压力传感器介绍.ppt

Design Concept设计概念 Specification 规格 Electrical Concept电性能概念 Quality Concept质量概念,Pressure Sensor,Pressure Sensor,Exploded view of components部件爆破图,Metal shell金属外壳,O-ring O型圈,Ceramic sense chip陶瓷敏感芯体,Signal processing circuit 信号处理电路,Conductive adhesive 导电胶,Plastic socket塑料插座,Pin插针,Pressure Sensor,Animated Exploded view of components部件动态分解图,Ceramic chip陶瓷芯体,Material：材料,Industrial ceramic工业陶瓷,Pressure Sensor,Ceramic chip敏感芯体,Circuit电路,Pressure Sensor,Ceramic sense chip 陶瓷敏感芯体,Signal processing circuit信号处理电路,Pressure Sensor,Plug-in unit插件,Plastic socket塑料插座,Material材料：,PBT+30%GF,Pin插针,Material：材料,CuZn6,Pressure Sensor,Metal shell 金属外壳,Material材料：,Stainless steel不锈钢,Pressure Sensor,Pressure sensor assembly压力传感器组装,Pressure Sensor,Pressure sensor section压力传感器剖面图,Metal shell 金属外壳,O-ring O型圈,Ceramic sense chip陶瓷敏感芯体,Conductive adhesive导电胶,Plastic socket塑料插座,Pin插针,Pressure Sensor,Basic Dimensions(基本尺寸),Pressure Sensor,Specification规格,Power Supply (Vcc) 5+/-0.5 VDC 输入电压5+/-0.5 VDC Supply Current 5 mA Max. 供应电流：最大5mA Operating Pressure 0 1000 Psi 操作压力0 1000 Psi Output Voltage 10 % 90 % Vcc 输出电压10%90%Vcc Proof Pressure 2000 Psi 耐压2000Psi Burst Pressure 3000 Psi 爆破压力3000Psi Operating Temperature -40 135C 操作温度:-40135C Output Load 10Kohm Pulldown 输出负载10Kohm 拉力,Pressure Sensor,Electrical Concept-Characteristics电性能概念-特性,Transfer Function:传输功能： Output%Vcc=10+0.08*PPsi,Pressure Sensor,Error Band误差范围,Electrical Concept-Characteristics电性能概念-特性,Pressure Sensor,Ceramic sense chip陶瓷敏感芯体,a. Vcc 5-30VDC b. Output sensitivity (typical) 2-3mv / V c. Linearity 0.2% d. Repeatability 0.2% e. Hysteresis 0.2% f. Operating temperature range : -40150 g. Temperature drift 0.02FS/ h. Security overload 3* i. Damage overload (typical) 5*,1激励电压530VDC 2输出灵敏度(典型) 2-3mv/V 3线性度 0.2% 4重复性 0.2% 5迟滞性 0.2% 6工作温度范围 -40150 7温度漂移 0.02FS/ 8. 安全过载 3倍额定值 9破坏过载（典型） 5倍额定值,Pressure Sensor,Electrical Concept-Summary电性能概念-总结,Ceramic chip, we have adopted a unique within large dip blind hole design for the ceramic core. It is international initiative and has the following salient features:做为核心的陶瓷芯体，我们采用了独特的内盲孔大倾角设计，为国际首创，具有以下几个显著的特征： Change the traditional bottom sealing within an awl hole as a sealing surface to make the core body were in a quasi-floating state normally and the core were almost no axial force.改变了传统的底面密封方式，以内盲孔环面做为密封面，使得芯体在常态下处于准浮动状态，芯体轴向几乎不受力。 Use small diameter O-ring seals, sealing more reliable.采用小直径O 型密封圈密封，密封更加可靠。 Installation of axial and radial structure will allow a high margin of error.安装结构轴向和径向均允许有较大的误差。 Can also play a positive pressure and negative pressure sealed role.可同时起到正压和负压的密封作用。 Due to the effective sealing surface areas derision, shell axial force decreases by about two thirds.由于密封面的有效面积减小，外壳轴向受力减小了约三分之二。 Signal processing circuit信号处理电路 Higher integration and reliability.更高的集成度和可靠性： Commercial requirement (e.g. Calibration signal all completed by the laser equipments.)商业要求（例如：信号校准过程全部由激光设备完成,Pressure Sensor,Quality Concept质量概念,Goods in check 外协检验,Assemble and test 组装测试,Ship to customer 运输给客户,Ceramic sense chip 陶瓷敏感芯体,Aluminum shell铝壳,Connector接头,O-ring O型圈,Pressure Sensor,Pressure Sensor,Pressure Sensor,Quality contact in delivery location time zone运输位置的质量联系 Response in 8D format 8D的反馈 8D Response Times:8D