电镀基础知识培训-PPT（精）

上海环讯电镀有限公司Shaihang skyrockplating co.,ltd.,ELECTROPLATING TRAINING电镀培训,OUTLINE内容提要,INTRODUCTION介绍ELECTROCHEMISTRY电化学CLEANING & PREPLATE 清洗及预镀,NICKEL 镍Copper 铜DECORATIVE CHROMIUM装饰铬TESTING测试FILTRATION 过滤TROUBLE SHOOTING故障处理,WHAT IS ELECTROPLATING ?什么是电镀？,THE DEPOSITION OF A METALLIC COATING UPON A NEGATIVELY CHARGED CATHODE BY THE PASSING OF AN ELECTRIC CURRENT在电流通过时，有金属层沉积在带负电荷的阴极表面.,WHAT IS THE PURPOSE ?电镀的目的是什么？,TO OBTAIN A METALLIC COATING HAVING CERTAIN PROPERTIES SUCH AS HARDNESS, BRIGHTNESS, CORROSION RESISTANCE AND TO REPRODUCE IDENTICAL FORMS IN ELECTROFORMING.是为了得到具有某种特性的金属层，如：硬度、光亮度、耐腐性及在电铸方面复制同样的形状.,REQUIREMENTS要求,SOURCE OF DIRECT CURRENT直流电源A PLATING TANK电镀槽A SOLUTION CONTAINING THE DISSOLVED SALTS OF THE METAL TO BE PLATED含有待镀的可溶性金属盐的溶液ANODE ( POSITIVE ELECTRODE )阳极（正电极）A PREPARED OBJECT - CATHODE ( NEGATIVE ELECTRODE ) 准备好的待镀工件-阴极（负电极）,WHAT IS DIRECT CURRENT ? 何为直流电？,THE FLOW OF ELECTRONS IN THE SAME DIRECTION BETWEEN POSITIVE AND NEGATIVE ELECTRODES在正负电极之间电子向同样的方向移动.,WHAT IS A PLATING SOLUTION ?电镀液是什么？,A CONDUCTING MEDIUM FOR THE MOVEMENT OF METAL IONS IN SOLUTION BETWEEN AN ANODE AND A CATHODE溶液中在阳极与阴极间金属离子移动的导电介质.,WHAT IS pH ?什么是pH值？,THE MEASUREMENT OF ACIDITY OR ALKALINITY用来度量酸碱度的ON A SCALE FROM 0 TO 14pH值的范围处于0-14之间 0 TO 6.9 BEING ACIDIC AND 7.1 TO 14 ALKALINE AND 7.0 BEING NEUTRAL. 小于7的为酸性，大于7且小于等于14的为碱性，7.0为中性,HOW ARE PLATING SOLUTION MAINTAINED ?如何维护电镀液？,CHEMICAL ANALYSIS OF THE CONSTITUENTS持续的化学分析HULL CELL PLATING TESTS赫氏槽电镀测试ADDITION OF CHEMICALS添加化学品ELIMINATION OF CONTAMINANTS去除污染物PERIODIC PURIFICATION定期净化REGULAR INSPECTION OF PARTS FOR DEFECTS缺陷/次品的常规检查PHYSICAL TESTING物理测试,WHAT IS A METAL ION ?什么是金属离子？,A METAL ION IS AN ATOM OF A METAL HAVING A POSITIVE ELECTRICAL CHARGE金属离子是带正电荷的金属原子(失去电子),WHAT ARE THE SOURCES OF METAL IONS ?金属离子来自何处？,METAL SALTS IN PLATING SOLUTION电镀液中的金属盐SOLUBLE METAL ANODES可溶性的金属阳极,WHAT ARE ANODE BAGS ?什么是阳极袋？,ANODE BAGS ARE POROUS MEMBRANES PLACED AROUND ANODES TO COLLECT SLUDGE FORMING ON THE DISSOLVING ANODE阳极袋是包扎在阳极外面,会将电镀过程中产生的阳极泥收集在袋内的多孔的袋。,Basic ELECTROCHEMISTRY基本的电化学理论,ELECTROCHEMISTRY 电化学Plating Cell 电镀槽,Ni+,Ni+,Cl-,Cl-,+,+,_,Rectifier整流器,ANODE阳极,CATHODE阴极,ANODE阳极,CATHODE REACTIONS 阴极反应Cathode 阴极,Reduction of ions离子还原反应Draw electrons from the external circuit从外部电路中吸收电子TYPICAL REACTION 典型的反应,Ni+ + 2e- Ni (metal 金属)2H+ + 2e- H24H2O + 4e- 2H2 + 4(OH)-,ANODE REACTIONS 阳极反应Anode 阳极,Oxidation of metal to ions 金属氧化成阳离子Release of electrons to external circuit 将电子释放至外部电路TYPICAL REACTION 典型的反应,Ni Ni+ + 2e-4OH- O2 + 2H2O + 4e-2H2O O2 + 4H+ + 4e-,RATE OF CURRENT FLOW 电流速率,Ohms Law 欧姆定律,Amperes安培 = Volts 伏特 Ohms 欧姆,I 电流= E 电压 R 电阻,FARADAYS LAW 法拉第定律,Factors 要素,Amperes 安培Time 时间Equivalent Weight of Metal 金属当量,FARADAYS LAW 法拉第定律,One ampere flowing for one second represents one coulomb. Faraday law states that 96,500 coulombs (one Faraday) will deposit one gram equivalent weight of a metal. Equivalent weight is the atomic weight of the metal divided by its valence.1安培的电流1秒的时间通过的电量等于1库仑。法拉第定律：1个法拉第即96,500库仑的电量可以沉积1克当量的金属。克当量是金属的原子量除以它的化合价.,FARADAYS LAW 法拉第定律,weight of metal deposited沉积的金属重量,96,500 Coulombs Deposit At. Wt. = grams 96,500库仑的镀层 Valence,WEIGHT OF NICKEL PLATED电镀镍的重量,KNOWN FACTORS已知的条件,Current 电流= 50 amps安培,Time 时间 = 15 mins分钟,原子量 At. Wt. Ni = 58.7 Valence = 化合价, 2 价,CALCULATION 计算,96,500 = 45,000 X = 13.7 GRAMS 克 58.7 x grams 2,CALCULATING THICKNESS FROM WEIGHT从重量计算厚度,Thickness = WT,1um=10 -4 cm,density x area,1mil = 25. 4 um,EXAMPLE :,wt = 0.136 grams,.,Density of Ni = 8.9,Area = 4 cm2,Thickness = 0.136,8.9 x 4,Answer = 1.5 mils,CURRENT IN CELL电镀槽中的电流,Anode阳极-e = cathode阴极 +e,Anode阳极-e = corrosion溶解 -e + Oxygen氧 -e,Cathode阴极+e = plating所镀金属+e + hydrogen氢+e,The exchange of electrons at the anode and the cathode or the total flow of current at each electrode is always equal.电子在阳极和阴极上交换,在阴阳极上流动的电流总是相等的。,DEPOSITION WITH H 2 LIBERATION伴随着氢气释放的沉积,NET RESULT 最终的结果Cathode Efficiency Reduced阴极电流效率的降低pH Increased pH值升高,Anode阳极,Cathode阴极,Ni+2,Ni+2,2H+,H2,PLATING EFFICIENCY AND TIME OF PLATING电镀效率和电镀时间,% Efficiency效率 = Actual Ni Plated实际镀的镍 X 100 Theoretical (Faradays Law ) 理论的（法拉第定律）,FACTORS AFFECTING PLATING CURRENT影响电镀电流的因素,Hydrogen Liberation ( cathode )氢气释放（阴极）Oxygen Liberation ( anode )氧气释放（阳极）Polarization极化Concentration Polarization ( Diffusion )浓度极化（扩散）Hydrogen Overvoltage氢过电位,POLARIZATION极化,E = IRE = Volts伏特 ( potential difference电位差 )R = Resistance电阻 ( resistance of solution to the flow of current 溶液对电流的阻抗) I = Current电流 ( flow of electricity电荷的移动 )E = CURRENT电流 (I) X RESISTANCE电阻 (R)Ep = Change in potential difference due to Polarization from resistance. 由于电阻升高造成的极化,极化导致的电位差的改变.,POLARIZATION 极化,E,I,Ep,R= E I,EP= Polarization,CONCENTRATION POLARIZATION 浓度极化,CONCENTRATION OF METAL IONS BUILD ON THE SURFACE OF THE ANODE 阳极表面的金属离子浓度CONCENTRATION OF THE METAL IONS DECREASE AT THE SURFACE OF THE CATHODE 阴极表面的金属离子浓度减少CHANGE IN ANODE AND CATHODE FILMS CAUSES POLARIZATION阳极和阴极膜层的改变导致了极化,CONCENTRATION POLARIZATION 浓度极化,Ni +,Ions,ANODE阳极,CATHODE 阴极,+,+ + + + +,EFFECT 影响,Agitation 打气Temperature 温度,HYDROGEN OVERVOLTAGE氢过电位,POLARIZATION DUE TO EVOLUTION OF HYDROGEN UPON A SPECIFIED ELECTRODE SURFACE OR THE EXCESS POTENTIAL ABOVE THE EQUILIBRIUM POTENTIAL REQUIRED TO EVOLVE HYDROGEN AT THE CURRENT DENSITY SPECIFIED.在指定的电极表面上氢气的形成而引起的极化 或 在某一电流密度下氢的形成所要求的超出平衡电位后的电位.,HYDROGEN OVERVOLTAGE氢过电压,FACTORS 要素TYPE OF METAL金属的种类SURFACE ROUGHNESS 表面的粗糙度TYPE OF SOLUTION 溶液的类型CURRENT DENSITY电流密度TEMPERATURE温度,HYDROGEN OVERVOLTAGE 氢过电位 (1 ma/cm2),ZnSnCdCuNiAgAuCPt,-0.80-0.80-0.80-0.60-0.40-0.30-0.15-0.110.00,ELECTROMOTIVE SERIES 电势序列,VoltsAl3+ -1.66Zn2+ -0.76Cr3+ -0.74Fe2+ -0.44Cd2+ -0.40Co2+ -0.29Ni2+ -0.25Sn2+ -0.14Pb2+ -0.13,VoltsH1+ 0.00Sb3+ +0.10Bi3+ +0.20Cu2+ +0.34 Cu1+ +0.52 Rh3+ +0.80Ag1+ +0.80Pt2+ +1.20Au1+ +1.68,ANY QUESTIONS ?有问题吗？,CLEANING & PREPLATE清洗与预镀,PURPOSE FOR CLEANING清洗的目的,TO PROVIDE ADHESION ON THE SUBSEQUENT DEPOSITS保障后续的镀层的结合力.TO OBTAIN A HIGH QUALITY FINISH DEPOSIT得到高品质的完美镀层TO OBTAIN THE DESIRED PROPERTIES OF THE DEPOSITS镀层具有期望的各种特性.,EFFECTS OF IMPROPER CLEANING不正确清洗的影响,POOR BONDING TO BASE METAL与基体(素材)金属间差的结合力PEELING OF DEPOSIT镀层的起皮SKIP PLATE漏镀MICRO ROUGHNESS微观粗糙PITTING起泡POOR CORROSION RESISTANCE差的耐腐性CONTAMINATED BATHS 污染镀液,PRECLEANING OPTIONS预清洗的选择,MECHANICAL CLEANING 机械清洗WET OR DRY BLASTING 干法喷砂/丸SOLVENT CLEANING 溶剂清洗DEGREASING, EMULSION, DIPHASE 脱脂、乳化、固液相分离.ALKALINE CLEANING 碱洗SPRAY, SOAK, ELECTRO, ULTRASONIC 喷射、浸泡、电解、超声波ACID CLEANING 酸洗SOAK, ELECTRO 浸泡、电解,HOW CLEANERS WORK清洗剂如何工作,DISPERSION 分散SAPONIFICATION皂化EMULSIFICATION乳化,DISPERSION分散,DISPERSION IS A METHOD WHEREBY SOLID PARTICLES ARE BROKEN DOWN TO SMALL PARTICLES BY THE ACTION OF SURFACTANTS AND OTHER COMPONENTS IN A CLEANER. THE PRINCIPLE IS EFFECTIVE FOR RESIDUE LEFT FROM POLISHING OPERATIONS分散是一种方法，固体的微粒通过表面活化剂和清洗剂中其它组分的作用分散成小的微粒。这个原则对抛光时留下的残余物的清洗是有效的。,DISPERSION 分散,DIRT污垢,COATED WITH SURFACTANT覆盖了表面活性剂,HOW CLEANERS WORK清洗剂如何工作,DISPERSION 分散SAPONIFICATION皂化EMULSIFICATION乳化,SAPONIFICATION皂化,SAPONIFICATION IS THE CHEMICAL ACTION BY WHICH FATTY ACID, FATTY OIL OR OTHER REACTABLE SOIL IS CONVERTED TO A WATER SOLUBLE COMPOUND, SOAP. ELEVATED TEMPERATURES, CONCENTRATION, AND pH PROMOTES THE SPEED AND COMPLETION OF THE REACTION皂化是将脂肪酸/脂肪油或其它可反应的污物转化成水溶性的混合物(肥皂)。提高温度、浓度和pH值都会促进反应的速度和反应的完成。,HOW CLEANERS WORK清洗剂如何工作,SAPONIFICATION 皂化,VEGETABLE OILS植物油,SOLUBLE ALKALI SOAPS可溶性的碱性肥皂,HOW CLEANERS WORK清洗剂如何工作,DISPERSION 分散SAPONIFICATION皂化EMULSIFICATION乳化,EMULSIFICATION乳化,EMULSIFICATION IS A CHEMICAL PROCESS BY WHICH SURFACTANTS PENETRATE OILS AND SOILS AND BREAK THEM DOWN TO TINY WATER SOLUBLE GLOBULES DISPERSED AND SUSPENDED IN SOLUTION乳化是一种化学过程，表面活性剂渗透油和污物，将它们在溶液中分散成微小的分散性的水溶性水珠和悬浮液.,HOW CLEANERS WORK清洗剂如何工作,EMULSIFICATION乳化,MINERAL OIL矿物油,COATED WITH EMULSIFIERS覆盖了乳化剂,TYPE OF CLEANING清洗的种类,SOLVENT DEGREASING溶剂脱脂ALKALINE CLEANING碱洗SPRAY CLEANING喷射清洁洗ACID PICKLING浸酸,TYPE OF CLEANING清洗的种类,SOLVENT CLEANING 溶剂脱脂MIXTURES OF SUITABLE SOLVENTS AND SURFACTANTS. 适合的溶剂和表面活性剂的混合USED IN VAPOR DEGREASING.在蒸汽除油时使用MINIMAL USE DUE TO HEALTH AND ENVIRONMENTAL CONCERNS.由于健康和环境方面的考虑尽量少使用,ALKALINE CLEANERS 碱洗,THREE MAJOR COMPONENTS 三种主要成份BUILDERS-SODIUM HYDROXIDE 氢氧化钠 or主体 POTASSIUM HYDROXIDE 氢氧化钾 SILICATES 硅酸盐 CARBONATES 碳酸盐 CONDENSED PHOSPHATES 浓缩磷酸盐 ADDITIVES- CHELATING AGENTS TO COUNTERACT EFFECTS OF HARD WATER AND METAL IONS.添加剂-螯合物可以消除硬水和金属离子的影响.SURFACTANTS-DISPLACE AND DISPERSE SOIL. LOWER SURFACE TENSION OF CLEANER AT METAL SURFACE FOR UNIFORM COVERAGE.表面活性剂-置换和分散污物，降低金属表面上清洗剂的表面张力,让金属表面被清洗液完全覆盖.,TYPES OF ALKALINE CLEANERS碱洗的类型,SOAK 浸泡HIGH INFINITY FOR OILS AND GREASES DUE TO HIGH SURFACTANT CONTENT 高的表面活性剂的含量可除去大量的油脂DESIGNED FOR SPECIFIC CLEANING为某些清洗而设计.SPRAY 喷射MECHANICAL IMPINGEMENT AND CHEMICAL CLEANING 机械冲击与化学冲洗LOW FOAMING 低泡,ALKALINE CLEANERS碱洗,SOAK/ELECTRO浸泡/电镀CONC. - 15 - 90 g/lTEMP. - 50 - 82 CTIME - 1 - 10 min.,SPRAY喷射CONC. - 2 - 15 g/lTEMP. - 43 - 66 CTIME - 15 - 60 sec.,TYPES OF ALKALINE CLEANING碱洗的类型,CATHODIC ELECTRO 阴极电镀 -GREATEST GAS EVOLUTION 产生大量的气体 -REDUCES OXIDE 减少氧化 -DEPOSITS SMUT 脏物会沉积到阴极上.ANODIC - ELECTRO 阳极电镀 -REMOVES SMUT 移走污物-TOLERANCE TO METAL IMPURITIES 容忍金属杂质-FORMS OXIDE FILM 形成氧化膜,TYPES OF ALKALINE CLEANING碱洗的类型,ULTRASONIC SOAK 超声波-浸泡ENERGY FROM SOUND WAVES BEYOND THE AUDIBLE RANGE BREAKS DOWN DIRT PARTICLES DUE TO FREQUENCY THAT RANGE OF 15 TO 40 kHz.由于频率在15-40KHz之间，超出听力范围的声波的能量将污物微粒分解,ALKALINE CLEANING 碱洗,CATHODIC ELECTROCLEANING阴极电除油HYDROGEN LIBERATED AT THE CATHODE. THE VOLUME OF THE HYDROGEN IS TWICE THAT OF OXYGEN GENERATED AT THE ANODE.阴极释放出氢气，氢气量是阳极释放的氧气量的两倍.ACTIVATES SURFACE.活化表面.CERTAIN OXIDE FILMS ARE REDUCED.某些氧化膜被还原.A DISADVANTAGE IS THAT METALLIC IONS CAN DEPOSIT ON THE WORK AS A LOOSE ADHERENT SMUT.缺点是金属离子会以疏松的污物形式沉积在工件表面.,ALKALINE CLEANING 碱洗,ANODIC ELECTROCLEANING阳极电解除油OXYGEN LIBERATED AT THE ANODE. THIS TYPE OF CLEANING WILL REMOVE SMUT. 阳极释放出氧气，这种形式的清洗能除去污垢.METALLIC CONTAMINATES WILL NOT DEPOSIT ON WORK.金属污染物不会沉积在工件表面.FORMS OXIDES产生氧化膜PASSIVATES SURFACE钝化表面.,ELECTROCLEANING REACTIONS电解除油反应,ANODE REACTION 阳极反应4(OH)- - 4e 2H2O + O2CATHODE REACTION 阴极反应4H2O + 4e 4(OH)- + 2H2,ALKALINE CLEANING 碱洗,ULTRASONIC 超声波 ULTRASONIC GENERATORS ARE USED TO CREATE SOUND WAVES WHICH IN TURN ARE CONVERTED WITHIN THE SOLUTION TO MECHANICAL ENERGY.超声波发生器被用来产生声波，它在溶液中会被转化成机械能.ULTRASONIC ENERGY ALTERNATELY COMPRESSES AND EXPANDS THE SOLUTION WHICH PRODUCES SEVERAL CONCURRENT EFFECTS.超生波可选择性地压缩和膨胀液体，使之产生几种同步效应CAVITATION DUE TO FREQUENCY ASSISTS THE PHYSICAL REMOVAL OF SOILS.由于高频率导致的气穴现象导致污物被物理方法去除.,ALKALINE CLEANING 碱洗,SPRAY CLEANING 喷射清洁SOLUTION IS USUALLY MILDLY ALKALINE DEPENDING UPON THE BASE METAL.根据基材的不同，溶液常常含有微碱性。ACCOMPLISHED BY PUMPING THE CLEANING SOLUTION THROUGH A SERIES OF PIPES AND JETS.通过一系列的管和喷射装置，通常由泵来输送清洗剂.ACTION OF PHYSICAL IMPACT AND CHEMICAL ACTION REMOVES DUST, METAL FINES, CARBON SMUT AND OTHER RESIDUES.物理的冲击作用和化学反应去除了灰尘、金属微尘、碳化物和其它的残留物。,TYPE OF CLEANING 清洗的类型,ACID PICKLING 过酸WHY DO WE PICKLE? 为什么要用酸浸泡？TO REMOVE OXIDES FROM THE SURFACE OF THE METAL TO OBTAIN GOOD BONDING OF THE SUBSEQUENT DEPOSIT.去除金属表面的氧化膜，使后来的金属镀层得到好的结合力。NEUTRALIZE ANY RESIDUAL ALKALINE FILM LEFT ON THE SURFACE.中和残留在表面的碱性膜。,ACID PICKLING 过酸去氧化膜,CHEMISTRY OF PICKLING 过酸的化学反应ACID酸 + BASE基材 H2O水 + SALT盐Sulfuric Acid + Caustic Soda Water + Sodium Sulfate硫酸氢氧化钠水硫酸钠ACID酸 + METAL金属 H2 氢气 + SALT盐Sulfuric Acid + Steel Hydrogen + Ferrous Sulfate硫酸 不锈钢氢气硫酸亚铁ACID酸 + METALLIC OXIDE金属氧化物 H2O水 + SALT盐Sulfuric Acid + Copper Oxide Water + Copper Sulfate硫酸氧化铜水硫酸铜,ACID PICKLING酸浸泡,METALS金属CHEMICALS 过酸使用的化学品 STEELH2SO4 or HCl不锈钢ACID SALTS ( NH4HF )酸性盐COPPER & H2SO4 or HClCu ALLOYSORGANIC ACIDS 有机酸铜及铜合金ACID FORMING SALTS 酸盐ALUMINUM H2SO4, H3PO4, HNO3 or HF铝 ZINC & ALLOYS ACID FORMING SALTS 酸盐锌及锌合金,SOAK CLEANER TYPE热浸清洗剂的类型,NON ETCHING 不发生浸蚀的BUFFING COMPOUND REMOVAL除腊水USED AS ULTRASONIC CLEANER超声波清洗用清洗剂LIGHT DIRT AND SOIL REMOVAL轻微脏物和污物去除剂,CLEANING & PICKLING清洗与过酸活化,SUMMARY总结PRE-CLEANING - VERY IMPORTANT.预清洗非常重要SELECTION OF PRE-CLEANING CYCLE IS DEPENDENT ON NATURE OF SOIL & BASE METAL.预清洗流程的选择根据污染物和基材的特性而定ELECTRO-CLEANING IS ESSENTIAL IN PRODUCING HIGH QUALITY METAL DEPOSITS.要获得高品质的金属镀层，电解清洗是必需的THOROUGH RINSING AFTER EVERY CLEANING AND PICKLING SOLUTION IS IMPORTANT IN PRODUCTION OF HIGH QUALITY DEPOSITS.在高品质电镀的生产中，每一个除油和过酸步骤后的彻底漂洗是非常重要的CLEANED AND RINSED PARTS ARE PICKLED TO REMOVE OXIDES AND ACTIVATE THE SURFACE OF THE BASE METAL.彻底除油并水洗后的工件过酸是为了除去氧化物和活化基材的表面.,BRIGHT ACID COPPER PLATING光亮酸铜电镀,BRIGHT ACID COPPER PLATING光亮酸铜电镀,APPLICATIONS 应用,DECORATIVE INTERMEDIATE COATING装饰的中间层Steel不锈钢Zinc Die Casting 锌压铸Brass黄铜Plastics 塑料Aluminum 铝,INDUSTRIAL COATING工业用的镀层Electroforming 电成型Electrotyping 电铸Rotogravure 印刷用滚筒Electroclading 电镀金属包层Stop-Off in Case hardening 中转镀层,ACID COPPER PROCESS FEATURES酸铜流程特点,BRIGHT 光亮GOOD LEVELING 好的填平DUCTILE 延展性好STRESS FREE 无应力FINE GRAIN DEPOSITS镀层结晶细致EASY TO CONTROL 容易控制FAST PLATING 快速电镀,EASILY BUFFED 容易抛光GOOD ELONGATION 好的延展性GOOD MICROTHROW 好的微观均镀性MACHINEABLE 好的机械加工性能GOOD ELECTRICAL CONDUCTIVITY 好的电导性,Why Acid Copper ?为什么用酸铜,Provides Leveling of Polishing/Buffing Scratches抛/磨光后提供好的填平效果,LEVELING 填平,MACROTHROW宏观上的均镀,THE ABILITY TO DEPOSIT METAL RELATIVELY UNIFORMLY OVER A BROAD CURRENT DENSITY RANGE 在一个宽的电流密度范围内相对地镀层均匀分布的能力,MICROTHROW 微观上的均镀,THE ABILITY TO DEPOSIT METAL IN GROOVES, PORES, CRACKS AND SURFACE IMPERFECTIONS OF MICROSCOPIC NATURE在凹槽、小孔、裂纹和其他表面微观缺陷上沉积镀层的能力.,Why Acid Copper ? 为何用酸铜？,Provides Leveling of Scratches将砂痕印填平,Dg,Tg,Ts,Good LevelingMicrothrow好的填平 及微观均镀,Poor/No Leveling差/无填平,% Leveling = Tg- Ts x 100 Dg,Why Acid Copper ? 为何用酸铜,Provides A Bright, Easy to Buff Surface for Coverage of Very Minor Blemishes in Castings, Aluminum or Plastic 提供一个光亮的、电镀后容易抛光覆盖压铸件,铝材或塑料表面的微小缺陷的镀层.,Bright Surface That Requires Little/No Buffing少/ 不要求抛光的光亮表面.,Long Term Protection Against Corrosion长期耐蚀,Microscopic Section Of A Porous Casting. Plating Has Bridged Surface Pores多孔压铸件的横截面图，电镀镀层覆盖了表面的微孔.,Spots,Surface Pores表面微孔,TYPICAL BATH FORMULATION传统的槽液配方及条件,Copper Sulfate 硫酸铜Sulfuric Acid 硫酸Chloride 氯离子Ultra Agents 添加剂Temperature 温度Anode Current Density 阳极电流密度Cathode Current Density 阴极电流密度,20-32 oz/gal (150 - 240 g/l)6-12 oz/gal (45 - 90 g/l)20 - 120 ppm (mg/l)As Recommended72 - 90F (22 - 32C)15 - 30 AS (1.5 - 3.0 A/dm2)20 - 80 A/Ft2 (2.0 - 8.0 A/dm2),BATH CHEMISTRY槽液化学物,CuSO4 Cu+ + SO4= Cathode Anode阴极阳极H2SO4 2H+ + SO4=CathodeAnode阴极阳极HCl H+ + Cl-Cathode Anode,Acid Copper Plate酸铜电镀,Key Ingredients 关键成份:Copper Sulfate 硫酸铜180-225 g/LSulfuric Acid 硫酸45-90 g/L,Acid Copper Plate酸铜电镀,Other Ingredients 其它成份:Chloride 氯化物80-120 mg/LUltra mu 开缸剂8-10 ml/LUltra A 添加剂0.3-0.5 ml/LUltra B 添加剂0.3-0.5 ml/L,COPPER SULFATE 硫酸铜,HIGH CONC.高浓度LOSS OF BRIGHTNESS AND LEVELING光亮度和填平性能的减少 ,并且阳极易结晶、钝化 240 g/l,LOW CONC.低浓度LOSS IN LEVELING AND BATH CONDUCTIVITY槽液导电性和填平性能的减少 113 g/l,Function of Ingredients 各成份的功能,At 113 gL,At 285 g/L,Low copper content can cause reduced leveling, slow deposition, and a narrow current density range铜含量低将减少填平性能、沉积慢和电流密度范围窄.Concentrations 248 g/L copper sulfate may produce crystals on tank walls, and anode bags, yielding rough deposits, and poor anode corrosion.硫酸大于248g/L会在槽壁中、阳极袋中产生结晶,引起粗糙的沉积和阳极溶解不好.,Low Copper Sulfate低硫酸铜,The Hull Cell indicates that at 113 g/L Copper Sulfate a deposit that is burned at very high current densities is produced.赫氏槽实验显示113g/L浓度下的硫酸铜液中沉积的金属在高电流密度下出现烧焦的情况,SULFURIC ACID 硫酸,GRAIN REFINEMENT晶粒细化SOLUTION CONDUCTIVITY溶液导电REDUCES ANODE POLARIZATION减少阳极极化IMPROVES THROWING POWER提高均镀能力,SULFURIC ACID 硫酸,HIGH CONC.高浓度 INCREASED ANODE CORROSION增加阳极溶解 INCREASE IN COPPER CONTENT铜含量增加,LOW CONC.低浓度 HCD BURNING高电流密度烧焦 NODULATION结瘤 POOR LEVELING填平差 DULLNESS颜色暗,Function of Ingre