IPCTM-650实验方法手册

IPCTM-650实验方法手册

IPCTM-650TestMethodsManual

IPCMemberTestingLaboratoriesList

ReportingandMeasurementAnalysisMethods

VisualTestMethods

Section1.0

Section2.1

Section2.2

Section2.3

Section2.4

Section2.5

Section2.6

DimensionalTestMethods

ChemicalTestMethods

MechanicalTestMethods

ElectricalTestMethods

EnvironmentalTestMethods

SECTION1.0-ReportingandMeasurementAnalysisMethods

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

Introduction

Calibration

AmbientConditions

Reporting,General

Reporting,Format

NumericalReporting

Reporting,InvalidTestResults

MeasurementPrecisionEstimationforBinaryData-1/03

MeasurementPrecisionCalculator-BinaryData

MeasurementPrecisionCalculatorUsersGuide

(forusewithtestmethod1.8)

MeasurementPrecisionEstimationforVariablesData-

1.9

1/03

MeasurementPrecisionCalculator-VariableData

MeasurementPrecisionCalculatorUsersGuide

(forusewithtestmethod1.9)

SECTION2.1-VISUALTESTMETHODS

2.1.1D

Microsectioning-3/98

2.1.1.1

Microsectioning,CeramicSubstrate-12/87

Microsectioning-SemiorAutomaticTechniqueMicrosectionEquipment

2.1.1.2

(Alternate)-7/93

2.1.2A

2.1.3A

2.1.5A

2.1.6B

2.1.6.1

2.1.7C

2.1.7.1

2.1.8B

2.1.9

PinholeEvaluation,DyePenetrationMethod-3/76

Plated-ThroughHoleStructureEvaluation-8/76

SurfaceExamination,UncladandMetalCladMaterial-12/82

ThicknessofGlassFabric-12/94

WeightofFabricReinforcements-12/94

ThreadCountofGlassFabric-12/94

ThreadCount,OrganicFibers-12/87

Workmanship-12/94

SurfaceScratchExaminationMetalCladFoil-5/86

2.1.10AVisualInspectionforUndissolvedDicyandiamide-12/94

2.1.13AInspectionforInclusionsandVoidsinFlexiblePrintedWiringMaterials-5/98

SECTION2.2-DIMENSIONALTESTMETHODS

2.2.1A

2.2.2B

2.2.4C

2.2.5A

2.2.6A

2.2.7A

2.2.8

MechanicalDimensionalVerification-8/97

OpticalDimensionalVerification-8/97

DimensionalStability,FlexibleDielectricMaterials-5/98

DimensionalInspectionsUsingMircosections-8/97

HoleSizeMeasurement,Drilled-8/97

HoleSizeMeasurement,Plated-5/86

LocationofHoles-4/73

2.2.10A

2.2.12A

HoleLocationandConductorLocation-12/83

ThicknessofCopperbyWeight-3/76

OverallThicknessandProfileFactorofCopperFoils

2.2.12.1

2.2.12.2

TreatedandUntreated-9/87

WeightandThicknessofCopperFoils

withReleasableCarriers-7/89

WeightandThicknessDeterminationofCopperFoils

2.2.12.3

2.2.13.1A

2.2.14

WithEtchableCarriers-7/89

Thickness,PlatinginHoles,MicrohmMethod-1/83

SolderPowderParticleSizeDistribution

-ScreenMethodforTypes1-4-1/95

SolderPowderParticleSizeDistribution

2.2.14.1

2.2.14.2

-MeasuringMicroscopeMethod-1/95

SolderPowderParticleSizeDistribution-OpticalImageAnalyzer

Method--1/95

2.2.14.3

2.2.15

DeterminationofMaximumSolderPowderParticleSize-1/95

CableDimensions(FlatCable)-6/79

2.2.16

ArtworkMasterEvaluationbyUseofaDrilledPanel-12/87

2.2.16.1

2.2.17

ArtworkMasterEvaluationbyOverlay-12/87

SurfaceRoughnessandProfileofMetallicFoils

(ContactingStylusTechnique)-3/90

SurfaceRoughnessandProfileofMetallicFoils

(ContactingStylusTechnique)-2/01

2.2.17A

2.2.18

DeterminationofThicknessofLaminatesby

MechanicalMeasurement-12/94

DeterminationofThicknessofMetallicCladLaminates,

2.2.18.1

Cross-sectional-12/94

2.2.19

MeasuringHolePatternLocation-12/87

2.2.19.1

2.2.20

Length,WidthandPerpendicularityofLaminateandPrepregPanels-12/94

SolderPasteMetalContentbyWeight-1/95

PlanarityofDielectricsforHighDensityInterconnection(HDI)Microvia

2.2.21

Technology-11-98

SECTION2.3-CHEMICALTESTMETHODS

2.3.1

ChemicalProcessing,SuitableProcessingMaterial-4/73

2.3.1.1B

2.3.2F

2.3.3A

2.3.4B

ChemicalCleaningofMetalCladLaminates-5/86

ChemicalResistanceOfFlexiblePrintedWiringMaterials-5/98

ChemicalResistanceofInsulatingMaterials-2/78

ChemicalResistance,MarkingPaintsandInks-8/97

ChemicalResistanceofLaminates,PrepregandCoatedFoilProducts,by

2.3.4.2A

SolventExposure-12/94

2.3.4.3

2.3.5B

ChemicalResistanceofCoreMaterialstoMethyleneChloride-5/86

Density,InsulatingMaterial-8/97

2.3.6A

Etching,AmmoniumPersulfateMethod-7/75

Etching,FerricChlorideMethod-7/75

2.3.7A

2.3.7.1A

2.3.7.2A

2.3.8A

CupricChlorideEtchingMethod-12/94

AlkalineEtchingMethod-12/94

Flammability,FlexibleInsulatingMaterials-12/82

FlammabilityofFlexiblePrintedWiring-12/88

FlammabilityofPrepregandThinLaminate-8/97

FlammabilityofLaminate-12/94

2.3.8.1

2.3.9D

2.3.10B

2.3.10.1

2.3.11

FlammabilityofSoldermaskonPrintedWiringLaminate-8/98

GlassFabricConstruction-4/73

DeterminationofAcidValueofLiquidSolderFlux-PotentiometricandVisual

2.3.13

TitrationMethods-1/95

2.3.14

Print,Etch,andPlateTest-4/73

2.3.15C

2.3.16B

2.3.16.1C

2.3.16.2

2.3.17D

2.3.17.1B

2.3.17.2B

2.3.18A

2.3.19C

2.3.21

Purity,CopperFoilorPlating-8/97

ResinContentofPrepreg,byBurn-off-12/94

ResinContentofPrepeg,byTreatedWeight--12/94

TreatedWeightofPrepreg-12/94

ResinFlowPercentofPrepreg-8/97

ResinFlowofAdhesiveCoatedFilmsandUnsupportedAdhesiveFilms-5/98

ResinFlowof"NoFlow"Prepreg-8/97

GelTime,PrepregMaterials-4/86

VolatileContentofPrepreg-12/94

PlatingQuality,HullCellMethod-8/97

CopperProtectiveCoatingQuality-2-78

2.3.22

2.3.23B

2.3.23.1A

2.3.24

Cure(Permanency)ThermallyCuredSolderMask-2/88

Cure(Permanency)UVInitiatedDryFilmSolderMask-2/88

PorosityofGoldPlating-2/78

PorosityTestingofGoldElectrodepositedonaNickelPlatedCopperSubstrate

2.3.24.1

2.3.24.2A

2.3.25B

2.3.25C

ElectrographicMethod-10/85

PorosityofMetallicCoatingsonCopper-BasedAlloysandNickel(NitricAcid

VaporTest)-8/97

DetectionandMeasurementofIonizableSurfaceContaminants-

8/97---Supersedes2.3.26and2.3.26.1

DetectionandMeasurementofIonizableSurfaceContaminantsbyResistivity

ofSolventExtract-2/01

2.3.25.1

2.3.26A

2.3.26.1

2.3.26.2

2.3.27

IonicCleanlinessTestingofBarePWBs

SupersededbyTestMethod2.3.25

SupersededbyTestMethod2.3.25

MobileIonContentofPolymerFilms-7/95

CleanlinessTest-ResidualRosin-1/95

2.3.27.1

2.3.28

RosinFluxResidueAnalysis-HPLCMethod-1/95

IonicAnalysisofCircuitBoards,IonChromatographyMethod-1/95

Flammability,FlexibleFlatCable-11/88

2.3.29

2.3.30A

2.3.31

SolventpHDeterminationinAnhydrousFlourocarbonSolvents-11/81

RelativeDegreeofCureofU.V.CurableMaterial-2/88

FluxInducedCorrosion(CopperMirrorMethod)-1/95

PresenceofHalidesinFlux,SilverChromateMethod-1/95

SolidsContent,Flux-1/95

2.3.32C

2.3.33C

2.3.34B

2.3.34.1B

PercentageofFluxon/inFlux-Coatedand/orFlux-CoredSolder-1/95

2.3.35B

2.3.35.1

2.3.35.2

2.3.36

HalideContent,Quantitative(ChlorideandBromide)-1/95

FluoridesbySpotTest,Fluxes-Qualitative-1/95

FlourideConcentration,Fluxes-Quantitative--1/95

AcidAcceptanceofChlorinatedSolvents-10/85

2.3.37B

2.3.38B

VolatileContentofAdhesiveCoatedDielectricFilms-5/98

SurfaceOrganicContaminantDetectionTest-8/97

SurfaceOrganicContaminantIdentificationTest(InfraredAnalyticalMethod)-

2.3.39B

2.3.40

8/97

ThermalStability-7/95

SECTION2.4-MECHANICALTESTMETHODS

2.4.1D

Adhesion,TapeTesting--8/97

2.4.1.1B

2.4.1.2

Adhesion,MarkingPaintsandInks--11/88

AdhesionofConductorsonHybridSubstrates--12/87

2.4.1.3

2.4.1.4

2.4.1.5A

2.4.1.6

2.4.2A

Adhesion,Resistors(HybridCircuits)--12/87

Adhesion,Overglaze(HybridCircuits)--12/87

DeterminationofHeatTransfer--5/95

Adhesion,PolymerCoating--7/95

DuctilityofCopperFoil--3/76

2.4.2.1D

2.4.3D

FlexuralFatigueandDuctility,Foil--3/91

FlexuralFatigue,FlexiblePrintedWiringMaterials--5/98

FlexuralFatigueandDuctility,FlexiblePrintedWiring--3/91

2.4.3.1C

2.4.3.2C

2.4.4B

2.4.4.1A

2.4.5

FlexuralFatigueandDuctility,FlexibleMetal-CladDielectrics--3/91

FlexuralStrengthofLaminates(atAmbientTemperature)--12/94

FlexuralStrengthofLaminates(atElevatedTemperature)--12/94

FoldingEndurance,FlexiblePrintedWiringMaterials--4/73

Flexibility-ConformalCoating

2.4.5.1

2.4.6

HotOil--4/73

2.4.7A

2.4.8C

2.4.8.1

Machinability,PrintedWiringMaterials--7/75

PeelStrengthofMetallicCladLaminates--12/94

PeelStrength,MetalFoil(KeyholeMethodforThinLaminates)--1/86

PeelStrengthofMetallicCladLaminatesatElevatedTemperature(HotFluid

2.4.8.2A

2.4.8.3A

Method)--12/94

PeelStrengthofMetallicCladLaminatesatElevatedTemperature(HotAir

Method)--12/94

2.4.8.4

2.4.9D

2.4.9.1

2.4.9.2

2.4.10

CarrierRelease,ThinCopper--1/90

PeelStrength,FlexibleDielectricMaterials--10/88

PeelStrengthofFlexibleCircuits-11/98

BondingProcess-11/98

PlatingAdhesion--4/73

2.4.11

ShearStrengthFlexibleDielectricMaterials--4/73

Solderability,EdgeDipMethod--6/91

SolderFloatResistanceFlexiblePrintedWiringMaterials--5/98

ThermalStressofLaminates--12/94

2.4.12A

2.4.13F

2.4.13.1

2.4.14

SolderabilityofMetallicSurfaces--4/73

Solderability,WaveSolderMethod--3/79

2.4.14.1

2.4.14.2

LiquidFluxActivity,WettingBalanceMethod--1/95

2.4.15A

2.4.16A

2.4.17

SurfaceFinish,MetalFoil--3/76

InitiationTearStrength,FlexibleInsulatingMaterials--12/82

TearStrength,Propagation--4/73

2.4.17.1A

2.4.18B

2.4.18.1

2.4.18.2

2.4.18.3

2.4.19C

2.4.20

Propagation,TearStrength,FlexibleInsulatingMaterials--12/82

TensileStrengthandElongation,CopperFoil--8/80

TensileStrengthandElongation,In-HousePlating--8/97

HotRuptureStrength,Foil--7/89

TensileStrength,Elongation,andModulus--7/95

TensileStrengthandElongation,FlexiblePrintedWiringMaterials--5/98

TerminalBondStrength,FlexiblePrintedWiring--4/73

LandBondStrength,UnsupportedComponentHole--8/97

2.4.21D

2.4.21.1CBondStrength,SurfaceMountLandsPerpendicularPullMethod--5/91

2.4.22C

2.4.22.1C

2.4.22.2

2.4.23

BowandTwist(Percentage)--6/99

BowandTwist-Laminate--5/93

SubstrateCurvature:SiliconWaferswithDepositedDielectrics--7/95

SolderingResistanceofLaminateMaterials--3/79

2.4.24C

2.4.24.1

2.4.24.2

2.4.24.3

GlassTransitionTemperatureandZ-AxisThermalExpansionbyTMA--12/94

TimetoDelamination(TMAMethod)--12/94

GlassTransitionTemperatureofOrganicFilms-DMAMethod--7/95

GlassTransitionTemperatureofOrganicFilms-TMAMethod--7/95

GlassTransitionandModulusofMaterialsUsedinHighDensityInterconnection

2.4.24.4

(HDI)andMicrovias-DMAMethod-11/98

GlassTransitionTemperatureandThermalExpansionofMaterialsUsedInHigh

2.4.24.5

DensityInterconnection(HDI)andMicrovias-TMAMethod-11/98

2.4.25C

2.4.26

GlassTransitionTemperatureandCureFactorbyDSC--12/94

TapeTestforAdditivePrintedBoards--3/79

2.4.27.1B

2.4.27.2A

2.4.28B

2.4.28.1C

2.4.29B

2.4.30

Abrasion(TaberMethod),SolderMaskandConformalCoating--1/95

SolderMaskAbrasion(PencilMethod)--2/88

Adhesion,SolderMask(Non-MeltingMetals)--8/97

Adhesion,SolderResist(Mask),TapeTestMethod--3/98

Adhesion,SolderMask,FlexibleCircuit--2/88

ImpactResistance,PolymerFilm--10/86

2.4.31A

2.4.32A

2.4.33C

Folding,FlexibleFlatCable--4/86

FoldTemperatureTesting,FlexibleFlatCable--4/86

FlexuralFatigueandDuctility,FlatCable--3/91

SolderPasteViscosity-T-BarSpinSpindleMethod(applicablefor300,000to

2.4.34

1,600,000Centipose)--1/95

SolderPasteViscosity-T-BarSpindleMethod(ApplicableatLessThan300,000

2.4.34.1

2.4.34.2

2.4.34.3

Centipose)--1/95

SolderPasteViscosity-SpiralPumpMethod(Applicablefor300,000to

1,600,000Centipose)--1/95

SolderPasteViscosity-SpiralPumpMethod(ApplicableatLessThan300,000

Centipose)--1/95

2.4.34.4

2.4.35

PasteFluxViscosity-T-BarSpindleMethod--1/95

SolderPaste-SlumpTest--1/95

2.4.36B

2.4.37A

ReworkSimulation,Plated-ThroughHolesforLeadedComponents--8/97

EvaluationofHandSolderingToolsforTerminalConnections--7/91

2.4.37.1A

2.4.37.2

2.4.38A

2.4.39A

2.4.40

EvaluationofHandSolderingToolsforPrintedWiringBoardApplications--7/91

EvaluationofHandSolderingToolsonHeavyThermalLoads--7/93

PrepegScaledFlowTesting--6/91

DimensionalStability,GlassReinforcedThinLaminates--2/86

InnerLayerBondStrengthofMultilayerPrintedCircuitBoards--10/87

CoefficientofLintearThermalExpansionofElectricalInsulatingBoards--3/86

2.4.41

CoefficientofThermalExpansionbytheVitreousSilica(Quartz)Dilatometer

2.4.41.1A

Method--8/97

2.4.41.2

2.4.41.3

2.4.41.4

2.4.42

CoefficientofThermalExpansion-StrainGageMethod--8/97

In-PlaneCoefficientofThermalExpansion,OrganicFilms--7/95

VolumetricThermalExpansionPolymerCoatingsonInorganicSubstrates--7/95

TorsionalStrengthofChipAdhesives--2/88

HighTempreatureMechanicalStrengthRetentionofAdhesives--3/88

DieShearStrength--2/98

2.4.42.1

2.4.42.2

2.4.42.3

2.4.43

WireBondPullStrength--2/98

SolderPaste-SolderBallTest--1/95

2.4.44

SolderPaste-TackTest--3/98

2.4.45

SolderPaste-WettingTest--1/95

SpreadTest,LiquidorExtractedSolderFlux,SolderPasteandExtractedCored

2.4.46

WiresorPreforms--1/95

2.4.47

2.4.48

2.4.49

2.4.50

FluxResidueDryness--1/95

SpittingofFlux-CoredWireSolder--1/95

SolderPoolTest--1/95

ThermalConductivity,PolymerFilms--7/95

2.4.51

SelfShimmingThermallyConductiveAdhesives--1/95

SECTION2.5-ELECTRICALTESTMETHODS

2.5.1B

2.5.2A

2.5.3B

2.5.4

ArcResistanceofPrintedWiringMaterials--5/86

CapacitanceofInsulatingMaterials--7/75

CurrentBreakdown,PlatedThroughHoles--8/97

CurrentCarryingCapacity,MultilayerPrintedWring--4/73

ConductorTemperatureRiseDuetoCurrentChangesinConductors--8/97

DielectricConstantofPrintedWiringMaterials--7/75

2.5.4.1A

2.5.5A

Permittivity(DielectricConstant)andLossTangent(DissipationFactor)of

2.5.5.1B

2.5.5.2A

2.5.5.3C

2.5.5.4

InsulatingMaterialat1MHz(ContactingElectrodeSystems)--5/86

DielectricConstantandDissipationFactorofPrintedWiringBoard

Material--ClipMethod--12/87

Permittivity(DielectricConstant)andLossTangent(DissipationFactor)of

Materials(TwoFluidCellMethod)--12/87

DielectricConstantandDissipationFactorofPrintedWiringBoard

Material--MicrometerMethod--10/85

StriplineTestforPermittivityandLossTangent(DielectricConstantand

2.5.5.5C

2.5.5.5.1

2.5.5.6

DissipationFactor)atX-Band--3/98

StriplineTestforComplexRelativePermittivityofCircuitBoardMaterialsto

14GHZ--3/98

Non-DestructiveFullSheetResonanceTestforPermittivityofClad

Laminates--5/89

CharacteristicImpedanceandTimeDelayofLinesonPrintedBoardsby

2.5.5.7

TDR--11/92

2.5.5.8

2.5.5.9

2.5.6B

LowFrequencyDielectricConstantandLossTangent,PolymerFilms--7/95

PermittivityandLossTangent,ParallelPlate,1MHzto1.5GHz--11/98

DielectricBreakdownofRigidPrintedWiringMaterial--5/86

DielectricStrength,PolymerSolderMaskand/orConformalCoatings--2/88

ElectricStrengthofPrintedWiringMaterial--8/97

2.5.6.1A

2.5.6.2A

2.5.6.3

2.5.7C

DielectricBreakdownVoltageandDielectricStrength--10/86

DielectricWithstandingVoltage,PWB--8/97

2.5.7.1

2.5.8A

DielectricWithstandingVoltage-PolymericConformalCoating-7/00

DissipationFactorofFlexiblePrintedWiringMaterial--7/75

InsulationResistance,MultilayerPrintedWiring(BetweenLayers)--12/87

InsulationResistivityforAdhesiveInterconnectionBonds--11/98

InsulationResistance,MultilayerPrintedWiring(WithinaLayer)--4/73

InterconnectionResistance,MultilayerPrintedWiring--4/73

ResistanceofCopperFoil--3/76

2.5.10A

2.5.10.1

2.5.11

2.5.12

2.5.13A

2.5.14A

2.5.15A

2.5.16A

2.5.17E

2.5.17.1A

ResistivityofCopperFoil--8/76

GuidelinesandTestMethodsforRFI-EMIShieldingofFlatCable--10/86

Shorts,InternalonMultilayerPrintedWiring--11/88

VolumeResistivityandSurfaceResistanceofPrintedWiringMaterials--5/98

VolumeandSurfaceResistivityofDielectricMaterials--12/94

VolumeResistivityofConductiveResistanceUsedinHighDentisty

2.5.17.2

Interconnection(HDI)andMicrovias,Two-WireMethod--11/98

2.5.18B

2.5.19A

2.5.19.1A

CharacteristicImpedanceFlatCables(Unbalanced)--7/84

PropagationDelayofFlatCablesUsingTimeDomainReflectometer--7/84

PropagationDelayofFlatCablesUsingTimeDomainReflectometer

(TDR)--7/84

2.5.21A

2.5.24

2.5.25A

2.5.26A

2.5.27

2.5.28A

2.5.30

2.5.31

2.5.32

2.5.33

DigitalUnbalancedCrosstalk,FlatCable--3/84

ConductorResistance,FlexibleFlatCable--6/79

DielectricWithstandVoltageFlexibleFatCable--11/85

InsulationResistanceFlexibleFlatCable--11/85

SurfaceInsulationResistanceofRawPrintedWiringBoardMaterial--3/79

QResonance,FlexiblePrintedWiringMaterials--4/88

BalancedandUnbalancedCableAttenuationMeasurements--12/87

CurrentLeakage(ThroughOverglazeFilms)--12/87

ResistanceTest,PlatedThrough-Holes--12/87

MeasurementofElectricalOverstressfromSolderingHandTools--11/98

MeasurementofElectricalOverstressfromSolderingHandTools(Ground

2.5.33.1

2.5.33.2

2.5.33.3

2.5.33.4

Measurements)--11/98

MeasurementofElectricalOverstressfromSolderingHandTools(Transient

Measurements)--11/98

MeasurementofElectricalOverstressfromSolderingHandTools(Current

LeakageMeasurements)--11/98

MeasurementofElectricalOverstressfromSolderingHandTools(Shielded

Enclosure)--11/98

SECTION2.6-ENVIRONMENTALTESTMETHODS

2.6.1E

FungusResistancePrintedWiringMaterials--8/97

2.6.1.1

FungusResistance–ConformalCoating--7/00

2.6.2C

MoistureAbsorption,FlexiblePrintedWiring--5/98

WaterAbsorption,MetalCladPlasticLaminates--5/86

MoistureandInsulationResistance,PrintedBoards--8/97

2.6.2.1A

2.6.3E

2.6.3.1C

MoistureandInsulationResistance-PolymericSolderMasksandConformal

Coatings--11/98

2.6.3.1D

2.6.3.2B

2.6.3.3A

2.6.3.4A

2.6.4A

MoistureandInsulationResistance-SolderMask--7/00

MoistureandInsulationResistance,FlexibleBaseDielectric--5/88

SurfaceInsulationResistance,Fluxes--1/95

MoistureandInsulationResistance–ConformalCoating--7/03

Outgassing,PrintedBoards--8/97

2.6.5C

PhysicalShock,MultilayerPrintedWiring--8/97

2.6.6B

TemperatureCycling,PrintedWiringBoard--12/