高通 - HSPA 的产业环境说明.pdf

1 2 082407 HSPA Ecosystem Panel Jeffrey Belk Mobile Asia Congress November 2007 2 Device and Network Evolution Multiple air interfaces supported with common all IP based core network Selection of access based on service requirements availability cost Full range of devices access the same content across different IP networks 3 Accelerating the Proliferation WCDMA HSPA Jan 2005 First to sample HSDPA solution MSM6275 UMTS HSDPA and EDGE chipset November 2005 First commercial HSDPA enabled devices utilize QUALCOMM s MSM6275 November 2005 First HSDPA data card Novatel Wireless Merlin U730 February 2006 First HSDPA embedded notebook Dell Latitude D820 February 2006 First HSDPA mobile handset Samsung SGH Z560 November 2006 First single chip UMTS QSC6240 and HSDPA QSC6270 solutions Dell Latitude D820 LGE CU320 HEDGE Cingular Samsung ZX20 HEDGE1 8 Cingular Samsung Z560 16mm thin First HSDPA in US First HSDPA for Europe Novatel Wireless Merlin U730 First HSDPA Data Card First HSDPA embedded Notebook 6275 QSC6270QSC6240 QUALCOMM HSDPA Industry Firsts 4 GSMA selects LG handset for 3G for All 3G for All program background Program to bring 3G multimedia services and Internet access to the mass market worldwide 12 leading mobile operators across 6 continents and representing 620 million subscribers voted on winning handset LG KU250 chosen as winner priced at 30 less than entry level WCDMA handsets 15mm thin video telephony 1 3 MP camera MP3 Bluetooth removable memory Internet access Uses QUALCOMM UMTS chipset Now selling into W Europe Philippines Indonesia Singapore Taiwan and other countries Steering Group Participants Cingular Wireless Globe Telecom Hutchison 3G KTF MTN Orange Smart Telecom Italia Telefonica Telenor T Mobile Vodafone LG KU250 Winner announced at 3GSM We congratulate QUALCOMM on the outcome of the 3G for All selection process QUALCOMM has provided enthusiastic support for the GSMA s goals for the program as well as significant efforts on behalf of their vendor partners such as LG Rob Conway CEO of the GSM Association Initiative to accelerate UMTS adoption 5 Qualcomm solutions cover entire range of end user product segments HSPA and highly integrated solutions are driving UMTS HSPA market CHIPSPLATFORMS APPROXIMATE OF COMMERCIAL DEVICES DEVICES 7k Convergence Platform 10 6k Enhanced Platform 140 6k Multimedia Platform 90 6k Value Platform 20 QUALCOMM chipset solutions More than 250 UMTS HSPA commercial devices launched to date including 150 HSPA 6 Moving Beyond Voice More Processing Power The Power of a Laptop in Your Pocket MSM2300 ARM MCU 20 MIPS MSM3000 ARM7TDMI 23 MIPS 27 MHz MSM5100 MSM6550 MSM7200 MSM2 Intel 80186 10 MIPS 2 5 MHz Convergence Dual Core Scorpion ARM 9 Up to 2370 MIPS 1GHz Multimedia Platform ARM7 Up to 40 MIPS 33 MHz Enhanced Platform ARM9 Up to 250 MIPS 225 MHz Convergence Dual Core ARM9 ARM11 Up to 740 MIPS 400 MHz 0 400 800 1200 1600 2000 2400 1996199820002002200420062008 MIPS Millions of Instructions per Second 7 October 2006 October 2007 50182 Launched NB Offerings 2791 Launched NB Models 918 Notebook Manufacturers 720 3G Embedded Carriers Sum of individual notebooks certified per carrier network Leveraging Partnerships to Drive Market Growth Many Embedded Mobile Broadband Solutions Today 8 Delivering Global Mobile Internet Today Qualcomm s Gobi Technology Delivers wireless communication technology to make mobile internet enabled notebooks mainstream Provides transparent global connectivity for end users End user confidence in purchase decision no complexities no compromise World coverage unifies wireless high speed networks CDMA2000 1X EV DO EV DO Rev A GSM GPRS EDGE HSDPA HS