常用元件封装.doc

BQFP132EBGA 680L详细规格LBGA 160L详细规格PBGA 217LPlastic Ball Grid Array详细规格SBGA 192L详细规格TEPBGA 288LTEPBGA 288L详细规格TSBGA 680L详细规格CERQUADCeramic Quad Flat PackCLCCCPGACeramic Pin Grid ArrayCeramic CaseLAMINATE CSP 112LChip Scale Package详细规格DIMM 168详细规格DIMM DDR详细规格DIMM168Dual In-line Memory Module详细规格DIMM168DIMM168Pinout详细规格DIMM184For DDR SDRAM Dual In-line Memory Module详细规格DIPDual Inline Package详细规格DIP-tabDual Inline Package with Metal HeatsinkEIAEIAJEDEC formulated EIA StandardsEISAExtended ISA详细规格FBGAFDIPFTO220Flat PackGull Wing Leads HSOP28ISAIndustry Standard ArchitectureITO220ITO3pJ-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsJLCCPCDIPPCI 32bit 5VPeripheral Component Interconnect详细规格PCI 64bit 3.3VPeripheral Component Interconnect详细规格PCMCIAPDIPPGAPlastic Pin Grid Array详细规格PLCC详细规格PQFPPS/2PS/2mouse port pinoutPSDIPLQFP 100L详细规格METAL QUAD 100L详细规格PQFP 100L详细规格QFPQuad Flat PackageQFPQuad Flat PackageTQFP 100L详细规格SBGASC-70 5L详细规格SDIPSIMM30SIMM30Pinout详细规格SIMM30Single In-line Memory ModuleSIMM72SIMM72Pinout详细规格SIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32L详细规格SOJSOP EIAJ TYPE II 14L详细规格SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP 16L详细规格SSOPSocket 603FosterLAMINATE TCSP 20LChip Scale Package详细规格TO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline