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1Aramid Fiber Kevelar(TA-01) (TL-01)(TCE) 6ppm/,Tg 194SMD2Base Material 3Bulge (Ductility)Bulge Test4Butter Coat 5Catalyzed BoardCatalyzed Substrate(or Material) CC-4(Copper Complexer #4)PCK 1964 6Clad/Cladding (Laminates) CCL(Copper Claded Laminates)7Ceramics (Clay)(Feldspar)(Sand)(62)Alumina()Beryllia(Be0)8Columnar Structure (E.D.Foil)(1000 ASF)(25 ASF)9Coefficient of Thermal Expansion CTE TCE 10Copper Foil CCL PCB (Electrodeposited)(Rolled)11Composites(CEM-1CEM-3) ()(Prepreg)Web() CEM-3 (Composite Epoxy Material) CEM-1 NEMA LI 1-198912Copper-Invar-Copper(CIC)Invar4050%5060% (CTE) IC(Leed Frame)Kovar Invar20/60/20 (Metal Core) XYSMDZ()(MoCu;70/30)13Core Material14Dielectric Breakdown Voltage () Dielectric Breakdown Voltage15Dielectric Constant(Electrostatic Energy)(Permittivity)()()(PTFE) 1 MHz 2.5 FR-4 4.716Dielectric Strength (Dielectric Withstand Voltage)17Dielectric 18Double Treated Foil (Matte Side),(Drum Side)19Drum Side ( 1000 ASF),(Drum)Drum Side20Ductility (Elongation)Hydralic Buldge Test21Elongation (Tension)22Flame Point23Flammability Rate UL-94NEMALI1-19887.1124G-10 NEMA (National Electrical Manufacturers Association)LI 1-19891.7 (Binder)G-10 FR-4(Flame Resist or Retardent)G-10 FR-4 20 LI-1-1989 UL-94 V-0 V-1 FR-4G-10 FR-4 G-10 25Flexural Strength 2.56Lbin2Flexural Yield Strength () () () () (/)0.030or 0.031 1 2.5 0.625 0.0250.060or 0.062 1 3 1 0.026 0.090or 0.093 1 3.5 1.5 0.0400.120or 0.125 1 4 2 0.0530.240or 0.250 0.5 6 4 0.10626HTE(High Temperature Elongation) (ED Foil) 0.5 oz 1 oz 180 2.0 3.0 IPC-CF-150E HTE-Type E 27Hydraulic Bulge Test (Ductility) X Y ( Elongation) 28Hygroscopic 29Invar 63.8 36 0.2 ( Metal Core ) Copper-Invar-Copper Laminate Void 30Lamination Void (Plating Void) Lamination Void 31Laminate(s) ,(Prepreg)CCL(Copper Claded Laminates)32Loss Tangent (TanDf) Loss Factor Dissipation FactorDielectric Loss() (Propagate) (Signal or Pulse) ( dB) Loss MIL-STD-429C 335(The Cotangent of Dielectric Phase Angle) (The Power Factor is the Sine Dielectric Loss Angle) (The Power Factor is the Sine Dielectric Loss Angle) () ()()(* stored) ( lost) (Loss Angle) /* /*Tan /Sin Tan Sin33Major Weave Direction (Warp)34Mat CEM-3(Composite Epoxy Material) Glass Mat , CEM-3 35Matte Side (ED Foil) (1000 ASF )(0.125 ),(Tw Treatmant,)(Tc Treatment,)(),Matte Side ED Foil Shiny Side Drum Side 36Minor Weave Direction(Fill)37Modulus of Elasticity 38Nominal Cured Thickness (Prepreg)39Non-flammable (Spark) (Flame)(Combustible)40Paper PhenolicKraft Paper (Kraft)Paper Phenolic41Phenolic(Thermosetted)(Phenol)(formalin)ResoleNovolac42Reinforcement43Resin Coated Copper Foil (Build Up Process) RCC44Resin Rich Area (CAF,Conductive Anodic Filament)(Butter Coat)Resin Rich Area45Resin Starved Area46Resistivity(Conductivity)47Substrate, 48Tape Casting(Hybrid) Slip Casting(Slurry) (Doctor Blade) (525mil)49Teflon(PTFE Poly-Tetra-Fluoro-Ethylene) 1 MHz 2.2 (R4737)2.67FR-44.5(3GHz30GHz) Teflon PTHTetra EtchTeflonTg (19)(20 ppm/)50Thermal Coefficient of Expansion(TCE) 1CTE51Thermomechanical anyalysis(TMA)TMATg52Thermount(Poly Amide) AramideKevelar NomexThermountKevelar(220)NomexThermount (Nonwoven) FR-415MCM-L53Thin Copper Foil(Clad) 0.7 mil 0.002 m/m 0.5 ozThin Copper Foil54Thin CoreThin Lminates Thin Core55UL SymbolU.L. Underwriters LaboratoriesINC. 1894ULULUL Santa ClaraULUL (1)(Listing)(2)(Classification)(3)(Recognition)(Logo)ULR U ULPCB UL 94 (Test for Flammability) UL 796 (PCB)56Voltage Breakdown()(Dielectric Withstanding Voltage)MIL-P-55110D4.8.7.21000 VDC30 IPC-RB-276 3.12.1Class 2 500 VDC30 Class 31000 VDC 3057Volume resistivity(Specific Insulation)1 cmMIL-S-13949/4D(1993.8.16)(IPC-TM-650 2.5.17.1)* 106 megohm-cm* (125)103 megohm-cm58Water AbsorptionMIL-S-13949/4DFR (NEMA FR-4)20 mil 31 mil:0.8% max32 mil 62 mil:0.35% max63 mil 93 mil:0.25% max94 mil 125 mil:0.20% max126 mil 250 mil:0.13% maxIPC-TM-650 2.6.2.12400 1051101(W1)(231)24(W2)(CAF Conductive Anodic Filament)59Watermark (Rigid Double Side 87628)(Logo)FR-460Yield Point Yield Strength ( Elastic Behavior ) (Plastic Behavior)CEM Composite Epoxy Material ; FR-4 8 7628 6 NEMA LI 1-1988 CEM

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