便携式设备-Notebook与Pad的设计制造流程

NotebookPC&Tablet相關設計介紹Common專案設計流程簡介Keyparts規格簡介Notebook設計簡介Tablet設計簡介Connectors設計簡介Trendof3CproductsAgendaCommon專案設計流程簡介RFIRFPRFQPMSalesCostTeamAwardMEEESWRFThermalNPSUPlacementstudyThermalSimulationLayoutSimulationMasterScheduleProductSpecificationRFSimulationIDIDstudyOS/Driver/BIOSProductionLineSimulationKeypartsListNOKick-offStartIDlockdownPCBreleaseOthersAStageMockup/ToolingSMTOthersB/CStageToolingTestQA/IQC/SQESafety……Pre-MPMPFCSTeamrosterColorplanICTnegotiationflowchartInformationandcommunicationstechnology

(ICT)

PMrequestRFI(RequestForinformation)RFP(RequestForProposal)RFQ(Requestforquotation)QualityRequirementsRegulationWarranty/ServiceQuotationProcurementISODocument1.NRE2.Samplerequestbystage3.Schedule4.Connectwindow1.SSA/SPA2.EnvironmentalRequirements3.RequestsForChange4.RegularReportsandMeetings5.QualityGoalsIFRTarget&Formulation6.AFRcompensationfee1.GuidelineofRestrictionofHazardousSubstance2.Regulatory3.ReportforEMC/Safety/Energyrequirement1.WarrantyPeriod2.OutofWarrantyService3.ReturnforRepair4.Landing-combatIFR(NPI)5.ServicePartsProvision6.ProductSupport7.FailureAnalysisreport8.SparePartsBufferandLocalRepair9.KeyPartsWarranty10.SparePartsWarranty1.ForecastAcceptance2.OrderConfirmation3.DeliveryRequirementContainerLoadingISODocumentsRequirement(SA8000,ISO14001&OHSAS18001)Keyparts規格簡介Keyparts規格簡介Keyparts為在3C專案進行任何一流程前必須選定之部品.Keyparts佔整個機種開發成本約20~30%.Keyparts定義:

a.TouchPanel觸控面板

b.LCM液晶螢幕c.WebCAM攝影鏡頭

前鏡頭&後鏡頭

d.Antenna無線天線

e.RF無線模組

Wi-Fi/WWAN/3G/GPS/Bluetooth

f.Batterypack/cell電池g.Keyboard鍵盤

h.GlidePad/Touchsensor滑鼠板i.HDD硬碟9.5H/7.0H/5.0H/SSD…..

j.ODD光碟機9.5H/8.5H/7.0H

k.CPU中央處理器Wintel(AMD/Intel)+ARM(Qualcomm/…..)

l.DDR記憶體模組DDR3/DDR4j.OS.Windows/AndroidKeyparts規格簡介-Touchpanel多點觸控技術大致可分為五種疊層結構，而以觸控疊構和顯示面板的相對位置，又可歸納為三類，包括Out-Cell、On-Cell及In-Cell等技術架構。其中，Out-Cell係指觸控面板模組外掛於顯示模組之外，共有單玻璃觸控方案(OGS)、雙玻璃(GG)與雙薄膜(CoverGlass/SensorFilmX/SensorFilmY,GFF)觸控方案三種主要類型。

與LCM結合的方式可分為Airbonding&Directbonding共二種。Keyparts規格簡介-Touchpanel

各項觸控面板之基本特性比較Keyparts規格簡介-TouchpanelAppleiPadairKeyparts規格簡介-LCMLCM設計上通常分為二種:

Module模組Opencell(Hingeup)Panelsize:

5”/6”/7”/7.9”/8.3”/10.1”/11.6”/13.3”/14.1”/15.6”/17”/18”/21.5”/23.3”/24”Keyparts規格簡介-LCMNoteBook設計簡介N/B設計上通常分為二區:

Displayunit(面板)Baseunit

(主機)主件分為4大件:

A:

Display

unitFrontcover

B:

Display

unitBackcover

C:BaseunitTopcase

D:BaseunitBottomcaseDisplayunitBaseunitNotebook設計分類-Teardown說明ABCDNotebook設計分類-DisplayunitA

coverLCMBcoverCable-RCable-LHinge-RHinge-LAntennaWebCAM+MICNotebook設計分類-BaseunitGlidePadM/BSpeakerboxFANBatterypackHeat-sinkD

coverKeyboardC

coverODDHDDD/BTablet設計簡介Tablet設計分類-Teardown說明Tablet設計上僅分為2主件:

A:

FrontcoverB:

BackcoverABConnector設計簡介I/OPorts-影像輸出CRT

portHDMI

portDisplay

portI/OPorts-資料傳輸USB2.0USB3.0ThunderBoltI/OPorts-資料傳輸&聲音傳輸AudioJackMICJackSDcardRJ45I/OPorts-電源供應DC-INI/OPorts-Tablet專用型MicroUSB2.0MiniUSB2.0MicroUSB3.0MiniHDMI

MicroHDMIMicroSDcardMiniSDcardMultifunctionconnector(USB+SD/DP+HDMI/USB+AC……..)//2013/06/30/apple-patent-stuffs-two-ports-in-one-saves-space-in-your-laptop/I/OPorts-SpecialtypeofmultifunctionUSB+ACpowermaynotimplementcontrollerICbyUSBassociationdefinition??Howtodo??Combinemagnetsolution(Applepatentissue)

Waterproofsolution-IPX5levelI/OPorts-Specialtypeofmultifunction外觀件加工法外觀處理與

設計簡介外觀件材料簡介-塑膠成型塑膠粒子塑膠模具塑膠成型機塑膠成型品外觀件材料簡介