仙童R2系列储存器

Index of /ds/R2/ Name Last modified Size Description Parent Directory R29621.pdf 22-Dec-99 00:14 170K R29623.pdf 22-Dec-99 00:14 170K R29631.pdf 22-Dec-99 00:14 170K R29633.pdf 22-Dec-99 00:14 170K R29651.pdf 22-Dec-99 00:14 170K R29653.pdf 22-Dec-99 00:14 170K R29681.pdf 22-Dec-99 00:14 170K R29683.pdf 22-Dec-99 00:14 170K R296XX.pdf 22-Dec-99 00:14 170K R29771.pdf 22-Dec-99 00:14 170K R29773.pdf 22-Dec-99 00:14 170K R29791.pdf 22-Dec-99 00:14 170K R29793.pdf 22-Dec-99 00:14 170K R297XX.pdf 22-Dec-99 00:14 170K Features Devices are available in military (-55C to +125C) temperature range Standard PROMs are offered in power-switched SPROM versions Typically, 75% power savings achieved by deselected SPROMs Reliable nichrome fuses Three-state outputs Devices programmed on standard PROM programmers High immunity or resistance to space levels of radiation Device pinouts comply with JEDEC standards Available in surface mount and through-hole packaging PROMs and SPROMs are offered in 24-pin, 0.3 wide DIPsApplications Microprogram control store Microprocessor program store Programmable logic Custom look-up tables Security encoding/decoding Code converter Character generator Use in redundant systemsDescriptionFairchild Semiconductor Electronics Semiconductor Divi-sions Bipolar Field Programmable Read-Only Memories include both standard and power-switched versions. CS/PS inputs provide logic flexibility and ease of memory expan-sion decoding. SPROM power-switch circuitry is activated by the PS input.Fairchild Semiconductor PROMs and SPROMs are manu-factured with nichrome fuses and low power Schottky tech-nology. The devices are shipped with all bits in the HIGH (logical ONE) state. To achieve a LOW state in a given bit location the nichrome link is fused open by passing a short, high current pulse through the link. All devices are pro-grammed using the same programming technique.Standard PROMs are enabled by a single active LOW CS or by both active LOW CS and HIGH CS inputs. Power-switched PROMs (SPROMs) are enabled by a single active LOW PS or by both active LOW PS and HIGH PS inputs. See the individual block diagrams for the enable scheme.R296XX/R297XXStandard PROMs and Power-Switched SPROMsRev. 1.0.1R296XX/R297XX PRODUCT SPECIFICATION2 Absolute Maximum Ratings (above which the useful life may be impaired)Operating ConditionsNote:1. Tests shall be conducted at input test conditions as follows: VIH = VIH(min) +20%, 0%； VIL = VIL(max) +0%, 50%. Devices may be tested using any input voltage within this input voltage range but shall be guaranteed to VIH(min) and VIL(max). CAUTION: To avoid test correlation problems, the test system noise (e.g., testers, handlers, etc.) should be verified to assure that VIH(min) and VIL(max) requirements are not violated at the device terminals.2. VIL = 0.6V for Chip Select Pins on all 29600 series devices.Supply Voltage to Ground Potential (continuous), VCC0.5V to +7.0VDC Input Current 30 mA to +5.0 mADC Input Voltage (address inputs) 0.5V to +5.5VDC Input Voltage (chip/power select input pin) R296XX 0.5V to +33V R297XX 0.5V to +28VDC Voltage Applied to Outputs (except during programming) 0.5V to +VCC max.Output Current into Outputs During Programming 240 mADC Voltage Applied to Outputs During Programming R296XX 26V R297XX 24VJunction Temperature +175CStorage Temperature 65C to +150CProgramming Temperature 25 5CLead Temperature (soldering, 10 seconds) 300CCurrent Density (metallization) 5 x 105A/cm2Thermal Resistance, Junction-to-Case qJC Dual-ln-Line 11C/W Leadless Chip Carrier 10C/W Flat Pack 10C/WMilitaryParameter Description Min. Max. UnitVCCSupply Voltage 4.5 5.5 VTCCase Operating Temperature 55 +125 CVIL11, 2DC Low Level Input Voltage 0.8 VVIH1DC High Level Input Voltage 2.0 VVILAC/Functional Low Level Input Voltage 0 VVIHAC/Functional High Level Input Voltage 3.0 VPRODUCT SPECIFICATION R296XX/R297XX3 Electrical Characteristics (Over Operating Range)Devices conform to MIL-STD-883, Group A, Subgroups 1, 2 and 3.Notes:1. This characteristic cannot be tested prior to programming； it is guaranteed by factory testing.2. Not more than one output should be shorted at a time. Duration of the short circuit should not exceed 1 second.3. VOUT = 0.0V for R29791/R29793.Pin DefinitionsParameter Description Conditions Min. Max. UnitsVOHOutput High Voltage VCC = Min, IOH = -1.6 mA 2.4 VVIN = VIH or VILVOL1Output Low Voltage VCC = Min, IOL = 8 mA 0.4 VVIN = VIH or VILIOL = 16 mA 0.5IILInput Low Current VCC = Max, VIN = 0.4V R296XX -250 mAR297XX -100IIHInput High Current VCC = Max, VIN = 2.7V 10 mAVCC = Max, VIN = 5.5V 40IOS2Output Short Circuit CurrentVCC = Max, VOUT = 0.2V3-15 -85 mAVICInput Clamp Voltage VCC = Min, IIN = -18 mA -1.2 VICEXOutput Leakage Current VCC = Max, VOUT = 5.5V +40 mAChip Disabled VOUT = 0.4V -40Symbol DescriptionA0AnAddress InputsCS Chip Select Active Low (PROM)CS Chip Select Active High (PROM)PS Chip Select Active Low (SPROM)PS Chip Select Active High (SPROM)O1OnData OutputsR296XX/R297XX PRODUCT SPECIFICATION4 A011 of 64Decoder64 x 64MemoryMatrix1 of 8Multiplexers(8)OutputDrivers (8)216345615CS7 8 911121314171819A1A5A2A3A4A6A7A8O1O2O3O4O5O6O7O820 19 18 17 16 15 14 13 12 11VCCA8A7A6A5A0A1A2A3A4CS O8O1O2O3O4GndO7O6O512345678910Pin 15 is also the programming pin (pp)512 x 8 PROMR29621/R29621APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Block DiagramNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 20 Lead Ceramic DIPPin AssignmentsParameter Description Test ConditionsMaximum LimitsUnits29621AM R29621MICCPower Supply Current VCC = Max 155 155 mAAll Inputs GNDtAA2Address Access Time CL = 30 pF175 95 nstEA2Enable Access Time R1 = 300W to VCC50 50 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 nsPDPower Dissipation 853 853 mWPart Type PackageOperating Temperature RangeR29621DM D -55C to +125CR29621DM/883B D -55C to+125CR29621DMS D -55C to +125CR29621ADM D -55C to +125CR29621ADM/883B D -55C to +125CR29621ADMS D -55C to +125C20 Lead Ceramic DIPPRODUCT SPECIFICATION R296XX/R297XX5 512 x 8 SPROMR29623/R29623APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Block DiagramNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 20 Lead Ceramic DIPPin AssignmentsParameter Description Test ConditionsMaximum LimitsUnits29623AM R29623MICCDPower Down, SupplyCurrent (disabled)VCC = MaxPS = VIH, All other inputs = GND45 45 mAICCSupply Current (enabled)VCC = MaxAll Inputs = GND155 155 mAtAA2Address Access Time CL = 30 pF175 100 nstEA2Enable Access Time R1 = 300W to VCC80 100 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 nsPDPower Dissipation(Disabled)248 248 mWPDPower Dissipation(Enabled)853 853 mWPart Type PackageOperating Temperature RangeR29623DM D -55C to +125CR29623DM/883B D -55C to +125CR29623DMS D -55C to +125CR29623ADM D -55C to +125CR29623ADM/883B D -55C to +125CR29623ADMS D -55C to +125CA011 of 64Decoder64 x 64MemoryMatrix1 of 8Multiplexers(8)OutputDrivers (8)216345615PS7 8 911121314171819A1A5A2A3A4A6A7A8O1O2O3O4O5O6O7O820 19 18 17 16 15 14 13 12 11VCCPin 15 is also the programming pin (pp)A8A7A6A5A0A1A2A3A4PS O8O1O2O3O4GndO7O6O51234567891020 Lead Ceramic DIPR296XX/R297XX PRODUCT SPECIFICATION6 1024 x 8 PROMR29631/R29631APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Block DiagramNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body WidthF = 24 Lead CERPACKPin AssignmentsParameter Description Test ConditionsMaximum LimitsUnits29631AM R29631MICCPower Supply Current VCC = Max 170 170 mAAll Inputs GNDtAA2Address Access Time CL = 30 pF175 105 nstEA2Enable Access Time R1 = 300W to VCC50 50 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 nsPDPower Dissipation 935 935 mWPart Type PackageOperating Temperature RangeR29631DM D -55C to +125CR29631DM/883B D -55C to +125CR29631DMS D -55C to +125CR29631FM F -55C to +125CR29631FM/883B F -55C to +125CR29631FMS F -55C to +125CR29631ADM D -55C to +125CR29631ADM/883B D -55C to +125CR29631AFMS D -55C to +125CR29631ADM F -55C to +125CR29631AFM/883B F -55C to +125CR29631AFMS F -55C to +125C20 19 18 1724 23 22 21 16 15 14 13VCCPin 20 is also the programming pin (pp)A8A9A5A7A6A4A3A2A1O7O8CS4CS3CS2CS1A0O1O2O3GndO6O5O41 2 3 4 5 6 7 8 9 10 11 1224 Lead Ceramic DIP/24 Lead CERPACKA441 of 64Decoder64 x 128MemoryMatrix1 of 16Multiplexers(8)OutputDrivers (8)32876921201918CS110 111314 15 16 1712322A5A6A0A1A25A3A7A8A9O1O2O3O4O5O6O7O8CS2CS3CS4PRODUCT SPECIFICATION R296XX/R297XX7 1024 x 8 SPROMR29633/R29633APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Pin AssignmentsNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body WidthF = 24 Lead CERPACKParameter Description Test ConditionsMaximum LimitsUnits29633AM R29633MICCDPower Down, SupplyCurrent (disabled)VCC = Max, PS = VIH, All other inputs = GND45 45 mAICCSupply Current(Enabled)VCC = MaxAll Inputs = GND170 170 mAtAA2Address Access Time CL = 30 pF185 105 nstEA2Enable Access Time R1 = 300W to VCC85 130 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 nsPDPower Dissipation(Disabled)248 248 mWPDPower Dissipation(Enabled)935 935 mWPart Type PackageOperating Temperature RangeR29633DM D -55C to +125CR29633DM/883B D -55C to +125CR29633DMS D -55C to +125CR29633FM F -55C to +125CR29633FM/883B F -55C to +125CR29633FMS F -55C to +125CR29633ADM D -55C to +125CR29633ADM/883B D -55C to +125CR29633ADMS D -55C to +125CR29633AFM F -55C to +125CR29633AFM/883B F -55C to +125CR29633AFMS F -55C to +125CA441 of 64Decoder64 x 128MemoryMatrix1 of 16Multiplexers(8)OutputDrivers (8)3287621201918PS112322A5A6A0A1A25A3A7A8A9O1O2O3O4O5O6O7O8PS2PS3PS4910111314151617Block Diagram24 Lead Ceramic DIP/24 Lead CERPACK20 19 18 1724 23 22 21 16 15 14 13VCCPin 20 is also the programming pin (pp)A8A9A5A7A6A4A3A2A1O7O8PS4PS3PS2PS1A0O1O2O3GndO6O5O41 2 3 4 5 6 7 8 9 10 11 12R296XX/R297XX PRODUCT SPECIFICATION8 2048 x 4 PROMR29651/R29651APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Block DiagramNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 18 Lead Ceramic DIPPin AssignmentsParameter Description Test ConditionsMaximum LimitsUnits29651AM R29651MICCPower Supply Current VCC = Max 170 170 mAAll Inputs GNDtAA2Address Access Time CL = 30 pF185 105 nstEA2Enable Access Time R1 = 300W to VCC50 55 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 45 45 nsPDPower Dissipation 935 935 mWPart Type PackageOperating Temperature RangeR29651DM D -55C to +125CR29651DM/883B D -55C to +125CR29651DMS D -55C to +125CR29651ADM D -55C to +125CR29651ADM/883B D -55C to +125CR29651ADMS D -55C to +125C14 13 12 1118 17 16 15 10VCCPin 10 is also the programming pin (pp)A7A8A4A6A5A3A0A1A2CSO4O3O2O1A9A10Gnd12345678918 Lead Ceramic DIPA521 of 64Decoder64 x 128MemoryMatrix1 of 32Multiplexers(4)OutputDrivers (4)117567CS16153A6A7A0A1A24A38A10A8A9A4O1O2O3O414 13 12 1110PRODUCT SPECIFICATION R296XX/R297XX9 2048 x 4 SPROMR29653/R29653APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Block DiagramNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 18 Lead Ceramic DIPPin AssignmentsParameter Description Test ConditionsMaximum LimitsUnits29653AM R29653MICCDPower Down, SupplyCurrent (disabled)VCC = Max, PS = VIH, All other inputs = GND45 45 mAICCSupply Current(Enabled)VCC = MaxAll Inputs = GND170 170 mAtAA2Address Access Time CL = 30 pF190 105 nstEA2Enable Access Time R1 = 300W to VCC95 110 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 45 45 nsPDPower Dissipation(Disabled)248 248 mWPDPower Dissipation(Enabled)935 935 mWPart Type PackageOperating Temperature RangeR29653DM D -55C to +125CR29653DM/883B D -55C to +125CR29653DMS D -55C to +125CR29653ADM D -55C to +125CR29653ADM/883B D -55C to +125CR29653ADMS D -55C to +125C14 13 12 1118 17 16 15 10VCCPin 10 is also the programming pin (pp)A7A8A4A6A5A3A0A1A2PSO4O3O2O1A9A10Gnd12345678918 Lead Ceramic DIPA521 of 64Decoder64 x 128MemoryMatrix1 of 32Multiplexers(4)OutputDrivers (4)117567PS16153A6A7A0A1A24A38A10A8A9A4O1O2O3O414 13 12 1110R296XX/R297XX PRODUCT SPECIFICATION10 2048 x 8 PROMR29681/R29681APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Parameter Description Test ConditionsMaximum LimitsUnits29681AM R29681MICCPower Supply Current VCC = Max 180 180 mAAll Inputs GNDtAA2Address Access Time CL = 30 pF185 120 nstEA2Enable Access Time R1 = 300W to VCC50 55 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 35 45 nsPDPower Dissipation 990 990 mWNotes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array beingprogrammed.3. TER is guaranteed by design but not performed.Ordering Information Notes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body Width L = 28 Terminal Leadless Chip CarrierS = 24 Lead Sidebrazed .300 Body Width Contact factory regarding flat pack packagePin AssignmentsBlock DiagramPart Type PackageOperatingTemperature RangeR29681DM D -55C to +125CR29681DM/883B D -55C to +125CR29681DMS D -55C to +125CR29681LM L -55C to +125CR29681LM/883B L -55C to +125CR29681LMS L -55C to +125CR29681SM S -55C to +125CR29681SM/883B S -55C to +125CR29681SMS S -55C to +125CR29681ADM D -55C to +125CR29681ADM/883B D -55C to +125CR29681ADMS D -55C to +125CR29681ALM L -55C to +125CR29681ALM/883B L -55C to +125CR29681ALMS L -55C to +125CR29681ASM S -55C to +125CR29681ASM/883B S -55C to +125CR29681ASMS S -55C to +125C20 19 18 1724 23 22 21 16 15 14 13VCCPin 24 is also the programming pin (pp)Pin 20 is also the programming pin (pp)A8A9A10A5A7A6A4A3A2A1O7O8CS3CS2CS1A0O1O2O3GndO6O5O4112328 Terminal Leadless Chip Carrier24 Lead Ceramic DIP/24 Lead Sidebrazed4 282726NCA7A6A5VCCA8A915141312 16 17 18NCGndO3O2O4O5O6567891011A4A3A2A1A0NCO125242322212019A16CS1CS2CS3NCO8O72 3 4 5 6 7 8 9 10 11 12A441 of 128Decoder128 x 128MemoryMatrix1 of 16Multiplexers(8)OutputDrivers (8)3287620191812322A5A6A0A1A25A3A7A8A921A10O1O2O3O4O5O6O7O8CS1CS2CS3910111314151617PRODUCT SPECIFICATION R296XX/R297XX11 2048 x 8 SPROMR29683/R29683APower and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Parameter Description Test ConditionsMaximum LimitsUnits29683AM R29683MICCDPower Down, SupplyCurrent (Disabled)VCC = Max, PS = VIH, All other inputs = GND50 50 mAICCSupply Current(Enabled)VCC = MaxAll Inputs = GND180 180 mAtAA2Address Access Time CL = 30 pF185 120 nstEA2Enable Access Time R1 = 300W to VCC100 125 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 45 50 nsPDPower Dissipation(Disabled)275 275 mWPDPower Dissipation(Enabled)990 990 mWNotes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array beingprogrammed.3. TER is guaranteed by design but not performed.Ordering Information Notes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body Width L = 28 Terminal Leadless Chip CarrierS = 24 Lead Sidebrazed .300 Body Width Contact factory regarding flat pack packagePin AssignmentsBlock DiagramPart Type PackageOperatingTemperature RangeR29683DM D -55C to +125CR29683DM/883B D -55C to +125CR29683DMS D -55C to +125CR29683LM L -55C to +125CR29683LM/883B L -55C to +125CR29683LMS L -55C to +125CR29683SM S -55C to +125CR29683SM/883B S -55C to +125CR29683SMS S -55C to +125CR29683ADM D -55C to +125CR29683ADM/883B D -55C to +125CR29683ADMS D -55C to +125CR29683ALM L -55C to +125CR29683ALM/883B L -55C to +125CR29683ALMS L -55C to +125CR29683ASM S -55C to +125CR29683ASM/883B S -55C to +125CR29683ASMS S -55C to +125C20 19 18 1724 23 22 21 16 15 14 13VCCPin 24 is also the programming pin (pp)Pin 20 is also the programming pin (pp)A8A9A10A5A7A6A4A3A2A1O7O8PS3PS2PS1A0O1O2O3GndO6O5O4112328 Terminal Leadless Chip Carrier24 Lead Ceramic DIP/24 Lead Sidebrazed4 282726NCA7A6A5VCCA8A915141312 16 17 18NCGndO3O2O4O5O6567891011A4A3A2A1A0NCO125242322212019A16PS1PS2PS3NCO8O72 3 4 5 6 7 8 9 10 11 12A441 of 128Decoder128 x 128MemoryMatrix1 of 16Multiplexers(8)OutputDrivers (8)3287620191812322A5A6A0A1A25A3A7A8A921A10O1O2O3O4O5O6O7O8PS1PS2PS3910111314151617R296XX/R297XX PRODUCT SPECIFICATION12 4096 x 8 PROMR29771Power and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Parameter Description Test ConditionsMaximum LimitsUnitsR29771MICCPower Supply Current VCC = Max 190 mAAll Inputs GNDtAA2Address Access Time CL = 30 pF185 nstEA2Enable Access Time R1 = 300W to VCC50 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 35 nsPDPower Dissipation 1.05 mWNotes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array beingprogrammed.3. TER is guaranteed by design but not performed.Ordering Information Notes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body WidthF = 24 Lead Leadless Chip CarrierL = 28 Terminal Leadless Chip CarrierS = 24 Lead Sidebrazed .300 Body Width Pin AssignmentsBlock DiagramPart Type PackageOperatingTemperature RangeR29771DM D -55C to +125CR29771DM/883B D -55C to +125CR29771DMS D -55C to +125CR29771FM F -55C to +125CR29771FM/883B F -55C to +125CR29771FMS F -55C to +125CR29771LM L -55C to +125CR29771LM/883B L -55C to +125CR29771LMS L -55C to +125CR29771SM S -55C to +125CR29771SM/883B S -55C to +125CR29771SMS S -55C to +125C20 19 18 1724 23 22 21 16 15 14 13VCCPin 24 is also the programming pin (pp)Pin 20 is also the programming pin (pp)A8A9A10A5A7A6A4A3A2A1O7O8CS2A11CS1A0O1O2O3GndO6O5O4112328 Terminal Leadless Chip Carrier24 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/24 Lead Sidebrazed4 282726NCA7A6A5VCCA8A915141312 16 17 18NCGndO3O2O4O5O6567891011A4A3A2A1A0NCO125242322212019A16CS1A11CS2NCO8O72 3 4 5 6 7 8 9 10 11 12A531 of 128Decoder128 x 256MemoryMatrix1 of 32Multiplexers(8)OutputDrivers (8)218762018232221A6A7A0A1A25A34A4A8A9A1019A11O1O2O3O4O5O6O7O8CS1CS2910111314151617PRODUCT SPECIFICATION R296XX/R297XX13 4096 x 8 SPROMR29773Power and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Parameter Description Test ConditionsMaximum LimitsUnitsR29773MICCDPower Down, SupplyCurrent (disabled)VCC = Max, PS = VIH, All other inputs = GND55 mAICCSupply Current(Enabled)VCC = MaxAll Inputs = GND190 mAtAA2Address Access Time CL = 30 pF185 nstEA2Enable Access Time R1 = 300W to VCC135 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 35 nsPDPower Dissipation(Disabled)303 mWPDPower Dissipation(Enabled)1.05 WNotes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array beingprogrammed.3. TER is guaranteed by design but not performed.Ordering Information Notes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body WidthF = 24 Lead Leaded Chip CarrierL = 28 Terminal Leadless Chip CarrierS = 24 Lead Sidebrazed .300 Body Width Pin AssignmentsBlock DiagramPart Type PackageOperatingTemperature RangeR29773DM D -55C to +125CR29773DM/883B D -55C to +125CR29773DMS D -55C to +125CR29773FM F -55C to +125CR29773FM/883B F -55C to +125CR29773FMS F -55C to +125CR29773LM L -55C to +125CR29773LM/883B L -55C to +125CR29773LMS L -55C to +125CR29773SM S -55C to +125CR29773SM/883B S -55C to +125CR29773SMS S -55C to +125C20 19 18 1724 23 22 21 16 15 14 13VCCPin 24 is also the programming pin (pp)Pin 20 is also the programming pin (pp)A8A9A10A5A7A6A4A3A2A1O7O8PS2A11PS1A0O1O2O3GndO6O5O4112328 Terminal Leadless Chip Carrier24 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/24 Lead Sidebrazed4 282726NCA7A6A5VCCA8A915141312 16 17 18NCGndO3O2O4O5O6567891011A4A3A2A1A0NCO125242322212019A16PS1A11PS2NCO8O72 3 4 5 6 7 8 9 10 11 12A531 of 128Decoder128 x 256MemoryMatrix1 of 32Multiplexers(8)OutputDrivers (8)218762018232221A6A7A0A1A25A34A4A8A9A1019A11O1O2O3O4O5O6O7O8PS1PS2910111314151617R296XX/R297XX PRODUCT SPECIFICATION14 8192 x 8 PROMR29791Power and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Block DiagramNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body WidthF = 24 Lead Leaded Chip CarrierS = 24 Lead Sidebrazed .300 Body Width Pin AssignmentsParameter Description Test ConditionsMaximum LimitsUnitsR29791MICCPower Supply Current VCC = Max, All Inputs GND 190 mAtAA2Address Access Time CL = 30 pF195 nstEA2Enable Access Time R1 = 300W to VCC50 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 30 nsPDPower Dissipation 1.05 WPart Type PackageOperatingTemperature RangeR29791DM D -55C to +125CR29791DM/883B D -55C to +125CR29791DMS D -55C to +125CR29791FM F -55C to +125CR29791FM/883B F -55C to +125CR29791FMS F -55C to +125CR29791SM S -55C to +125CR29791SM/883B S -55C to +125CR29791SMS S -55C to +125C20 19 18 1724 23 22 21 16 15 14 13VCCPin 20 is also the programming pin (pp)A8A9A10A5A7A6A4A3A2A1O7O8A12A11CSA0O1O2O3GndO6O5O4124 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/24 Lead Sidebrazed2 3 4 5 6 7 8 9 10 11 12A531 of 256Decoder256 x 256MemoryMatrix1 of 32Multiplexers(8)OutputDrivers (8)2187620232221A6A7A0A1A25A34A4A8A9A1019A1118A12O1O2O3O4O5O6O7O8CS910111314151617PRODUCT SPECIFICATION R296XX/R297XX15 8192 x 8 SPROMR29793Power and AC Characteristics Over Operating RangeICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.Notes:1. See AC Test Load Circuit and Switching Waveforms.2. Speeds are based on a minimum of 50% of the array being programmed.3. TER is guaranteed by design but not performed.Ordering Information Block DiagramNotes:/883B suffix denotes MIL-STD-883, Level B processingS suffix denotes Level S processingD = 24 Lead Ceramic DIP .600 Body WidthF = 24 Lead Leaded Chip CarrierS = 24 Lead Sidebrazed .300 Body Width Pin AssignmentsParameter Description Test ConditionsMaximum LimitsUnitsR29793MICCDPower Down, SupplyCurrent (disabled)VCC = Max, PS = VIH, All other inputs = GND50 mAICCSupply Current(Enabled)VCC = MaxAll Inputs = GND190 mAtAA2Address Access Time CL = 30 pF195 nstEA2Enable Access Time R1 = 300W to VCC145 nstER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 30 nsPDPower Dissipation (Disabled) 275 mWPDPower Dissipation (Enabled) 1.05 WPart Type PackageOperatingTemperature RangeR29793DM D -55C to +125CR29793DM/883B D -55C to +125CR29793DMS D -55C to +125CR29793FM F -55C to +125CR29793FM/883B F -55C to +125CR29793FMS F -55C to +125CR29793SM S -55C to +125CR29793SM/883B S -55C to +125CR29793SMS S -55C to +125C20 19 18 1724 23 22 21 16 15 14 13VCCPin 20 is also the programming pin (pp)A8A9A10A5A7A6A4A3A2A1O7O8A12A11PSA0O1O2O3GndO6O5O4124 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/24 Lead Sidebrazed2 3 4 5 6 7 8 9 10 11 12A531 of 256Decoder256 x 256MemoryMatrix1 of 32Multiplexers(8)OutputDrivers (8)2187620232221A6A7A0A1A25A34A4A8A9A1019A1118A12O1O2O3O4O5O6O7O8PS910111314151617R296XX/R297XX PRODUCT SPECIFICATION16 AC Test Load CircuitNotes:1. tAA is tested with switch S1 closed and CL = 30 pF.2. tEA is tested with CL = 30 pF； S1 is open for high impedance to “1” test and closed for high impedance to “0” test.3. tER, is tested with CL = 5 pF； S1 is open for “1” to high impedance test and measured at VOH-0.5V output level and is closedfor “0” to high impedance test and measured at VOL+0.5V output level.Switching WaveformsVCCCLOutputS1R1300R2600A0An3.0V1.5V0V3.0V1.5V0VKeys to Timing DiagramVOH1.5VVOLtAAtERtEACSPSWaveforms InputsMust beSteadyWill beSteadyDont Care.Any ChangePermittedChanging StateUnknownDoes Not ApplyCenter Line isHigh ImpedanceOff StateOutputsO1OnPRODUCT SPECIFICATION R296XX/R297XX17 12345678910F0F1F2F3F4F8F7F6VCCVBB VCCVBB VCCF5F920191817161514131211Dynamic Burn-InR29621/621AR29623/623A123456789101112F7F6F5F4F3F2F1F0F8F9F10F13F11F12VCCVBB VCCVBB VCC242322212019181716151413Dynamic Burn-InR29631/631AR29633/633AR29681/681AR29683/683AR29771R29773R29791R29793123456789F6F5F4F3F0F1F2F10F9F7F8F11VCCVBB VCC181716151413121110Dynamic Burn-InR29651/651AR29653/653ADynamic Life Test/Burn-In CircuitsIn accordance with MIL-STD-883, Methods 1005/1015, Condition D:TA = 125+10 C minimum VCC = 5.25 0.25VSquare Wave Pulses on F0 to Fn are: 50% 10% duty cycle Frequency of each address is to be 1/2 of each preceding input, with F0 beginning at 100 kHz (e.g., F0 = 100 kHz 10%, F1 = 50 kHz 10%, F2 = 25 kHz 10%,Fn = 1/2 Fn-1 10%, etc.) Resistors are optional on input pins (R = 300 10%)0R296XX/R297XX PRODUCT SPECIFICATION18 123456789VCC181716151413121110Static Burn-InR29651/651AR29653/653A12345678910VCC20191817161514131211Static Burn-InR29621/621AR29623/623A123456789101112VCC242322212019181716151413Static Burn-InR29631/631AR29633/633AR29681/681AR29683/683AR29771R29773R29791R29793Static Life Test/Burn-In CircuitsIn accordance with MIL-STD-883, Methods 1005/1015, Condition C:TA = 125+10 C minimum VCC = 5.25 0.25VResistors are optional on input pins (R = 300W 10%)0PRODUCT SPECIFICATION R296XX/R297XX19 Programming CharacteristicsProgramming TimingAddressR296XX Series R297XX SeriesStrobeVPPVOUTVCCTPPTPTRTD2TD1TR = 0.34V/S Min. 1.25V/S Max.TPP = 80 S Min. 110 S Max.TP = 1 S Min. 40 S Max.TD1 = 70 S Min. 90 S Max.TD2 = 100 nS Min.VPP = 27V Min. 33V Max.VOUT = 20V Min. 26V Max.TR = 0.34V/S Min. 1.25V/S Max.TPP = 70 S Min. 120 S Max.TP = 20 S Min. 40 S Max.TD1 = 60 S Min. 100 S Max.TD2 = 100 nS Min.VPP = 26V Min. 28V Max.VOUT = 22V Min. 24V Max.Notes:Output Load = 0.2 mA During 6.0V CheckOutput Load = 12 mA During 4.2V Check6.0V4.2V5.5VTR90%10%90%10%Check CheckVPPTTL HighTTL LowTTL HighTTL LowTTL LowTTL LowDevice Programming InputsIf you would like to have Fairchild Semiconductor program your devices, please submit one of the following: Two masters and truth table Two masters and checksumIn either case, we require customer approval prior to pro-gramming the devices.If you need blank devices in order to supply programming masters, please do not hesitate to contact Fairchild Semicon-ductor Electronics Semiconductor Division for unpro-grammed samples.Commercial Programmers (subject to change)Equipment must be calibrated at regular intervals. Each time a new board or a new programming module is inserted, the whole system should be checked. Both timing and voltages must meet published specifications for the device.Please contact the following manufacturers for equipment information:Data I/O Corp.10525 Willows Road, N.E.P.O. Box 97046Redmond, WA 98073-9746(800) 247-5700Stag Microsystems Inc. (R296XX Series) 1600 Wyatt Drive, Suite 3 Santa Clara, CA 95054 (408) 988-1118Commercial Surface Mount Socket Adapter Manufacturer (subject to change)Please contact the following manufacturer for equipment information:Emulation Technology, Inc.2344 Walsh Avenue, Bldg. FSanta Clara, CA 95051(408) 982-0660The companies listed above are not intended to be a complete guide of manufacturers of programmers or adapters, nor does Fairchild Semiconductor endorse any specific company.R296XX/R297XX PRODUCT SPECIFICATION20 Mechanical Dimensions24 Lead CERPACKL EQc1Aeb1s1DE1Notes:1. Index area: a notch or pin one identification mark shall beshall not be used as a pin one identification mark.3. This dimension allows for off-center lid, meniscus and glass overrun.4. All leads - Increase maximum limit by .003 (.08mm) measured at thecenter of the flat, when lead finish is applied.5. Dimension s1 may be .000 (.00mm) minimum if leads number 1, 12,13 and 24 bend toward the cavity of the package within one leadswidth from the point of entry of the lead into the body.located adjacent to pin one. The manufacturers identification2. Dimension Q shall be measured at the point of exit of the lead fromthe body.Note 1A .045 .090 1.14 2.29SymbolInchesMin. Max. Min. Max.MillimetersNotesb1 .015 .019 .38 .48c1 .004 .006 .10 .15E .300 .420 7.62 10.67e .050 BSC 1.27 BSCL .250 .370 6.35 9.40.026 .045 .66 1.14.005 .13 52434E1 .440 11.18 3Qs1D .640 16.26PRODUCT SPECIFICATION R296XX/R297XX21 Mechanical Dimensions (continued) 24 Lead Leaded Chip CarrierNotes: 1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one. The manufacturers identification mark shall not be used as a pin one identification mark.2. This dimension allows for off-center lid, meniscus and glass overrun.3. The basic pin spacing is .050 (1.27mm) between centerlines. Each pin centerline shall be located within .005 (.13mm) of its exact longitudinal position relative to pins 1 and 24.4. All leads - Increase maximum limit by .003 (0.08mm) measured at the center of the flat, when finish A is applied.5. Twenty-two spaces.6. Applies to all four corners (leads number 1, 12, 13, and 24).Db1eS1EE1L2 PLE32 PLc1E2QAEK Alternatively, a tab (dim. K) may be used to identify pin one.Note 1A .045 .115 1.14 2.92SymbolInchesMin. Max. Min. Max.MillimetersNotesb1 .015 .019 .38 .48c1 .004 .006 .10 .15E .350 .420 8.89 10.67e .050 BSC 1.27 BSCL .250 .370 6.35 9.40.026 .045 .66 1.14.000 .00 6424E1 .450 11.43 2E2 .180 4.57 E3 .030 .76 3, 5Qs1D .640 16.26R296XX/R297XX PRODUCT SPECIFICATION22 Mechanical Dimensions (continued)28 Terminal Leadless Chip CarrierNotes:1. The index feature for terminal 1 identification, optical orientation orhandling purposes, shall be within the shaded index areas shown onplanes 1 and 2. Plane 1, terminal 1 identification may be an extensionof the length of the metalized terminal which shall not be wider thanthe B1 dimension.2. Unless otherwise specified, a minimum clearance of .015 inch(0.38mm) shall be maintained between all metallized features (e.g.,lid, castellations, terminals, thermal pads, etc.).3. Dimension “A” controls the overall package thickness. The maximum“A” dimension is the package height before being solder dipped.The corner shape (square, notch, radius, etc.) may vary at themanufacturers option, from that shown on the drawing. The indexcorner shall be clearly unique.5. Dimension “B3” minimum and “L3” minimum and the appropriatelyderived castellation length define an unobstructed three dimensionalspace traversing all of the ceramic layers in which a castellation wasdesigned. Dimensions “B3” and “L3” maximum define the maximumwidth and depth of the castellation at any point on its surface.Measurement of these dimensions may be made prior to solderdripping.6. Chip carriers shall be constructed of a minimum of two ceramiclayers.7. Symbol “N” is the maximum number of terminals. Symbol “ND” and“NE” are the number of terminals along the sides of Length “D” and “E” respectively.EE3D4D3A1LIDAL2eD2DETAIL“A”DETAIL“A”D1PLANE 1PLANE 2B3B1L3E2E1L1(h) X 453 PLCSj X 45A .060 .100 1.52 2.54A1 .050 .088 1.27 2.243, 63, 6SymbolInchesMin. Max. Min. Max.MillimetersNotesB1 .022 .028 .56 .71B3 .006 .022 .15 .56D1/E1e .050 BSC 1.27 BSCh .040 REF 1.02 REF.300 BSC 7.62 BSC.150 BSC 3.81 BSCj .020 REF .51 REF445L1 .045 .055 1.14 1.40L2 .075 .095 1.91 2.41L3 .003 .015 .08 .387728 28772, 52D2/E2D3/E3 .460 11.68ND/NEND/E .442 .460 11.23 11.684PRODUCT SPECIFICATION R296XX/R297XX23 Mechanical Dimensions (continued)24 Lead Sidebrazed .300 Body Width DEAQb2 b1LeS1S2eAc1Note 17. All leads - Increase maximum limit by .003 (.08mm) measured at the center of the flat when lead finish is applied.5. Applies to all four corners (leads number 1, 12, 13, and 24). 4. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline shall be located within .010 (.25mm) of its exact longitudinal position relative to pins 1 and 24.3. Dimension Q shall be measured from the seating plane to the base plane. 1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one. The manufacturers identification shall not be used as pin one identification mark.2. The minimum limit for dimension b2 may be .023 (.58mm) for leads number 1, 12, 13, and 24 only. 8. Twenty-two spaces. 6. eA shall be measured at the centerline of the leads.A .200 5.08SymbolInchesMin. Max. Min. Max.MillimetersNotesb1 .014 .023 .36 .58c1 .008 .015 .20 .38D 1.280 32.51.220 .310 5.59 7.87Ee .100 BSC 2.54 BSC.300 BSC 7.62 BSC4, 86eA.125 .200 3.18 5.08.015 .060 .38 1.52LQS1 .005 .1335S2 .005 .13b2 .045 .065 1.14 1.65772Notes:R296XX/R297XX PRODUCT SPECIFICATION24 Mechanical Dimensions (continued)18 Lead Ceramic Dual Inline Package (CerDIP)8. All leads - Increase maximum limit by .003(.08mm) measured at the center of the flat, when is 90.7. eA shall be measured at the center of the lead bends or at the centerline of the leads6. Applies to all four corners (leads number 1, 8, 9, and 18). pins 1 and 18. shall be located within .010 (.25mm) of its exact longitudinal position relative to5. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline4. This dimension allows for off-center lid, meniscus and glass overrun.3. Dimension Q shall be measured from the seating plane to the base plane. one. The manufacturers identification shall not be used as pin one identification mark.1. Index area: a notch or a pin one identification mark shall be located adjacent to pinaNotes: 2. The minimum limit for dimension b2 may be .023(.58mm) for leads number 1, 8, 9 and 18 only.9. Sixteen spaces. when lead finish is applied.Db2eb1EQALs1c1eAaNote 1A .200 5.08SymbolInchesMin. Max. Min. Max.MillimetersNotesb1 .014 .023 .36 .58.065 1.65b2 .045 1.14c1 .008 .015 .20 .38E .220 .310 5.59 7.87e .100 BSC 2.54 BSCL .125 .200 3.18 5.08.015 .070 .38 1.78.005 .13 368482, 845, 9eA .300 BSC 7.62 BSC 7Qs190 105 90 105aD .960 24.38PRODUCT SPECIFICATION R296XX/R297XX25 Mechanical Dimensions (continued)20 Lead Ceramic Dual Inline Package (CerDIP)8. All leads - Increase maximum limit by .003(.08mm) measured at the center of the flat, when is 90.7. eA shall be measured at the center of the lead bends or at the centerline of the leads6. Applies to all four corners (leads number 1, 10, 11, and 20). pins 1 and 20. shall be located within .010 (.25mm) of its exact longitudinal position relative to5. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline4. This dimension allows for off-center lid, meniscus and glass overrun.3. Dimension Q shall be measured from the seating plane to the base plane. one. The manufacturers identification shall not be used as pin one identification mark