机种功能不良分析总结function issue customers complaint analysis summary

1、机种3073200048 功能不良分析总结PN 3073200048 function issue customers complaint analysis summaryLewiss Lee2015.10.14 Contents问题描述 Describe the issue原因分析 Root cause analysis短期对策 Temporary countermeasure长期对策 Permanent countermeasure效果验证 Effect verification 总结已发生的不良现象，所有不良品分为三种：1.USB第一个Pin脚翘起；2.D1锡裂。 Make a summ

2、ary for all defective phenomenon, which could be classified into three molds. First, end of first pin of USB turn up. Second, welding split with D1.一、问题描述 Describe the issue标号No.日期 Date不良位置 Issue Point不良现象 Defective PhenomenonPCB DC12014.11.5/2015.2.2USB第一个PIN翘起142622015.2.2/2015.4.15D1锡裂 D1 Welding

3、 Slit1445、1502 1. 不良现象 USB第一只Pin翘起， 发生原因： For second defective phenomenon, end of first pin of USB turn up. Root cause: (1)原材来料为Tray盘包装，USB在tray盘中并没有完全固定，有Pin变形风险； The package method for material is dish packaging, and USB material is not fixed into tray firmly, there is risk to cause deformation. (

4、2) 产线人员手工摆放USB，少数人员操作不规范可能导致Pin脚被压迫后向上弯折，造成Pin脚变形不良。 The operator plug USB into PCB by manual before reflow，few operators did not obey the rules which may cause pin was pushed and turned up, so deformation pin caused. 二、原因分析 Root cause analysis 流出原因： (1). 外观检没有定义要观测USB Pin，不良未检测到； (2). 高的零件有投影，过AOI时

5、未探测到； (3). USB pin有弹性，测试时如果Pin接触到Pad 或者USB 金属外壳，测试结果OK; Flow out reason : (1). There is no requirement in SOP to inspect USB pins, operator did not find the defective samples; (2). As there is projection with tall materials, which could not stop issue products in AOI station; (3). As there is elasti

6、c with pin, if the pin contact with pad or metal shell of USB, test result is OK. 二、原因分析 Root cause analysis 2.不良现象 D1锡裂 发生原因( Root cause) 从D1外观上，可以明显看到受到外力压迫导致的锡裂； We could find obvious pressure with force from D1 appearance; 二、原因分析 Root cause analysis 外观可见靠近D1位置的线束都有不同程度的损伤，可以确定线束之前挤压过D1元件,这是造成D1锡

7、裂的原因； We could find obvious different level of damage with wiring harness, and we confirm D1 was pressured by wiring harness，that is root cause for D1 split; 二、原因分析 Root cause analysis 二、原因分析 Root cause analysis 流出原因（Flow out reason) 测试时线束压迫到元件，导致测试结果Pass,不良流出。 When operator proceed testing, and the

8、 wiring pressed D1, so the test result OK, and which leads defective sample outflow. 三、短期对策 Temporary countermeasure 1.针对库存成品660pcs 100%重新确认焊接效果同时安排再次测试，未发现不良。 To the stock in our W/H(660pcs), we reconfirm the soldering effect and retest all stock, there is no defective found. 2.测试后的板子做好打点标识； Make d

9、ot mark on the plastic shell after pass the test. 三、短期对策 Temporary countermeasure 3. 针对产线所有作业人员再次进行宣导，人员贴装USB时，必须两只定位脚同时插入PCB，且注意不要压迫Pin脚导致Pin脚变形！ Give one point lesson to all operators on production line, when operator plug USB into PCB, they should put location feet to PCB at the same time, at the

10、 same time, they must not press the USB and cause pin deformation. 4. MI外观检测增加针对USB Pin针焊接确认。 During MI station, we add the inspection requirement to check the pins soldering effect and confirm OK, and we have finished it. 三、短期对策 Temporary countermeasure 5. 规范人员作业手法，在组装外壳工艺中增加不可触碰或挤压D1位置； Add the co

11、ntent in operators SOP, no contacting and pushing D1 during assembling the plastic shell; 三、短期对策 Temporary countermeasure 6. 所有测试不良品立即隔离，放入不良品盒内，与正常测试OK品分开（已经完成）。 All issue products after tested should be isolated at once, and put into reject box, they should be ensure kept part with OK products（Hav

12、e been finished). 四、长期对策 Permanent countermeasure 1. 为了彻底避免运输过程和人员手摆造成Pin脚变形的风险，供应商12月12日后所有订单USB包装从Trap盘装改为卷装，后续新安将从人员手摆变更为机器贴片。 In order to avoid deforming pin during transit and plugging the USB into PCB by manual, we have contacted with USB supplier ACT, and had changed the packaging method of U

13、SB from tray to reel from Dec.12th，so we could stick the USB by SMT machine. 四、长期对策 Permanent countermeasure 2.过炉后先分板，分板后先定型线束，尖嘴钳扩张线束焊接一端，使得线束成型后不会挤压到D1位置, 再装到治具上进行手焊作业 ； .Proceed board split after wave-soldering, we add the content about wiring harness forming action after soldering the wiring har

14、ness, and keep the wiring harness away from D1, in order to avoid D1 might be pressed by it. and then put into fixture and solder the wire by manual. 四、长期对策 Permanent countermeasure 3. 针对可能由于组装时人员抵压PCB板尾部中间，前推时挤压D1可能造成的锡裂，增加压合治具，避免人员操作手法不当造成的不良； In order to prevent the operator push the middle of PC

15、Bs tail, so D1 was contacted and pushed with force, we make the pressing fixture, which D1 would not be pushed by operator directly. 四、长期对策 Permanent countermeasure 4. 针对USB Pin针翘起和D1锡裂，修改失效分析和控制计划， In order to avoid Pin of USB turn up and D1 solder split, we also change the Flow Chart, CP 和FMEA； 五、效果验证 Effect verification 1. 以上改善实施后，厂内生产合计13265pcs, 制程未发现有类似不良产生； Since we hav