Protel实习报告.doc

Protel上机实习报告设计任务1. 绘制给定电路原理图；2. 生成原理图的元件列表；3. 建立网络表文件；4. 制作给定电路的单面板（或双面板）PCB图；5. 生成电路板信息报表。目录一、 电路原理图2二、 电路板布线图3三、 元件列表4四、 原理图网络表4五、 PCB板信息表6六、实习总结9一、 实验原理图11二、电路板布线图在protel中给线路板自动布线前一定要生成网络表；然后进入到要布线的PCB文件中，利用design菜单项目中的netlist选项加入刚才生成的网络表文件；然后在自动布线Auto route中选all即开始自动布线。三、原理图元件表元件列表Part TypeDesignatorFootprintPart TypeDesignatorFootprint0.1uFC7RAD-0.10.1uFC7RAD-0.10.1uFC6RAD-0.10.1uFC6RAD-0.10.1uFC4RAD-0.10.1uFC4RAD-0.10.1uFC5RAD-0.1510R5AXIAL-0.30.1uFC8RAD-0.1510R6AXIAL-0.32KR24AXIAL-0.36264U3DIP-284.7KR18AXIAL-0.3AT89C52U1DIP-4010KR21AXIAL-0.3CON2J2SIP-210KR20AXIAL-0.3CON2J1SIP-210KR19AXIAL-0.3DB9U5DB-9/M10uF/25C1RB.2/.4IN4728D10DIODE0.411.059MXTAL1XTAL1LEDD3RAD0.130PC3RAD-0.1LEDD4RAD0.130PC2RAD-0.1LEDD1RAD0.174AL128U4DIP-16LEDD2RAD0.174AS573U2DIP-20LEDD7RAD0.1200R17AXIAL-0.3LEDD8RAD0.1500KR23AXIAL-0.3LEDD5RAD0.1510R25AXIAL-0.3LEDD6RAD0.1510R3AXIAL-0.3MAX202U6DIP16510R4AXIAL-0.3RESETSW1SW1510R1AXIAL-0.3510R7AXIAL-0.3510R2AXIAL-0.3510R8AXIAL-0.3四、原理图网络表C1RB.2/.410uF/25C2RAD-0.130PC3RAD-0.130PC4RAD-0.10.1uFC5RAD-0.10.1uFC6RAD-0.10.1uFC7RAD-0.10.1uFC8RAD-0.10.1uFD1RAD0.1LEDD2RAD0.1LEDD3RAD0.1LEDD4RAD0.1LEDD5RAD0.1LEDD6RAD0.1LEDD7RAD0.1LEDD8RAD0.1LEDD10DIODE0.4IN4728J1SIP-2CON2J2SIP-2CON2R1AXIAL-0.3510R2AXIAL-0.3510R3AXIAL-0.3510R4AXIAL-0.3510R5AXIAL-0.3510R6AXIAL-0.3510R7AXIAL-0.3510R8AXIAL-0.3510R17AXIAL-0.3200R18AXIAL-0.34.7KR19AXIAL-0.310KR20AXIAL-0.310KR21AXIAL-0.310KR23AXIAL-0.3500KR24AXIAL-0.32KR25AXIAL-0.3510SW1SW1RESETU1DIP-40AT89C52U2DIP-2074AS573U3DIP-286264U4DIP-1674AL128U5DB-9/MDB9U6DIP16MAX202XTAL1XTAL111.059M(2R17-2SW1-1)(4C1-1SW1-2)(AC5-1D1-AD2-AD3-AD4-AD5-AD6-AD7-AD8-AJ1-1R21-1R24-2U1-31U1-40U2-20U3-26U3-28U4-6U4-16U5-8U6-16)(A0U2-19U3-10)(A1U2-18U3-9)(A2U2-17U3-8)(A3U2-16U3-7)(A4U2-15U3-6)(A5U2-14U3-5)(A6U2-13U3-4)(A7U2-12U3-3)(A8U1-21U3-25)(A9U1-22U3-24)(A10U1-23U3-21)(A11U1-24U3-23)(A12U1-25U3-2)(A13U1-26U4-1)(A14U1-27U4-2)(A15U1-28U4-3)(CS8255U4-14)(CSADU4-13)(CSDAU4-12)(CSRAMU3-20U4-15)(D0U1-39U2-2U3-11)(D1U1-38U2-3U3-12)(D2U1-37U2-4U3-13)(D3U1-36U2-5U3-15)(D4U1-35U2-6U3-16)(D5U1-34U2-7U3-17)(D6U1-33U2-8U3-18)(D7U1-32U2-9U3-19)(GNDC2-1C3-1C4-2C6-2R18-1R25-1U1-20U2-1U2-10U3-14U4-4U4-5U4-8U5-1U5-4U5-5U6-15)(NetC1_2C1-2R18-2)(NetC2_2C2-2U1-19XTAL1-1)(NetC3_2C3-2U1-18XTAL1-2)(NetC5_2C5-2U6-2)(NetC7_1C7-1U6-1)(NetC7_2C7-2U6-3)(NetD1_KD1-KR1-1)(NetD2_KD2-KR2-1)(NetD3_KD3-KR3-1)(NetD4_KD4-KR4-1)(NetD5_KD5-KR5-1)(NetD6_KD6-KR6-1)(NetD7_KD7-KR7-1)(NetD8_KD8-KR8-1)(NetJ2_1D10-1J2-1)(NetJ2_2J2-2R19-1)(NetR17_1C4-1R17-1U1-9)(NetR19_2D10-2R19-2R20-1)(NetR24_1R24-1R25-2U5-3)(NetU1_16U1-16U3-27)(NetU1_17U1-17U3-22)(NetU1_30U1-30U2-11)(NetU1_40J1-2U1-40)(NetU5_2R20-2U5-2)(NetU6_4C8-1U6-4)(NetU6_5C8-2U6-5)(NetU6_6C6-1U6-6)(NetU6_13U5-2U6-13)(NetU6_14U5-3U6-14)(RXDU1-10U1-11U6-12)(T1R21-2R23-2U1-15U5-7)(TXDU6-11五、PCB板信息表Specifications For PCB1.PCBOn 3-Jul-2010 at 18:37:03Size Of board 3.97 x 4.47 sq inEquivalent 14 pin components 1.21 sq in/14 pin componentComponents on board 43 Layer Route Pads Tracks Fills Arcs Text- TopLayer 0 391 0 0 0 BottomLayer 0 347 0 0 0 TopOverlay 0 229 1 6 86 KeepOutLayer 0 8 0 0 0 MultiLayer 205 0 0 0 0- Total 205 975 1 6 86 Layer Pair Vias- Top Layer - Bottom Layer 23- Total 23 Non-Plated Hole Size Pads Vias- Total 0 0 Plated Hole Size Pads Vias- 28mil (0.7112mm) 34 23 30mil (0.762mm) 2 0 32mil (0.8128mm) 92 0 35mil (0.889mm) 64 0 38mil (0.9652mm) 9 0 40mil (1.016mm) 2 0 110mil (2.794mm) 2 0- Total 205 23 Top Layer Annular Ring Size Count- 18mil (0.4572mm) 44 22mil (0.5588mm) 23 24mil (0.6096mm) 9 27mil (0.6858mm) 64 30mil (0.762mm) 34 34mil (0.8636mm) 34 40mil (1.016mm) 2 48mil (1.2192mm) 16 60mil (1.524mm) 2- Total 228 Mid Layer Annular Ring Size Count- 18mil (0.4572mm) 44 22mil (0.5588mm) 23 24mil (0.6096mm) 9 27mil (0.6858mm) 64 30mil (0.762mm) 34 34mil (0.8636mm) 34 40mil (1.016mm) 2 48mil (1.2192mm) 16 60mil (1.524mm) 2- Total 228 Bottom Layer Annular Ring Size Count- 18mil (0.4572mm) 44 22mil (0.5588mm) 23 24mil (0.6096mm) 9 27mil (0.6858mm) 64 30mil (0.762mm) 34 34mil (0.8636mm) 34 40mil (1.016mm) 2 48mil (1.2192mm) 16 60mil (1.524mm) 2- Total 228 Pad Solder Mask Count- 4mil (0.1016mm) 205- Total 205 Pad Paste Mask Count- 0mil (0mm) 205- Total 205 Pad Pwr/Gnd Expansion Count- 20mil (0.508mm) 205- Total 205 Pad Relief Conductor Width Count- 10mil (0.254mm) 205- Total 205 Pad Relief Air Gap Count- 10mil (0.254mm) 205- Total 205 Pad Relief Entries Count- 4 205- Total 205 Via Solder Mask Count- 4mil (0.1016mm) 23- Total 23 Via Pwr/Gnd Expansion Count- 20mil (0.508mm) 23- Total 23 Track Width Count- 7.874mil (0.2mm) 15 8mil (0.2032mm) 2 10mil (0.254mm) 773 12mil (0.3048mm) 185- Total 975 Arc Line Width Count- 7.874mil (0.2mm) 3 10mil (0.254mm) 3- Total 6 Arc Radius Count- 25mil (0.635mm) 5200mil (5.08mm) 1- Total 6 Arc Degrees Count- 180 5 360 1- Total 6 Text Height Count- 60mil (1.524mm) 86- Total 86 Text Width Count- 10mil (0.254mm) 86- Total 86 Net Track Width Count- 10mil (0.254mm) 64- Total 64 Net Via Size Count- 50mil (1.27mm) 64六、实习总结一周的实习结束了首先说一下这写报告，真是花了不少精力，Word排版真是麻烦，不过也学了不少知识。下面就来总结一下用protel软件做PCB的大体步骤吧。1准备电路原理图和网络表：根据设计要求设计电路原理图，并绘制原理图，然后由该原理图文件生成相应的网络表。2规划印制电路板：在设计电路板之前，要对电路板有个初步的规划，主要是各元件的封装形式，这是一项相当重要的工作，。3设置参数：设置参数包括设置元件的布置参数、板层参数和布线参数等。大多数情况下，可以直接使用系统的默认值，参数设置是一次性完成的，在后续的设计工作中很少需要修改。4加载网络表和元件封装：网络表是自动布线的基础，是连接原理图和印制电路板的纽带。只有加载了网络表和元件封装后，电路板的自动布线才能完成。5元件布局：规划电路板并导入网络表后，通过执行命令，系统将自动装入元件并将元件布置在电路板边框内。元件布局可以由系统自动完成，然后进行手工调整布