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FPCFPC名词中英比照目的FPC使用上的统一化适用范围词无类别一:FPC不良工程名词工程类别不良名称中文

英 文ConductorsOpenShortNicksPinholes导线VisualInspectionofConductors基底薄膜VisualInspectionofBaseFilm掩盖层和掩盖涂层Visual

毛刺结瘤裂纹凹坑划痕

ExtraneousCopperBetweenConductorsSpursNodulesEtchedConcaveConductorDelaminationCracksScratchesonConductorDentsDiscolorationDentsScratchesonBaseFilmDentsonCoverlayandCovercoatScratchesonCoverlayandCovercoatInspectionof 空洞Coverlayand 偏位Covercoat毛刺外来物 导电性异物

VoidCoverlayMisalignCoverlayBurrsConductiveForeignMattersForeignMatters非电性异物起泡和分层掩盖涂层渗出镀金镀金层缺陷镀锡渗透Discoloration)电镀金属或焊锡的Discoloration)电镀金属或焊锡的镀铜孔内镀层空洞PlatingVoidsinPlated-thoughHole外表条件镀金粗糙RoughGoldSurface镀金白雾GoldDiscolorationConditionof镀金变色GoldDiscolorationPlatedMentalandSolder镀金针孔GoldCrackGoldPinhole电镀露铜PlatedExposeWetting剥离PlatedPeeledOff电镀渗入PlatedWicking

Non-conductiveForeignMattersBlisteringandDelaminationSqueeze-outofAdhesiveofCoverlayOoze-outofCovercoatSkippingofConvercoatGoldPlatingGoldPlatingDefectsTinPlatingPenetrationofPlatedMetalorSolderDarkenedAppearance(Blackening漏镀 NoPlating外表伤痕 PlatingScratch电镀粗糙 RoughPlated药水渗入 Wicking撕裂和缺口 TearsandNicks毛刺 Burrs外形和孔边缘 丝状毛刺 ThreadyBurrsVisual 弯曲、变形 WarInspectionof 微连筋不良 PoorMicro-jointEdgesofOutlineandHoles增加板Visual

外形偏移 OutlineMisalign外形漏冲 NoOutline反折偏位 BendingLineMisalignFPC与增加板之间 ForeignMatterBetweenFlexiblePrintedBoard的外来物 andStiffenerFPC与增加板之间 VoidsBetweenFlexiblePrintedBoardandImperfections 的空洞 StiffenerRelatedto 裂纹 CracksStiffener 缺角 Chip-offBonding 划痕 Scratches变形 Deformation增加板贴偏移 StiffenerMisalign外表附着物 热固胶 ThermosettingAdhesiveAffixed 焊剂残渣 FluxResiduesSubstanceson 金属粉末残渣 ResidueofMetalPowderstheSurfaceMarking定位精度

突起厚度孔安装孔导线宽度孔中心间距最小距离标记错误孔的定位精度

ResidueofAdhesiveProtrusionsDentsBowTwistDimensionalInspectionsMeasurementofDimensionsExternalDimensionsThicknessHolesComponentHolesViaHolesViaHoleMisalignMountingHolesConductorWidthsClearancesBetweenConductorsDistanceBetweenHoleCentersMinimumDistanceBetweenBoardEdgesandConductorsWrongMarkingUnclearLetterPositionalAccuracyofHolesPositional

孔与焊盘的重合性RegistrationofHoletoLandAccuracyFPC合性RegistrationofStiffenertoFPCOther

合性孔的重合性的重合性FPC合性度离型纸脱落材料错误

RegistrationofCoverlay(orCovercoat)toLandRegistrationofHolesRegistrationofOutlinesRegistrationofPunchedOutlinetoConductorPatternsRegistrationofPressureSensitiveorHeatActivatedAdhesivestoFPCandStiffenerPlatingThicknessofCopperPanted-throughHolesShortageMixedStowage/PackingReleasedPaperPeeledoffWrongMaterial类别二:PFC工程用语板BoardType

中 单面板单面双接触

英 文SingleSidedFlexCircuitsDoubleAccessorBack-baredFlexCircuits双面板双面板模具图纸量产模具样品模具DoubleSidedFlexCircuitsRigid-flexCircuitsDieDrawingMassProductionDiePrototypeDie钢模刀模上模下模外形模具SteelDieDieTopDieBottomDieWireCutOutlineCut胶纸模具补强模具银浆模具导柱冲头CoverlayDiePressureSensitiveAdhesiveDieStiffenerDieSilverDiePostPunch销钉曝光治具CuttingSteelRuleDiePinLaminationJigElectricalCheckJigTackingJigExposureJig丝印网框电测定位孔ScreenPrintingFrameGuideHoleforExposureGuideHoleforDieGuideHoleforTackingGuideHoleforAdhesiveGuideHoleforElectricalTest孔环下料钻孔GuideHoleforScreenPrintingLiftedLandStannizeHoleFittingHoleMaterialPreparationDrilling镀铜化学铜leCopperPlatingEletcrolessPlatingCopperDie治具Jig(Fixture)孔Hole制程ManufactureProcedure

贴干膜 SensitiveDryFilm丝印阻焊油墨 LiquidPhotosensitiveSoldermask曝光 Exposure显影 Developing蚀刻 Etching脱膜 Stripping贴保护膜 TackingCoverlay粗化 Abrade层压 LaminationMaterial

〕黑孔微蚀前处理刷板枯燥镍〕闪镀局部电镀化学镍金丝印字符贴补强板贴胶纸打孔雷射切割外表贴装冲孔验〔镜检〕性能测试包装铜箔基材无胶基材胶〕压克力顶层补强底层补强银浆油墨

CuringBlackHoleSurfaceTreatmentCascadeRinseMicro-etchAcidCleaningWaterCleaningAnti-corrosionTreatmentPre-treatmentBrushingDryup(Gold、Solder、Nickel)Plating(Gold)FlashPlating/StrikePlatingPatternPlateImmersionGoldOrganicSolderabilityPreservatives(OSP)PrintingofLegendBackBoardLaminationElectricalInspectionDoubleFacedAdhesiveTapePunchingLaserCutAutomaticOpticalInspection〔AOI〕SurfaceMountingTechnology〔SMT〕PunchingPunchingFinalInspectionVisualInspection〔FinalInspection)ConductorMicroscopeInspectionReliabilityTestPackingCopperFoil(CU)Electro-depositedCopperFoil(ED)RolledAnnealedCopperFoil(RA)Coverlay(CVL)BaseMaterialFlexibleCopperCladLaminate(FCCL)AdhesivelessFCCLAdhesives(Ad)AcrylicTopStiffenerBottomStiffenerTopSilverPasteBottomSilverPasteSliverInk其 Others

聚酯钢片玻璃纤维布FR4补强板压敏胶泡棉导电泡棉屏蔽膜关电容电阻二极管静电进刀转速焊接波焊菲林浓度线宽线距

TopCircuits/ConductorsBottomCircuits/ConductorsBondingFilm(BOD)Polyimide(PI)PolyesterFilm(PET)SheetSteelWovenGlassClothFiberboardLiquidPhotoimageableResistInkPressureSensitiveAdhesive〔PSA〕ReleasePaperConductingResinElectricFabricFoamAnisotropicConductiveFilm〔ACF〕Conductive/ElectricFoamShieldFilmMetalDome〔DOME〕ConnectorCapacitance (C)Resistance (R)IntegratedCircuit 〔IC〕Diode (D)Electro-StaticDischarge〔ESD〕MachineDirection 〔MD〕TransverseDirection〔TD〕FeedChipLoadSpeedSolderingHandSolderingWaveSolderingAcceptableQualityLevel〔AQL〕FilmLegendOvenTemperatureHumiditySpeedPressureSpoutingPressureConcentrationSchematicDiagramLineSpaceLineWidth线路间距线路间距Pitch类别三:FPC牢靠性测试工程中 文 英 文电气性能 TestingofElectricalPerformance导线电阻 ConductorResistance外表层绝缘电阻 SurfaceInsulationResistance(SIR)外表介质层耐电压强度DielectricWithstandingVoltageofSurfaceLayers机械性能测试 TestingofMechanicalProperty剥离强度 PeelStrength孔和焊垫的拉脱强度 Pull-outStrengthforPlainHolesandFootprints镀层附着力 PlatingAdhesion可焊性 Solderabil

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