Michael-quirk-半导体制造技术-第五章-半导体制造中的化学品PPT课件

1、,SemiconductorManufacturingTechnologyMichaelQuirk&JulianSerdaOctober2001byPrenticeHallChapter5ChemicalsinSemiconductorFabrication,Objectives,Afterstudyingthematerialinthischapter,youwillbeableto:1.Identifyanddiscussthefourstatesofmatter.2.Describetheimportantchemicalpropertiesrelevanttosemiconductor

2、manufacturing.3.Statehowthedifferentprocesschemicalsarecategorizedandusedinawaferfab.4.Explainhowanacid,baseandsolventareusedinchipmanufacturing.5.Statewhetheragasisabulkorspecialtygasandhoweachtypeofgasisdeliveredandusedinwaferfabrication.,PhysicalStatesofMatter,Figure5.1,PropertiesofMaterials,Temp

3、eraturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,PropertiesofMaterials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,TemperatureScales,Figure5.2,Propertiesof

4、Materials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,PressureAgainstaContainerWall,Figure5.3,GaugePressure(psig)VersusAbsolutePressure(psia),Figure5.4,UnitsofPressureatSeaLeveland23C,Table5.1,PropertiesofMaterials,Temperat

5、urePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,BarometeratAtmosphericPressure,Figure5.5,PropertiesofMaterials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,Pro

6、pertiesofMaterials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,VaporPressure,Figure5.6,PropertiesofMaterials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansion

7、Stress,Sublimation,Dryice(CO2),Figure5.7,Deposition,Figure5.8,PropertiesofMaterials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,DensityofObjects,Figure5.9,DensitiesofSomeCommonSubstances,Table5.2,PropertiesofMaterials,Tempe

8、raturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,SurfaceTensionofaLiquidonaWafer,Figure5.10,PropertiesofMaterials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStres

9、s,ThermalExpansionofaHeatedObject,Figure5.11,PropertiesofMaterials,TemperaturePressureandVacuumCondensationVaporPressureSublimationandDepositionDensitySurfaceTensionThermalExpansionStress,CTEMismatchofTwoMaterials,Figure5.12,ProcessChemicals,ChemicalsareusedinSMTto:Cleanorpreparethewafersurfacewithw

10、etchemicalsolutionsandultrapurewaterrinse.Dopethewaferwithenergeticatomstocreatep-typeandn-typesilicon.Depositthedifferentmetalconductorlayerswiththenecessarydielectriclayersbetweentheconductors.GrowthethinsilicondioxidefilmtobeusedasthecriticalMOSgatedielectric.Etchthinfilmswithplasmaorwetchemicals

11、toselectivelyremovematerialandformtherequiredpatterninthefilm.,ProcessChemicals,LiquidsAcidsBasespHSolventsChemicalDistribution,CommonAcidsUsedinSemiconductorManufacturing,Table5.3,CommonBasesUsedinSemiconductorManufacturing,Table5.4,ThepHScaleforDifferentChemicals,Figure5.13,CommonSolventsUsedinSem

12、iconductorManufacturing,Table5.5,BulkChemicalDistribution,PhotocourtesyofAdvancedMicroDevices,Photo5.1,BulkChemicalDistribution,Figure5.14,ProcessChemicals,GasesBulkGasesSpecialtyGasesGaspurgeGaspipingGaslineconnectionsGasstickCylinderchange-outClassifyingSpecialtyGases,BulkGases,Table5.6,BulkGasDis

13、tributionSystem,PhotocourtesyofAirProducts,nitrogengeneratoroncustomersite,Photo5.2,TypicalSpecialtyGasSystemDesign,UsedwithpermissionfromInternationalSEMATECH,Figure5.15,Double-WalledTubing,UsedwithpermissionfromInternationalSEMATECH,Figure5.16,CGAGasLineConnector,UsedwithpermissionfromInternationalSEMATECH,Figure5.17,GasStickatProcessTool,(a)SchematicusedwithpermissionfromInternationalSEMATECH,(b)ComponentdiagrambasedonSwagelokcomponents,SwagelokCo.CatalogprovidedbyArthurValve&FittingCo.,Austi