ASM-自动焊线机器介绍Au-wire-bonding-process演示幻灯片

Section9.3

BasicAuWireBondProcess9/21/20231ContentsBasicIntroductionGoldWireBonderBondingSequenceMaterial&ToolsBondQuality9/21/20232BasicIntroductionUnderstandanICPackageICManufacturingFlowWireBondingIntroduction9/21/20233Cross-sectionofanICPackageDieGoldWireLeadFrame9/21/20234WaferGrindingDieBondingWaferSawToasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacement

SingulationPackingICManufacturingFlowDejunkTrimSolderPlatingSolderPlatingForming/SingulationTrim/Forming

BGASURFACEMOUNTPKGTHROUGHHOLEPKG9/21/20235GoldWireBondingDiePadLeadGoldwireBallBond(1stBond)WedgeBond(2ndBond)9/21/20236WedgeBonding9/21/20237WhattechniqueisusedinGoldWireBonding?9/21/20238WireBondingTechniquesTherearethreebasicwirebondingtechniques:Thermosonicbonding:utilizestemperature,ultrasonicandlowimpactforce,andball/wedgemethods.Ultrasonicbonding:utilizesultrasonicandlowimpactforce,andthewedgemethodonly.Thermocompressionbonding:utilizestemperatureandhighimpactforce,andthewedgemethodonly.9/21/20239ThermocompressionvsThermosonicThermocompressionweldingusuallyrequiresinterfacialtemperatureoftheorderof>300°C.Thistemperaturecandamagesomedieattachplastics,packagingmaterials,andlaminates,aswellassomesensitivechips.Thermosonicwelding,theinterfacetemperaturecanbemuchlower,typicallybetween100to150°C,whichavoidssuchproblems.Theultrasonicenergyhelpsdispersecontaminatesduringtheearlypartofthebondingcycleandhelpscompletetheweldincombinationwiththethermalenergy.9/21/202310AdvantagesofThermosonicMetallurgicaljoiningismorereliablethanconductiveparticlesandadhesivejoining.Processcycletimecanbereducedfromseveralminutestolessthan10seconds.Lowermanufacturingcostperunit.9/21/202311Wirebonding

OperatingTemperatureWireMaterialsPadMaterialsNoteThermo-compression300-500°CAuAl,AuHighpressure,noultrasonicenergyUltrasonic25°CAu,AlAl,AuLowpressureinultrasonicenergyThermosonic100-240°CAu,CuAl,AuLowpressureinultrasonicenergyComparisonofDifferentWireBondingTechniques9/21/202312WhataretheimportantparametersinGoldWireBonding?9/21/202313BondingParametersThermosonicBondingPressure(Force)Amplify&Frequency(Power–138KHz)WeldingTime(BondTime)WeldingTemperature(Heater)

HighPower3.2WmaxLowPower1.6WmaxUltra-LowPower0.8WmaxPower-mWVib.-umPower-mWVib.-umPower-mWVib.-um32003.2116002.268001.599/21/202314SiO2Si

BondingPrincipleAlPressure(Force)Vibration(Power)ContaminationMoistureAl2O3GlassHeat9/21/202315NexttoGoldWireBonder9/21/202316GoldWireBonderMachineRoadmapUnderstandIndividualPartMachineSpecificationBondingTemperature9/21/202317ASMGoldWireBonderRoadmapMachineModel(ATS)AB308

AB309

AB309A

AB339

AB339Eagle

Eagle60

Eagle60AP

Harrier

TwinEagle

HummingBird

Eagle50??9/21/202318ASMGoldWireBonderMachineModel(ATS)DescriptionEagle60-00ICApplicationsEagle60-01TO-92Eagle60-02Opto(BentLeadframe)ApplicationsEagle60-03VerticalLEDorOptoApplicationsEagle60-08Power&HybridDeviceApplicationsEagle60-09Power&HybridDeviceApplications9/21/202319MatchingEagle60APEagle60-03HummningBirdHarrierTwinEagle.....ACEDB9/21/202320Eagle60AP

MachineIntroduction9/21/202321Eagle60vsEagle60AP

Eagle60Eagle60APFinepitch35μm.30μm.Speed60+ms.<60ms.BondheadDigitalbondheadNewbondheadwith8~10%fasterBondPlacementAccuracy±3μm@3sigma±2.5μm@3sigmaLoopTypesStandardloopingdatabaseAdditionalEscargot,Flex,BellloopOptics

ProgrammableBallFormationMonitoringStandard8xfasterCapacitancenon-stickdetectionStandard10xfaster9/21/202322LowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith0.4micronperencoderstepFastcontactdetectionSuppressedForcevibration&FastForceresponseFastresponsevoicecoilwireclampBondHeadASSY9/21/202323XYTableLinearMotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-3um@3sigmaResolutionof0.2umperencoderstep9/21/202324W/HASSYIndexingresolutionof1umperencoderstepFullyprogrammableindexer&tracksMotorizedwindowclampwithsoftclosefeatureOutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice9/21/202325BondingSystemBondingMethod

Thermosonic(TS)BQMMode

Multi-modewithprogrammableBQMBdWireSize 15.2umupto76.2um(Au,Cu)WireLength 0.6to8mmBondingAccuracy +/-2.5um@3sigmaBondingArea 54mmX65mm(LFWidth72mm) 54mmX(137-LFWidth)mmBondingSpeed +60msfor2mmWire(Qloop)BondForceRange 1~400gramLoopType

Q-Auto,Square&PentaLoopHeightRange

3~16milXYResolution

0.2umZResolution

0.4umFinePitchCapability

30umpitch@0.6milwireNo.ofBondingWires

upto3000ProgramStorage

1000programsonHardDiskTransducerSystem 138KHZEagle60APMachineSpecifications(1)9/21/202326VisionSystemPatternRecognitionTime

60ms/pointPatternRecognitionAccuracy

0.37umLeadLocatorDetection

12ms/leadMinimumLeadPitch 80umPostBondInspection

1st,2ndBondandWire TracingDepthofField

3.5X(320um) 8X(100um)FacilitiesSinglePhase110VAC(optional100/120/200/210/220/230/240VACFloorSpacing

720mm(width)X 820mm(length)X 1600mm(height)

Eagle60APMachineSpecifications(2)9/21/202327MaterialHandlingSystemIndexerResolution

1umLeadframePositionAccuracy

2milApplicableLeadframe

W=23~90mm@bondingareainY=65mmL=140~295mmT=0.1~0.8mmApplicableMagazine

W=16~100mm(Maximum) L=140~295mm H=180mm(Maximum)MagazinePitch

2.4~10mm(0.09”~0.39“)DeviceChangeover

<4minutes(withinsameLFtype)PackageChangeover

<5minutes(betweenLFtype)NumberofBufferMagazine

3(max.435mm)Eagle60APMachineSpecifications(3)9/21/202328SPCCapabilityMTBF:168HoursMTBA:2HoursMTTA:1MinuteMTTR:30MinutesOthersAbletolinkuptoformInlineSystem(IDEALine)CompatibletoOLP(OfflineProgrammingSoftware)PowerFailureProtectionEagle60APMachineSpecifications(4)9/21/202329TheWireBondTemperature

Material Preheat Bondsite CUL/F 200+/-10 200+/-10 ALL/F 210+/-10 230+/-10 BGA 150+/-10 160+/-10 TFBGA 150+/-10 160+/-10 LBGA 150+/-10 160+/-10NotIncludeDedicateLine9/21/202330NexttoBondingSequence9/21/202331BondingSequence9/21/202332PadLeadBondingSequenceWireClampCapillaryGoldWireFreeAirBall9/21/202333PadLeadMovefromResetPositionFirst,wireclampopenSecond,bondheadmovedownto1stbondpositionThird,FABiscapturedatthechamfer9/21/202334Approachto1stBondSearchHeightPadLeadSearchHeight9/21/202335Goingto1stBondPositionSearchSpeed1SearchTol.1PadLead9/21/202336SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition9/21/202337SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition9/21/202338SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition9/21/202339TouchDownSearchSpeed1SearchTol.1PadLead9/21/202340ImpactForcePadLeadFormationof1stBond9/21/202341heatPressureUltraSonicVibrationPadLeadFormationof1stBond(ContactPhase)9/21/202342heatPressureUltraSonicVibrationPadLeadFormationof1stBond(BondPhase)9/21/202343CapillaryrisestoReverseHeightPositionPadLead9/21/202344PadLeadCapillaryrisestoReverseHeightPosition9/21/202345PadLeadCapillaryrisestoReverseHeightPosition9/21/202346PadLeadCapillaryrisestoReverseHeightPosition9/21/202347PadLeadCapillaryrisestoReverseHeightPosition9/21/202348RHPadLeadCapillaryrisestoReverseHeightPosition9/21/202349GoingtoReverseDistancePositionRD(ReverseDistance)PadLead9/21/202350FormationofaLoopPadLead9/21/202351PadLeadFormationofaLoop9/21/202352CalculatedWireLengthWireClampClosePadLeadGoingtoLoopTop9/21/202353CalculatedWireLengthPadLead9/21/202354SearchDelayTrajectoryPadLead9/21/202355PadLeadTrajectoryAtthismoment,starttocheck1stbondstickdetection9/21/202356PadLeadTrajectory9/21/202357PadLeadTrajectory9/21/202358PadLeadTrajectory9/21/202359PadLeadTrajectory9/21/202360PadLeadTrajectory9/21/202361PadLeadTrajectory9/21/202362PadLeadTrajectory9/21/202363PadLeadTrajectory9/21/202364PadLeadTrajectory9/21/2023652ndSearchHeightApproachto2ndSearchHeightPadLead9/21/202366SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition9/21/202367SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition9/21/202368PadLeadheatFormationof2ndBond9/21/202369heatPadLeadFormationof2ndBond(ContactPhase)9/21/202370heatheatPadLeadFormationof2ndBond(BondPhase)9/21/202371TailLengthPadLead9/21/202372TailLengthPadLead9/21/202373TailLengthPadLead9/21/202374TaillengthTailLengthPadLead9/21/202375DisconnectionoftheTailPadLeadAtthismoment,starttocheck2ndbondstickdetection9/21/202376PadLeadDisconnectionoftheTail9/21/202377PadLeadDisconnectionoftheTail9/21/202378FormationofaNewFreeAirBallPadLeadApply5000Vtogeneratethesparktomeltthegoldwire9/21/202379PadLeadFormationofaNewFreeAirBall&BacktoResetPosition9/21/202380ChipInter-connectionUsingWireBonding9/21/202381NexttoMaterial&Tools9/21/202382Material&ToolsLeadFrameCapillaryGoldWireWindowClamp&TopPlate9/21/202383LeadFrame(1)9/21/202384LeadFrame(2)9/21/202385Capillary(1)CapillaryManufacturer(SPT,GAISER,PECO,TOTO…)CapillaryData(Tip,Hole,CD,CA,FA&OR,IC)9/21/202386Capillary(2)Capillariesaretypically1/16"(.0625"/1.587mm)indiameterand.437"(11.10mm)inlength.

9/21/202387HowToDesignYourCapillaryCapillary(3)TIP

PadPitchx1.3~TIPHole

Wirediameter+40%10%CD

Padsize/open/1stBallCD+0.4~0.6=1stBondBallsizeFA&OR

Padpitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15ICtype

looptype9/21/202388Capillary(4)WireDiameter(mil)RecommendedHole(mil)MinRecommendedHole(mil)2.03.02.41.52.21.81.31.81.51.21.71.41.11.61.31.01.51.20.91.21.10.81.00.950.70.90.859/21/202389Capillary(5)MatteFinishenlargesEffectiveFaceandcreatesbetterfrictionwiththegoldwireduringbondformation.PolishFinishprovidessmooth2ndbondandprolongsthecapillarylifespanduetoreducecontaminationaccumulationrate.9/21/202390

CapillaryParameterswhichAffecttheBondingProcess

LoopingFeedholeInnerChamferOuterRadiusandFaceAngle9/21/202391

CapillaryParameterswhichAffecttheBondingProcessSmallerORSharperEdgeLikelihoodofCracksBiggerORReducesCracksReducesEffectiveFaceIncreaseFACompensateSmallerTipAreaHigherCrossSection9/21/202392

CapillaryCondition9/21/202393GoldWireGoldWireManufacturer(MKE,MEM,Nippon,SUMITOMO,TANAKA….

)GoldWireData(WireDiameter,Type,EL,TS)9/21/202394PropertiesofVariousWireTypesPropertyCuAuAlAgElectricConductivity(%IACS)103.173.464.5108.4ThermalConductivity(W/mK)398.0317.9243.0428.0ThermalExpansionCoeff(mm/mK)16.514.223.619.0TensileElasticModulus(GPa)1157862719/21/202395GoldWire(ApplicationofWireType)9/21/202396GoldWire(FreeAirBall)Thediameterofthefree-airballrangesfor1.5times(forsmallballultra-finepitchapplication)to2.5times(forlargeballnon-finepitchapplication)ofwirediameter(WD).

9/21/202397GoldWire(HeatAffectedZone)Sourcefrom:MKElectron9/21/202398GoldWire(ElectricalResistance)Sourcefrom:MKElectron9/21/202399WindowClamp&TopPlate9/21/2023100WindowClampDimension(1)9/21/2023101WindowClampDimension(2)9/21/2023102TopPlateDimension(1)9/21/2023103TopPlateDimension(2)9/21/2023104NexttoBondQuality9/21/2023105BondQualityBasicRequirementforSuccessfulWireBondingBasicMeasurementWirePull&BallShearTestBondFailure9/21/2023106BasicRequirementforSuccessfulWireBondingCleaningProperTemperatureSettingProperForceSettingProperPowerSettingProperClampingProperTooling9/21/2023107CleaningMethodsThemetallizationmustbefreeoforganicandinorganiccontamination.Forexample,fingerprintoilonthebondingareareducesthereliabilityoftheinterconnection.Plasmacleaningiseffectiveforremovingepoxybleed-out,whichiscausedbyoutgassing.Gasestypicallyusedinplasmascanincludecombinationsofargon,nitrogen,hydrogen,oxygen,andotherlesscommongases

UVozonecleaningemitssignificantamountsofradiation(wavelengths1848Aand2537A)toremoveorganiccontaminants.9/21/2023108ProperTemperatureSettingThermosonicbonding–100

C~150

C.Ultrasonicbonding–25

Corambienttemperature.Thermocompressionbonding–300

C~500

C.9/21/2023109ProperPowerSettingToensurequalitybonds,increasethepowersettingwithoutexertingorover-stressingthewire.Youwillknowover-stressingistakingplacewhenthepulltestingdeviceindicatesalowbreak.9/21/2023110ProperClampingMakesuretheunitisproperlyclampedintheworkholder,asitiscriticalthatnomovementtakesplace.Youcanverifythisbynudgingtheobjectwithtweezers.Ifmovementtakesplace,theunitmustbesecuredduringhighspeedbonding.9/21/2023111ProperToolingMakesurethetool(thecapillary)isinfunctionalcondition.Thepropertoolselectionisessentialforconsistentwirebonding.9/21/2023112BasicMeasurementProcessstabilityismeasuredaccordingtothefollowingperformancespecifications:FreeAirBalldiameter(min,max,std,Cpk)Balldiameter&height(min,max,std,Cpk)Loopheight&shape(min,max,std,Cpk)Ballshearforce&Strength(min,Cpk)Wirepullforce(min,Cpk)Ballplacementaccuracy(min,Cpk)Confirmationrun(stability,numberofassists,visualinspection,UPH)Capillarydimensionstolerances(SPECs,effectonprocess,lifetime)Overallprocessfeasibility(cost,demand,timetomarket)9/21/2023113BondPadOpen&BondPadPitchUnit:umorMilBPO:

InternaldimensionofthepadinXandYaxisBPP:

DistanceofthepadcentertotheothernearbypadcenterBondPadPitchBondPadOpenBondPadOpen9/21/2023114BallSizeBallThicknessBallSizeBallSize&BallThicknessUnit:um,Mil

MeasureMagnification:50XBallThicknessCalculateFormula:

60umBPP:WD=50%

60umBPP:WD=40%~50%BallSize=PadSize–6umBondPadPitchWireDiameter9/21/2023115LoopHeightUnit:um,Mil

MeasureMagnification:20XLoopHeight線長9/21/2023116WirePullTestNeckPull WirePull StitchPullDieLead1/3ofwirelengthGoldwire9/21/2023117WirePullTestFactorsaffectingtheF:WirediameterWirelengthLoopheightPadtoleadplanegapProcessHooklocationTestercalibration,accuracyandvacuum9/21/2023118WirePullTestGradeBrokenatReasonQuality1BallLiftBadprocessPoor2BallNeckH.A.Z.Good3WireDependsonconditionVerygood4WeldWelddeformationGood5StitchLiftBadprocessPoor9/21/2023119WirePullTestGoodwedgesizecangiveoutstrong2ndbondAfterstitchpull,thewedgestillremainonlead(2ndbond)9/21/2023120BallShearTestUnit:gramorg/mil²Inter-metallic(Coverageshouldhavemorethan75%,ShearStrength＞6.0g/mil²)SHEARSTRENGTH＝BallShear/Area(g/mil²)BallShear=x;BallSize=y;Area=π(y/2)²x/π(y/2)²=zg/mil²9/21/2023121Inter-metallicatGoldBallPoorcoverage(34%)Goodcoverage(>75%)9/21/2023122Inter-metallicLayerThicknessX=Kt1/2WhereXistheinter-metalliclayerthickness,tisthetimeandKistherateconstantwhichiscalculatedbyfollowing:

K=Ce-E/KT

WhereCistherateconstant,eistheactivationenergy,KistheBoltzmanconstant,andTisthetemperatureinabsolutescale.9/21/2023123CBallbondTestspecimenSpecimenclampShearing

ramWireBondshoulderInterfacialcontact

ballbondweldareaBondingpadh(A)UnshearedCLCBallbondCLTestspecimenSpecimenclampBondingpadFullballattachedtowire-exceptforregions

ofintermetallicvoidingBallseparatedatbondingpad-Ballinterface-residualintermetallic(andsometimesportionofunalloyedballandmetal)onpadinbondinteractionarea(D)Ballbond-bondingpadinterfaceseparation(typicalAutoAl)CTestspecimenSpecimenclampShearingramWireMinorfragmentofball

attachedtowireBondingpadCLBallshearedtoohigh

(offline,etc.)onlya

portionofshoulderand

balltopremovedInterfacialcontact

ballbondweldarea(B)Wire(balltopand/orside)shearCBallbondCLTestspecimenSpecimenclampShearing

ramBondingpadMajorportionofballattachedtowireInterfacialcontact-

ballbondweldareaintact(C)Belowcenterlineshear,ballshearedthrough(typicallyAutoAu)CBallbondCLTestspecimenSpecimenclampBondingpadPadmetallizationseparatesfrom

underlyingsurfaceResidualpadonballball-padinterface

remainsintact(E)BondpadliftsTestspecimenSpecimenclampCBallbondCLBondingpadBondingpadlifts,takingportionofunderlyingsubstratematerialwithit(F)CrateringResidualpadandsubstrateattached

toball,ball-padinterfaceremains

intactShearFailureModes9/21/2023124NormalCondition9/21/2023125MaterialProblem9/21/2023126WithBallWirePadSizeMissingBallWireBrokenBondingBallInspectionBallDetection9/21/2023127BallSizePadCenterBallCenterBallPlacement(X,Y)BallOffPadBondingBallInspection(cont.)BallMeasurement9/21/2023128

Peeling1stBondFail(1)PossibleCauses:PowertoomuchBaseForcenotenoughAlpadnotfullycuredorcontaminationbetweenAlandoxidelayer9/21/2023129

BallLift1stBondFail(2)BallLiftBallLiftWithPadPeelingPossibleCauses:BasePowernotenoughMaterialproblem9/21/20231301stBondFail(3)NeckCrackPossibleCauses:RDtoohighRHtoolowWrong/overusedcapillaryWireClampgaptoosmallWireproblemEFOCurrenttoolarge9/21/2023131OffCenterBallPossibleCauses:TailLengthtoolongWireorWirePathcontaminationEFOBoxorcableconnectionproblemAirTensionerflowtoolow1stBondFail(4)OffCenterBall(GolfBall)9/21/20231321stBondFail(5)SmashBallPossibleCauses:TailLengthtooshortWireorE-torchcontaminationTipoftaillengthswingawayfromE-torchSmashBall9/21/20231331stBondFail(6)MissingBallPossibleCauses:TailLengthtooshortFireLeveltoolowortoohighE-torchtipdirty2ndBondPower/Force/SearchSpeedtoohigh9/21/2023134WithWeldWireCapillaryMarkMissingWeldBrokenWedgeLeadSufficientWedgeWidth&LengthSecureToolImpressionNoFishTailNoDamage/BrokenWedgeBondingWeldInspectionWeldDetection9/21/2023135BrokenWedgePossibleCauses:2ndBondPower/ForcetoohighLeadclampingnotenough2ndBondFail