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IC 1CMOSMCURISCCISCDSPASICFPGAMCUMCU(Micro Controller Unit)(Single Chip Microcomputer)CPURAMROMI/OMCUMCUMASK()ROMOTP()ROMFLASH ROMMASK ROMMCUFALSH ROMMCUOTP ROMMCURISCReduced Instruction Set Computing CPURISC MacPower PCCISCComplex Instruction Set Computing, CPU,CPU,80X86CPU DSPDigital Signal ProcessingDigital Signal ProcessorDSPs2FPGAASICFPGAASICASIC:ASIC(Application Specific IC)3OTPotpone time programme,mcu(456FPGA7ICeda8RTL synthesistape outflow,tool.9Asicdesign flowVIA 2003.11.06 10asic11IC1. design input)vhdlveriloghdlSUMMIT VISUALHDLMENTOR RENIOR: composer(cadence);viewlogic (viewdraw)2. circuit simulation)vhdVerolog CADENCE Verolig-XLSYNOPSYS VCSMENTOR Modle-simVHDL : CADENCE NC-vhdlSYNOPSYS VSSMENTOR Modle-simAVANTI HSpice pspicespectre micro microwave: eesoft : hp3. synthesis tools)vhdgates delay,121314150.25,0.18161718CMOS19latch-upAntenna effect.20Latchup?21? 22NMOSPMOSCMOSPNPNPN23COMSNPNN24CMOSCROSS-OVERInfineon25interver,NCMOSprocess,26Please explain how we describe the resistance in semiconductor. Comparethe resistance of a metal,poly and diffusion in tranditional CMOS process.circuit design-beijing-03.11.0927mos28p-bulk nmos29schematic note 30ic31MOSIC: Cadence,Synopsys, AvantUNIX32unix cp -r, rm,uname2 ICICICICASICCOTCICEDAICEDAEDAICEDAICEDA 123, ,4IC5ICEDAICDesign KitIC6ICICDesign KitICICICIC.1BGA(ball grid array) LSI (PAC)200LSI QFP()1.5mm 360 BGA 31mm 0.5mm 304 QFP 40mm BGA QFP Motorola BGA ()1.5mm225 LSI 500 BGA BGA Motorola OMPAC GPAC(OMPAC GPAC)2BQFP(quad flat package with bumper)QFP () ASIC 0.635mm84 196 (QFP)3PGA(butt joint pin grid array)PGA (PGA)4C(ceramic)CDIP DIP5CerdipECL RAMDSP() Cerdip EPROM EPROM 2.54mm8 42DIPG(G )6CerquadQFPDSP LSI Cerquad EPROM QFP 1.5 2W QFP 35 1.27mm0.8mm0.65mm0.5mm 0.4mm 32 3687CLCC(ceramic leaded chip carrier) EPROM EPROM QFJQFJG(QFJ)8COB(chip on board) COB TAB 9DFP(dual flat package)SOP (SOP)10DIC(dual in-line ceramic package)DIP()(DIP).11DIL(dual in-line)DIP (DIP)12DIP(dual in-line package) DIP ICLSI 2.54mm6 6415.2mm7.52mm 10.16mm skinny DIP slim DIP(DIP) DIPDIP cerdip(cerdip)13DSO(dual small out-lint)SOP (SOP)14DICP(dual tape carrier package)TCP() TAB()LSI 0.5mm LSI EIAJ( )DICP DTP15DIP(dual tape carrier package)DTCP (DTCP)16FP(flat package)QFP SOP(QFP SOP) 17flip-chipLSI LSI LSI 18FQFP(fine pitch quad flat package)QFP0.65mm QFP(QFP) 19CPAC(globe top pad array carrier)Motorola BGA (BGA)20CQFP(quad fiat package with guard ring)QFP LSI (L ) Motorola 0.5mm208 21H-(with heat sink)HSOP SOP22pin grid array(surface mount type)PGAPGA 3.4mmPGA 1.5mm 2.0mm PGA1.27mmPGA (250528)LSI 23JLCC(J-leaded chip carrier)J CLCC QFJ (CLCC QFJ) 24LCC(Leadless chip carrier) IC QFN QFNC(QFN)25LGA(land grid array) 227 (1.27mm )447 (2.54mm )LGA LSI LGA QFP LSI 26LOC(lead on chip)LSI 1mm 27LQFP(low profile quad flat package)QFP1.4mm QFPQFP 28LQUADQFP 78 LSI W3208 (0.5mm )160 (0.65mm )LSI 1993 10 29MCM(multi-chip module) MCMLMCMC MCMD MCML MCMC () IC MCML MCMD ()SiAl 30MFP(mini flat package)SOP SSOP (SOP SSOP)31MQFP(metric quad flat package)JEDEC()QFP 0.65mm3.8mm2.0mm QFP(QFP)32MQUAD(metal quad)Olin QFP 2.5W2.8W 1993 33MSP(mini square package)QFI (QFI)MSPQFI 34OPMAC(over molded pad array carrier)Motorola BGA ( BGA)35P(plastic)PDIP DIP36PAC(pad array carrier)BGA (BGA)37PCLP(printed circuit board leadless package)QFN(LCC)(QFN) 0.55mm 0.4mm 38PFPF(plastic flat package)QFP (QFP)LSI 39PGA(pin grid array) PGA LSI 2.54mm64 447 64256 PGA 1.27mm PGA(PGA)( PGA)40piggy backDIPQFPQFN EPROM 41PLCC(plastic leaded chip carrier) 64k DRAM 256kDRAM LSIDLD()1.27mm18 84 J QFP PLCC LCC(QFN) J (LCCPCLPP LCC )1988 J QFJQFN(QFJ QFN)42PLCC(plastic teadless chip carrier)(plastic leaded chip currier)QFJ QFN(LCC)(QFJ QFN) LSI PLCC PLCC 43QFH(quad flat high package)QFP QFP (QFP)44QFI(quad flat I-leaded packgac)I I MSP(MSP) QFP IC Motorola PLL IC 1.27mm18 6845QFJ(quad flat J-leaded package)J J 1.27mm QFJ PLCC(PLCC) DRAMASSPOTP 18 84 QFJ CLCCJLCC(CLCC)EPROM EPROM 32 8446QFN(quad flat non-leaded package)LCCQFN QFP QFP QFP 14 100 LCC QFN1.27mm QFN 1.27mm 0.65mm 0.5mm LCCPCLCPLCC 47QFP(quad flat package)(L) QFPQFP LSI LS

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