電子行業國際標準目錄

IPC目录大全-CollectedbyJieley

"一,设计(Design)部分"

IPC-M-106TechnologyReferenceforDesignManual设计技术手册

IPC-2220DesignStandardSeries设计标准系列手册

IPC-2221AGenericStandardonPrintedBoardDesign印制板设计通用标准

IPC-2222SectionalStandardonRigidOrganicPrintedBoards刚性有机印制板设计分标准

IPC-2223SectionalDesignStandardforFlexiblePrintedBoards挠性印制板设计分标准

IPC-2224SectionalStandardofDesignofPWBforPCCardPC卡用印制电路板分设计分标准

IPC-2225SectionalDesignStandardforOrganicMultichipModules(MCM-L)andMCM-LAssemblies有机多芯片模块(MCM-L)及其组装件设计分标准

IPC-2226SectionalDesignStandardforHighDensityInterconnect(HDI)PrintedBoards高密度互连(HDI)印制板设计分标准

IPC-7351GenericRequirementsforSurfaceMountDesignandLandPatternStandard表面贴装与焊盘设计的通用标准

IPC-SM-782ASurfaceMountDesignandLandPatternStandard--IncludesAmendments1&2表面安装设计及连接盘图形标准(包括修订1和2)

IPC-EM-782SurfaceMountDesign&LandPatternStandardSpreadsheet表面安装设计及连接盘图形标准

IPC-D-859DesignStandardforThickFilmMultilayerHybridCircuits厚膜多层混合电路设计标准

IPC-1902IPC/IECGridSystemsforPrintedCircuitsIPC/IEC印制电路网格体系

SMC-WP-004DesignforSuccess成功的综合设计分析手册

IPC-PWB-EVAL-CHPrintedCircuitBoardDefectEvaluationChart印制板缺陷评估图册

IPC/JPCA-2315DesignGuideforHighDensityInterconnects&Microvias高密度互连(HDI)和微通孔设计指南

IPC-2615PrintedBoardDimensionsandTolerances印制板尺寸和公差

IPC-A-311ProcessControlsforPhototoolGenerationandUse照相版制作和使用的过程控制

IPC-D-279DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies高可靠表面安装印制板组装件技术设计导则

IPC-D-310CGuidelinesforPhototoolGenerationandMeasurementTechniques照相版制作指南和测量技术

IPC-D-322GuidelinesforSelectingPrintedWiringBoardSizesUsingStandardPanelSizes使用标准在制板尺寸的印制板尺寸选择指南

IPC-D-422DesignGuideforPressFitRigidPrintedBoardBackPlane压配合刚性印制背板设计指南

IPC-PWBADV-SG02(HARDCOPY)

IPC-PWBADV-CD(CD)PCBAdvancedDesignerCertificationStudyGuide印制电路板高级设计师证书学习指南和多媒体光盘

IPC-PWB-CRT-SG01(HARDCOPY)

IPC-PWB-CERTCD1(CD)PCBDesignerCertificationStudyGuide印制电路板设计师证书学习指南和多媒体光盘

"IPC-2531StandardRecipeFileFormatSpecificationSMEMA发布:标准""菜单""(过程控制)文件格式规范注:SMEMA{TheSurfaceMountEquipmentManufacturersAssociationmergedwithIPC}"

IPC-2541GenericRequirementsforElectronicsManufacturingShopFloorEquipmentCommunication电子制造车间现场设备信息沟通(CAMX)通用要求

IPC-2546SectionalRequirementsforSpecificPrintedCircuitBoardAssemblyEquipment特殊印制板组装设备分要求

IPC-2547SectionalRequirementsforShopFloorElectronicInspectionandTestEquipmentCommunication车间现场电子检验及测试设备信息沟通分要求

IPC-2571GenericRequirementsforElectronicsManufacturingSupplyChainCommunication-ProductDataeXchange(PDX)电子制造供应链信息沟通分要求产品数据交换

IPC-2576SectionalRequirementsforElectronicsManufacturingSupplyChainCommunicationofAs-BuiltProductData–ProductDataeXchange制成态产品-产品数据电子制造供应链信息沟通分要求

IPC-2578SectionalRequirementsforSupplyChainCommunicationofBillofMaterialandProductDesignConfigurationData-ProductDataeXchange材料单及产品设计构造数据-产品数据交换供应链信息沟通分要求

IPC-2511AGenericRequirementsforImplementationofProductManufacturingDescriptionData&TransferMethodology实施产品制造数据描述及其传输方法学的通用要求

IPC-2501DefinitionforWeb-BasedExchangeofXMLDataXML数据网络交换定义

IPC-2511BGenericRequirementsforImplementationofProductManufacturingDescriptionData&TransferXMLSchemaMethodology实施产品制造数据描述及其网络传输方法学的通用要求

IPC-2512ASectionalRequirementsforImplementationofAdministrativeMethodsforManufacturingDataDescription实施制造数据描述管理方法的分要求

IPC-2513ASectionalRequirementsforImplementationofDrawingMethodsforManufacturingDataDescription实施制造数据描述绘制方法的分要求

IPC-2514ASectionalRequirementsforImplementationofPrintedBoardManufacturingDataDescription实施印制板制造数据描述的分要求

IPC-2515ASectionalRequirementsforImplementationofBare-BoardProductTestingDataDescription实施裸板成品测试数据描述的分要求

IPC-2516ASectionalRequirementsforImplementationofAssembledBoardProductManufacturingDataDescription实施已组装板制造数据描述的分要求

IPC-2517ASectionalRequirementsforImplementationofAssemblyIn-CircuitTestDataDescription实施组装件在线测试数据描述的分要求

IPC-2518ASectionalRequirementsforImplementationofPartsListProductManufacturingDataDescription实施零部件制造数据描述的分要求

IPC-D-356BBareBoardElectricalTestDataFormat裸基板电检测的数据格式

"二,印制电路板(PrintedCircuitBoards)"

IPC-M-105RigidPrintedBoardManual刚性印制板设计手册

IPC-D-325ADocumentationRequirementsforPrintedBoards印制板设计文件图册要求

IPC-PE-740ATroubleshootingforPrintedBoardManufactureandAssembly印制板制造和组装的故障排除

IPC-6010SeriesIPC-6010QualificationandPerformanceSeriesIPC-6010印制电路板质量标准和性能规范系列手册

IPC-6011GenericPerformanceSpecificationforPrintedBoards印制板通用性能规范

IPC-6013-KQualification&PerformanceSpecificationforFlexiblePrintedBoards(IncludesAmendment1)挠性印制板的鉴定与性能规范(包括修改单1)

IPC-6016Qualification&PerformanceSpecificationforHighDensityInterconnect(HDI)LayersorBoards高密度互连(HDI)层或印制板的鉴定与性能规范

"IPC-6012A-AMQualificationandPerformanceSpecificationforRigidPrintedBoards,IncludesAmendment1刚性印制板的鉴定与性能规范(包括修改单1)"

IPC-6018AMicrowaveEndProductBoardInspectionandTech微波成品印制板的检验和测试

IPC-6015Qualification&PerformanceSpecificationforOrganicMultichipModule(MCM-L)MountingandInterconnections有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范

IPC-A-600FAcceptabilityofPrintedBoards印制板验收条件

IPC-QE-605APrintedBoardQualityEvaluationHandbook印制板质量评价

IPC-QE-605A-KITHardCopyandCD印制板质量评价书和光盘(CD)

IPC-HM-860SpecificationforMultilayerHybridCircuits多层混合电路规范

IPC-TF-870QualificationandPerformanceofPolymerThickFilmPrintedBoards聚合物厚膜印制板的鉴定与性能

IPC-ML-960QualificationandPerformanceSpecificationforMassLaminationPanelsforMultilayerprintedBoards多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范

IPC-TR-481ResultsofMultilayerTestsProgramRoundRobin多层印制板联合试验计划结果

IPC-TR-551QualityAssessmentofPrintedBoardsUsedforMountingandInterconnectingElectronicComponents用于电子元件安装与互连的印制板质量评价

IPC-TR-579RoundRobinReliabilityEvaluationofSmallDiameterPlatedThroughHolesinPCBs印制板中小直径镀覆孔可靠性评价联合试验

IPC-4552SpecificationforElectrolessNickel/ImmersionGold(ENIG)PlatingforPrintedCircuitBoards印制电路板表面非电镀镍/沉金规范

IPC-DR-572DrillingGuidelinesforPrintedBoards印制板钻孔导则

IT-95080Improvements/AlternativestoMechanicalDrillingofPCBVias印制板通孔机加工方案的改进和优选手册

IPC-NC-349ComputerNumericalControlFormattingforDrillersandRouters钻床和铣床用计算机数字控制格式

IPC-SM-839Pre&PostSolderMaskApplicationCleaningGuidelines施加阻焊前及施加后清洗导则

IPC-HDI-1HighDensityInterconnectMicroviaTechnologyCompendium高密度(HDI)互连微通孔技术纲要

IPC/JPCA-4104SpecificationforHighDensityInterconnect(HDI)andMicroviaMaterials高密度互连(HDI)及微导通孔材料规范

IPC-6016Qualification&PerformanceSpecificationforHighDensityInterconnect(HDI)LayersorBoards高密度互连(HDI)层或印制板的鉴定与性能规范

"IPC/JPCA-6801IPC/JPCATerms&Definitions,TestMethods,andDesignExamplesforBuild-Up/HighDensityInterconnection积层/高密度互连的术语和定义,试验方法与设计例"

IPC-DD-135QualificationTestingforDepositedOrganicInterlayerDielectricMaterialsforMultichipModules多芯片组件内层有机绝缘材料的鉴定试验

"IT-96060HighDensityPCBMicroviaEvaluation(OctoberProject),PhaseI,Round1高密度印制板微通孔评价指标手册,第一期第一版"

"IT-97071HighDensityPCBMicroviaEvaluation,PhaseI,Round2高密度印制板微通孔评价指标手册,第一期第二版"

"IT-30101HighDensityPCBMicroviaEvaluation,PhaseI,Round3高密度印制板微通孔评价指标手册,第一期第三版"

IT-98123MicroviaManufacturingTechnologyCostAnalysisReport微通孔制作技术成本核算报告

IPC-2141ControlledImpedanceCircuitBoards&HighSpeedLogicDesign控制阻抗电路板与高速逻辑设计

IPC-2252DesignGuideforRF/MicrowaveCircuitBoards射频/微波电路板设计指南

IPC-4103SpecificationforBaseMaterialsforHighSpeed/HighFrequencyApplications高速高频用基材规范

IPC-6018AMicrowaveEndProductBoardInspectionandTest微波成品印制板的检验和测试

IPC-D-317ADesignGuidelinesforElectronicPackagingUtilizingHighSpeedTechniques采用高速技术电子封装设计导则

IPC-M-102FlexibleCircuitsCompendium挠性电路纲要

IPC-4202FlexibleBaseDielectricsforUseinFlexiblePrintedCircuitry挠性印制线路用挠性绝缘基底材料

IPC-4203AdhesiveCoatedDielectricFilmsforUseasCoverSheetsforFlexiblePrintedCircuitryandFlexibleAdhesiveBondingFilms挠性印制线路覆盖层用涂粘接剂绝缘薄膜

IPC-4204FlexibleMetal-CladDielectricsforUseinFabricationofFlexiblePrintedCircuitry挠性金属箔去电应用于柔性电路组装

IPC-6013-KQualification&PerformanceSpecificationforFlexiblePrintedBoards&Amendment1挠性印制板的鉴定与性能规范(包括修改单1)

IPC/JPCA-6202IPC/JPCAPerformanceGuideManualforSingle-andDouble-SidedFlexiblePrintedWiringBoardsIPC/JPCA单双面挠性印制板性能手册

IPC-FA-251GuidelinesforAssemblyofSingle-andDouble-SidedFlexCircuits单面和双面挠性电路组装导则

IPC-FC-234CompositeMetallicMaterialsSpecificationforPrintedWiringBoards印制线路板复合金属材料规范

IPC-MB-380GuidelinesforMoldedInterconnectionDevices模压互连器件导则

IPC-M-107StandardsforPrintedBoardMaterialsManual印制板材料标准手册

IPC-MI-660IncomingInspectionofRawMaterialsManual原材料接收检验手册

IPC-4101ASpecificationsforBaseMaterialsforRigidandMultilayerPrintedBoards刚性及多层印制板用基材规范

IPC-4121GuidelinesforSelectingCoreConstructionforMultilayerPrintedWiringBoardApplications多层印制板用芯板结构选择导则

IPC-4562MetalFoilforPrintedWiringApplications印制线路用金属箔

IPC-CF-148AResinCoatedMetalforPrintedBoards印制板用涂树脂金属箔

IPC-CF-152BCompositeMetallicMaterialsSpecificationforPrintedWiringBoards印制线路板复合金属材料规范

IPC-TR-482NewDevelopmentsinThinCopperFoils薄铜箔的新发展

IPC-TR-484ResultsofIPCCopperFoilDuctilityRoundRobinStudyIPC铜箔延展性联合研究结果

IPC-TR-485ResultsofCopperFoilRuptureStrengthTestRoundRobinStudy铜箔断裂强度试验联合研究结果

"IPC-4412SpecificationforFinishedFabricWovenfrom""E""GlassforPrintedBoards""E""类精纺玻璃纤维层印制板技术规范"

"IPC-4130Specification&CharacterizationMethodsforNonwoven""E""GlassMaterialsE玻璃纤维非织布材料规范及性能确定方法"

IPC-4110SpecificationandCharacterizationMethodsforNonwovenCelluloseBasedPaperforPrintedBoards印制板用纤维纸规范及性能确定方法

"IPC-4411-KSpecificationandCharacterizationMethodsforNon-WovenPara-AramidReinforcement,withAmendment1聚芳基酰胺非织布规范及性能确定方法,包括修改单1"

"IPC-4411-AM1SpecificationandCharacterizationMethodsforNon-WovenPara-AramidReinforcement,Amendment1关于聚芳基酰胺非织布规范及性能确定方法的修改单1"

"IPC-SG-141SpecificationforFinishedFabricWovenfrom""S""GlassforPrintedBoards印制板用经处理S玻璃纤维织物规范"

IPC-A-142SpecificationforFinishedFabricWovenfromAramidforPrintedBoards印制板用经处理聚芳酰胺纤维编织物规范

IPC-QF-143SpecificationforFinishedFabricWovenfromQuartz(PureFusedSilica)forPrintedBoards印制板用经处理石英(熔融纯氧化硅)纤维编织物规范

IPC-2524PWBFabricationDataQualityRatingSystem印制板制造数据质量定级体系

"IPC-9151APrintedBoardProcess,Capability,QualityandRelativeReliabilityBenchmarkTestStandardandDatabase印制板工艺,容量,质量,可靠性试验标准和数据库"

IPC-9191GeneralGuidelinesforImplementationofStatisticalProcessControl(SPC)实施统计过程控制(SPC)的通用导则

IPC-9199StatisticalProcessControl(SPC)QualityRating统计分析控制

IPC-9252GuidelinesandRequirementsforElectricalTestingofUnpopulatedPrintedBoards未组装印制板电测试要求和指南

IT-97061PWBHoletoLandMisregistration:CausesandReliability印制线路板通孔与焊盘的错位:原因和可靠性

IT-98103ReliabilityofMisregisteredandLandlessInnerlayerInterconnectsinThickPanels多层板内部无焊盘层互连错位的可靠性

IPC-MS-810GuidelinesforHighVolumeMicrosection大批量显微剖切导则

"IPC-QL-653ACertificationofFacilitiesthatInspect/TestPrintedBoards,Components&Materials印制板,元器件及材料检验试验设备的认证"

IPC-TR-483DimensionalStabilityTestingofThinLaminates-ReportonPhase1&2InternationalRoundRobinTest薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告

IPC-TR-486RoundRobinStudytoCorrelateIST&MicrosectioningEvaluationsforInner-LayerSeparation内层分离的互连应力测试(IST)与显微剖切相关性联合研究

"三,电子组装(Assembly)"

IPC-T-50FTermsandDefinitionforInterconnectingandPackagingElectronicCircuits电子电路互连与封装的定义和术语

IPC-S-100StandardsandSpecificationsManual标准和详细说明汇编手册

IPC-E-500IPCElectronicDocumentCollection已出版的IPC标准电子文档资料合订本

IPC-TM-650TestMethodsManual试验方法手册

IPC-ESD-20-20AssociationStandardfortheDevelopmentofanESDControlProgram静电释放控制过程(由静电释放协会制定)

IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies电气与电子组装件锡焊要求

IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1J-STD-001辅助手册及指南及修改说明1

IPC-A-610CAcceptabilityofElectronicAssemblies印制板组装件验收条件

IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)

"IPC-EA-100-KElectronicAssemblyReferenceSet电子组装成套手册,包括:IPC/EIAJ-STD-001C,IPC-HDBK-001,IPC-A-610C."

IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies电缆和引线贴装的要求和验收

IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology倒装芯片及芯片级封装技术的应用

IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation芯片直装技术实施导则

IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications倒装芯片用半导体设计标准

J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurationsFC(倒装片)和CSP(芯片级封装)的外形轮廓标准

IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps倒装芯片及芯片级凸块结构的性能标准

SMC-WP-003ChipMountingTechnology芯片贴装技术

J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology球栅阵列(BGA)及其它高密度封装技术的应用

IPC-7095DesignandAssemblyProcessImplementationforBGAs球栅阵列的设计与组装过程的实施

IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBallsBGA球形凸点的标准规范

IT-98000JPLChipScalePackagingGuidelinesJPL发布的CSP导则注:

IT(TheCaliforniaInstituteofTechnology)JPL(TheJetPropulsionLaboratory)

IT-98080JPLBallGridArrayPackagingGuidelinesJPL发布的BGA封装导则

"IT-98093ITRIChipCarrier,Phase1ReportITRI关于芯片载体的报告ITRI(TheInterconnectTechnologyResearchInstitute)"

IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization多芯片组件技术应用导则

IPC-M-108CleaningGuidesandHandbookManual清洗导则和手册

IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs电路板离子洁净度测量:它告诉我们什么

IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies印制板及组装件清洗导则

IPC-SC-60APostSolderSolventCleaningHandbook锡焊后溶剂清洗手册

IPC-SA-61PostSolderSemi-aqueousCleaningHandbook锡焊后半水溶剂清洗手册

IPC-AC-62AAqueousPostSolderCleaningHandbook锡焊后水溶液清洗手册

IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrintedCircuitAssemblies电化学迁移:印制电路组件的电气诱发故障

IPC-TR-580CleaningandCleanlinessTestProgramPhase1TestResults清洗及清洁度试验计划1阶段试验结果

"IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3--LowSolids,FluxesandPastesProcessedinAmbientAirIPC第3阶段非清洗助焊剂研究"

IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting深入离子洁净度测试

IPC-9201SurfaceInsulationResistanceHandbook表面绝缘电阻手册

"IPC-TP-104KCleaning&CleanlinessTestProgram,Phase3WaterSolubleFluxes,Part1&Part2第3阶段水溶性助焊剂清洗,第一和第二部分"

IPC-M-109ComponentHandlingManual元件处理手册

IPC/JEDECJ-STD-020BMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices非密封固态表面贴装器件湿度/再流焊敏感度分类

"IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices对湿度,再流焊敏感表面贴装器件的处置,包装,发运和使用"

IPC/JEDECJ-STD-035AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponents非气密封装电子元件用声波显微镜

IPC-9500-KSetoffourdocuments9501-95049501至9504手册合订本

IPC-DRM-18FComponentIdentificationDeskReferenceManual零件分类标识手册

IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册

IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册

IPC-DRM-56WirePreparation&CrimpingDeskReferenceManual导线和端子预成形参考手册

IPC-DRM-53IntroductiontoElectronicsAssemblyDeskReferenceManual电子组装基础介绍手册

IPC-M-103StandardsforSurfaceMountAssembliesManual所有SMT标准合订本

IPC-M-104StandardsforPrintedBoardAssemblyManual10种常用印制板组装标准合订本

IPC-TA-722TechnologyAssessmentofSoldering锡焊技术精选手册

IPC-TA-723TechnologyAssessmentHandbookonSurfaceMounting表面安装技术精选手册

IPC-TA-724TechnologyAssessmentSeriesonCleanRooms清洁室技术精选系列

IPC-SM-780ComponentPackagingandInterconnectingwithEmphasisonSurfaceMounting以表面安装为主的元件封装及互连导则

IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountAttachments表面安装焊接件加速可靠性试验导则

IPC-PD-335ElectronicPackagingHandbook电子封装手册

IPC-7525StencilDesignGuidelines网版设计导则

IPC-TR-581IPCPhaseIIIControlledAtmosphereSolderingStudyIPC第3阶段受控气氛焊接研究

IPC-MI-660IncomingInspectionofRawMaterialsManual原材料接收检验手册

IPC/EIAJ-STD-004RequirementsforSolderingFluxes-IncludesAmendment1锡焊焊剂要求(包括修改单1)

IPC/EIAJ-STD-005RequirementsforSolderingPastes-IncludesAmendment1焊膏技术要求(包括修改单1)

IPC-HDBK-005GuidetoSolderPasteAssessment焊膏性能评价手册

"IPC/EIAJ-STD-006ARequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSolders电子设备用电子级锡焊合金,带焊剂及不带剂整体焊料技术要求"

IPC-SM-817GeneralRequirementsforDielectricSurfaceMountingAdhesives表面安装用介电粘接剂通用要求

IPC-CA-821GeneralRequirementsforThermallyConductiveAdhesives导热胶粘剂通用要求

IPC-3406GuidelinesforElectricallyConductiveSurfaceMountAdhesives表面贴装导电胶使用指南

IPC-3408GeneralRequirementsforAnisotropicallyConductiveAdhesivesFilms各向异性导电胶膜的一般要求

IPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies印制板组装电气绝缘性能和质量手册

"IPC-HDBK-830GuidelineforDesign,SelectionandApplicationofConformalCoatings敷形涂层的设计,选择和应用手册"

IPC-SM-840CQualificationandPerformanceofPermanentSolderMask-IncludesAmendment1永久性阻焊剂的鉴定及性能(包括修改单1)

IPC-HDBK-840GuidetoSolderPasteAssessment焊膏性能评价手册

IPC-TP-1114TheLayman'sGuidetoQualifyingaProcesstoJ-STD-001基于J-STD-001组装工艺雷氏选择法

IPC-TR-467SupportingData&NumericalExamplesforJ-STD-001(ControlofFluxes)J-STD-001(焊剂控制)的支持数据及数字实例

IPC-AJ-820Assembly&JoiningHandbook装联手册

IPC-7530GuidelinesforTemperatureProfilingforMassSoldering(Reflow&Wave)Processes大规模焊接(回流焊与波峰焊)过程温度曲线指南

IPC-9701PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachments表面安装锡焊件性能试验方法与鉴定要求

IPC-TP-1090TheLayman'sGuidetoQualifyingNewFluxes新型助焊剂雷氏选择法

IPC-TP-1115SelectionandImplementationStrategyforaLow-ResidueNo-CleanProcess低残留不清洗工艺的选择和实施

IPC-S-816SMTProcessGuideline&Checklist表面安装技术过程导则及检核表

IPC-TR-460ATrouble-ShootingChecklistforWaveSolderingPrintedWiringBoards印制板波峰焊故障排除检查表

IPC-CM-770DComponentMountingGuidelinesforPrintedBoards印制板元件安装导则

IPC-7912CalculationofDPMO&ManufacturingIndicesforPrintedBoardAssemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算

IPC-9261In-ProcessDPMOandEstimatedYieldforPWAs印制板组装过程中每百万件缺陷数(DPMO)及合格率估计

IPC