《LED元件简介》PPT课件.ppt

1、LED 元件簡介, 2008/1/24,目錄,LED 晶片概論 LED Lamp Chip Type LED (SMD LED) 最近的發展趨勢,LED 發光原理,Types of LED Chips,GaP/GaP : Red/Yellow Green AlGaAs/GaAs : Red (UR,SR), IR GaAsP/GaAs: Red (SRD) GaAs/GaP : Orange GaAsP/GaP : Yellow AlInGap/GaAs :AS 四元(Red/Orange/Yellow) AlInGaP/GaP : TS 四元(Red/Orange/Yellow) InGaN

2、/Saphire : Blue/Green (Nichia) InGaN/SiC :Blue/Green (Cree),LED Chip (H5C),LED Chip Spec,AS/TS AlInGaP Chip Structure,InGaN/Saphire Chip Structure,靜電打穿現象,晶片供應狀況,LED Lamp Package,LED Lamp,Stopper 高度,Stopper 高度,A,B,C,LED Lamp Color,LED Lamp Spec.,LED Lamp Spec.,How to Make White LED,銀膠烘烤,LED Lamp Proc

3、ess,固晶(Die Attach),打線(Wire Bonding),灌膠(Encap),短烤(Pre Cure),長烤(Post Cure),測試分 Bin,支架(Lead Frame),固晶 (Dice Attach),打線 (Wire Bonding),模粒(灌膠模),噴離模劑,注膠,沾膠與插入灌膠模,已灌膠之半成品,烘烤(50min)(Pre-Cure),半成品,第一次切腳(正負極),電性及外觀檢驗,第二次切腳,分 Bin,LED 封裝常見問題,偏心(off center) 晶高不均 Open/Short 水氣滲入 漏電 : IR, VF(100uA) PCB 污染 熱應力不良,La

4、mp 供應狀況(Display),Lamp 供應狀況(交通燈),Chip Type LED,PCB Type Chip LED,Lead Frame Type Chip LED,Chip LED 製程,銀膠烘烤,固晶(Die Attach),打線(Wire Bonding),Molding,測試,切割,分 Bin,銀膠烘烤,固晶(Die Attach),打線(Wire Bonding),灌膠(Encap),短烤(Cure),長烤(Post Cure),測試分 Bin,PCB Type,Lead Frame Type,Chip LED 比較,LED 發光效率演進,First High Power

5、 LED 食人魚 (Piranha),Introduced by HP Drive current : 70mA 加大散熱機制 主要使用於第三煞車燈,High Power Package (LumiLEDs),Advantage of Power Package,Chip size 12 mil x 12 mil,Power LEDs reduced LED count higher brightness better reliability lower costs,Input power: 0.5 - 2 W Output Light:10 - 100 lm,Chip size 40 mil x 40 mil,Heatsink 15 C/W,Thermal Resistance