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dell confidential summaryquality supplier audit (flex/mcx) company:foxconnaudit date: location:kstotal score: rating: approved90-100% conditionally approved70-89% not approvedspec conditions) are violated 物控系統被破壞? 3.2.6.bb.) suppliers tolerance for usage is tighter than storage conditions (ie: usage must be a low temp but can be stored at high temp) 供應商使用公差比倉儲條件緊(使用必需低溫但可高溫儲存) (ref 4.15)3.2.7are storage facilities (containers) used for holding parts appropriate? (ie: esd/thermal/combustible parts) 用於倉儲物料設備或設施是否適宜? dell confidentialwarehouse14/2 (ref 4.16)3.2.8is control journal/on-line system used to manage numbers and lots of incoming and outgoing parts? 有無用物控期刊管理來料和出貨批次數字? (ref 4.16)3.2.9is the materials control journal properly maintained? 有無對物控期刊定期維護? (ref 4.16)3.2.10are the materials control records maintained per the procedures defined? 物控記錄有無按程序要求維護? avg score:# score 3. materials identificationsubtotal:0counts:0yes=1; no=0; n/a=xremarks (ref 4.16)3.3.1is there any system to identify materials location? (indication, address control, and etc) 有無識別物料位置系統(索引、地點、管控) (ref 4.16)3.3.2are the materials in the warehouse clearly identified with part name or part number? 倉儲物料是否清楚標示料號? (ref 4.16)3.3.3are the “reserved“ and “stalled“ materials clearly identified and separately handles? 保存和擺放物料是否標識清楚和分開處理? (ref 4.16)3.3.4are the non-conformance materials identified, recorded, and segregated? 不良物料有無標識記錄隔離? (ref 4.16)3.3.5are defective materials clearly separated from non-defective materials and appropriately handled? 不良物料是否清楚標識與處理? (ref 4.16)3.3.6are flammable, corrosive, and toxic materials properly stored and segregated? 易燃、腐蝕性、有毒的物料是否適當存儲和隔離? (ref 4.16)3.3.7has a clear method been established for managing delivery boxes? (re-cycle box may be dirty and with many old stickers) 有無清楚建立處理運輸箱方法?(再使用箱很臟且貼很多的舊標簽) (ref 4.16)3.3.8are delivery boxes managed in accordance with these rules? (re-cycle box may be dirty and with many old stickers ) 運輸箱是否遵循規則管理?(再使用箱很臟且貼有很多舊標簽) (ref 4.16)3.3.9are all the materials in the kit clearly identified with part number for traceability when necessary? 配套物料是否清楚標示料號供必要時可追溯? avg score:# score 4. environment controlsubtotal:0counts:0yes=1; no=0; n/a=xremarks (ref 4.15) 3.4.1are temperature and humidity monitored on a regular basis? how frequent? 溫度和濕度是否有根據一般規律來監控?頻率怎樣? (ref 4.15) 3.4.2are there appropriate controls on temperature and humidity? 有沒有適當去控制關於溫度和濕度呢? (ref 4.15) 3.4.3are action taken when temperature or humidity out of control range? dell confidentialsub no=0; n/a=x (ref 4.9)4.1.1 is process management flow available? (e.g., qc flow chart, pmp) 有無制程管理流程表?(qc流程圖、pmp) (ref 4.9)4.1.2 is there a work instruction for each process/station? 每道次每站有無工作指示圖(sop)? (ref 4.9)4.1.3 does the working instructions sheet clearly specify the machines, equipment, tools, fixtures, and program to be used? sop是否清楚注明所用的機器、設備、工具、治具、程序? (ref 4.9)4.1.4 does the working standard specify the materials (including part number) to be used? (e.g., part number/name, assembly tools, inspection tools) 工作標準有無注明所用材料(包括料號即:料號、裝配治具、檢驗工具)? (ref 4.9)4.1.5 does the work standard specified assembly specifications and machine setting? (e.g., solder temp, torque connector setting, and adjustment/test specifications) 工作標準有無注明裝配規格和模具設定?(焊接溫度,插頭設定與測試規格)? (ref 4.5)4.1.6 are the quality documents (e.g., qc-flow/work instructions) revision controlled and approved by authorized personnel prior to issue? 品質文件(qc工程圖)版次有無經權威人士管控及確認? (ref 4.5)4.1.7 are the changes identified in the document or otherwise? 文件有無確定變更內容? (ref 4.16)4.1.8 is there a master list of these changes? 有無變更明細記錄? (ref 4.13)4.1.9 is there a documented control system for non-conformity? (e.g., car, rescreen, rework, and etc) 有無不良管控系統?(即:car 返工等) avg score: #div/0! 2. manual and sub assembliessubtotal:0counts:0yes=1; no=0; n/a=x remarks (ref 4.9)4.2.1 is the actual process set up according to the qc-flow? 是否根據qc工程流程圖設定實際操作工序? (ref 4.9)4.2.2 is the conveyor speed defined and verified on a regular basis? 傳送帶速度定義和調整正常范圍? dell confidentialsub no=0; n/a=x remarks (ref 4.8) 4.6.1 is the materials at manual and final assembly clearly identified? (e.g., part number, description, quantity, etc.) 手工操作最後裝配過程中物料有無明確標識? (ref 4.8) 4.6.2 are the materials used traceable to actual build product? 物料可否追溯到實際生產成品? (ref 4.15) 4.6.3 is there a requirement to verify correct materials are being used before start of production? 生產前,有無要求去驗証物料是否正確? (ref 4.15) 4.6.4 is the materials verification log sheet maintained? 物料驗証標簽是否維護? (ref 4.15) 4.6.5 are all materials bins in the line labeled with printed part number and description? 生產中物料是貼標簽注明料號和描述? (ref 4.15) 4.6.6 are all esd sensitive materials stored in anti-static container? 所有esd敏感材料是否用防靜電箱倉存? (ref 4.13)4.6.7 for product failed test, is the non-conformance product identified, recorded, and segregated? 電測不良品,有無不良品標識,記錄並隔離? (ref 4.13)4.6.8 are boxes or wagons used for defective goods clearly marked as such? 組裝不良品是否清楚標識? avg score:100%score 7. statistical process controlsubtotal:1counts:1yes=1; no=0; n/a=x remarks (ref 4.20)4.7.1 is there a spc plan that contained a description of the spc system, responsibilities, and steps required to implement spc at a specific operation? (ref 4.20)4.7.2 is the spc training plan documented? spc培訓計劃是否文件化? (ref 4.18)4.7.3 have all the relevant employees been trained according to the spc training plan? 相關職員是否受到於spc培訓計劃? (ref 4.18)4.7.4 is there a spc training program? 有無spc培訓程序? (ref 4.18)4.7.5 does the spc training program include control chart theory and process capability analysis skills? spc程序是否包括管控圖和過程能力分析技巧? (ref 4.18)4.7.6 is the spc training record for each employees maintained? 每位職位spc培訓計劃有無維護? (ref 4.20)4.7.7 are all critical processes and parameters under statistical control? (e.g., control chart, cp/cpk study) dell confidentialsub no=0; n/a=x remarks (ref 4.15)4.8.1 are temperature and humidity monitored on a regular basis? how frequent? 溫度、濕度是否定時調整正常?調整頻率? (ref 4.15)4.8.2 are there appropriate controls on temperature and humidity? 有無適當對溫度、濕度進行控管? (ref 4.15)4.8.3 are action taken when temperature or humidity out of control range? dell confidentialfunc test, no=0; n/a=xremarks (ref 4.9)5.1.1 is there a work instruction for each test station? 每個站都有作業指導書嗎? (ref 4.9)5.1.2 does the working instructions sheet clearly specify the machines, equipment, tools, fixtures, and program to be used? 作業指導書中有沒有詳細說明哪些被用到機器、設備、模具? (ref 4.9)5.1.3 is there a procedure to control test program? (ref 4.9)does the procedure for test program specify the control of: 有無程序來控制測試站? 5.1.4.a a.) revision? 版本? 5.1.4.b b.) specifications? 規格? 5.1.4.c c.) tolerance? 公差? 5.1.4.d d.) coverage? 范圍? 5.1.4.e e.) number of copy issued and location? 發行數量? (ref 4.9)5.1.5 are the changes identified in the document or otherwise? 變更在文件中可以被識別嗎? (ref 4.5)5.1.6 is there a master list of these changes? 有沒有清單記錄這些變更? avg score:#div/0!score 2. burn-insubtotal:0counts: yes=1; no=0; n/a=xremarks (ref 4.10) 5.2.1 is the actual process set up according to the qc-flow? 實際操作程序是否根據qc流程? (ref 4.10) 5.2.2 are copies of work standards (newest revision) available at the burn-in station? (product specific) 生產過程中發行的圖紙是否是最新版本? (ref 4.10) 5.2.3 is work carried out in accordance with the work standard? 生產是否與生產標準一致,且是否根據標準嚴格執行? (ref 4.10) 5.2.4 are the connectors 100% burn-in at 3550 deg c, for 1hr (min), continuous seek? (ref 4.10) 5.2.5 are the burn-in environment monitored daily? 老化環境每日有被監控嗎? (ref 4.10) 5.2.6 are the connectors at burn-in monitored hourly? else, how frequent? dell confidentialfunc test, no=0; n/a=xremarks (ref 4.10) 5.3.1 is working instructions available at each assembly process? (product specific) 在每一個組裝過程中作業指導書是否都可用到? (ref 4.10) 5.3.2 is work carried out in accordance with the work standard? 生產與生產標準是否一致?生產是否根據標準貫徹執行? (ref 4.10) 5.3.3 is the test operator certified to set-up and run ict/functional test? 測試操作者有經過ict、功能測試証明嗎? (ref 4.10) 5.3.4 is the test program name and revision specified on the test instructions? 測試儀器名字和版本是否有列入測試証明書中? (ref 4.10) 5.3.5 is there a system to verify correct test program has been downloaded? 有沒有體系來核實正確的測試儀器被使用? (ref 4.10) 5.3.6 are the locations of support pins in the test fixture specified? i 在測試固定設備中有沒有當地資源被列入? (ref 4.10) 5.3.7 does the test measure and track critical parameters ? 有測試方法和測試參數嗎? (ref 4.10) 5.3.8 is it sufficient? 這些足夠嗎? (ref 4.10) 5.3.9 is the total test coverage (including ict and functional test) greater than 95%? 整個測試范圍(包括ict功能測試)會大於95%嗎? (ref 4.10) 5.3.10 is the untested components identified? 未被測試部分可以被識別嗎? (ref 4.10) 5.3.11 does the supplier establish a process to verify untested components? 供應商有沒有建立程序來檢驗未被測試的部分? (ref 4.10) 5.3.12 are the criteria for judging defects clear? 判斷缺點的標準是否清楚? (ref 4.10) 5.3.13 is test yield monitored? is target value/process trigger limits defined? 測試有被監控嗎? (ref 4.10) 5.3.14 is process-defect recording sheet maintained, correctly filled in, and review on a regular basis? 過失記錄有沒有被維持,被矯正被評論在合格根據裡? (ref 4.10) 5.3.15 is the cause of defect identified? 過失的原因有被確定嗎? (ref 4.10) 5.3.16 is action taken to improve yield? 被實施的動作有沒有提高產量? (ref 4.10) 5.3.17 is the action report reviewed and approved by relevant authority to ensure low product quality risk? 矯正措施是否有經相關授權的人審核且被批準來減少品質風險? (ref 4.10) 5.3.18 is the work bench in the static-safe area properly grounded? 工作長椅在靜態安全區有被很好地接好嗎? dell confidentialfunc test, no=0; n/a=xremarks (ref 4.10)5.3.1 is the actual process set up according to the qc-flow? 實際操作過程是否依據qc流程? (ref 4.10)5.3.2 are copies of work instructions available at the inspection station? (product specific) 在出貨檢驗站作業指導是否被用到? (ref 4.10)5.3.3 does the visual inspection checks for jumper setting? 跳躍裝置是通過視覺檢查嗎? (ref 4.10)5.3.4 does the visual inspection checks for “push-pins“? 推針是通過視覺檢查嗎? (ref 4.10)5.3.5 does the visual inspection checks for mounting screws? 裝置螺絲通過視覺檢查嗎? (ref 4.10)5.3.6 does the visual inspection checks for safety labels, bar-code labels, and etc? lable bar-codelable是通過視覺檢查嗎? (ref 4.10)5.3.7 are the criteria for judging defects clear? are they thoroughly understood by all personnel? (e.g., training records) 判定缺點的標準清楚嗎?所有操作人員都明白?(培訓記錄) (ref 4.10)5.3.8 is the work bench in the static-safe area properly grounded? 工作長椅在安全區有被很好的接好嗎? avg score:#div/0!score 5: equipment controlsubtotal:0counts: yes=1; no=0; n/a=xremarks (ref 4.11)5.4.1 is the (test) equipment used for measuring/inspection calibrated? 測試設備是否有於測量、檢驗標準? (ref 4.11)5.4.2 are manufacturing measuring equipment gr no=0; n/a=xremarks (ref 4.18) 5.6.1 is the operator/inspector properly trained and has sufficient knowledge to perform the operation? 操作人員是否經過培訓及具備足夠的知識? (ref 4.15) 5.6.2 is the operator properly grounded when handling esd sensitive parts? 當處理帶靜電產品時,檢驗人員是否經過適當的接地處理? (ref 4.9 / 4.16) 5.6.3 is operator check static strap on a daily basis? is the records available? 檢驗人員是否有對靜電帶進行日常檢驗,有記錄嗎? (ref 4.9) 5.6.4 is the operator/inspector following the working instructions? 操作員/檢驗員是否有按作業指導書進行作業? (ref 4.15) 5.6.5 is the operator/inspector handling method appropriate, i.e., to avoid damage or mixing? 操作員/檢驗員的作業方式是否適當?如避免損壞及混料 (ref 4.15) 5.6.6 is the inspector wearing gloves/finger cots when handling pcba/connectors? 當檢驗pcba及conn,檢驗員是否有戴手套及指套? avg score:#div/0!score 7. materials handling no=0; n/a=xremarks (ref 4.15) 5.7.1 are all esd sensitive materials stored in anti-static container? 所有帶靜電的物料,是否都存在於防靜電箱內? (ref 4.15) 5.7.2 for boards tested in panel, is the failed board properly identified? 測試機板時,不良的機板是否有進行標示? (ref 4.15) 5.7.3 are the pcbas/connectors properly stored to avoid mixing or damage? 是否所有pcba/插頭有妥善保存以防止混淆及損害? (ref 4.8 / 4.13) 5.7.4 is there any system to identify products that passed test and failed test? (e.g., marking on board/case) 通過檢驗的產品是否有標示程序? (ref 4.13) 5.7.5 for product failed test, is the non-conformance product identified, recorded, and segregated? 未經過檢驗的產品,是否有標示,記錄及隔離? (ref 4.13)5.7.6 are boxes or wagons used for defective goods clearly marked as such? 裝有缺陷成品的盒子和車子是否有清楚的標示? dell confidentialfunc test, no=0; n/a=xremarks (ref 4.20)5.8.1 is there a spc plan that contained a description of the spc system, responsibilities, and steps required to implement spc at a specific operation? 是否有一個描述spc系統,責任人執行流程的spc計劃? (ref 4.20)5.8.2 is the spc training plan documented? spc培訓計劃是否文件化? (ref 4.18)5.8.3 have all the relevant employees been trained according to the spc training plan? 是否所有相關人員都經過spc培訓? (ref 4.18)5.8.4 is there a spc training program? 是否有spc培訓程序? (ref 4.18)5.8.5 does the spc training program include control chart theory and process capability analysis skills? spc培訓程序是否包含控制理論及制程能力分析技巧? (ref 4.18)5.8.6 is the spc training record for each employees maintained? 是否保管所有雇員的spc培訓記錄? (ref 4.20)5.8.7 are all critical processes and parameters under statistical control? (e.g., control chart, cp/cpk study) 是否所有的嚴格制程及參數都受統計控制?(cp/cpk研究 控制圖) (ref 4.20)5.8.8 are upper and lower limits used on control charts? 控制圖表中是否包含上下限? (ref 4.20)5.8.9 are out-of-control conditions noted on control charts, with causes investigated, and actions provided? 控制圖上是否標示,失控條件,包含原因調查及措施提供? (ref 4.20) 5.8.10 are the causes for out-of-control conditions investigated and noted? 失控條件的原因是否被調查及清晰? (ref 4.20) 5.8.11 are the actions for out-of-control conditions provided? 失控條件下有無採取措施? (ref 4.20) 5.8.12 are appropriate action taken when the cp/cpk values not performed to expectation? 當cp/cpk值超出期望時,是否採取必要措施? avg score:#div/0!score 9. environment controlsubtotal:0counts: yes=1; no=0; n/a=xremarks (ref 4.15)5.9.1 are temperature and humidity monitored on a regular basis? how frequent? 是否有進行溫度、濕度的控制,頻率多少? (ref 4.15)5.9.2 are there appropriate controls on temperature and humidity? 是否有對溫度、濕度進行必要的控制? (ref 4.15)5.9.3 are action taken when temperature or humidity out of control range? dell confidentialf.a. no=0; n/a=xremarks (ref 4.13)6.1.1 is there a rework and failure analysis procedures/flows for the specific product being built? 特別產品有建立重工、失敗分析原因程序嗎? (ref 4.13)6.1.2 is there a procedure to handle ntf pcba/connectors? 有沒有程序來掌控ntf pcba插頭? (ref 4.13)6.1.3 does the procedures clearly specify the machines, equipment, tools, fixtures, and program to be used? 這個程序有沒有詳細說明哪些被用機器、模具、設備? (ref 4.16)6.1.4 are the rework and failure analysis procedures revision controlled and approved by authorized personnel prior to issue? 重工、失敗分析原因程序在發行之前有沒有最高管理者評審且核準呢? (ref 4.16)6.1.5 are the changes identified in the document or otherwise? 任何變更在文件或其它地方可以被識別嗎? (ref 4.16)6.1.6 is there a master list of these changes? 有沒有清單來記錄這些變更? avg score: # score 2. rework no=0; n/a=xremarks (ref 4.13)6.2.1 is the rework procedures and materials flow (after rework) readily available? 重工過程和物料流程能容易地可利用嗎? (ref 4.13)6.2.2 are all the necessary documents available at the rework station? (e.g., schematic, layout, bom, etc) dell confidentialf.a. no=0; n/a=xremarks (ref 4.9) 6.3.1 are the tools/fixtures properly identified? 模具、固定設備有沒有準確地標示? (ref 4.9 / 4.14) 6.3.2 are torque measurement check on a regular basis (minimum once/day) and documented? (if applicable) 轉矩測試檢查是根據合格依據還是文件? (ref 4.9) 6.3.3 are the connector bit size and torque setting appropriate? (if applicable) 插頭小的尺寸和轉矩裝置是適當的嗎? (ref 4.9 / 4.14) 6.3.4 are actions taken if torque measurement is out of control spec? (if applicable) 如果轉矩測量在范圍之外是否有採取措施? (ref 4.9 / 4.14) 6.3.5 is solder iron temperature check on a regular basis (minimum once/day) and documented? 烙鐵溫度檢查是依據合格依據還是文件呢? (ref 4.9 / 4.14) 6.3.6 is action taken if solder iron temperature is out of control spec? 如果烙鐵溫度在范圍之外是否有採取措施? (ref 4.11) 6.3.7 is the (test) equipment used for measuring/inspection calibrated? 被用來測試地設備有被校正嗎? (ref 4.9) 6.3.8 is the condition of test equipment, test program, and test fixture verified before start of production? 生產前,有沒有對測試設備,測試項目等進行核實呢? (ref 4.14) 6.3.9 is action taken when condition of test equipment, test program, or test fixture is no good? 若測試設備、測試儀器不好時,是否有採取措施? avg score: # score 4. operator and esd controlsubtotal:0counts:0yes=1; no=0; n/a=xremarks (ref 4.18) 6.4.1 is the operator properly trained and has sufficient knowledge to perform the rework and failure analysis? 操作者是否有適當的培訓和有足夠的知識來完成重工及失敗原因分析? dell confidentialf.a. no=0; n/a=xremarks (ref 4.) 6.5.1 are the materials, including consumables, at manual insertion and rework area clearly identified? (e.g., part number, description) (物料包括消費品)手工插入和重工區域有被清晰地說明嗎? (ref 4.15) 6.5.2 are all esd sensitive materials stored in anti-static container? 所有eso感光物料庫存在反向安全容器裡嗎? (ref 4.15) 6.5.3 are the pcbas/connectors properly stored to avoid mixing or damage? pcba插頭有被很好地儲存來避免混合和損害嗎? (ref 4.13) 6.5.4 for product failed test, is the non-conformance product identified, recorded, and segregated? 產品測試失敗,不符合產品是否有標識,記錄和隔離? (ref 4.13) 6.5.5 are boxes or wagons used for defective goods clearly marked as such? 不合格產品用紙箱是否有清晰地標示? (ref 4.13) 6.5.6 is there any system to identify products after rework? 重工後有沒有任何體系來辨認這些產品呢? (ref 4.13)6.5.7 are the test/inspection marking removed prior to re-input to manufacturing line? 重工部分測試和檢測標示在重工前是否有拿掉? avg score: # score 6. environment controlsubtotal:0counts:0yes=1; no=0; n/a=xremarks (ref 4.15)6.6.1 are temperature and humidity monitored on a regular basis? how frequent? 溫度和濕度是否有根據一般規律來監控?頻率怎樣? (ref 4.15)6.6.2 are there appropriate controls on temperature and humidity? 有沒有適當控制關於溫度和濕度呢? (ref 4.15)6.6.3 are action taken when temperature or humidity out of control range? dell confidentialoba32/9 section 7: open box audit (oba) avg score: # score 1. working proceduressubtotal:0counts:0yes=1; no=0; n/a=xremarks (ref 4.10)7.1.1 is there a open box audit procedure and sampling plan for each model? 對每批產品是否有最終檢驗程序和抽樣計劃? (ref 4.10)7.1.2 does the open box audit procedure specify the sampling plan, acceptance criteria, inspection equipment, and inspection method? 最終檢驗程序是否有規定抽樣計劃,接收標準,檢驗儀器和檢驗方法? (ref 4.10)7.1.3 is there a documented control system for lot rejected a

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