设备标准参数建立.xls

DBDB 各各機機種種標標准准參參數數 機台號 DB 01 內容機種 06PE1006PH0707PE0106PE0306PE01 Edge to pad Distance1160013500134991349913500 Number of units1210101010 unit length1180014000140011400114000 LF total length15300150000153000153000153000 substrate width3480034800347003470034800 Row Distance140000140001400014000 Pad Size x810010000100001000010000 Pad Size y810010000100001000010000 MAG width4300043000430004300043000 MAG Height100000100000100000100000100000 Number of slots2020202020 Wafer size205199205207204 Cassatte Height152000152000152000152000152000 Pick x 100140013 Pick y 62491 62826 62852 62941 62922 Pick z2590526145262102574826060 Wafer loader x Home 00000 Mag392392392392392 Bcod7373737373 Algn173173173173173 Exhg44444 Wafer loader y Home 00000 Wafer233233233233233 Redy150150150150150 Exhg00000 Index positions Inpidx get lf posn 190000 190000 175000 190000 180000 First Distance DISP168186639595858585959 Bond 2537 2036 2611 2551 2496 Inp100000100000100000100000100000 Outp4200040000480004000040000 機台號 DB 02 內容機種 06PH0606PE1006PE2307PE0106PE02H Edge to pad Distance1550012000135001350013500 Number of units412101010 unit length3499011800140001400014000 LF total length153000152000153000153000153000 substrate width3480034800348003480034800 Row Distance1400014000120001400014000 Pad Size x10000850010000950010000 Pad Size y10000850010000950010000 MAG width4300043000430004300043000 MAG Height9900099000990009900099000 Number of slots2020202020 Wafer size204208207206210 Cassatte Height152000152000152000152000152000 Pick x194355180156324 Pick y 60194 59947 60214 60209 59994 Pick z2922029285291902921429223 Wafer loader x Home 00000 Mag395395395395395 Bcod88888 Algn169169169169169 Exhg22222 Wafer loader y Home 00000 Wafer247247247247247 Redy150150150150150 Exhg1111111111 Index positions Inpidx get lf posn 180000 190000 190000 180000 180000 First Distance DISP391686 199224504435 Bond45574233462444524627 Inp10000090000100000100000100000 Outp4500080000450006000035000 機台號 DB 03 內容機種 07PE0307PM0506PE0207PE0106PE23 Edge to pad Distance1348727261140001350013650 Number of units105101010 unit length1400027900140001400014000 LF total length153010153000153000153000153000 substrate width3480034800348003480035000 Row Distance140000140001400014000 Pad Size x9000960010000100008000 Pad Size y9000960010000100008000 MAG width4300043000430004300043000 MAG Height9900099000990009900099000 Number of slots2020202020 Wafer size207203206213206 Cassatte Height15300001530000153000015300001530000 Pick x 2900 361 3270 Pick y 61440 61430 61396 61516 61500 Pick z2766927628273352720827531 Wafer loader x Home 00000 Mag394394394394394 Bcod6362626262 Algn173173173173173 Exhg00000 Wafer loader y Home 00000 Wafer250250250250250 Redy200200200200200 Exhg00000 Index positions Inpidx get lf posn 180000 185000 190000 185000 180000 First Distance DISP 10985 7644200 7581 10438 Bond1192893646441968310980 Inp100000100000100000100000100000 Outp8000040000340003500018000 機台號 DB 04 內容機種 07PE0106PE1006PH0706PH0607PM02 Edge to pad Distance1350011600115001530015000 Number of units10121044 unit length1400012000140003496135000 LF total length153000153000152000153000153000 substrate width3480034800360003480035000 Row Distance1400014500140001400014000 Pad Size x1000085009500100008000 Pad Size y1000085009500100008000 MAG width4250042500425004250042500 MAG Height9900099000990009900099000 Number of slots2020202020 Wafer size207208207208209 Cassatte Height153000153000153000153000153000 Pick x 311 344 239 237 130 Pick y 61977 61500 62030 62028 62700 Pick z2900629108290502908929065 Wafer loader x Home 2 2 2 2 2 Mag389389389389389 Bcod100100100100100 Algn168168168168168 Exhg00000 Wafer loader y Home 00000 Wafer248248248248248 Redy66666 Exhg55555 Index positions Inpidx get lf posn 180000 180000 180000 185000 180000 First Distance DISP 16399 2066 19484 9680 14512 Bond1363614504149201003911426 Inp100000110000100000100000100000 Outp4000017000350004500045000 DBDB 各各機機種種標標准准參參數數 機台號 DB 01 機種 Wafer loader x Wafer loader y Index positions 機台號 DB 02 機種 Wafer loader x Wafer loader y Index positions 機台號 DB 03 機種 Wafer loader x Wafer loader y Index positions 機台號 DB 04 機種 Wafer loader x Wafer loader y Index positions WBD Parameters Check List K S 機台號 WB 01 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 03 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 05 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force Bond Two BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 07 機機種種 PARAMETER06PE0106PE0207PE0107PE0206PE03 Bond One Tip 88888 C V0 50 50 60 50 5 USG Current140125130120120 USG Bond Time3020202020 Force3530303030 Bond Two Tip 85858 C V0 50 50 50 50 4 USG Current140125135135130 USG Bond Time2020252020 Force8585808585 Kink Height991089 Reverse Motion77877 Loop Factor 4 3 3 5 3 3 FAB Size2 352 32 32 32 3 EFO Current3030303030 FFO GAP3030303030 Tail XY Scrub00000 Tail Scrub PhaseLINELINELINELINELINE Tail Scrub USG0402000 Tail Scrub Force1560602020 BITS NSOP Sensitivity 50 2 2 2 2 NSOL Sensitivity 20 40 50 30 50 SHTL Sensitivity15 4 2 5 5 機台號 WB 09 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 11 ASM 機機種種 PARAMETER06PE1006PE22D06PE0207PE0107PE03 Bond One Search high988108 Search speedl130125150130135 USG Current70859095100 USG Bond Time1520151020 Force3540353520 Bond Two Tip 10910810 C V5050509090 USG Current105958595120 USG Bond Time2025281225 Force8070804595 loop heihgt88888 Reverse angle3030302025 CHTcorrection scale OS00000 FAB Size1919242026 EFO wide warning Volt40004000400038004000 FFO GAP45004000480040005000 Tail XY ScrubNANANANANA Tail Scrub PhaseNANANANANA Tail Scrub USGNANANANANA Tail Scrub ForceNANANANANA BITS NSOP Sensitivity 3030303030 NSOL Sensitivity 12 10 10 8 10 SHTL Sensitivity5050505050 機台號 WB 13 ASM 機機種種 PARAMETER06PE1006PE22D06PE0207PE0107PE03 Bond One Search high898118 Search speedl150130135130135 USG Current8595908595 USG Bond Time1520151220 Force3540354030 Bond Two Tip 1010101010 C V5050509090 USG Current1051059595110 USG Bond Time2025251020 Force70707045100 loop heihgt88888 Reverse angle3030302525 CHTcorrection scale OS00000 FAB Size1919242026 EFO wide warning Volt40004000400038004000 FFO GAP45004000480040005000 Tail XY ScrubNANANANANA Tail Scrub PhaseNANANANANA Tail Scrub USGNANANANANA Tail Scrub ForceNANANANANA BITS NSOP Sensitivity 3030303030 NSOL Sensitivity 12 10 10 8 10 SHTL Sensitivity5050505050 機台號 WB 15 ASM 機機種種 PARAMETER06PE1006PE22D06PE0207PE0107PE03 Bond One Search high88888 Search speedl128130135130135 USG Current8590908595 USG Bond Time1020151220 Force3540354025 Bond Two Tip 1010101010 C V5050509090 USG Current1051059595110 USG Bond Time2025251020 Force70707045100 loop heihgt88888 Reverse angle3030302525 CHTcorrection scale OS 60000 FAB Size1919242026 EFO wide warning Volt40004000400038004000 FFO GAP45004000480040005000 Tail XY ScrubNANANANANA Tail Scrub PhaseNANANANANA Tail Scrub USGNANANANANA Tail Scrub ForceNANANANANA BITS NSOP Sensitivity 3030303030 NSOL Sensitivity 12 10 10 8 10 SHTL Sensitivity5050505050 機台號 WB 17 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current Bond One FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 19 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 02 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 04 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current WBD Parameters Check List K S 機台號 WB 01 機機種種 機台號 WB 03 機機種種 USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 06 機機種種 PARAMETER07PE0107PE0306PE0106PE0206PE03 Bond One Tip 88888 C V0 60 50 50 50 5 USG Current135120125125130 USG Bond Time 2020302020 Force3530303530 Bond Two Tip 66555 C V0 50 50 50 50 5 USG Current140130135130130 USG Bond Time 2520202020 Force8085808580 Kink Height98 5999 Reverse Motion76 5777 Loop Factor 3 5 3 3 3 3 5 FAB Size2 42 32 32 32 3 EFO Current3530303030 FFO GAP3030303030 Tail XY Scrub00000 Tail Scrub PhaseLINELINELINELINELINE Tail Scrub USG200000 Tail Scrub Force6020202020 機台號 WB 05 機機種種 Bond Two BITS NSOP Sensitivity 10 2 2 20 1 NSOL Sensitivity 50 40 40 40 30 SHTL Sensitivity 4 4 4 4 4 機台號 WB 08 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 10 機機種種 PARAMETER06PE0106PE0206PE0307PE0107PE02 Bond One Tip 88888 C V0 50 50 50 60 5 USG Current120125130133120 USG Bond Time 2020202020 Force3530353130 機台號 WB 07 機機種種 機台號 WB 09 機機種種 Bond Two Tip 567 585 C V0 50 50 50 50 5 USG Current135130140135135 USG Bond Time 2020202520 Force9090808085 Kink Height998 5108 Reverse Motion77887 Loop Factor 3 3 3 3 5 3 5 FAB Size2 32 32 32 42 3 EFO Current3030303530 FFO GAP3030303030 Tail XY Scrub44000 Tail Scrub PhaseLINELINELINELINELINE Tail Scrub USG604040200 Tail Scrub Force2560106020 BITS NSOP Sensitivity 2 2 2 2 2 NSOL Sensitivity 50 40 10 50 30 SHTL Sensitivity 4 4 2 2 2 機台號 WB 12 ASM 機機種種 PARAMETER06PE1006PE22D06PE0207PE0107PE03 Bond One Search high89898 Search speedl135130135130135 USG Current8590908595 USG Bond Time 1020201220 Force3535354025 Bond Two Tip 1010101010 C V5050509090 USG Current1051059595120 USG Bond Time 2025251220 Force70757050100 loop heihgt88888 Reverse angle3030302525 CHTcorrection scale OS00000 FAB Size1919242026 EFO wide warning Volt40004000400038004000 FFO GAP45004000480040005000 Tail XY ScrubNANANANANA Tail Scrub PhaseNANANANANA 機台號 WB 11 ASM 機機種種 Tail Scrub USGNANANANANA Tail Scrub ForceNANANANANA BITS NSOP Sensitivity 3030303030 NSOL Sensitivity 12 10 10 8 10 SHTL Sensitivity 5050505050 機台號 WB 14 ASM 機機種種 PARAMETER06PE1006PE22D06PE0207PE0107PE03 Bond One Search high88888 Search speedl128135130120135 USG Current8595908595 USG Bond Time 1520151220 Force3540354025 Bond Two Tip 1010101010 C V50505010090 USG Current1051059595110 USG Bond Time 202525920 Force70707045100 loop heihgt88888 Reverse angle3030302525 CHTcorrection scale OS00000 FAB Size1919242026 EFO wide warning Volt40004000400038004000 FFO GAP45004000480040005000 Tail XY ScrubNANANANANA Tail Scrub PhaseNANANANANA Tail Scrub USGNANANANANA Tail Scrub ForceNANANANANA BITS NSOP Sensitivity 3030303030 NSOL Sensitivity 12 10 10 8 10 SHTL Sensitivity 5050505050 機台號 WB 16 機機種種 PARAMETER06PE0106PE0206PE0307PE0107PE22D Bond One Tip 88788 C V0 40 50 50 50 5 USG Current125120120135100 機台號 WB 13 ASM 機機種種 機台號 WB 15 ASM 機機種種 USG Bond Time 2020202520 Force3530303030 Bond Two Tip 55865 C V0 50 50 40 80 5 USG Current130120130140130 USG Bond Time 2520202020 Force8080858585 Kink Height98 59108 5 Reverse Motion76 578 57 5 Loop Factor 3 3 4 4 3 FAB Size2 42 32 32 352 3 EFO Current3034303030 FFO GAP3030303030 Tail XY Scrub00000 Tail Scrub PhaseLINELINELINELINELINE Tail Scrub USG00020100 Tail Scrub Force6020206040 BITS NSOP Sensitivity 2 2 2 50 2 NSOL Sensitivity 40 30 50 40 20 SHTL Sensitivity 4 4 5 5 4 機台號 WB 18 機機種種 PARAMETER06PE22D06PE0106PE0207PE0107PE02 Bond One Tip 88888 C V0 50 50 50 50 5 USG Current130125130135120 USG Bond Time 2020202020 Force3030303030 Bond Two Tip 65665 C V0 60 50 50 50 5 USG Current125140130145135 USG Bond Time 1525202520 Force8590858085 Kink Height89998 Reverse Motion7778 57 Loop Factor 3 3 3 3 3 5 FAB Size2 332 32 32 42 3 EFO Current4530503530 機台號 WB 17 機機種種 Bond One FFO GAP3030303030 Tail XY Scrub02000 Tail Scrub PhaseLINELINELINELINELINE Tail Scrub USG0400500 Tail Scrub Force4060202020 BITS NSOP Sensitivity 15 2 2 2 2 NSOL Sensitivity 70 50 10 75 30 SHTL Sensitivity 4 4 3 3 2 機台號 WB 20 機機種種 PARAMETER Bond One Tip C V USG Current USG Bond Time Force Bond Two Tip C V USG Current USG Bond Time Force Kink Height Reverse Motion Loop Factor FAB Size EFO Current FFO GAP Tail XY Scrub Tail Scrub Phase Tail Scrub USG Tail Scrub Force BITS NSOP Sensitivity NSOL Sensitivity SHTL Sensitivity 機台號 WB 19 機機種種 機台號 WB 02 機機種種 機台號 WB 04 機機種種 機台號 WB 06 機機種種 機台號 WB 08 機機種種 機台號 WB 10 機機種種 機台號 WB 12 ASM 機機種種 機台號 WB 14 ASM 機機種種 機台號 WB 16 機機種種 機台號 WB 18 機機種種 機台號 WB 20 機機種種 HDM Parameters Check List ASM 機台號 HDM 01 機機種種 06pd17 06pd02 06pe01 06pe10 06p047 Substrate Length152152152152152 Width3535353535 Edge to Pad11 511 513 511 613 5 Pad Row Col2 122 122 102 121 10 Key in Pitch Pad Row Pitch 14 14 14 14 14 Pad Column Pitch X 12 12 14 14 14 Pad Column Pitch Y 00000 HolderHolder Dimersion X79007900980084006000 Y 79007900980084006000 Bondhead Pick level 13620 8712 12767 9913 4234 Bond level 11652 3251 10777 11516 7949 Blow level00000 Bond force297281290203281 Bond time300250400400400 Pick time150250350400400 機台號 HDM 02 機機種種 06pd17 06pd02 06pe01 06pe10 Substrate Length152152152152 Width35353535 Edge to Pad11 511 513 511 6 Pad Row Col2 122 122 102 12 Key in Pitch Pad Row Pitch 14 14 14 14 Pad Column Pitch X 12 12 14 14 Pad Column Pitch Y 0000 HolderHolder Dimersion X7900790098008400 Y 7900790098008400 Bondhead Pick level 13620 8712 12767 9913 Bond level 11652 3251 10777 11516 Blow level0000 Bond force297281290203 Bond time300250400400 Pick time150250350400 機機台台號號 HDM HDM 0303 機機種種 07pe01 Substrate Length150 Width35 Edge to Pad13 5 Pad Row Col2 10 Key in Pitch Pad Row Pitch 14 Pad Column Pitch X 14 Pad Column Pitch Y 0 HolderHolder Dimersion X9800 Y 9800 Bondhead Pick level 12061 Bond level 10148 Blow level0 Bond force218 Bond time300 Pick time250 HDM Parameters Check List ASM 機台號 HDM 01 機機種種 機台號 HDM 02 機機種種 機機台台號號 HDM HDM 0303 機機種種 SAWSAW 站站標標准准參參數數 Spindle rotation speed38000rpmDicing mode Dicing mannerDicing height Feed speed50mm sWafer size Wafer thicknessO D I D Thickness0 025 0 030mmTape size Tape thicknessInlet water resistance Outlet water resistance1 0 5M Water temperature Water pressure 0 35Mpa A 8 55 56mm 230mm 100mm 10M 20 5 C SAWSAW 站站標標准准參參數數 SGL切單程式參數參照表 SGL program parameter reference form 機種 Device name 程式名 Program name 參數Parameter 刀片磨損量氣壓值 主軸轉速 20000 35000rpm Spindle Rev 切割速度 50 70mm s cutting speed 切割深度 0 04 0 1mm cutting height 05PC1505PC1530000700 06 小于1mm大于0 4Mpa 05PD02D 05PD02D30000700 06 小于1mm大于0 4Mpa 06PD12D 06PD12D30000700 06 小于1mm大于0 4Mpa 05PD0705PD0730000700 06 小于1mm大于0 4Mpa 05PD1005PD1030000700 06 小于1mm大于0 4Mpa 06PD1706PD1730000700 06 小于1mm大于0 4Mpa 06PD2106PD2130000700 06 小于1mm大于0 4Mpa 06PE0206PE0230000700 1 小于1mm大于0 4Mpa 06PE0306P