FPC板基本组成培训教材.doc

达利电子实业有限公司fpc基本组成培训教材页 次：第1页；共9页一、 铜箔基材的组成： 1、单面板铜箔基材的组成：铜箔+胶+pi 2、单面板铜箔基材的叠构：铜箔胶pi 3、双面板铜箔基材的组成：铜箔+胶+pi+胶+铜箔 4、双面铜箔基材的叠构：pi胶铜箔铜箔胶二、保护膜的组成： 1、保护膜的组成：胶+pi 2、保护的叠构：胶pi 三、基本单位换算： 1mil=0.0254mm 1oz 1.4mil 1inch=25.4mm编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第2页；共9页四、原材料资料表覆 铜 板表示方法材料型号材料组成材料厚度厂商单面铜箔kchhxsir0505130.5mil（pi）+0.5mil胶+0.5ozcu1.7mil台虹kc1hxsir100520ajy1mil（pi）+0.8mil胶+0.5ozcu2.5milkc1h2005k8101mil（pi）+1mil胶+0.5ozcu2.7milrogerskc112005k1101mil（pi）+1mil胶+1ozcu3.4milkc1h1000l8101mil（pi）+1mil胶+0.5ozcu2.7milkc11lf9110r1mil（pi）+1mil胶+1ozcu3.4mildupontkchhpscr12095040.5mil（pi）+0.5mil胶+0.5ozcu1.7mil律胜kchhpsbr12110.5mil（pi）+0.5mil胶+0.5ozcu1.7mil双面铜箔ckc111ndir101020noc1mil（pi）+0.8mil胶+1ozcu5.4mil台虹ckc111ndie100320hme1mil（pi）+0.8mil胶+0.5ozcu4milckch1h1000l8181mil（pi）+1mil胶+0.5ozcu4.4milrogersckc1111100l1111mil（pi）+1mil胶+1ozcu5.8milckc111lpi1ed35-d1mil（pi）+1mil胶+1ozcu5.8mil九江福莱克斯ckc111fr9111r1mil（pi）+1mil胶+1ozcu5.8mildupontckchhhpdbe15095710.5mil（pi）+0.5mil胶+0.5ozcu2.9mil律胜ckc111lvw1035eat101mil（pi）+1mil胶+1ozcu5.8mil住友保 护 膜表示方法材料型号材料组成材料厚度厂商ka11fd1025al31mil（pi）+1mil胶2mil台虹kahhfd0515hl0.5mil（pi）+0.7mil胶1.2milka11cpi1a11mil（pi）+1mil胶2mil九江福莱克斯kahhpcap10190.5mil（pi）+0.7mil胶1.2mil律胜kahhpcap10211mil（pi）+1mil胶2milkahhca2310.5mil（pi）+0.5mil胶1mil信越ka11cvk1030ka1mil（pi）+1mil胶2mil住友pi（i）50p25做补强板用3mil东溢kahh2005cfho0.5mil（pi）+0.5mil胶1milrogerska112005c1101mil（pi）+1mil胶2mil2005bf000.5 milka11fr01101mil（pi）+1mil胶2mildupontka11lf01101mil（pi）+1mil胶2mil编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第3页；共9页五、fpc基本组成及叠构厚度：（以下列几种型号基材为例）单面铜箔基材型号：xsir050513 组成厚度：0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔） 双面铜箔基材型号：ndir101020noc组成厚度：1oz（铜箔）+0.8mil(胶)+ 1mil(pi)+0.8mil(胶)+1oz（铜箔） 保护膜型号：fd0515hl 组成厚度：0.5mil(pi)+0.7mil(胶)保护膜型号：ca231 组成厚度：0.5mil（pi）+0.5mil胶1、单面板的叠构组成：a、单面板组成：铜箔基材+保护膜 b、单面板叠构：铜箔胶pipi胶保护膜铜箔基材 c、单面板厚度公差： j0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.7mil(胶)=2.9mil （0.0740.01 mm） k0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.5mil(胶)=2.7mil （0.0690.01 mm） 2、双面板的叠构组成： a、双面板组成： 保护膜+铜箔基材+保护膜 b、双面板叠构：pi胶胶pipi胶铜箔铜箔胶保护膜铜箔基材保护膜编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第4页；共9页 c、双面板厚度公差： j0.5mil(pi)+0.7mil(胶)+1oz（铜箔）+0.8mil(胶)+ 1mil(pi)+0.8mil(胶)+1oz（铜箔）+0.5mil(pi)+0.7mil(胶)= 7.8mil (0.1980.02mm) k0.5mil(pi)+0.5mil(胶)+1oz（铜箔）+0.8mil(胶)+ 1mil(pi)+0.8mil(胶)+1oz（铜箔）+0.5mil(pi)+0.5mil(胶)= 7.4mil (0.1880.02mm) 3、镂空板的叠构组成： a、镂空板的组成： 保护膜+1oz纯铜箔+保护膜 b、镂空板的叠构：1oz纯铜箔胶pipi胶保护膜纯铜箔保护膜 c、镂空板厚度公差： j0.5mil(pi)+0.7mil(胶)+1oz（纯铜箔）+0.5mil(pi)+0.7mil(胶)=3.8mil (0.0970.02mm) k0.5mil(pi)+0.5mil(胶)+1oz（纯铜箔）+0.5mil(pi)+0.5mil(胶)=3.4mil (0.0860.02mm)4、双层板的叠构组成： a、双层板组成： 保护膜+铜箔基材+纯胶+铜箔基材+保护膜 b、双层板叠构：铜箔胶pipi胶保护膜铜箔基材铜箔胶pipi胶保护膜铜箔基材纯胶纯胶编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第5页；共9页 c、双层板厚度公差 ： j0.5mil(pi)+0.7mil(胶)+0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(胶)+0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.7mil(胶)= 6.3mil (0. 160.02mm)k0.5mil(pi)+0.5mil(胶)+0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(胶)+0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.5mil(胶)= 5.9mil （0.150.02mm) 5、三层板的叠构组成： a、三层板组成： 保护膜+铜箔基材+纯胶+保护膜+铜箔基材+纯胶+铜箔基材+保护膜b、三层板叠构：纯胶纯胶铜箔胶pipi胶保护膜铜箔基材铜箔胶pipi胶保护膜铜箔基材pi胶保护膜铜箔胶pi铜箔基材纯胶纯胶c、三层板厚度公差 ： j0.5mil(pi)+0.7mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi)+0.7mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi) +0.5mil(胶)+ 0.5oz（铜箔）+0.7mil(胶)+0.5mil(pi)=9.7mil (0.2460.03mm)k0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi) +0.5mil(胶)+ 0.5oz（铜箔）+0.5mil(胶)+0.5mil(pi)=9.1mil (0.2310.03mm)编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第6页；共9页6、四层板的叠构组成： a、四层板组成： 保护膜+铜箔基材+纯胶+保护膜+铜箔基材+纯胶+铜箔基材+保护膜+纯胶+铜箔基材+保 护膜 b、四层板叠构：纯胶纯胶铜箔胶pipi胶保护膜铜箔基材铜箔胶pipi胶保护膜铜箔基材pi胶保护膜铜箔胶pi铜箔基材纯胶纯胶铜箔胶pipi胶保护膜铜箔基材纯胶纯胶c、四层板厚度公差 ： j0.5mil(pi)+0.7mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi)+0.7mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi) +0.5mil(胶)+ 0.5oz（铜箔）+0.7mil(胶)+0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi) +0.5mil(胶)+ 0.5oz（铜箔）+0.7mil(胶)+0.5mil(pi)=13.1mil (0.3330.04mm) k0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi) +0.5mil(胶)+ 0.5oz（铜箔）+0.5mil(胶)+0.5mil(pi)+0.5mil(胶)+ 0.5mil(pi) +0.5mil(胶)+ 0.5oz（铜箔）+0.5mil(胶)+0.5mil(pi)=12.3mil (0.3120.04mm)编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第7页；共9页六、其它型号基材组成厚度 1. 单面板厚度公差：j铜箔基材型号：xsir050513 保护膜型号：fd1025al3 0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+1mil(pi)+1mil(胶)=3.7mil （0.0940.015 mm） k铜箔基材型号：xsir100520ajy 保护膜型号：fd1025al31mil(pi)+0.8mil(胶)+0.5oz（铜箔）+1mil(pi)+1mil(胶)=4.5mil （0.1140.015mm）l铜箔基材型号：xsir100520ajy 保护膜型号：fd0515hl1mil(pi)+0.8mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.7mil(胶)=3.7mil （0.0940.01mm）m铜箔基材型号：xsir100520ajy 保护膜型号：ca2311mil(pi)+0.8mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.5mil(胶)=3.5mil （0.0890.01mm）n铜箔基材型号：2005k810 保护膜型号：fd1025al31mil(pi)+1mil(胶)+0.5oz（铜箔）+1mil(pi)+1mil(胶)=4.7mil （0.1190.015mm）o铜箔基材型号：2005k810 保护膜型号：fd0515hl1mil(pi)+1mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.7mil(胶)=3.9mil （0.0990.01mm）p铜箔基材型号：2005k810 保护膜型号：ca2311mil(pi)+1mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.5mil(胶)=3.7mil （0.0940.01mm）q铜箔基材型号：2005k110 保护膜型号：fd1025al31mil(pi)+1mil(胶)+1oz（铜箔）+1mil(pi)+1mil(胶)=5.4mil （0.1370.015mm）r铜箔基材型号：2005k110 保护膜型号：fd0515hl1mil(pi)+1mil(胶)+1oz（铜箔）+0.5mil(pi)+0.7mil(胶)=4.6mil （0.1170.015mm）s铜箔基材型号：2005k110 保护膜型号：ca2311mil(pi)+1mil(胶)+1oz（铜箔）+0.5mil(pi)+0.5mil(胶)=4.4mil （0.1120.015mm）编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第8页；共9页 2. 双面板厚度公差：j铜箔基材型号：ndir101020noc 保护膜型号：fd1025al3 1mil(pi)+1mil(胶)+1oz（铜箔）+0.8mil(胶)+ 1mil(pi)+0.8mil(胶)+1oz（铜箔）+1mil(pi)+1mil(胶) =9.4mil (0.2390.03mm) k铜箔基材型号：ndie100320hme 保护膜型号：fd1025al31mil(pi)+1mil(胶)+0.5oz（铜箔）+0.8mil(胶)+ 1mil(pi)+0.8mil(胶)+0.5oz（铜箔）+1mil(pi)+1mil(胶) =8mil (0.2030.03mm)l铜箔基材型号：ndie100320hme 保护膜型号：fd0515hl0.5mil(pi)+0.7mil(胶)+0.5oz（铜箔）+0.8mil(胶)+ 1mil(pi)+0.8mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.7mil(胶)=6.4mil (0.1630.02mm) m铜箔基材型号：ndie100320hme 保护膜型号：ca2310.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+0.8mil(胶)+ 1mil(pi)+0.8mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.5mil(胶)=6.0mil (0.1520.02mm)n铜箔基材型号：1000l818 保护膜型号：fd1025al31mil(pi)+1mil(胶)+0.5oz（铜箔）+1mil(胶)+ 1mil(pi)+1mil(胶)+0.5oz（铜箔）+1mil(pi)+1mil(胶)=8.4mil (0.2130.03mm)o铜箔基材型号：1000l818 保护膜型号：fd0515hl0.5mil(pi)+0.7mil(胶)+0.5oz（铜箔）+1mil(胶)+ 1mil(pi)+1mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.7mil(胶)=6.8mil (0.1730.025mm)p铜箔基材型号：1000l818 保护膜型号：ca2310.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+1mil(胶)+ 1mil(pi)+1mil(胶)+0.5oz（铜箔）+0.5mil(pi)+0.5mil(胶)=6.4mil (0.1630.02mm)q铜箔基材型号：1100l111 保护膜型号：fd1025al31mil(pi)+1mil(胶)+1oz（铜箔）+1mil(胶)+ 1mil(pi)+1mil(胶)+1oz（铜箔）+1mil(pi)+1mil(胶)=9.8mil (0.2500.03mm)编 制校 核审 查安捷利电子实业有限公司fpc基本组成培训教材页 次：第9页；共9页r铜箔基材型号：1100l111 保护膜型号：fd0515hl0.5mil(pi)+0.7mil(胶)+1oz（铜箔）+1mil(胶)+ 1mil(pi)+1mil(胶)+1oz（铜箔）+0.5mil(pi)+0.7mil(胶)=8.2mil (0.2080.03mm) s铜箔基材型号：1100l111 保护膜型号：ca2310.5mil(pi)+0.5mil(胶)+1oz（铜箔）+1mil(胶)+ 1mil(pi)+1mil(胶)+1oz（铜箔）+0.5mil(pi)+0.5mil(胶)=7.8mil (0.1980.03mm)铜箔基材型号：pdbe1509571 保护膜型号：fd1025al31mil(pi)+1mil(胶)+0.5oz（铜箔）+0.5mil(胶)+ 0.5mil(pi)+0.5mil(胶)+0.5oz（铜箔）+1mil(pi)+1mil(胶)=6.9mil (0