Seebelowpicture,weaddthemontopsideanddisplaythembysilkletters.问题：客户要求线路表面油厚为30ummin，线路拐角位为20ummi

4、n,此要求太高。建议：线路油表面厚与线路拐角位油厚分别放松到15ummin与10ummin.Question:Soldermaskisrequiredtobe30umminoverlineand20umminatcorners,itstoostrict.Suggestion：Relaxittobe15umminoverlineand10umminatcorners,问题：客户未规定镍金厚度要求。建议：我们按镍厚2.54ummin,金厚0.030.08um制作.Question:CustomerdoesntspecifythicknessofNiandgold.Suggestion：Ni：2.5

5、4umminandgold：0.03-0.08um.问题：客户未清楚指明层序。建议：层序为：Question:Customerdoesntindicatelayersequence.Suggestion：Layersequenceis问题：客户未规定压板结构。建议：按下图所示做。Question:Customerdoesntspecifylay-upstructure.Suggestion：Followbelowpicturetodo.问题：客户未规定如何对电测试0K的板加注标记。建议：A)板边划一条黑线。B)板内盖白色的T印。Question:Customerdoesntspecifyhow

6、totakeamarkfor“E-TestOK”board.Suggestion:A)Markablacklineatedge-board.B)Takeawhitestamponboard.问题：客户未指定V-CUT标准。建议：V-CUT角度为305，余厚为0.40+/-0.10mm。Question:CustomerdoesntspecifyV-cutstandard.Suggestion:V-cutangle:305,residuethickness:0.40+/-0.10mm。问题：客户未指明斜边标准。建议：按下图所示制作。Question:Customerdoesntspecifybe

7、velstandard.Suggestion:Followbelowpicturetodo.问题：请看下图，成品板四个角为直角，运输与包装过程中易造成板间擦伤。建议：A)将直角改成Rl.Omm的圆角。B)不能更改。Question:Seebelowpicture,fouroutercornersarerectangular,sharpcornerswillbringscratchingbetweenboardsduringtransportationandpackaging.Suggestion:A)ChangetherectangularcornersintoR1.0mmones.B)Tak

8、enochange.问题：板上P/N为ABCD，但客户资料上为EFG。建议：A)将板上的P/N改为EFG将文件资料上的P/N改为ABCD。不予理会。Question:PartnumberisABCDonboard,butEFGindocuments.Suggestion:A)changeABCDintoEFGonboard.changeEFGintoABCDindocuments.Letthembe.问题：客户资料上版本为REV.A,但板上为REV.B。建议：A)将板上版本改为REV.A。将资料上版本改为REV.B.不需做任何更改，允许版本不一致。Question:ReversionNo.is

9、Aindocuments,butBonboard.Suggestion:A)ChangeAintoBonboard.ChangeBintoAindocuments.Nottakeanychange,letthembe.钻孔部分-问题：客户未规定孔径公差。建议：VIAHole：+0.08/-0.40mmPTH：+/-0.08mm，NPTH：+/-0.05mm，Slot：width+0.08mm，length+/-0.10mm。Question:Customerdoesntspecifytolerancesforholes.Suggestion:VIAHole：+0.08/-0.40mmPTH：+

10、/-0.08mm，NPTH：+/-0.05mm，Slot：width+0.08mm，length+/-0.10mm。问题：客供图纸上“A”处数据与“B”处数据相矛盾，请看下图。建议：a)按“A”处数据做。b)按“B”处数据做。Question:Seebelowpicture,thedatamarked“A”isconflictwith“B”onthemechanicaldrawing.Suggestion:a)Followthedatamarked“A”todo.b)Followthedatamarked“B”todo.问题：见下图，图纸上“A”处数据公差+/-0.05mm,超我司能力。建议：

11、将其放松到+/-0.10mm。Question:Seebelowpicture,thetolerance(+/-0.05mm)marked“A”isoutofourcapability.Suggestion:Relaxittobe+/-0.10MM.问题：图纸上“A处数据为100.25mm(请看下图)，Gerber中此处实测数据为100.34mm。建议：a)按图纸做。b)按Gerber做。Question:Seebelowpicture,thedatamarked“A”is100.25mmondrawing,butthefactualvalueis100.34mminGerber.Sugges

12、tion:a)Followdrawingtodo.b)FollowGerbertodo.问题：请看下图，红色圆圈圈住的Slot宽度为0.65mm,长度为12mm。由于长度比较长，不宜钻出。如果锣出，其宽度又比最小锣刀的直径(0.8mm)还小，也无法锣出。建议：将Slot宽度改为0.80mm以便锣出。Question:Seebelowpicture,theslot(whichismarkedwithredcircle)sizeis0.65mmX12mm.Astheslotisverylong,wehavetoroutitout,butoursmallestroutbitis0.8mm,itsim

13、possibletorouttheslotoutyet.Suggestion:Changetheslotwidthinto0.8mm.问题：请看下图，一个0.86mm的孔与一个1.23mm的孔相互重叠。建议：A)删去0.86mm的孔。B)删去1.23mm的孔。Question:Seebelowpicture,one0.86mmholeoverlapsanother1.23mmhole.Suggestion:A)Delete0.86mmhole.B)Delete1.23mmhole.问题：请看下图，两个相同大小的孔部分重叠。建议：为避免钻板时易断钻嘴，我们将其改作成Slot。Question:S

14、eebelowpicture,partofoneholeoverlapspartofanotherwithsamesize.Suggestion:Changethetwoholesintoaslottoavoideasydisjunctionofdrillbitduringdrillingprocess.问题：图纸中有一类孔为3.20mm,但钻带中却为3.25mm。建议：A)做成3.20mmB)做成3.25mmQuestion:Theholesizeis3.20mmondrawing,but3.25mminGerber.Suggestion:A)Makeitas3.20mmB)Makeitas

15、3.25mm.问题：客户要求3.0mmPTH孔完成公差为+0.05/-0mm，此公差超出我司工艺能力。建议：将公差放松到+0.10/-0mm。Question:Customerrequires+0.05/-0mmfor3.0mmPTH,thetoleranceisoutofcapability.Suggestion:Relaxittobe+0.10/-0mm.问题：客户没有规定哪些孔为PTH,哪些孔为NPTH。建议：3.0mm，4.10mm孔做成NPTH，其余做成PTH。Question:CustomerdoesntindicatewhichholesarePTHandwhichholesar

16、eNPTH.Suggestion:3.0mm,4.10mmholesaremadeintoNPTH,othersaremadeintoPTH.问题：请看下图，“a”处PTH(1.0mm)与“b”处PTH(2.10mm)的距离只有10mil(我司工艺能力为14mil)，电镀时易渗镀造成两孔短路。建议：A)将两孔分别往相反方向移动2mil。B)将两孔Size分别缩小0.05mm,即做成0.95mm与2.05mm。Question:Seebelowpicture,thedistanceisonly10milbetween1.00mmholemarked“a”and2.10mmholemarked“b

17、”(its14milmindistanceforournormalworkmanship),theclosedistancewilleasilycauseshortsbetweenthetwoholesinplatingprocess.Suggestion:A)shiftthetwohole2milawayindividuallytowardscounter-directions.B)Reduce0.05mmforholesizes,i.e.makethemas0.95mmand2.05mm.问题：板上没有NPTH，用PTH做锣板定位孔时易损伤孔壁铜。建议：A)请看下图，我们于无铜区补加3个2

18、.5mm的NPTH做锣板定位孔。B)不允许加NPTH，接受PTH孔铜擦花。Question:TherearenoNPTHsinboard.HolecopperwillbeeasilyhurtifweusePTHastoolingholesinroutingprocess.Suggestion:A)Seebelowpicture,wewilladdthree2.5mmNPTHincopper-freeareaandusethemastoolingholes.B)NotpermittoaddextraNPTHandacceptcopperwallbeinghurt.问题：请看下图，两个3.0mm的

19、PTH离板边的距离只有10mil。建议：A)按Gerber做，允许锣板时破孔。B)将孔往内移动10mi1,以免破孔。Question:Seebelowpicture,two3.0mmPTHareonly10milawayfromedgeboard.Suggestion:A)Fo11owGerbertodoanda11owbrokenho1es.B)Shiftho1es10mi1awaytowardsinside.内层线路部分.问题：客户要求的底铜厚为2OZ,但最小线宽线距只有5/5mi1(我司能力是8/6mi1)。建议：A)将底铜厚改为10Z。请更改GERBER并重新提供给我们。取消此定单。Q

20、uestion:Customerrequires20Zbasecopper,buttheminimum1inewidth/spacinginGerberis5/5mi1(Its8/6milforoutcapability)Suggestion:A)Changebasecopperinto10Z.P1easetakechangesforpatternsandsendnewGerbertous.Cance1thisorder.问题：见下图，板边一处线路离Outline只有4mil,锣板时会伤线。建议：将线路内移至离板边12mil。Question:Seebelowpicture,thereisal

21、inewhichisonly4milwayfromedgeboard,itwillbehurtduringroutingprocess.Suggestion:Shiftittowardsinside12milawayfromedgeboard.问题：请看下图，3.0mmNPTH钻在铜面上。建议：A)削铜离孔1012mi1,以保证钻后不露铜。B)按原装做，允许钻后露铜。Question:Seebelowpicture,thereisa3.0mmNPTHlyingincopperplane.Suggestion:A)Cutsuitablecopperandkeepcopper1012milfara

22、wayfromholetoensurenocopperexposure.B).FollowGerberandcopperexposureisallowable.问题：内层L2与L5完全相同。建议：A)L2与L5完全相同是正确的，依原装做即可。B)L2与L5完全相同是正确的，请提供新GERBER。Question:Wefindoutlayer2isassameaslayer5entirely.Suggestion:A)Theyareright,justfollowGerbertodo.B)Theyarewrong,pleaseprovideusnewmodifiedGerber.问题：POWER

23、层与GROUND层于红圈处短路，请看下图。建议：A)正确，依原装做即可B)错误，请提供新GERBER。Question:ThecopperwithredcircleisshortbetweenPOWERandGNDplanes,Suggestion:A)Itsright,justfollowGerber.B)Itswrong,pleaseprovidenewGerber.问题：内层上有许多孤立PAD。建议：A)删孤立PAD,以方便我司生产。B)不可以删，要按GERBER做。Question:Theremanyisolatedpadsoninnerlayers.Suggestion:A)Dele

24、tethemtobenefitourproductionprocess.B)Notdelete,justfollowGerber.问题：工艺边无铜。建议：A)为平衡压板时的板厚，我们于工艺边加Dummycopper，并将避开外层各种标记。B)不可以加。Question:Nocopperonbreakaway.Suggestion:A)Tobalanceboardthicknessduringpressingprocess,weadddummycopper,thecopperwillkeepawayfrommarkingsonouterlayers.B)Notpermittoaddextradu

25、mmycopper.外层线路问题：客户要求的底铜厚为2OZ,但最小线宽线距只有5/5mil(我司能力是6/6mil)。建议：A)将底铜厚改为10Z。请更改GERBER并重新提供给我们。取消此定单。Question:Customerrequires2OZbasecopper,buttheminimumlinewidth/spacinginGerberis5/5mil(Its8/6milforoutcapability)Suggestion:A)Changebasecopperinto1OZ.PleasetakechangesandsendnewGerbertous.Cancelthisorder

26、.:问题：板边一处线路离Outline只有4mil,锣板时会伤线。建议：将线路内移至离板边810mil。Question:Seebelowpicture,thereisalinewhichisonly4milwayfromedgeboard,itwillbehurtduringroutingprocess.Suggestion:Shiftittowardsinside8-10milawayfromedgeboard.问题：请看下图，3.0mmNPTH钻在铜面上。建议：A)削铜离孔8-10mi1，以保证干膜封孔。B)依依原装做，允许钻后露铜。Question:Seebelowpicture,th

27、ereisa3.0mmNPTHlyingincopperplane.Suggestion:A)Cutsuitablecopperandkeepcopper8-10milfarawayfromholetoensuredryfilmtenting.B).FollowGerberandtake2nddrillprocess,copperexposureisallowable.问题：请看下图，3.0mmNPTH离旁边的线路只有4.5mil。建议：移线离孔8mil，以保证干膜封孔及避免伤线。Question:Seebelowpicture,3.0mmNPTHisonly4.5milfarawayfrom

28、adjacentline.Suggestion:Shiftthelineaside8milawayfromholetoensuredryfilmtentingandtoavoidlinebeinghurt.问题：请看下图，3.0mmNPTH离旁边的SMD之PAD只有5mil。建议：A)削PAD2mil以保证干膜封孔。B)依原装做，允许钻后PAD边露铜。Question:Seebelowpicture,3.0mmNPTHisonly5milfarawayadjacentpadsofSMD.Suggestion:A)Cut2milcopperofedg-padtoensuredryfilmtent

29、ing.B)FollowGerbertodoandallowcopperexposureofedge-pad.问题：3.0mmNPTH上的PAD单边比孔大6mil。建议：A)删PAD，以保证干膜封孔。B)将PAD加大到单边比孔大12mil，以免二钻时PAD剥离板面。Question:Thepadover3.0MMNPTHis6milbiggerthanholeinalldirections.Suggestion:A)Deletethepadtoensuredryfilmtenting.B)Extendthepadtobe12milbiggerthanholeinalldirectionstoa

30、voidpadpeelingoffboardduring2nddrillingprocess.问题：请看下图，多处SMD之PAD间距小于7mil，无法印制绿油桥，喷锡时严重将严重短路。建议：A)适当削PAD将间距加大到8mil，以免喷锡时严重短路。B)将表面处理由喷锡改为沉金。Question:Seebelowpicture，thespacingsbetweenmanypadsofSMDsarelessthan7mil,itsimpossibletoprintsoldermaskbetweenpads，thusseriousshortsoccurduringHASLprocess.Sugges

31、tion:A)Cutsuitablecopperofpadsandextendthespacingstobe8mil.B)ChangeHASLintoimmersiongold.问题：请看下图，KEYPAD要求印碳油，但PAD间间距只有20mil,无法印制。建议：适当削PAD,将间距加大到26mil.Question:Seebelowpicture,customerrequiresustoprintcarbonoilonkeypads,butthespacingsareonly20milbetweenpads,itshardtoachieve.Suggestion:Cutalittlecopp

32、erofkeypadandextendthespacingstobe26mil.问题：此板表面处理为沉金，但板上有KEYPAD。KEYPAD是不需要焊接的。建议：A)KEYPAD上加印蓝胶。B)不需加印蓝胶。Question:Thesurfacefinishisimmersiongold,buttherearemanykeypads.Keypadswillnotbeweldedduringassemblyprocess.Suggestion:A)Printpeelablesoldermaskonkeypads.B)Notneedtoprintsoldermaskonkeypads.问题：客户要

33、求做V-CUT。建议：请看下图，为防止漏V-CUT，我们补加V-CUT测试线。Question:CustomerrequiresustotakeV-cut.Suggestion:Seebelowpicture,toavoidV-cutskipweaddE-Testpatterns.绿油部分.问题：VIA孔两面都没有开窗。建议：A)依原装做，允许绿油入孔或塞孔。B)补加单边大孔4mil的开窗，不允许绿油入孔。Question:Viaholeshavenosoldermaskopeningsonbothsides.Suggestion:A)FollowGerberandallowsoldermas

34、ktoenterintoortoplugholes.B)Addsoldermaskopeningswhichare4milbiggerthanholesinalldirectionsandnotallowsoldermasktoenterintoholes.问题：部分VIA孔只有一面开窗。建议：A)依原装做，允许绿油入孔但不塞孔。B)于无开窗的一面补加单边大孔4mil的开窗，不允许绿油入孔。Question:Someviaholesonlyhavesoldermaskopeningsononeside.Suggestion:A)FollowGerbertodoandallowsoldermas

35、ktoenterintobutnottoplugholes.B)Notallowsoldermasktoenterintoholesandaddopeningswhichare4milbiggerthanholesinalldirections.问题：VIA孔两面开窗单边大孔只有2mil。建议：A)依原装做，允许绿油入孔但不塞孔B)将开窗加大到加单边大孔4mil,不允许绿油入孔。Question:Soldermaskopeningsareonly2milbiggerthanviaholesinalldirectionsonbothsides.Suggestion:A)FollowGerbera

36、ndallowsoldermasktoenterintobutnottoplugholes.B)Notallowsoldermasktoenterintoholesandextendopeningstobe4milbiggerthanholesinalldirections.问题：部分插件孔只有一面开窗。建议：A)按GERBER做，允许绿油入孔。B)于无开窗的一面补加单边大孔4mil的开窗，不允许绿油入孔。Question:Therearesoldermaskopeningsovercomponentholesonlyononeside.Suggestion:A)FollowGerberand

37、allowsoldermasktoenterintobutnottoplugholes.B)Notallowsoldermasktoenterintoholesandaddopeningstobe4milbiggerthanholesinalldirectionsonanotherside.问题：客户要求绿油塞孔，但有部分VIA孔离MD之PAD不足6mil,易爆油上PAD。建议：A)接受些许绿油上PAD。B)不接受绿油上PAD,将这些过于靠近SMDPAD的VIA孔补加单边大孔4mil的开窗，取消塞孔要求。Question:Customerrequiresustoplugallviaholesw

38、ithsoldermask,buttherearesomeholeswhichareonly6milawayfromadjacentpadsusedforwelding.Soldermaskwillsplashontothepadsbecauseofhightemperatureduringcuringprocess.Suggestion:A)FollowGerberandacceptsoldermasksplashingontopads.B)Notpermitsoldermasktosplashontopadsandaddsoldermaskopeningsovertheviaholeswh

39、icharelessthan6milfarawayfromadjacentpads.问题：客户提供了PASTEGERBER，但有一处PASTE缺绿油窗，请看下图。建议：A)此处PASTE补加绿油窗。B)不需补加绿油窗。Question:CustomerhasprovideduspasteGerber,butwefindoutoneofpastehavenosoldermaskopening.Seebelowpicture.Suggestion:A)Addsoldermaskopeningsforthispaste.B)JustfollowGerberandnotneedtoaddsolderm

40、askopeningforthispaste.问题：客户提供了PASTEGERBER，但有一处PASTE形状与对应的绿油窗不一致，请看下图。建议：A)将绿油窗的形状改做成与PASTE一致。B)不需修改绿油窗，按原装做。Question:CustomerhasprovideduspasteGerber,butwefindoutthefigureofonepasteisdifferentfromthecorrespondingsoldermaskopeningthere.Seebelowpicture.Suggestion:A)Changethefigureofsoldermaskopeningintoasthatofpaste.B)JustfollowGerberandnotneedtotakeanychange.问题：请看下图，密集蚀刻字开有绿油窗，喷锡后易发生锡堆积，造成字符不清。建议：A)取消绿油窗。B)按GERBER做，允许喷锡后字符不清。Qu