SPS-production-flow.ppt

P CSBGPeripheralsSBU SPS流程講解 Oct 8 2006 LITE ONTECHNOLOGYCORP P CSBGPeripheralsSBU FacilityIntroduction LandArea 87 500m2 L 350M W 250M BuildingArea 134 800m2Factory Onebuilding 3Floors 1F AI SMD2F PCPower3F NCPowerCanteen Onebuilding 4Floors 2fortraining entertainment LocalStaffDormitory Fourbuildings 6Floorseach Capacityfor10000employees P CSBGPeripheralsSBU FactoryIntroduction Mainmanufactureproduction1 DesktopSPS2 Adapterpower3 Printerpower4 GameConsume5 Networkcommunicationpower6 TYCOpower P CSBGPeripheralsSBU FactoryIntroduction CustomerGroup1 DELL2 HP3 IBM Lenovo4 ACCER5 ASUA6 APPLE7 MICROSORFT P CSBGPeripheralsSBU FactoryIntroduction Establishment 1994ISO9002certifiedsince1995 updatedISO9001 2000in2002ISO14001certifiedinApril 2001bySGS OHSAS18001wascertifiedinNov 2003bySGS LaunchedLead FreeMPsinceOct 2004 6SigmalaunchedinJul 2003 7BB 14GBcertifiedin2003 7BB 26GBcertifiedin2004 P CSBGPeripheralsSBU SPS switchpowersupply 機種命名規則 P CSBGPeripheralsSBU HowtoNameLiteonPowerPartNumber P CSBGPeripheralsSBU 材料分階流程 P CSBGPeripheralsSBU BOMMaterialStructure 一 AI分階准則二 RI分階准則三 SMD分階准則四 HI分階准則五 PR PP HP HI AS PK分階准則 P CSBGPeripheralsSBU 材料命名規則 P CSBGPeripheralsSBU 材料命名規則 P CSBGPeripheralsSBU SMD命名規則及分類 1 所有SMD元件必須為貼片帶狀 2 舊料號以30 S開頭的電阻 如 30 S102J4SA0603 0805 1206 2010 1 10W 1 8W 1 4W 1 2W 3 舊料號以31 S開頭的電容 如 31 S1471KA024 舊料號以33 S開頭的二極體 如 33 SRLS41418145 舊料號以34 S開頭的三極管 如 34 SRN14016 舊料號以32 S開頭的IC晶體 如32 STSM103AID以SOT SOT23 SOIC STM結尾的IC晶體 P CSBGPeripheralsSBU HP段元件分階要求及分類 1 凡需要提前隨線加工的元件均可分在HP段 2 所有需要鎖附晶體的散熱片 52 3 鎖附晶體所用到的螺絲 螺帽 絕緣片 絕緣豆 50 28 4 鎖附熱敏電阻用的卡座及螺絲 44 5 所有要在鎖附晶體后需貼的膠紙 07 28 6 所有在大電容及變壓上要的膠紙 7 所有在晶體腳上要套的鐵芯 及點綠膠 37 8 所有需要整腳的光耦 及IC P CSBGPeripheralsSBU HI段元件分階要求及分類 1 不需要提前加工的元件均可分在HI段 2 所有不需要整腳的光耦和IC 32 3 所有O P線材及DCCORD 45 04 4 所有的變壓器 42 5 所有的電感 37 6 所有不需要剪腳的大電容 31 7 部分卡散熱片的塑膠支柱 44 8 PVC的跳線 04 9 不須要加工的小線材和散熱片 04 52 P CSBGPeripheralsSBU AP段元件分階要求及分類 1 DESKTOP需要提前加工的INLET及SW元件均可分在AP段 2 所有的INLET及所需要的元件 如 INLET X CAP Y CAP L NWIRE GNDBAND 3 所有的SW所需要的元件 如 SW SW100 1 SW100 2 P CSBGPeripheralsSBU AS段元件分階要求及分類 1 需要在組裝隨線加工及組裝的元件均可在AS段 2 所有組裝用到的CASE 46 CASE3 所有組裝過程中用到的束線 43 CALETIE4 所有組裝用的FAN及用到的螺絲貨橡膠拉訂 如FAN 61 FANGUANRD61 50 44 SNAP5 所有組裝INLET SW用的螺絲和螺帽 50 6 所有鎖FG PCB PFC CASE用的螺絲和螺帽 50 7 不用加工的PFC及PCB的支柱 37 44 Support8 所有要在CASE PCB上貼的膠紙 28 07 P CSBGPeripheralsSBU PK段元件分階要求及分類 1 需要在包裝時用到的物料均可在AS段 2 包裝用的小紙箱 大外圍 91 CTN3 包裝用的蜂槽 91 PAPLTLAY4 包裝用的大塑膠袋 90 PEBAG5 包裝用的說明書 53 MANUAL6 包裝用的防鏽紙07 PROTEK7 包裝用的大棧板 55 PALLET8 包裝用的主標簽 93 LBL SPS99 包裝用的警告標簽 93 LBL CAUT10 包裝用的BRACODE跳碼 93 LBL BAR P CSBGPeripheralsSBU PCPowerProcessMap P CSBGPeripheralsSBU Solderpaste Repair Rework START Pintest Glue ComponentPlacement Equipment PanasonicRH3 RH5 BD20S M BD30S M FlowChart Control FAI P chart Profile ComponentPlacement A Reflow AxialInsertion RadialInsertion FAI P chart FAI P chart FAI P chart DailyReport P chart FAI P chart FAI P chart Specification IPC A 610C IPC A 610C IPC A 610C ENGprofile IPC A 610C MOI IPC A 610C IPC A 610C SP22P M SP28P DH CM88S M CM86S M Heller1800EXL 1700W PanasonicAVK AVK2 Testfixture CM88S M CM86S M ProcessManufacturePlan P CSBGPeripheralsSBU Reflow Repair Rework A LQC HandInsertion Equipment FlowChart Control FAI P chart WaveSoldering B Touchup FAI P chart FAI P chart IPC A 610C P chart P chart P chart Specification ENGprofile MOI TestMOI SPEC Repair Rework LQC Repair Rework LQC In CircuitTest Repair Rework InitialTest Repair Rework ProfileX Rchart FAI P chart IPC A 610C IPC A 610C ENGProfile IPC A 610C IPC A 610C TestMOI SPEC Booster3200 PC Heller1800EXL 1700W SoungeSEL 350 C Chroma6304 6314 6120 PC Magnifier 5 Magnifier 5 Magnifier 5 Magnifier 5 ProcessManufacturePlan HP SBassembly P CSBGPeripheralsSBU B INLET PFC SWassembly Equipment FlowChart Control P chart C P chart P chart P chart Specification Repair Rework BurnIn IPC A 610C Chroma6304 6314 Extech7440 Ultrasonic Fixture B IChamber connector Chroma6304 6314 PowerFactor OLP OVP Hi Pot Repair Rework Repair Rework Repair Rework TestMOI SPEC TestMOI SPEC TestMOI SPEC TestMOI SPEC UltrasonicWelding ADP IPC A 610C ProcessManufacturePlan InsertandsolderDCcord IPC A 610C PCB CASEassembly IPC A 610C P CSBGPeripheralsSBU C Equipment FlowChart Control END P chart ANSIZ1 4 Specification OBA Reject Scanner PC Repair Rework DailyReport ConnectorInspection StickingLabel ScanBarcode Packing IPC A 610C IPC A 610C MOI MOI CustomerSPEC Magnifier 5 Chroma6000ATS PCExtech7440 ShopFloorSys ProcessManufacturePlan P chart Repair Rework PT LQC P chart Repair Rework TestMOI SPEC IPC A 610C Repair Rework ATE P chart Chroma6000ATS PC TestMOI SPEC P CSBGPeripheralsSBU DesktopProcessFlowChart Model PS 6311 2DFS LF HI W S AS T U ICT PK B I PK P CSBGPeripheralsSBU PowerMfg ProcessFlow P CSBGPeripheralsSBU 1 A I R I AutoRecovery PinTestPChart Every4Hrs P CSBGPeripheralsSBU 2 SMT a PickandPlaceb HotAirReflow CheckPoints a SolderPasteThickness Cpk 1 5 b Temp Profile 1 ChangeModel P CSBGPeripheralsSBU 3 H I a ManualInsertionb WaveSoldering CheckPointsa FirstArticleInspectionb SolderingM CParameterControl Foam WaveWidth FluxDensity RChart Temp Profile MonthlyorChangeModel P CSBGPeripheralsSBU 4 ICT TestCoverage 94 PChart Every4Hrs AutoReleaseFixtureGoldenSampleCheckEquipment 5 InitialTest PChart Every4Hrs AutoReleaseFixtureGoldenSampleCheckEquipment P CSBGPeripheralsSBU 7 Burn In a Fullload Cyclingb Elevatedtemp 6 Pre ATEPChart Every4Hrs AutoReleaseFixtureGoldenSampleCheckEquipment P CSBGPeripheralsSBU 8 Hi PotTest100 perspec 9 SCP OVPProtectionTest P CSBGPeripheralsSBU 10 Final ATE FullFunctionTest PChart Every4Hrs AutoReleaseFixture GoldenSampleCheckEquipment AutoPass FailJudgement P CSBGPeripheralsSBU 11 VisualInspection Labels a Followingcustomerspec IPC A 610b BarcodeScannerC Packing OOBAAQLANSIZ1 40 25 C 0 P CSBGPeripheralsSBU ProductDesignDevelopmentProcessNPI P CSBGPeripheralsSBU DFMEA PilotRun EOL CustomerInquiry ORT DesignReviewDFx DFMScore 80 MassProduction 6StepsDFxProjectMilestoneBOMReviewTeamMemberProcessInformation DemonstratedMTBF SafetyApproval EVT UnitTest ProjectKickOffMeeting Product Sign off YellowBook Release DVT Product SystemTest BetaTest PTT Bringup Standard MaterialPreparation TechnicalproposalsBlockDiagramPreliminaryschematicPowerlossanalysisThermalevaluationPackagedesignTheoryofOperation RFQPackage DesignGuideline ElectronicDesignGuidelineRev GPCBLayoutGuidelineRev EEMIDesignGuidelineRev CSafetyDesignGuidelineRev 06orcustomersComponentStressGuidelineRev CorCustomers MechanicalDesignGuidelineDFxScoreeCard LessonLearn NPIImplementation1 EarlyInvolvement DFMEA2 AssessManufacturingrequirement3 DesignReview RFQProcess DesignReviewDFx DFMScore 90 Dec26 2005 PMP DesignReviewDFx DFMScore 90 PhaseGo NoGocontrolpointPhasereviewchecklistDFxScoreNumbersIssueTrackingCriterionMaturityReport FinalReview DesignReviewDFx DFMScore 75 DFxProcessMappingwithPdP PSU PFMEA P CSBGPeripheralsSBU KickOffMeeting IssueRDR PTTbuild DesignEvaluation DesignModification OrganizeNPITeam PTTINTPE Openmeeting SPORelease Doc Release ScheduleReviewMeeting Production Closemeeting PTTINDG3 PTTReport GotoEVT PTTRelease GotoEVT NO PASS PASS P CSBGPeripheralsSBU No GotoDVT EVTStageFlow EVTRelease DesignModification Openmeeting SPORelease Doc Release ScheduleReviewmeeting Production ReliabilityEvaluation Closemeeting IssueEVTReport NO PASS P CSBGPeripheralsSBU No GotoPR DVTStageFlow DVTRelease DesignModification Openmeeting SPORelease Doc Release ScheduleReviewmeeting Production ReliabilityEvaluation Closemeeting IssueDVTReport NO PASS No P CSBGPeripheralsSBU No GotoMassProduction PilotRunStageFlow ReleaseMeetingTransfertoMPTeam DesignModification Openmeeting SPORelease Doc Release ScheduleReviewmeeting Production ReliabilityEvaluation Closemeeting IssuePilotRunReport NO PASS No Yes 課程一 新机种試產流程 P CSBGPeripheralsSBU 課程二 新机种試產詳細工作清單 新机种試產流程 P CSBGPeripheralsSBU 課程二 新机种試產詳細工作清單 新机种流程 P CSBGPeripheralsSBU PTT DesignReviewThermalProfileDFMDe ratingTestPerformanceEvaluationProductFeaturesConfirmProductionStructureReviewDFMEA BenchTestAlphaTestComponentStressCMTBFDFMThermalProfileEnvironmentTestEMCTestDFMEA BetaTestDMTBFDFMPFMEAMixingSourceCPKSafetyAuditHALT EMCTestEnvironmentTestStructureTest EVT DVT PilotRun MassProduct ORTTestEnvironmentEMCTestStructureTestHASS FieldFailure CollecttheAFRinformationforallthefieldfailureDriveTeamestablishedforfieldreliabilityToanalyzethetopthreefieldfailureandfindtherootcause suchasdesign processorrawmaterial Feedbacktheanalysisinformationtodesignandadditintodesignguideline ReliaSoftWeilbull 6softwareforLifeDataanalysis IncludingBurnindataanalysis ReliaSoftALTA6 AcceleratedLifeTestAnalysis softwaretoestimatetheLifeinnormalcondition