SOP封装工艺流程介绍

SOP封装工艺流程介绍ContentsPackageInstructionProcessFlowQualityControlPackageInstructionSOPSSOP3.TSSOP4.MFPASEASEPackageInstructionASYprocessflowWaferSawDieAttach

WireBond

WaferMountWaferGrindingEpoxyCure

MoldingPostMoldCurePlatingTrim/FormPacking&ShippingDe-junkLaserMarking前段制程后段制程WaferDie(chip)DieonLeadframeEpoxyLeadFrameBeforeAfterLaserMarkingLaserMarkingLaserMarkingLaserMarkingWaferGrindingLOADUNLOADGRINGINGPurpose:GrindingthewafertoCustomerrequiredthicknessWaferGrinding晶圓(未研磨)研磨機晶圓(研磨後)晶元背面WaferbacksideFrameMountTapePurpose:CombinethewaferwithDicingtapeontotheframefor

die

sawingWafermountMachineWaferMountFrame大家应该也有点累了，稍作休息大家有疑问的，可以询问和交流Purpose:ToseparatediesfromeachotherfordieattachMonitorLoad/UnloadSawingCleaningMachineWaferSawBeforewafersaw:Afterwafersaw:WaferSawPurpose:AttachthedieswithepoxyonsubstrateforthefollowingprocessDieAttachOutputDiebondSubstrateloadbondWorkingflow:DieAttachRobbertipLead-frameEpoxyPurpose:

SolidifytheepoxyafterD/AInsideOvenEpoxyCurePurpose:ConnectingthechipandtheexteriorcircuitinputinputoutputBondlocationTheory:

Useultrasonic,thermal,forcetoformtheintermetallicbetweengoldenwireandjointmetal(Al,Au,Ag…)WireBondGoldwireleadDieAlpadCapillaryMoldMachineMoldingPurpose:

SealtheproductwithEMCtopreventdie,goldwirefrombeingdamaged,contaminatedandoxygenic.MoldingMoldingTopchaseAirventBottomchaseCavityLeadframePlungerPotGateinsertRunnerCompoundBottomcullblockTopcullblockMoldingMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerMoldingMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerMoldingAfterMoldMoldingTopchaseAirventBottomchaseCavityLeadframePotGateinsertRunnerCompoundBottomcullblockTopcullblockPlungerEpoxyLeadFramePurpose：UselaserlightirradiatedbyCO2orYAGtovapourtheEMCtoshowcontentonthepackage，suchasdate,schedule,placeofproductionandsoon.LaserMarkinglaserEMCvapouredBeforeAfterLasermarkingOvenInsidePurpose:

ToletEMCreactcompletelysothatproductscanbeprotectedmoreeffectively.PostmoldcureDe-junkPurpose：Removethedem-barofleadframe.WorkingareaBeforeAfterLaserMarkingLaserMarkingPlatingPurpose:

ToplatingSnontheleadwhichwillmountonboardpad.loadunloadPlatinglinePlatingAfterBefore投料區電解去膠高壓噴洗酸洗收料區活化槽電鍍槽中和槽熱D.I.水烘乾

SOLDERPLATING(S/P

區)ELECTRODEFLASH(E/D區

)面板操作Purpose:

Removethetie-barandlead-frameandformproductstounitsfromstrips,fillthemintotubesandthenpasstonextprocess.TrimFormSawworkareaunloadWorkingareaunloadLasermarkingTrimFormWorkingareaLasermarkingunloadunloadLeadCutFormingQualityControlDieSaw切偏Chipping外观检查划片宽度量测RejRejLeadFrameEpoxyDieQualityControlDieShearEpoxyVoidCheckDieAttachQualityControlEpoxyThickness&FilletHeightDieAttachDieLocationRejQualityControlWireBond外观检查第二焊点重叠RejRejRejRej第二焊点偏移线弧不良RejRejDieQualityControl推球测试拉力测试WireBondQualityControl