PCB缺陷英语汇总

1、开路open circuit 2短路short circuit线路狗牙circuit wist3线路缺口circuit nick4线路凹痕circuit dent5渗镀plating Bloody6焊盘缺口pad nick7内层白斑I/L white spot8黑化不良poor B.O9爆板measling10粉红圈pinking ring11层压起泡press blister12错位misregistation13偏位shift14孔内无铜no Cu on Pth15孔内毛刺hole burrs16NPTH有铜Cu on NPTH17铜面露基材exposed laminate18铜面凹痕de

2、nt on Cu surface19胶渍gum residue20夹膜D/F nip21蚀刻不尽under etching22线幼line too thin23孔大hole oversize24孔小hole undersize25偏孔hole misregistration26铜面瘤粒Cu nodule27显影不尽under developing28铜面刮伤scratch on Cu surface29塞孔hole plugged30修理不良poor repairing31铜薄copper too thin32内层擦花I/L scratch 33内层偏位I/L misregistation34

3、内层杂物I/L inclusions35掉膜film off36干膜碎D/F meaking37退锡不尽poor Sn stripping38间隙小space too marrow39板薄board too thin40板厚board too thickness41针孔pinhole42崩孔breakout43侧蚀undrcut44镀层粗糙plating layer roughness45亚色dull colour46焊 盘 翘 起 lifted land47漏 钻 孔 missing hole48露 布 纹 weave exposure49钻 偏 孔 hole misregistratiio

4、n50孔 损 害 hole damage51基 材 分 层 delamination52蚀 刻 过 度 over etching53多 孔 hole too much54残 铜 remain Cu55孔 内 露 基 材 laminate exposure in hole56焊 盘 脱 落 pad break off57焊 盘 凹 痕 pad dent 58焊 盘 凸 起 pad bulge 59焊 盘 损 坏 pad damaged60焊 盘 缺 口 pad nick61焊 盘 露 铜 pad expose Cu1板面凹痕dent2内层白斑I/L white spot3线路缺口circuit

5、nick4蚀刻不净undering etching5绿油剥离S/M peel off6显影不净under developing7基 材 白 点laminate measling8铜面氧化copper oxide9绿油上焊盘s/m on pad10白字上焊盘c/m on pad11阻焊不良poor S/M12线路擦花track scratch13锡上线sn on circuit14聚锡sn mass15锡灰sn gray16焊盘露铜cu exposed on pad17锡上金手指sn on G/F18金手指凹痕G/F dent19金手指擦花G/F scratch20金手指粗糙G/F roughness21v-cut不良poor V-cut22倒边不良poor milling23针床压伤ET dent24拖锡不良poor touch up25补金不良poor repairing Au26补油不良poor repairing s/m27针孔pinhole28胶渍paster stain29k孔内毛刺burrs in hole30锡珠入孔solder in hole31露铜expose Cu32露镍expose Ni33绿油起泡solder mask blister34绿油起皱solder mask winbles35金手指氧化G/F oxiding36金颜色不良A