资讯人才在封装测试业之角色.ppt

資訊人才在封裝測試業之角色 Ming ChengShengASEKH ITApril9 2003 Agenda ITRequirementforAssembly TestingHouseBusinessModelASEKH TestITSystemsCIM MESEITERPB2BTheRoleofITSomeLessonsfromOurOJT 半導體封裝製造價值鏈 半導體封裝測試業產品生產流程 DESIGNHOUSE 設計廠 產品需求 ProductRequest 電路設計 CircuitR D 電路模擬 Simulation 電路佈圖 CircuitLayout 佈圖模擬 LayoutSimulation 光罩製作 Mask 晶柱成長 CzochralskiGrowth 晶圓切片 WaferSlice WAFERFAB 晶元廠 晶圓製程 WaferProcess 氧化模成型感光劑塗佈乾板設計組合曝光顯像定影顯像蝕刻溶解高溫擴散 離子植入金屬蒸著成型晶圓 半導體封裝測試業產品生產流程 ASSEMBLYHOUSE 封裝廠 晶粒切割 WaferSaw 黏晶 DieAttach 焊線 Wirebond 封膠 Molding 化學處理 電鍍 合成 酸洗 切腳成型 Trimform 印字 TopMark 檢測 Inspection 半導體封裝測試業產品生產流程 TESTINGHOUSE 測試廠 晶圓測試 WaferSort 老化實驗 BurnIn 最終測試 FinalTest 外觀檢測 V MInspection B LASSEMBLY 板子組裝廠 表面粘著 SurfaceMountTechnology 板子組裝 PCBModule PRODUCTIONLINE 成品組裝廠 最終產品 FinalProduct 半導體封裝測試業產品生產流程 ProcessFlowIntroduction ProcessFlowWaferSortFinalTestBurnIn TDBI LeadScanT R Drypack Outputs SummaryWaferMapYieldReportQCData MES Subsystem Process IncomingMaterialType WaferfromFab 70 PackagefromASEK 30 PackagefromotherAssemblyHouse TESTINGHOUSETurnKeyBusinessSolution WaferSort WaferIncomingInspectionESD GroundingProtectionInklessOperationWaferMapping TraceForm In LineYieldSPCChartStackWaferMapYieldReportandTrendChartCorrelationProcessControl WaferSortSetUpProcedureIn ProcessStatisticalProcessControl SPC ManufacturingExecutionSystem MES LotTracking ReportingProbeCardMaintenanceClean CalibrationPreventiveMaintenance Operation Calculation Analysis Charts Controls WaferSortProcessFlow 1 CircuitProbingProberPMandcalibrationSet upprocedureandhandlingYieldmonitorProbemarkandwaferV McheckDatacollectionprocedure IQA IncomingQualityGateLoader UnloaderPMMicroscopehandlingDe packhandlingWaferV Mcheck IDSorting CP WaferMap WaferSortingSortercapabilitySorterPMVacuumpenhandlingN2cabinethandling WaferMapcontrolDataconfirmationDatatransfer Foundry QualityGateLoader UnloaderPMMicroscopehandlingWaferV McheckCPdataconfirmationandupdate OutgoingshippinggatePackingmaterialcheckShippingdata Inking WaferInkingProberPMandcalibrationInkingoperationInkrelatedspecificationInkcheckprocedure Bake QA Pack OQA WaferBakingOvenPMandCalibrationCassettetransferhandlingTemp andTimedefinitionVisualInspection WaferoutingpackingMaterialstorageCassettetransferhandlingSorterPMandoperationShippingdatapreparationPackingprocedure WaferSortProcessFlow 2 LaserTrim LaserRepairFuseCuttingESI 9200 9300 WaferSortCapability FinalTest ICIncomingInspectionESD GroundingProtectionInProcessVisualMechanical V M MonitoringInProcessYieldMonitor SocketCycleTimeControl In LineVM YieldControlChartDaily Weekly MonthlyYieldReportandTrendChart FinalTestSetUpProcedureMESLotTracking ReportingLoadBoardMaintenanceClean CalibrationPreventiveMaintenance Operation Calculation Analysis Charts Controls FinalTestProcessFlow 1 FinalTestESD GroundingProtectionInProcessV MSPCControlBinOperationControlYieldControlProcedureFastTATandCycleTimeControl ASE OtherAssemblyHouse IQA IncomingQualityGateLeadScanningVisualEyeInspectionIncomingDataCheckWaferInspectionCapability TESTINGHOUSETurnKeyBusinessSolutionProvider BurnIn FinalTest QA BurnInCapabilityBIBDesign BuildAutoLoad UnloadTestDuringBurnIn BurnInSetUpSheet ElectricalQAGateAQL 0 1 QARejectHandlingProcedureQualityReport FinalTestProcessFlow 2 BakeCapabilityBakeTemp 125CBakeHour 8HrsWindowTime 4HrsRealTimeBakeOvenMonitoringSystem Pack DropShipDryPackPackMTLDesignLabelDesign DataLinkingColorfulPackingSystem FrontEnd W S F T B I Top mark TopMarkCapabilityInkmark LasermarkControlbySetupprocedure SOP TCM PackagefromotherAssemblyHouse TESTINGHOUSETurnKeyBusinessSolutionProvider LeadScan Bake T R Pack LeadScanCapabilityCopl BendLeadStandOff SkewBallQualityInspect VisualInspection Tape ReelCapabilityMulti MaterialSourceKitAvailabilityPeelStrengthSPC DropTestQualification 半導體封裝測試業產品生產流程 IC封裝測試業現場生產流程之特色服務性質的製造業特殊的出貨方式 Dropshipmentservice 委測產品測試流程的多樣性測試批的Hold住現象 造成測試流程相依於測試結果測試機台的跨機問題客戶化之產品生產流程 Subcon 同時上線的IC封裝產品形式多 批量多寡不一須提供客戶現場即時生產資訊 拆批 YieldJudgment Handling Pre Test Test YieldLT90 Pre Test Test HoldInv HoldInv ELSE END IF Yield 90 Yield 90 BurnIn Test2 ELSE END IF MISSystemArchitecture MANAGEMENT Infrastructure ERPSDFI COPPMMQM CRMB2Bi VirtualFactory quickrespondsystem IRS Standardreport KM 1 CommonBusinessServicesInfrastructure virus firewall 2 MessagingInformationDistributionInfrastructure EDI e mail FTP E FAX 3 MultimediaContentandNetworkPublishingInfrastructure HTML JAVA WorldWideWeb ASP 4 NetworkInfrastructure Internet WAN LANIntranetExtranetVLAN ISDN 5 InterfacingInfrastructure To databases customers andapplications CIMPTSFCEDC SPCAlarmFA PDMDocumentManagementProductDataProductStructureManagementECManagement OAWorkflow HR QA CS ENG E mailFTPDocumentcenterWeb intranet internet CIMHardwareArchitecture TCP IPTIB RV4 2 PROMISServer HSJ50 HSJ50 Secondary Alpha4100 5 400 22GBRAM Primary Alpha4100 5 400 12GBRAM MES CELL 110 12 20 8 ASE110 12 20 2 ASE210 12 20 4 Gateway 10 12 20 254Mask 255 255 255 0 10 12 20 16 S WSetupProcedureServer 4 3GBHD 20 DiskArray 9GBHD 418GBHD 2OpenVMS7 1C DECC FORTRAN7 1 1PROMIS5 5TIB RV4 2ReportGatewayv2 2 ReportServer PIII 550 2NT4 0C1GBRAM9 1GBHDD 3Oracle8 0 4TIB RV4 2TPServerAlarmsvrDBsvrVGS CELLServer Secondary AlphaES40 22GBRAM9 1GB 2localHD OS Primary AlphaES40 12GBRAM9 1GB 2localHD OS ASE410 12 20 21 ASE310 12 20 31 9 1GBHD 12 DiskArray0 1 ORACLEDB8 0 59 1GBHD 4 DiskArray5 INTENCHAP18GBHD 2DBBackup HSZ80 Secondary AlphaES40 21GBRAM18GB 2localHD OS ORACLE Primary AlphaES40 12GBRAM18GB 2localHD OS ORACLE ASETRPT110 12 20 7 ASETRPT210 12 20 9 18GBHD 11 DiskArray0 1 OracleData8 0 5 Rpt 9GBHD 4 Mirror DBBackup9GBHD 2 Mirror RedoLog Rollbacksegment9GBHD 2 Mirror ArchiveLog9GB 1 Standalone OracleData Webdb HSG80 10 12 20 6 TPServer ASET AP10 12 15 13 ASET WS210 12 51 5 P3Xeon700Hz 1MBNetServerLT6000r9 1GHotSwapX3 ASET WS110 12 51 4 P3Xeon700Hz 1MBNetServerLT6000r9 1GHotSwapX3 ASET AP110 12 15 23 NetServerLCIIPII266Hz160MECCSDRAM18GBX3 Ultra16068pin 10 000RPM NetServerLCIIPII266Hz160MECCSDRAM9 1G4 2G Storage 18GHotSwapX4 ASET WS110 12 51 3 ReportingServer WSCellServer VMSServerMESDatabase PROMIS LotInformation Recipe ReportClient DataCollection WaferMap BinSummary SPCData UPH AutoDataCollectionSystem GUIClient Transaction Setup TrackIn Maintenance Datacollected TrackOut Reporting WIPData YieldData CycleTime Output Performance MESCellServerPT Setup Maintenance ConfigurationTable WaferMapRawData ProbeData FTCellServer TestResult SPCData UPHdata Handler CIMCurrentSystemArchitecture ReportingServer WSCellServer VMSServerMESDatabase PROMIS LotInformation Recipe ReportClient DataCollection WaferMap BinSummary SPCData UPH AutoDataCollectionSystem GUIClient Transaction Setup TrackIn Maintenance Datacollected TrackOut Reporting WIPData YieldData CycleTime Output Performance Prober MESCellServerPT Setup Maintenance ConfigurationTable WaferMapRawData ProbeData FTCellServer TestResult SPCData UPHdata EAPCellServer SetupM C RecipedownloadDataCollection Engineeringdata Equipmentdata Handler Tester Tester CIMFutureSystemArchitecture WSFileServer WSAPServer EDCServer Layer1ControllayerAutomation PC EPQ Layer2Executelayer MES Prober Tester Handler PanelPC LAN LAN TTL GPIB GPIB CIMserver Layer3Planninglayer ERP SCM Planningdata Shopfloordata TesterWorkstation EDAServer Summarydata Programdownload CIMF EFramework SECS WSOnline FTOnline YieldManagement EMS SPC RMS FABResourceManagement ShuntBox SPCFileServer SPCDatabase EDCServer Layer1ControllayerAutomation PC EPQ Layer2Executelayer MES Scanner Marking Bake PanelPC LAN LAN CIMserver Layer3Planninglayer ERP SCM Planningdata Shopfloordata CIMB EFramework LAN LAN RS 232 T R LAN Jobdownload SPCsummaryUpload Jobdownload Temp monitor SPCsummaryUpload WSOnline FTOnline YieldManagement EMS SPC RMS FABResourceManagement ASETEngineeringInformationSystemRelationDiagram ERP SCM B IOvenmonitor PCS Setupprocedure SetupMatrix H Wconfig Tooling Spareboard Correlationsample PEDB MM BOM ColorPacking TEV APQP Spec F E B E BIMS BCS MES AssetControlDiagram TestingEngineeringControlCenter TECC CUSTOMER Verify IncomingSendBack ProductTestingEngineer PTE MFGControlCenter L BRepairRoom RepairPM Tester ProductionEngineeringUse DeviceNameLeadCountPKGIBM610 256BGA Bin StatusRemark1GoodPass2FailO S S WBininformation GlanceatSetupProcedure MatrixMFG LBBCSDispositionBIovenSpareboardCorrelationToolsPMTestprgmmgem H Wconfig Yield Setup TEV PEDBColorpacking SPEC FT WS BIsetupprocedure H W Tooling Disposition Tooling FT WS BIsetupprocedure BIoven SPECECTEVFT WS BISpecRouting PDM ERP FRP LogisticMFG SCM MES RBOMMBOMRouting ENG MFG MM PCSAPQPPEDB BOM colorpacking EIS CapabilityofPDM NewVersionControlEventAlertAPQP ECMonitorInternetApprovalAvailableBetterTurn keyServiceCollaborationMechanismEfficiencyManufacturing ASRS Packing PEDB Label PT SetupProcedure TDRP Shipping Price PO SAP FI GUI MES Invoice MM AOL Intranet Internet EquTimeRecord Bonus Cost SpareParts Tooling Extricity FCST TSMCShipInstr MESMenu Plan TEV HoldBank SPEC CAR TesterConfig HoldLot E PR HR E HR CurrentERPSystemArchitecture NotesAP ByASET Package Operation Distribution SCM ForecastPCPlanHRBonusProgramVersionControlSystem Cust POControlQuotationPricingShippingNoticeInvoicingPackingListLabeling FinanceCostGUIPurchaseInventoryMan Bond ERPApplications FlexiblePO PricingControltomeetCustomerrequirementFlexibleShippingDoctomeetCustomerreq including InvoicePackingListInnerboxLabelOuterboxLabelMaterialControlInventoryManagementGoodAP ReportVersionControl ERPCapability PR Quotation ERP SAP InventoryControl Sales DistributionOrderEntryPricing Service PurchaseMaterialControlPurchase Finance CostingGL AR APAssetManagement Budget CostControl Treasury Receive Customer Vendor Quotation PO WarehouseManagement Pick Pack Shipping Material FG ShippingRecords Invoicing Validate RT Invoice 發料記錄 Payment Payment invoice Invoice ASSY FinishGoods Waferissue WaferSort FinalTest ProductionControl ProductionPlanningSchedulingMaterialPlanning SCM ProductionOrder invoice GRPProjectScope MM QM SD FI CO PP SCM MES 1 SetupProc 2 PEDB3 Tooling Label E PUR IRS 1 借機管理2 機台進出 AS RS HR OtherNotesAP FutureSystemArchitecture UtilizationConfigureAutolinkage SpeedupCust Req ReduceManpower FutureCapability ASEB2BArchitecture RosettaNetPIPsSupported BusinessAp