SMT作业指导课件

SMT作业指导PlacementModuleCoursedescriptionTargetaudience:CMEorCQEthatwillengagecustomerissuesPlacementCourseDescriptionCh-0:CourseDescription[5min]Ch1:PlacementModuleOverview[30min]

DescribeplacementmodulefunctionalityandfeaturesDefinedifferenttypesofplacementequipmentsavailableDescribetheplacementmainsystemsUnderstandtheplacementmodulefuturekeychallengesCh2:SPECOVERVIEW[15min]

Findtheappropriatespecfortheplacementmodule.Navigatethroughthespecanduseitasareferencedocument.EducatehowtounderstandIntelprocessandappliedtheknowledgewhendealingwithcustomers.Ch-3:ProcessControlSystem[20min]UnderstandwhatisProcessControlSystemIdentifyprocesscontrolsystemusedbyplacementmoduleownerPlacementCourseDescriptionCh4:CriticaltoFunctionParameter(CTFP)[20min]

IdentifymajorparameterusedfortheplacementmoduleDefinetheimpactofthemajorparameterCh5:ResponseFlowChecklist(RFC)&CommonFailuremodes[15min]

IdentifycommonfailuremodesforplacementmoduleDescribehowtosolveplacementissuesCh6:CASESTUDYONSJR[15min]TohavebasicunderstandingonBGASJRintermsoffailuremodesandpotentialrootcauses.TodevelopCQEcompetencyinprovidingsomesolutionsorprelimdatacollectiononBGASJRrelatedissues.GlossaryPlacementModuleChapter1PlacementCourseDescriptionOBJECTIVES:Uponcompletionofthistopic,theparticipantwillbeabletodothefollowing:DescribeplacementmodulefunctionalityandfeaturesDefinedifferenttypesofplacementequipmentsavailableDescribetheplacementmainsystemsUnderstandtheplacementmodulefuturekeychallengesIntelMalaysiaTechnicalTrainingwebsitehttp://pgswebtrg01/hrtweb/index.asp

Topick&placeSurfaceMountTechnology(SMT)componentsaccuratelyatpredefinedlocationonPrintedCircuitBoard(PCB)surfaceintheautomatedprogrammablesequencesPlacementMachineFunctionNozzle2typesofPlacementequipmentsingeneral:ChipShooterForsmallinexpensivecomponentplacementwithhighspeedFinePitchPlacerForfinepitchQFP&BGAcomponentplacementwithmediumtohighspeedNo.ComparisonItemsChipShooterFinePitchPlacer1ComponentSizeSmall=>MediumMedium=>Large2ComponentTypeDiscreetpassive,SOT,SOICFinepitchQFP,BGA,CSP3PlacementSpeedFastMedium4AccuracyMedium(+/-0.1mm/4mils)High(+/-0.025mm/1mils)PlacementEquipmentTypesUniversalGSMPhillipsTopazFujiCP7SanyoPanasonicMSFChipShooterFinePitchPlacerPanasonicMSRPanasonicMPAGJukiKE2060UniversalHSPFujiXPFujiQPFujiXPPhillipsAssembleonFCMPhillipsAssembleonACMSiemensHSPlacementEquipmentModelsTurretHeadPartSupplyNozzleCameraTape&ReelFeederNozzleHeadPlacementSystemPicturesTrayCHIPResistorCHIPCapacitorSOICSmallOutlineIntegratedCircuitQFPQuadFlatPackRectangularTSOPTypeIIThinSmallOutlinePackageDRAMSmallOutlineJLeadedComponentTypePicturesSimple,EasytoUse

ConsistentSampleHandling

LowCost

Reliable

CompetitiveAdvantage

GreaterThroughput

IncreasedProductivity

SmallFootprint

PlacementAdvantagesLocatedafterthesolderpastemoduleinSMTprocessPlaceComponentFinalAssemblyScreenPrintSolderPasteReflowSolderWaveSolderingTestProbeComponentTestPackPlacementLocationInSMTProcessWhichonebelowisnotthetypeofcomponentsplacedbyplacementequipment?1:SOIC2:QFP3:THM3:THM

No.SystemPurposeVariables1ConveyorTotransportboardsin&outforpartplacementIn,Main,Out2PartSupplyTofeedpartforpick&placeTape&Reel,Tray,Bulk,Tube3Pick&PlaceTopick&placepartonboardsTurret,OverheadGantry,MassiveParallel4VisionTorecognize&alignpartsBacklight,Frontlight,SideChipShooterPartSupplyFinePitchPlacerPlacementSystemoverviewNo.ItemsTape&ReelTrayTubeBulk1ComponentTypePassives,SOIC,PLCCLeaded,BGA,CSPPLCC,SOICPassives2ComponentQuantityLarge(10K-15K)Medium(8-150parts/tray)Least(10-20parts/tube)VeryLarge(10-30K)3UsageHVMHVM/DevelopmentDevelopmentHVM4BeatrateHighMediumLowHigh4typesofpartsupplysystemingeneral:Tape&ReelTrayTubeBulkPartSupplySystemComparisonFeederTable3typesofpick&placesystemsingeneral:(1)TraditionalTurretSystemAseriesofidenticalrotatingheads(2)TraditionalGantry-StylePick&PlaceEmployX&Y-axisbeamstomoveaplacement"head"toaspecificlocationoveraprintedcircuitboard(PCB)thatisclampedintoafixedpositionpriortoplacement(3)MassivelyParallelSystemSeriesofsmall,individualplacementsectionFeederTableFeederTableFeederTablePick&PlaceSystemComparison321#ItemsTraditionalTurretSystemTraditionalGantry-StylePick&PlaceMassivelyParallel1HeadMovementFixedrotatingMovableMovable2HeadStructureCircularmultiplehead1or2headsMultiplesinglehead3PartSupplyMovementMovableStationaryStationary4TableMovementMovableStationaryStationary5Odd-formCapabilityNoneGoodGood6PlacementSpeedFastLowMedium7ChipPlacementGoodGoodBest8ActiveComponentPlacementPoorBestGood9FlexibilityMediumBestMediumPick&PlaceSystemComparisonNo.ItemsBacklightFrontlightLaser1LightSourceFromTopFromBottomFromSide2ScanningMethodTopOutlineBall/LeadSideOutline2AccuracyGoodBestGood3ApplicableComponentPassivesLeaded/BGA/CSPPassive3typesofvisionsystemingeneral:BacklightFrontlightLaserVisionSystemComparisonNo.ProcessStepPurpose1BoardTransport-InTransportboardintomachineforpartplacement2BoardPositioningHoldboardfirmlyinposition3FiducialScanningIdentifyactualboardlocation4PartIn-PositionPartisreadyinpickupposition5PartPickupPickuppart6PartRecognitionRecognizethepickuppart7PartAlignmentAlignpartplacementifoffseted/skewed8PartPlacementPlacepartonboard9BoardTransport-OutTransportboardoutofmachineafterpartplacementComponentPlacementProcessStepsstep1Step3ComponentPlacementProcessStepsStep5Step8SimulationKeyChallenges0402or0201technologyforsmallercomponentthatcancontributetohighertombstone/missingcomponent.

Placementaccuracy&ballrecognitioncapabilityforfinepitchcomponentsThinnerandsmallerboards.Ex:SmallformfactorOddformorshapecomponentNewpackagingforI/OdevicesuchBGA,chipscalepackage(CSP)andflipchipChapter1Quiz1)WhereistheplacementmodulelocatedafterintheSMTprocessflow?A–ScreenPrint C-TestB–Reflow D–WaveSoldering2)WhichcomponentbelowisnotplacedontothePCBbytheplacementmachine?A–Caps C-THMB–Transistor D–Resistor3)Whichonebelowisnotthetypesofplacementpartsupplysystem?A–Tape&Reel

C–FootPrintB–Tray D–TubeA–ScreenPrintC-THMC–FootPrintREVIEW&SUMMARYAplacementisaequipmentwhichpickupSurfaceMountcomponentandplacesthemonaPrintedCircuitBoard(PCB)2differenttypeofPickandPlacementmoduleChipshooterFinepitchLocatedafterthescreenprintmoduleintheSMTprocessflowPlacementmainsystemconsists:ConveyorsystemPartsupplysystemPick&placesystemVisionsystemDifferenttypesofplacementmodulesavailableareFujiCP6,IP3,Universal,Phillipsandetc.Keychallengesareonsmaller,finepitch&oddshapepartplacementEndofChapter1Appendix1:Non-GridArrayPlacementEquipmentCapabilityEquipmentSupplierModel#Software/FirmwareVersionBallRecognitionCapable%BallPresenceInspectionCorrectPolarityDetectionCommentsFujiNP-251N/AYES100%YESFujihasprovidedthePDfilestoIntelfordist.toourcustomers.FujiQP-341/351N/AYES100%YESFujiQP-242Cam#7YES100%YESFujiQP-242Cam#4YES50%YESInadequatelighting.FujiIP-III4800/cam12YES100%YESMCSnotcapable.NeedF4Gorlater.FujiIP-III4400/cam13YES100%YESPanasonicMSFN/APartial<10%YESCurrentequipmentcanonlyinspecttheperimeterarray.Panasonicwilldevelop100%ballinspectionforMSF&MPAV2machinesforacharge–1monthleadtime.PanasonicCM402N/APartial<10%YESPanasonicMPAV2A/BN/APartial<10%NOPanasonicMPAV2N/APartial<10%NOPanasonicMPAVN/APartial<10%NOUniversalGSM1N/APartial<10%NOCenterarrayonlyunlesspurchaseUPS+software&hardwareupgrades.UniversalGSM2N/APartial<10%NOSiemensF4/F5N/AYES100%YESGFFileavail.32mmFOV4images/2secperpartPlacementProcessSpecOverviewChapter2PlacementProcessSpecCourseDescriptionOBJECTIVES:Uponcompletionofthistopic,theparticipantwillbeabletodothefollowing:Findtheappropriatespecfortheplacementmodule.Navigatethroughthespecanduseitasareferencedocument.EducatehowtounderstandIntelprocessandappliedtheknowledgewhendealingwithcustomers.IntelMalaysiaTechnicalTrainingwebsitehttp://pgswebtrg01/hrtweb/index.aspThepurposeofspecistoprovideguidelinesonhandlingequipmenttoensureconsistentpracticesamongdifferentusersEachrespectiveSMTmodulewillhaveitsownspecsAtypicalmodulewillhaveOperationandPreventingMaintenance(PM)specSpecsareusuallybreakdownintoseveralsectionsTypically,eachmodulespecswillconsistofpurposeorscope,safety,procedureoroperationandqualityassurance.SomespecsalsoconsistRFCandblockdiagramavailableintheappendix.SpecOverviewPlacementspecsuse13sectionsspecformatSpecisdividedinto3categories:Process/OperationSpecPreventiveMaintenanceSpecMetrologySpecPlacementSpecNo.CategorySpec#TitleDescription1Process78-8075FujiCP6SeriesProcessSpecforComplexProductsOperating&ProcessspecforFujiCP6equipment2Process78-8074FujiIP3ProcessSpecforComplexProductsOperating&ProcessspecforFujiIP3equipment3PM78-8078FCP6&FCP-642HighSpeedChipPlacerPMSpecPreventiveMaintenanceProceduresforFCP6&FCP-642equipment4PM78-8077FujiFIPIIIDualHeadChipPlacerPMSpecPreventiveMaintenanceProceduresforFujiFIPIIIequipment5Metrology78-8073PartVerificationSystemOperatingProcedureOperatingprocedureforPVS6Metrology78-8120SJ-10PlacementAccuracyMeasurement&ComponentInspectionOperationProcedureSpecOperatingproceduresforSJ-10PlacementSpecApplyingforSmartSpaceaccount?ToapplyforasmartspaceaccountyoucaneitherAttendtheVspecdocumentumclass.Duringtheclass,youwillbegivenanaccount.Theaccountwouldenabletoviewandmakeanychangesonthespec.http://cdcvdctm001iis/rs-bin/RightSite.dll/ssi3Or,ifyoujustwanttoviewthespecs,youcangoto/rs-bin/rightsite.dll/ssi4andjustloginasavisitor.Inthenextexercise,youwillneedtoopentheFujiIP3Processspec(spec#78-8074)&answerafewquestions.DocumentSystemAccessingyourspecClickURL/rs-bin/rightsite.dll/ssi4

ClickthenameoftheDocbasetowhichyouwanttoconnect.Inthisexercise,youcanchooseSM_DMIS_KulimTypeyourusername.Typeyourpassword.*Note:Ifyoudon’thaveanyaccessyoucanclickthe“FORCONSUMERS”buttontologin.ClickLogIn.AccessingyourspecOnceyoulogin,youwillseealistofcontents.ClicktheIPMfolder.Youcanalsotrytoclicktootherfolderinyourfreetime.WhenyouareattheIPMfolder,youcanclickattheengineeringcabinet.AccessingyourspecThen,intheEngineeringfolderclicktheSMTD-Mfolder.ThisisfollowedbyclickingtheMTD-Mfolder.ThiswouldbringtoMTDMequipmentspecarchiveAccessingyourspecClickFujiIP3Processspec(spec#78-8074)Note:Anothersimplewayistoperformasearchtolocatespec#78-8074InwhatsectioncanyoufindthePERSONALPROTECTIVEEQUIPMENT.Section____.____NametwoPersonalprotectiveequipmentrequired

2.InwhatsectioncanyoufindtheTrouble-shootingsectionSection____.____3.ForQualityCharacteristicskew,missing,wrongorientation,extraparts,wrong/mixingpartswhataretheTriggerlimit:____.____Responseneeded:____.____SpecexerciseREVIEW&SUMMARYEachmodulespecswillconsistofpurposeorscope,safety,procedureoroperationandquality.Placementspecsuse13sectionsspecformatSpecisdividedinto3categories:Process/OperationSpecPreventiveMaintenanceSpecMetrologySpecThesedocumentarebasedaturlhttp://cdcvdctm001iis/rs-bin/RightSite.dll/ssi3&wouldenableusertoviewandmakeanychangesonthespec.Thesedocumentarebasedurl/rs-bin/rightsite.dll/ssi4wouldenableusertoonlyviewthespecs,byjustloginasavisitor.ApendixWhatCanYouDoinSmartSpace?SmartSpaceIntranetletsyouworkwithdocumentsthatareinyourDocumentumDocbasesthroughstandardgraphicalWebbrowsers.Youcan:NavigatethecabinetandfolderhierarchyofanyDocbaseEditandviewdocumentcontentCheckdocumentsinandoutViewdocumentattributesViewrenditions(differentformats)ofyourdocuments,includingPDFandHTMLViewannotationsmadeonPDFdocumentsSearchforobjectsbasedonattributesandcontentToaccessthespec,ausercanusedocumentumsystem.ThedocumentumisaworldwidetoolandcurrentlyisavailablewithSmartSpaceIntranetSometimesitisalsocalledDocbases.TheDocumentumFeaturesLetsusersstoreobjectsofanykind—text,graphics,scannedimages,evensoundanddigitalmovies.Whenyouwanttomodifyadocument,youcancheckitoutadocument.Whenyoucheckthedocumentback,yourchangesaresavedtotheDocbaseIfsomeonechecksthedocumentout,itcontainsthechangesyou'vemade.ApendixApendixPlacementModuleProcessControlSystemChapter3CourseDescriptionOBJECTIVES:Uponcompletionofthistopic,theparticipantwillbeabletodothefollowing:UnderstandwhatisProcessControlSystemIdentifyprocesscontrolsystemusedbyplacementmoduleownerIntelMalaysiaTechnicalTrainingwebsitehttp://pgswebtrg01/hrtweb/index.aspOn-line,realtimesystemforidentifying&respondingtoprocessorequipmentproblemsIncorporatesthetraditionalworkingelementsofSPC-measurementsystem,controlcharts,trendrules+responseflowchecklists(RFC)/troubleshootingguidesPCS=SPC+RFCReducevariation,achievestability&ensurepredictableoutputNo.ItemsDescriptionMetrologyUsed1ComponentCheckVerifycorrectpartplacement,alignment,orientation&missingMachineVisionSystem2ProgramCheckVerifycorrectprogramisloadedMachineCheck3FeederCheckVerifycorrectfeedersareloadedPartVerificationSystem(PVS)4AttritionLossPartsthrownorscrappedMachineComputerSystem(MCS)5NozzleBendEnsurethenozzlesareatgoodconditionmeetingspecNozzleCenteringCheckComponentCheckToverifyforcorrectpartplacement,alignment,orientation&missingPartsafterpickuparetransferredthroughmachinevisionsystemforpartidentificationbeforemountingProgramCheckToverifycorrectpartplacementprogramisloadedPerformwheneverworkorderchangeorshiftchangeFeederCheckToverifycorrectfeederwithcorrectpartsareloadedincorrectdevicelocationExample:0804feederfor0402passivePN#A36945-001inD24AttritionLossToensurepartarenotthrownorscrappedexcessivelyGenerally,attritionlosstargetis<1%NozzleBendToensurenozzleisingoodconditionforpartpickup&placementmeetingthespec.Generally,nozzlebendlimitisset<0.1mmWhichonebelowisnotanitemusedunderPCSforplacementmodule?1:ComponentCheck2:BacklightVisionSystem3:AttritionLoss2:BacklightVisionSystemChapter3Quiz1)Whatistherealtimesystemthatisusetoidentify&respondtoprocessorequipmentproblemsA–RFC C-SPCB–PCS D–AOI2)Whichbelowisnotthecommonmeasurementorvariableforplacementmodule

A–FeederCheck C–Attritionloss B–ProgramCheck D–Overheadgantry-style3)_____isusedtocollectsmachineattritionlosswhiletheplacementmoduleisrunning.A–AOI C-MCSB–PC2M D–GlassplateB–PCSD-Overheadgantry-styleC-MCSREVIEW&SUMMARYProcessControlSystem(PCS)isarealtimesystemforidentifying&respondingtoprocessorequipmentproblemsTheendresultofPCSaretoestablishameasurementcapabilityandselectvariabletobemonitoredforacertainprocessThecommonPCSmeasurementorvariableforplacementmoduleareComponentCheckProgramCheckFeederCheckAttritionLossNozzleBendPlacementCriticaltoFunctionParameter(CTFP)Chapter4CourseDescriptionOBJECTIVES:Uponcompletionofthistopic,theparticipantwillbeabletodothefollowing:IdentifymajorparameterusedfortheplacementmoduleDefinetheimpactofthemajorparameterIntelMalaysiaTechnicalTrainingwebsitehttp://pgswebtrg01/hrtweb/index.aspNo.CTFParametersCritically1PartDataAllrequiredinfoforthepartforrecognition2VisiontypeAffectaccuracy3FeederTypeAffectpartpickupperformance4NozzletypeAffectpartpick&placeperformance5NozzlebendlimitAffectpartplacementaccuracy6BoardsupporttypeAffectpartplacementquality7Firmware/SoftwarerevisionAffectpartplacementperformance8AirSupply/VacuumPressureAffectpartpick&placecapability&stability9MachineZ-HeightAffectpartpick&placequalityPartDataDetailsofpartthathelpmachinetorecognizethepickuppartVisionTypeDifferentpartwillneeddifferentvisiontypetorecognizepartRectangular-resistor&capacitorLeaded–QFP,SOTFeederTypeDifferentpartrequiredifferentfeedertype0402passives–0804feederChipset–5612feederNozzleTypeDifferentpartrequiredifferentnozzleforpickup1mmroundnozzle–0603passive7mmroundnozzle–BGAMechanicalchuck–OddShapeConnectorNozzleBendLimitNozzlebendlimitneedtobecontrolledtobe<0.1mmforaccuratepartplacementBoardSupportTypeToprovideflatboardsurfaceforpartplacementFirmware/SoftwareRevisionRefertothecapabilityofthemachineBallscanningenabled/disabledAirSupply/VacuumPressureToensurepartispickup&placedfirmlyMachineZ-HeightToenablegoodpartpickup&placementbypreventingnozzleoverorunderpressingonpartChapter4Quiz1)WhichoftheparameterbelowisNOTusetoensurequalityoutput?A–SolderPaste C–FeederTypeB–VisionType D–NozzleType3)Whichonebelowcontainsalltherequiredinfofortheparttoberecognizedbymachine?A–MachineData C–PartDataB–FeederData D–VisionData4)Whichtypeofnozzleisusedtopickupoddshapeconnector?A–Round C-RectangularB–MechanicalChuck D–OvalA–SolderPasteC–PartDataB–MechanicalChuckREVIEW&SUMMARYCTFPisameasurementusedtodeterminewhethertheplacementmoduleparameterwillprovidequalityassemblyoutput.Forplacementmodule,hereareseveralparameteristoensurecomponentplacementqualityassemblyoutput.

PartDataVisionTypeFeederTypeNozzleTypeNozzleBendLimitBoardSupportTypeFirmware/SoftwareRevisionAirSupply/VacuumPressureMachineZ-HeightPlacementModuleResponseFlowChecklist&CommonFailuremodes

Chapter5PlacementModuleResponseFlowChecklist&CommonFailuremodes

CourseDescription

OBJECTIVES:Uponcompletionofthistopic,theparticipantwillbeabletodothefollowing:IdentifycommonfailuremodesforplacementmoduleDescribehowtosolveplacementissuesIntelMalaysiaTechnicalTrainingwebsitehttp://pgswebtrg01/hrtweb/index.aspNo.CommonFailureModesRootCausePossibleSolution1MissingpartIncorrectnozzleused,nozzledamaged,incorrectpartpickedup,wrongfeederused,incorrectPartDatausedUsecorrectnozzle,replacewithnewnozzle,loadincorrectpart,usecorrectfeeder,usecorrectPartData2Shift/skewIncorrectnozzleused,nozzlebend,machineaccuracyisout,incorrectpartpickedup,wrongfeederused,incorrectPartDatausedUsecorrectnozzle,replacewithnewnozzle,recalibratemachine,replacewithcorrectpart,usecorrectfeeder,usecorrectPartData3MisorientatedIncorrectpartplacementangle,incorrectincomingpartorientationPlacepartperorientationspecified,replaceincomingpartwithcorrectpartorientation4TombstonePartplacementoffsetImproveplacementaccuracy5WrongpartWrongpartloadedLoadincorrectpart6DamagedpartNozzlehit,defectiveincomingmaterialChangePartDatatocorrectsetting7HighattritionlossWrongnozzleused,nozzledamaged,wrongpartpickedupUsecorrectnozzle,replacenozzle,replacewithcorrectpartPlacementCommonFailureModesWrongComponentDamagedComponentMissingComponentBentLeadLiftedLeadShift/SkewTombstonePlacementCommonFailureModesPicturesMissingPartIncorrectnozzleused–ie.Nozzle1mmfor0402passivevs1.3mmNozzledamagedduetohitorbendduringmachineoperationIncorrectpartpickup–ie.0603passivevs0402passiveWrongfeederused–ie.0804feedervs1208feederIncorrectPartDataused–ie.OutlinevsleadscanningShift/SkewIncorrectnozzleused–ie.Nozzle1mmfor0402passivevs1.3mmNozzlebendduetohitorbendduringmachineoperationMachineaccuracyisoutduetomachinenotcalibratedIncorrectpartpickup–ie.0603passivevs0402passiveWrongfeederused–ie.0804feedervs1208feederIncorrectPartDataused–ie.OutlinevsleadscanningMisorientatedIncorrectpartplacementangle–ie.0vs90degreeIncorrectincomingpartorientation–ie.0vs90degreeDetailsTombstonePartplacementoffset–ie.Partplacedcenteredor10milsoffWrongPartWrongpartloaded–iePN#A22222-002vsPN#A77777-002DamagedPartNozzlehitDefectiveincomingmaterialHighAttritionLossWrongnozzleused–ie.1mmvs2.5mmNozzledamagedWrongpartpickup–ie.PN#A22222-002vsPN#A77777-002DetailsWhichbelowisnotthetypeofcommonfailureforplacementmodule1:Missingpart2:Bridgingpart3:Tombstonepart2:BridgingPartChapter5Quiz1)WhichbelowisnotatypicaltypeofcommonfailureforplacementmoduleA–Solderbridging C–Shift/SkewPartB–WrongPart D–Tombstone2)Forwrong/mixingpart,afteryouhavecheckinMAI,thenyouwillneedtoA–Checkfeedercondition C–CallLineEngineerB–Checkfeedersetup D–Checkprogram3)Whatisnotthecauseforhighattritionloss?

A–Wrongnozzle

C–IncorrectpaddesignB–Wrongpart D–NozzledamagedA–SolderbridgingB-CheckfeedersetupC–IncorrectpaddesignREVIEW&SUMMARYRFCisacommonprocessusedIntelmanufacturingtoidentifythesolutionforacertainfailurebyperformingastepbystepanalysis.Typically,thecommonfailureandRFCinformationareusuallyavailableattheendofeachmodulespecTop7failurescommonlyfoundonplacementmoduleare:MissingpartsShift/SkewartsMisorientationTombstoneWrongpartsDamagedpartsHighattritionlossBACKUPShift/SkewPartsUsuallyisbecauseofthealignmentofthepartsisnotaccuratelyplacetothePCB.FollowtheRFCbelowtoidentifythesolutionShift/SkewPartsMissingPartsUsuallyisbecauseofthenozzlecentering/pickuporsolderpasteFollowtheRFCbelowtoidentifythesolutionMissingPartsDamagePartsUsuallyisbecauseoftheincomingorpartoverpressed.FollowtheRFCbelowtoidentifythesolutionDamagePartsTombstoneUsuallyisbecauseofthealignmentofthepartsisnotaccurate.FollowtheRFCbelowtoidentifythesolutionTombstoneBGASolderJointReliability(SJR)Chapter6BGASolderJointReliability(SJR)

CourseDescriptionOBJECTIVES:Uponcompletionofthistopic,theparticipantwillbeabletodothefollowing:TohavebasicunderstandingonBGASJRintermsoffailuremodesandpotentialrootcauses.TodevelopCQEcompetencyinprovidingsomesolutionsorprelimdatacollectiononBGASJRrelatedissues.IntelMalaysiaTechnicalTrainingwebsitehttp://pgswebtrg01/hrtweb/index.aspBGASolderJointReliabilityThismodulecoverssolderjointreliability(SJR)issuesonIntelBGApackagesdetectedfromtest.Visualfailuresarenotincluded.Theyarecategorizedinfailuremodes(namingusingpreviousBGAOpenTF).Potentialrootcauseareaswereidentifiedbasedonthepreviouslearning.BGAFailureModes&PotentialRootCauseModePotentialRootCauseAreasAReflowBPCBCAllProcessesInvolvingTemperatureDPackageAssembly,HandlingFReflow,PCBGMechanicallyInduced(e.g.Handling,ICT,etc),Package&BoardDesignHPackageDesign,Handling,PCB*ModeEwaseliminatedduringre-categorization.ModeA:ColdSolderJointSignature:SolderpastenotreflowingtoBGAballAppearanceofneckingwitharoughBGAsurfaceGrainystructureinsolderpaste–differentfromstructuresinBGAPotentialareasoffailure:LowreflowpeaktemperatureReflowovenexcursionBlowerprotectionisrequiredasaCTFinreflowprocessBGAOpenFailure-ModeANeckingRoughsurfaceModeB:Non-wettingonPadSignature:Non-solderableinterfacebetweenPCBpadandBGAballSolderpastewettedtoBGAball,butnottoPCBpadPotentialareasoffailure:Non-PORreworkatPCBsuppliersresultingincontaminatedBGApadswithsoldermask.CorrectiveAction:Nolaserreworkorre-applicationofsoldermasktotheBGAareaisallowed.Improperwickingprocessinrework(boardassemblyfactory)resultingtonon-solderablesurface.Solderpadoxidation,fingerprintcontamination,and/orotherorganiccontamination.BGAOpenFailure-ModeBModeC:BallDropSignature:BGAsolderballdewetfromBGAcomponent-sidepadwithroundedtopsand/orflattopsFailureMechanism:TopsideBGAcomponentsolderballsaresofteningand/ormeltingduringthewavesolderpre-heatprocessThermo-mechanicalforcescausetheBGAcomponentsubstratetobepulledawayfromtheboardduringthewavesolderprocessExcesssurfacetensionduringactual“wavesolder”appliedtoa“softened”ormeltedBGAsolderjointThesetwofactorsoccurringtogetherareresultingintheBGAsolderballtodewetfromtheBGAcomponentlandandto“drop”,creatingtheopenjointPo