产品审阅指引.doc

9.1 PCL(Project Checking List)格式如下：PROJECT CHECKING LISTCUST. CODE CUST. P/N： GME P/N： BASIC RULE: ANY MODIFICATION ON CUSTOMER DESIGN MUST BE APPROVED/CONFIRMED BY THE CUSTOMER.Remark: NR=No requirement, Cap= GME capability; - OK, XNOT OK, N/A(NOT APPLICABLE/ NOT AVAILBE). if an item is OK, then fill the related ACTION volume with a tick A. DOCUMENT RECEIVED ITEMGME CAPABILITYCUSTOMER REQUIREMENTACTION (OR ICS OR APQP )REMARKA-1SPECIFICATIONSpec. indicated on the project matches with the Spec. in hand.And the Spec. is reviewed. Spec. indicated on this project:No. Rev. N/RProvide or ignore the Spec. we have no in hand:No. Rev. OK NR=GME internal standard & IPC CLASS 2A-2 REFERENCE PROJECTSimilar ICS can be referred, Do not need ask customer again. Customer provide referred projectChecking current capability, confirm reference project whether can be referred. GME find according customer code. GME P/N:_ It is a ECN project, Reference old revision. N/AA-3 SAMPLE BOARDMatch with other information if it is a golden board. Only for reference Golden board need confirm CAD artwork by imitating golden board N/AA-4 DATA INTEGRALITYCheck, if there is any questions need to be clarified.Extra files need to be clarified.If all files are integralityA-5 PTL CHECKINGPTL content match with customer requirementU/S：U/P = ： Include GME, MIT, OPC, SYE PTLB. DRAWING AND FILE CHECKINGITEMGME CAPABILITYCUSTOMER REQUIREMENTACTION (,ICS OR APQP )REMARKB-1 LAYER COUNT & PCB TYPE24 layers Max. if it is variable depth via-HDI and so on special PCB, discussion is needed.B-2 SURFACE TREATMENT(1) ENIG. ( Immersion Gold ), If customer requirement is Flash Gold, need confirm with customer to change it to Immersion Gold. ENIG I Ag OSP Carbon ink Brown Oxide Selective ENIG Adding teardrops should be approved by customerRecommend ENIG as the surface treatment for keypad pattern of mobile phone project.(2) Immersion Silver: teardrop should be added (3) OSP: Shikokukasei F2: thickness 0.15 um Min. If customer asking for Entek, need confirm with MARKTING for change Entek to OSP(F2).(4) Carbon ink. printing(5) Brown Oxide (For inner layers)(6) Selective ENIG:(The distance between the area of ENIG and OSP is 12mil(min), and though plated hole on OSP area need ICS with customer that gold in holes allowed)B-3 SPECIFIED PREPREG THIN CORE OR DIELECTRIC THK.The dielectric thk = 2 mil Min.PP=7628 / 2116 / 1080 / 3313 / 106 / RCC80T12/RCC70T12 is availableGeneral T/C thickness: 4mil、4.3mil、5mil、6 mil、8 mil、10 mil、12 mil、14 mil、16 mil、18mil, 20mil, 21 mil、24 mil、28 mil、30 mil、36 mil、39 mil、43 mil、47 mil is availableT/C = 2mil 1/1oz ( Min )The specified core / prepreg / dielectric should meet overall board thickness and impedance. Total thk0.3 Min.-0.5mm tol.+/-0.05mmTotal thk 0.5-4.0mm Max. tol.+/-10%, Tol.+/-0.5mil for single PP, +/-10% for PP more than one piece.PP 1080, 1086 and RCC70T12 is suitable for Laser drill.Resin content should be considered per copper content(%) in working panelTotal Copper thk.= Total T/C thk.=Total PP thk.=Total Pressure thk.=Overall thk.= Pressure thk.+(UP +4.3/ LOW+2.7) mil= Tol.=T/C thickness exclude copper NR=Cap. AND finding a P/N for reference is recommended.B-4 VENDOR OF BASE MATERIALUsually: FR-4 MICA(S) or MICA(V), Multi-Function ( UV)Specially: CEM-3, FR-4 150Tg , 170Tg Halogen Free MaterialFR-4 MICA ( S ) UV(T/C5mil)FR-4 MICA (V ) UV(T/C5mil)CEM-3 Should be UL approved material B-5 MIN. FINISHED COPPER THICKNESSHole wall:15um Min30um Min. (20 um Average. min)Blind hole: 13um(min) for laser hole, 15um(min) for mechanical hole.Buried hole: 15um Min.NR=CapBase copperInner (um)Outer (um)Min. conductor copper thk.:Inner layerOuter layerT8um25umH12um33um125um53um256um90um391um125um1/4 (for 0.5mm BGA pitch HDI)/22umB-6 FINISHED BOARD SIZE2 Inch x 2 Inch (Min).22 Inch x 26 Inch (Max).B-7 OUTLINE TOLERANCE (Rout & Punch)Hole to edge: +/-0.20mm(hole dia.1.0mm); +/-0.15mm(hole dia.1.0mm);0.10mm(if the hole is drilled at PF.); edge to edge: 0.10mm (but 0.15mm if PTH posited)NR=0.13 mm (0.15 -PTH) for edge to edge5for angleNR=Cap.B-8 INSIDE CORNERR0.8mm Max. (Rout)NR=R1.0mm MaxB-9 SOLDER MASK MATERIALFollow customer Spec./ follow previous Rev.NR=DPM fileShould be UL approved materialBright(glass) or Matte solder maskCoating thickness：10m (Min.) except 5um Min at conductor cornersColor: Green or Red or Blue and so on.NR=GreenB-10 COMPONENT MARK MATERIALNonconductive epoxy in White or Yellow color.White Yellow Should be UL approved materialB-11 THE THICKNESS OF AU/NIENIG: Ni thickness 6.0um Min Gold thickness 0.10um Min.NR=Ni/Au:2.54/0.05um(min)B-12 HOT SOLDER THICKNESS1.0um25umB-13 CARBON INK MATERIALDiscussion with ME / PMCResistance: Material: B-14 HOLE PLATING ASPECT RATIOBoard thk.: PTH drill size= 7 : 1 (Max )Laser drill: depth: Dia.= 0.75:1 (Max )B-15 COUNTERSINK HOLE SIZE:DIA. 6.35 ( Max ) When top angle is 165 degreeB-16 BOW & TWIST0.7% (per IPC class 3). But it is shall be discussed for unsymmetrical lay upNR=Cap.B-17 IONIC CONTAMINATION6.45ug / in2 (1.0ug / cm2 )NR=CapB-18 PACKAGE REQUIREMENTFollow GME internal Spec.(If customer no requirement)NR=internal spec.B-19 THE RESISTANCE FOR SHORT /OPEN OF E-TESTShort10 MOpen50B-20 E-TEST VOLTAGE250 V (max)B-21 TEST REQUIREMENTAny test requirement, should be discussed with QA colleague, and they decide whether need ICS or APQP or not.B-22 Special requirementFor example: NEC13, BVH SPEC is required, and so on.B-23 4M RequirementFor certain customer have 4M change requirement, It should be confirmed by customer if there are any change (Man Machine Material Method)B-24 The weight for board.If customer requirement the finished weight of board, should raise ICS ignore the requirement or APQP.B-25 Lead Free requirementWhether customer have Lead Free requirement for material and PCB or not，for example there is lead free mark in PCB design, (RoHs requirement), Choose material must ensure it.C. HOLE AND SLOT CHECKINGITEMGME CAPABILITYCUSTOMER REQUIREMENTACTION (,ICS OR APQP )REMARKC-1 GERBER DATA INPUTPlotted A/W match with master A/W or photo copy.Match Unmatch, Need to ClarifySend CAD A/W and ICS to customer for approval if customer needs.Netlist should be verified if customer provide CAD netlist.C-2 DRILL HOLE INFORMATIONHole drawing /drill tapeHole drawing match with drill tape.Hole quantity correct.Qty of hole code match with that in hole table and in drill tape.There should be a dimension from one hole to the edge of board or completely CAD outline frame is needed C-3 TURE POISITION TOLERANCE (Compared with CAD)1st drill=0.076mm2nd drill=0.13mmNC rout=0.13mm 1st drill= 2nd drill= NC rout= NR=Cap. C-4 HOLE TO HOLE C-4.1 MIN. DISTANCE BETWEEN HOLES OR/AND SLOTS IN SAME DRILL LAYER0.30mm ( Min.) for PTH holes and slots. 0.20mm ( Min.) for NPTHCheck customer drill tape and find as below: If the MIN. distance smaller than the requirementSuggest customer to drill them to slot move the holes approved by customersIf Through Hole to Through Hole less than 26mil for H OZ, 26.5mil for 1 OZ; 28.5mil for 2 OZ; 30.5mil for 3 OZ , need take care of D-12C-4.2 distance between laser holes and through / blind/ buried holes 0.127 mm (5mil) Min (drilled size) C-5 HOLEC-5.1 PTHFinished hole size form 0.20 to 6.35mm.If it is bigger than 6.35mm, only routing can be used.If drill size is smaller than 0.30mm, need to clarify with customer to enlarge the finished hole size OR approved by PE managerGME Laser drill size 4-8 milDiameter tolerance: 0.076 mm by drillingNR=0.075Min spacing between PTH hole and inner circuit=8 mil.(6mil need PIN LAM)For Press Fit Hole the tolerance should be +/-0.05mm, and the drill bit size is required usually. If no requirement should issue ICS.C-5 HOLEC-5.2 NPTHFinished hole size from 0.30 to 6.45mm.If it is bigger than 6.45mm, only routing/punching can be used. Tolerance is +/-0.076mm by routing.If drill size is smaller than 0.3 mm, need to clarify with customer to enlarge the finished hole sizeDiameter tolerance=0.05mm by drillingNR=Cap.Max drilled size NPTH for dry film tenting 6.0mmCountersink hole size(when top angle is 165degree):6.35mm(MAX.)Min spacing between NPTH hole and inner circuit=7milC-6 SLOTC-6.1 PLATED SLOTDrill slot width from 0.5 to 6.45mm, if it is bigger than 6.45 mm, use routing. Drill slot length from 0.70mm to 10+drill slot width, if it is bigger than 10+drill slot width, use routing.Can not drill Slot if the width is smaller than 0.5mm.Tol.LxW0.10(L)0.10(W) mm.NR=Cap.C-6 SLOTC-6.2 NON-PLATED SLOTFinished slot width from 0.6 to 6.0 mm, if it is bigger than 6.0mm, use routing/punching. Finished drill slot length is 8mm(max), I if it is bigger than 8mm, use routing/punching.Tol. LxWMulti-drill0.05(L)0.025(W) mm if L2WNR=Cap.0.10(L)0.025(W) mm if L2.0) C-8 Drill review.C-8.1 RECORD OF DRILL CHECK AND DRILL SUMMARY (through hole)CODESIZE TOLERANCEPTH (/X)QUANTITYDRILL SIZEANNULAR RINGCLEARANCES/M OPENINGREMARKC-8.2 BLIND / BURIED HOLE (It is not allow break pad on laser holes) LAYERS DRILLEDSIZETOLERANCEPTH (/X)QUANTITYDRILL SIZEANNULAR RINGCLEARANCES/M OPENINGREMARKL_-L_D. ARTWORK INSPECTIONITEMGME CAPABILITYCUSTOMER REQUIREMENTACTION (OR ICS OR APQP )REMARKD-1 ArtworkComponent side solder maskSolder side solder mask.Component side comp. MarkSolder side comp. Mark artworkCarbon ink artworkSelective ENIG artworkExtra A/W need confirm its useWith Gerber file. Should be judged Whether is it the customer production film or original film. If found negative elements in the Gerber, Need confirm with customer whether it is production Artwork or CAD artwork.D-2Circuit filmD-2-1 LAYERS FILENAME And DIRECTION OF VIEWINGThe relationship between layer NO. and layers file name can be decided firmlyThe relationship can be decided according to_(More information about Gerber see page 6)The pattern attribute (positive / negative) must be clear. Can be judged according to Thermal or_ According to text file_Must clarify the drawing view side for all project if no call. ( For example customer GPV, they may design view from solder side but no specified)View from sideAccording to D-2-2 Inner layer NFPRecommend to delete inner layer NFP of through holes but ICS is needed. Except ATI customer.NFP: non functional padD-2-3 Normal inspectionAbnormally design. (Short or break need confirm to customer)Whether there are NPTH drill on copper, or the distance is small between NPTH and copper(line) on all layers. (need 2-nd drill process), Shave copper or allow exposed copper must be confirmed by customer.Whether no circuit pad for corresponding PTH hole on outer layers.Whether the circuit pad size is larger than the corresponding NPTH size., need confirm with customer.BGA Pad size and pitch.(0.50mm pitch is OK)The pad size whether reach E-test capability(prefer10mil), it is necessary to discuss with fixture colleague.Checking whether there is short between power and ground layers.If two or more layers are identical. Must confirmed with customer.D-2-4 SMTMin. spacing for S / M bridge A=7.5mil.S/M bridge B=2.5mil MinA=B=SMT pitch C 16mil MinC=If pitch =2 mil larger than drill bit.The Max. drill bit size of the plugged holes is 0.7mmS/M in hole but not plug OR cover pads is OKD-3-2 Pad solder mask statusSmaller than SMD, BGA, PAD, ask to enlarge S/M opening.S/M opening is bigger or equal to pad, build opening clearance=1.4 mil.NR=CL 2.0milNo S/M opening for test point, ask to addS/M opening or follow CAD but only test short not ensure open of E-test.D-3-3 Conductor exposedS/M cover conductor over 1.6mil after adjust circuit width in prod. A/WD-3-4 Opening at the outlineDeleted it if Width =10 Mil D-3-5 S/M opening for keypad areaBuild full solder mask opening on keypad area.D-3-6 Plug hole in BGA area.The via at BGA area must be plugged by Solder mask.D-4C/MD-5-1 Min line width 5milNR=CapD-4-2 C/M on SMTNot allowedD-4-3 C/M on padNeed approval by customer.D-4-4 C/M in holeNot allowed (except via holes plugged by S/M)D-4-5 C/M in S/M openingIf the opening is on epoxy resin area, the C/M in S/M opening is allowed.If the opening is on copper area, ICS is necessary.D-4-6 Shave C/M need confirm by customerAt PVT stage or Mass production stage, Shouldconfirm with customer that C/M will be illegible or missing after shave the C/M to keepenough clearance for registration, Especiallyfor oversea customers. D-4-7 Corner markC/M frame for BGA should be legible after enlarge them, at least ensure four corner mark. If corner mark or direction point could notbe printed, ask customer is necessary. D-5 CUSTOMER P/NEnd customer P/N=Drawing P/N=A/W P/N.All P/N and Revision of material from customer are consistent. (include PTL),End customer P/N must be legible, include the line width, space etc. ICS is needed if we shave P/N to avoid them enter in hole or on Pad. Any conflict with left mentioned should be confirmed with customer.D-6 Confirm to modify illegible letter or pattern, confirm to add dummy pads in uneven pattern area.Confirm to modifyD-7 Overlap letterIt is not allow in production film for letter overlap each other between circuit film and S/M film and C/M film and so on. Unless customer agree.D-8 MIN. CLEARANCE FROM HOLE WALL TO OUTLINEThe clearance shall be =board thickness for Punch (And layer count =0.60 mm)D-12 CLEARANCEThe min. clearance for hole should be 9mil bigger than PTH hole/slot bit size and min. clearance for NPTH /slot should be 8mil