二次配系统简介.doc

_Secondary process system introductionWorking characteristics1. Wafer factory2. Fab features and capabilities of the gas required3. Chemical substances and their properties required for fab4. Work contents1. Wafer factoryFAB is a modern plant producing chips, the main workplace for the cleanroom. Clean room is a constant temperature and humidity, temperature is 21 c. Relative humidity 65%. Fab clean rooms divided into the diffusion zone (furnace batch), yellow, etching, thin film areas. 2. Fab features and functionality of the gas requiredDue to the manufacturing process on the need and use of many kinds of gases in semiconductor factories. We generally are based on gas properties to distinguish words. Specialty gases and gas can be divided into two broad categories. The former to use less gas. Such as SiH4, andNF3 . Which use large amounts of gas. Such as N2, andCDA . Due to a larger amount; General gas often in bulk gas call. The Bulk Gas. Specialty gas -Specialty Gas. 2-1 Bulk GasIn the semiconductor manufacturing process, need to provide a variety of high purity gas used in pneumatic equipment power, chemicals or pressure medium is used as an inert environment, or take part in the reaction or to remove impurities, such as different functions.Because of increasingly sophisticated semiconductor production, its requests for gas purity is ever mentioned. Semiconductor factory will be briefly described below the general quality requirements and the necessary equipment for gas and its functions.2-1-1Bulk gas products:Bulk gas Semiconductor plants can use, there are generally CDA 、 GN2 、 PN2 、 PAr 、 PO2 、 PH2 、 PHe 7 Species. 2-1-2 Bulk gas manufacturing: CDA/ICA(Clean Dry Air)Clean, dry air.CDASources taken from the air compressed by compressor dehumidifier, then by a filter or activated carbon adsorption to remove dust and hydrocarbons to supply the clean room CDA/ZCD 。 CDA System:Air compressor Buffer storage tank cooling dryerFilter CDA GN2Compressed using compressor cooling gas into liquid gas. Catalytic converter, CO reaction to CO2, H2, reaction to H2O, then sieve absorption of CO2, andH2O And then slip separation O2&CnHm. N2=-195.6C O2=-183CPN2GN2 Through the Purifier (Purifier) Purification, producing high purity N2 。 Liquid original nitrogen purity99.9999%After purification for purification of nitrogen purity99.9999999%GN2&PN2 System(See attached map) PO2 Compressor compressed cooled gas into liquid gas, awarded by second slip 99% Above in purity O2 And then drop N2 、 Ar 、 CnHm 。 Another by electrolytic dissociationH2&O2PO2 System(See photos) PArCompressor compressed cooled gas into liquid gas, awarded by second slip 99.0% More purity argon. Ar content in the air is only 0.93%. Production costs are relatively high. PAr System (See attached map) PH2Compressor compressed cooled gas into liquid gas, awarded by second slip 99.0% Above in purity H2 。 Also by H2O electrolytic dissociation H2&O2. High hazard manufacturing cheap but easy to trigger explosions. PH2 System (See attached map) PHeRare and rich He Extracted from natural gas, its main origin for the United States, and Russia. Air compressors compressed cooled gas in liquid, easily obtained from the slip. He lium=-268.9C Methane (Methane)= -161.4CPHe System (See attached map)2-1-3 Use of bulk gases in semiconductor plantsCDAMain supply FAB Pneumatic device powered air source and blowing (Purge),Local Scurruber Fuel it. ICAMain facility system pneumatic equipment-powered gas source and blowing.N2Main supply part of the pneumatic equipment air supply or supply blowing and dilute source of pressure of inert gas and chemical delivery.O2Supply ETCH -Process oxidizer needed and CPCVD Supplies oxidation process with business routine supply O3 Generator Required O2 Supplies and other processes required. ArSupply Sputter Manufacturing process and ion sputtering heat transfer media Chamber Dilution and inert gas environment. H2Feeding tube devices burning mix of oxygen, POLY Manufacturing process H2 BAKE Purposes. W-PLUG manufacturing process as WF6 for the reduction of gas and other processes. HePressure medium supply chemicals and processing chips cool.Bulk GasAlthough not as Specialty Gas , Some with highly toxic and corrosive. But we still need to pay attention to safety using a bulk gas. GN2, andPN2, andPAr, andPHe has the danger of suffocating, that gas is colorless and odorless, massive emission of lead in the air contain O2 ( Usually 21%), decreased to 16% below, namely, headaches and nausea. Dang O2 less to 10% Shi, who will be in a State of the will is not clear,6% , instantly Faints, unable to breathe,6 minutes less than death. PH2 due to leakage or when mixing, concentration of his own as long as the H2 of the blast RADIUS (4%-75%) (air), if they got the fire burning this gas is mixed. PO2 will make material easily oxidized to yield burning, causing fire mishap. Therefore, our works in the semiconductor, in the design, construction, and how to avoid leaks, and how to protect themselves from, you are one of our hard work. 2-2 SpecialtyGasUsed by the semiconductor factory Specialty Gas A wide range of about 40 or 50, according to risks can be divided into the following categories:2-2-1 Flammable gasesWhen some leaks gas when mixed with, as long as his own concentration in a certain range (air), if they got the fire, this gas is burning from the mix. This called the explosion of the gas range. Such as:SiH4 1.35%-100% SiH2CL2 4.1%-98.8% PH3 1.32%-100%2-2-2 Low pressure gasSome gases under normal for the viscous liquid gas at room temperature of saturated vapor pressure is less than 10Psi , Can also interfere with pipeline blocked, need to pack heat, improving the air vapor pressure can be an adequate supply of gas. For example:DCS, andCLF3, andWF62-2-3 Toxic gasSome gases due to its strong reaction of animals (including humans) respiratory and mucous membranes, skin and other features with a strong impact. Such as:NF3,PH32-2-4 Corrosive gasesSome gas and water effects, that is produced by hydrolysis HCL HF Acidic substances such as, the human body (including eyes, nose, skin, respiratory system, etc) and equipment (such as piping and valves) have a corrosive effect. This gas has the following: HCL、 CL2 、 SiH2CL2 、 BCL3 CL Elements of gas-HCL BF3、 SiF4 、 WF6 F Element-HF NH3-Ammonia water Very irritating2-2-5 Asphyxiant gasesSuch as: CO2 、 CF4 、 C2F6 Such gases, odorless and tasteless. If a large number of emission of air caused by O2 content reduced to 16% when the headache and nausea. Dang O2 less to 10% Shi, who will be in a State of the will is not clear,6% , instantly Faints, unable to breathe,6 minutes less than death. 2-2-6 Spontaneous combustion gasesSome of the gases, mixed with the air, even without the fire catches fire spontaneously burst into flames. This is called spontaneous combustion gases. Its fire at room temperature. This gas are:SiH4、 PH3 、 B2H6 Though we cannot exclude these gases can cause various adverse effects on us. But we working in semiconductor plants, may be included in the design, construction, and stop loss. To avoid leaks, he stressed.3 Fabs require chemical substances and their properties3-1 Types of chemicals (solvents)C260、 EKC-270 、 NMP 、 OK-73 、 A515 、 IPA In addition to EKC-270 PFA/304 BA Tube, others use 316L EP Tube. Take over the way with VMB outlet and the machine inlet side takes over. 3-2 Chemical species (pH class)HF1%、 HF49% 、 H2O2 、 NH4OH29% 、 DEVELOPER 、 M1 、 BOE 200:1 、BOE 500:1、 BOE 50:1 、 HNO3 、 HCL 、 H3PO4 、 H2SO4 。 Used PEA/CLEAR PVC double pipe bend directly, take over the way with VMB outlet and the machine inlet side, inner tube direct expansion tubes. Outer tube using the 40A C-PVC SOKET fixed. 3-3 Chemical characteristicsSee table belowSerial number -Chemical name chemical characteristics1 H2SO4 Sulfuric acid Highly corrosive liquids2 H3PO4 Phosphoric acid Corrosive liquids3 HNO3 Nitric acid Highly corrosive liquids4 HCL Hydrochloric acid Liquid corrosive irritant5 BOE 50:1 Etching solution The corrosive and toxic liquids6 BOE 100:1 Etching solution The corrosive and toxic liquids7 BOE 200:1 Etching solution The corrosive and toxic liquids8 DEV Developer Corrosive liquids9 NH4OH Ammonia water Strong irritant liquid10 H2O2 Hydrogen peroxide solution Irritant, corrosive liquids11 M1 Nitric acid hydrofluoric acid mixture Highly corrosive liquids12 49% HF Hydrofluoric acid in aqueous solution Corrosive liquid13 1% HF Hydrofluoric acid in aqueous solution Corrosive liquid14 Thinner Crystal cleaning liquid Flammable liquids15 EKC270 Liquid photoresist removal Corrosive and irritant liquid16 A515 Developer Flammable, irritant liquid17 NMP Ka ketone, methyl Flammable, irritant liquid18 IPA Isopropyl alcohol Flammable, toxic liquids19 C260 Fountain solution Flammable, irritant liquid4. Work contentsThe work we do is the use of automated tools such as welding, pipe Bender. Air bottle cabinet (or tank) side set up the pipeline to FAB reserved near the machine and open the valve in the TAKE OFF point (this is referred to as a distribution). Then TAKE OFF point preparation pipeline to contact secondary with (HOOK UP). Introduction to semiconductor materials of piping and valves1. Pipe fittings-Pipe&Tube2. Connecting accessories-Fittings3. Valves-Ultra Clean Valves4. Pressure regulating valve-Pressure Regulator5. Pressure sensors-Pressure Gauge&Transducer6. Filter-Gas Filter7. Selection of materials based on8. Two-disc set of the form1 About Pipe&Tube1-1.According to material pipe can be divided into:SUS 304 SUS 316 SUS 316LThe difference is that SUS316 Add mo ( Mo ) Metals, improve their mechanical properties. LSaid material to reduce C Increased nickel ( Ni ). 1-2.According to specifications classification can be divided into:Sundials ( JIS ):PIPE SIZEAmerican Standard ( ASTM ):TUBE SIZEIt should be noted that:1 PIPE SIZE=25A, Outside diameter OD 34.4mm, TUBE SIZE OD 25.4mm PIPE SIZE 25A Also known as 1,50A Also known as 2,80A Also known as 3,100A Also known as4 TUBE SIZE(Generally used in 1 Gas Piping) , Common sizes 1/8 (A), 2/8 (B), 3/8 (Three points), 4/8 (D), 5/8 (Five points), 6/8 (Six points), 1 。 1-3 According to the classification of surface treatment methods:Is generally divided into threeAP( Annealed and pickled ) Level (plain tubes): pickling tubeBA (Bright-annealed)Grade: bright annealed tubeEP (Electrolytic polished)Level: electrolytic polishing pipesNote: the factors affect the price of pipe is the most important determining factors in surface treatment methods, the height of the price order EPBAAP 。 1-4.According to the differentiated thickness:General thickness specifications SCH5S 、 SCH10S 、 SCH20S 、 SCH40S 。 1-5.Pipe manufacturing process can be divided into:SINGLE MELTDOUBLE MELT(Aimed at reducing tube impurities and increased corrosivity) example:VIM+VAR( SUMKIN Patented nicknames)VIMVACUUM INDUCTION MELTINGVARVACUUM ARC REMELTING1-6 Welded and seamless pipes can be divided into two types.2 About Fittings2-1.Material and pipe fittings.(EP/BA.)2-2.Commonly used categories:Nut+Gland+Gasket Elbow、 Tee 、ReducerCap、 Plug Connector Connector2-3 Types and specifications:Can generally be divided into VCR (1/8 ),/SWG (1 )/Welding/ Screw the streets/FlangeSize from 1/8-1(VCR/SWG) 1/4300A(Welding/Flange) Short connector SCM(micro) or Long connectorSCL(long)&SCF2-4.Label:KITZ/HAM-LET/IHARA/SWAGELOK/FUJIKINN2O、 CO 、O3Gasket must be SUSNote: the gas used Gasket Ni Material. CO Ni has eroded, so the CO Gasket must be a SUS series material. 3 About Valves3-1 Material with tubing3-2 Commonly used categories:Manual valve (Manual Valve): Ball valve (Ball Vavle1/4-3/4) Corrugated pipe valve (Bellows Valve1/4 - large size, used for high pressure ) Diaphragm valve (Diaphragm Valve1/4 -1 for low voltage high)Pneumatic valves (Air Valve) :a.Use the air control valve open or closed source, achieve the purpose of automation, pneumatic valve itself has a long drive ( Normally Open/N.O. ) Long closed ( Normally Close/ n.c. ) With two more commonly used forN.C.b.Pneumatic valve actuation forms are divided into:Diaphragm type pneumatic valve ( Air Operated Diaphragm Valve ) Generally300psiCheck valve (Check Valve): Also known as one-way valves, check valves, main functions for the maintenance of the pipeline gas (liquid) unidirectional flows, preventing the damage caused by upstream. Pressure relief valve ( Relief Valve ) : Also known as the safety valve, its function is to maintain system pressure, when the pressure exceeds safety when setting pressure, will be via the pressure relief valve. Voltage regulation method ( Regulator ) : Also known as the reducing valve, main function is to change the gas from high pressure inlet port ( HP ) , Adjusting the working pressure, then the outlet port ( LP ) Flow to the pipe or device. Voltage regulation method for gas should be used, piping and equipment requirements, and can distinguish between two broad categories:a. For general industrial use Instrument ( banned oil treatment Oil Free), Applicable gas purity, non-corrosive, non-toxic, non-flammable (such as N2,He,CDA, Ar . )b. Semiconductor High Purity (BA/EP ) Apply to gases with high purity and corrosive, poisonous, flammable (such as H2,HCL,H2/N2. )3-3 Label: KITI/OHNO/IHARA/MOTOYAMA/NUPRONH3Check Valve must be AFLAS type3-4.NotesHigh pressure valve / Low pressure valve According to different places to chooseTwo way valve / The three-way valve / Four-way valve /. According to your demand to select, pay attention to the flow of choice4 About Regulator4-1.Material and pipe fittings4-2.Frame material: PCTFE 、 SS316L 、Kel-F814-3.Commonly used categories:High voltage / Low-voltage / General pressure2PNo header /3P or 4P Single or double headers for the table headerVCR/SWG/Flange4-4.Note:Bulk GasGeneral use 316L BA 316L EP /VCR SWG 1/4R25Series 3/8R35 Series 1/2RH1 Series Because of different flowSpecialty Gasa:Toxicity / Flammability / Noble gases: 316L EPL25 or R25 Seriesb:Corrosive gases: VIM+VARL25 SVA Seriesc:Low pressure gas: adjustable negative-pressure types should be selected (type)-L96SSA Series5 About Pressure Gauge & Transducer5-1.Popular categories:Pressure Gauge(PG)Pressure gauge head pointer type,C122Pressure Switch (PS)Pressure switches, analog, with transmission lines,IPS122Digital Pressure Gauge(PID)Electronic pressure gaugePressure Tranaducer (PT)Pressure transmitters5-2 Pressure range can be divided into:High voltage(03000Psi)Low-voltage(-30Hg030Psi)(-30Hg0160Psi)5-3.Power supply:24V DC 420Ma DC6 About Gas Filter6-1.Features: filtering particles in the air(particle)6-2.Filter grade option, that is, filter diameter (particle size), Can be divided into:0.01um/0.03um/0.003um (Micron)6-3.Center filter (Medium) Material: PTFE/SS 316L/Ni ( tiefulong / stainless steel / nickel)6-4.Flow (Flow Rate) General flow and high flow30slpm/100slpm/300slpm/1500slpm6-5.Connecting type:VCR or SWG or Welding6-6.Common filter material:Bulk GasPTFESpecialty Gas:Toxicity / Flammability / Inert gas PTFE SeriesCorrosive gasesPTFEFor COPTFE typeFilter effects Leak- capture rates of anti-corrosion performancePTFE(F) Good Bad 10.8 N/ASS316L(M) Very good Well 6. 2 badNickel(Ni) Very good Very good 10.8 good7. Selection of materials based on7-1 Types of gases, gas properties:Effects of material grade:AP/BA/EP/V+V(VIM+VAR)7-2.Owners needs and budgetsNote there is no specified brand or specifications7-3 According to the dosage required for machine and its own contacts selected material sizeDimensions that affect the materials used: 1/4 、 3/8 、 1/2 、15A7-4.Machine required material pressure and flow different options formSelection of pressure ranges flow from suitable for valves. (1/43/4)7-5 Depending on the disc Assembly choose component joint typeVCRF or M; SWG ; Welding7-6. Operating temperature, Cost8. Two-disc set of the form:In general have the following common forms:Specialty Gas(No disk group, VMB/VMP Replace)Bulk GasEPLevel by the Diaphragm Valve+Regulator+Gauge+Filter CompositionBALevel by the Ball Valve+Regulator+Gauge CompositionNote: close the secondary disk group when piping Parts Structures will not be finalized after discussions with the owner. Construction specifications1. Piping erection2. Bends tubing specifications3. Pipe cutting and milling surfaces4. Installation of pipe joints5. Specification for welding6. CHEMICAL HOOK-UP specifications1. Piping erection1-1 Prefabrication work environmentTo be equipped with a temporary clean Studio (Clean Booth) And all piping work operation within this area basically completed, in order to avoid undue pollution. This clean Studio and control must be maintained in the following environmental conditions:Temporary clean Studio:a. Number of dust (static, particles smaller than 0.3um ) 1um=0.001mm :(Human hair100um)Warehouse : (Disc used for storing materials and prefabricated, fittings, etc)The cleanliness is Class 10000 。 Class 10000 Clean Booth measured the amount o