CMOS工艺流程演示.ppt

1、Wafer Fabrication Process Technology,CMOS,CMOS,Starting with a silicon wafer,Cross Section of the Silicon Wafer,Magnifying the Cross Section,CMOS,n/p-well Formation,Grow Thin Oxide,Deposit Nitride,Deposit Resist,silicon substrate,UV Exposure,Develop Resist,Etch Nitride,n-well Implant,Remove Resist,C

2、MOS,n/p-well Formation,silicon substrate,Grow Oxide (n-well),Remove Nitride,p-well Implant,Remove Oxide,Twin-well Drive-in,Remove Drive-In Oxide,CMOS,LOCOS Isolation,Grow Thin Oxide,Deposit Nitride,Deposit Resist,UV Exposure,Develop Resist,Etch Nitride,Remove Resist,CMOS,LOCOS Isolation,Deposit Resi

3、st,UV Exposure,Develop Resist,Field Implant B,Remove Resist,Grow Field Oxide,Remove Nitride,Remove Oxide,Grow Screen Oxide,CMOS,Transistor Fabrication,Vt Implant,Deposit Resist,UV Exposure,Develop Resist,Punchthrough Implant,Remove Resist,Remove Oxide,Fox,Grow Gate Oxide,CMOS,Transistor Fabrication,

4、Deposit PolySi,PolySi Implant,Deposit Resist,UV Exposure,Develop Resist,Etch PolySi,Remove Resist,Fox,CMOS,Transistor Fabrication,Deposit Thin Oxide,Deposit Resist,UV Exposure,Develop Resist,n-LDD Implant,Remove Resist,Fox,polySi,polySi,CMOS,Transistor Fabrication,Deposit Resist,UV Exposure,Develop

5、Resist,p-LDD Implant,Remove Resist,Deposit Spacer Oxide,Etch Spacer Oxide,Fox,polySi,polySi,CMOS,Transistor Fabrication,Deposit Resist,UV Exposure,Develop Resist,n+ S/D Implant,Remove Resist,Fox,polySi,polySi,CMOS,Transistor Fabrication,Deposit Resist,UV Exposure,Develop Resist,p+ S/D Implant,Remove

6、 Resist,Fox,polySi,polySi,n+,n+,CMOS,Contacts & Interconnects,Deposit BPTEOS,BPSG Reflow,Planarization Etchback,Deposit Resist,UV Exposure,Develop Resist,Contact Etchback,Remove Resist,Fox,polySi,polySi,n+,n+,p+,p+,CMOS,Contacts & Interconnects,Depost Metal 1,Deposit Resist,UV Exposure,Develop Resis

7、t,Etch Metal 1,Remove Resist,Fox,polySi,polySi,p+,p+,n+,n+,BPTEOS,CMOS,Contacts & Interconnects,Deposit IMD 1,Deposit SOG,Planarization Etchback,Deposit Resist,UV Exposure,Develop Resist,Via Etch,Remove Resist,Fox,polySi,polySi,p+,p+,Metal 1,n+,n+,BPTEOS,CMOS,Contacts & Interconnects,Deposit Metal 2,Deposit Resist,UV Exposure,Deve