BSOB模式与BBOS模式ppt课件

1,CHAPTER6,2,BondStickOnBall(BSOB)/BondBallOnStitch(BBOS)/TailBreak,3,1.0)BONDSTICKONBALL(BSOB),1.1)DescriptionThisbondingprocessisspeciallydevelopedbyASMtohandlemulti-die(MCM)bondingapplication.Intheconventionalapproach,ifoneistryingtoconnectthegoldwirefromonedietotheanother,acapillarymarkofsecondbondwillbeevidentontopofthediewhichmaydamagethedie.TheBSOBprocesswillsolvethisproblembybondingaballontothediessurfacefirst,followedbybondinganotherwirewherethesecondbondswedgewillbelandingontopofthisbondedball(figure1).,4,Die1,Die2,BondBall,2ndBond(wedge),Figure1:BondStickOnBall(BSOB),5,2.0)BONDBALLONSTITCH(BBOS)/SECURITYBOND,2.1)DescriptionThisprocessisalsoknownassecuritybond.Itbondsaballontopofthewedgeofthenormalconnectionwire.Thisprocessismainlyusedtosecurethesecondbondstickingcapability.(Figure2),Die1,Lead,BondBall,2ndBond(wedge),Figure2:BondBallOnStitch(BBOS),6,3.1)FreeAirBall(FAB2)isalignedtothecenterofthebondpadondevice2.,FAB2,3.0STANDOFFBALLCONTROLBONDINGSEQUENCE,7,3.2)Capillarydescendsandbondsballtobondpad.,Device1,Device2,W/clampopen,Capillary,Applicationof1stbondstandoffballparametertoformBallThicknessandBallSize,DuringStandOffBonding,SOBparametersareapplied.,8,3.3)Capillaryrisestoloopbasetoclearball.,Device1,Device2,W/clampopen,CapillaryrisestosetLoopBase,LoopBase,ContactPt.,Loopbaseisthedistancebetweenthecapillarytipandcontactpoint.,Recommendedsetting=2,9,3.4)Capillarymovetoprogrammeballoffset.Balloffsetcanbeprogrammedtowardsorawayfromthefirstbond.+vetowards2ndbond-veaway2ndbond,Device1,Device2,ActualBallOffset=Settingx10umIfBallOffsetSetting=22ThenActualLoopBase=220um,RecommendedSetting=-ve35,10,3.5)Capillarydescendsandformsstitchbondontopoftheball.,Device1,Device2,*BallThickness,SOBParameter(StandOffBallParameter),CapillarydescendstosetBallThickness(Amt.Zmovementabovetheballheight),ContactPt.,*BallThicknessisthedistancebetweenthecapillarytipandcontactpointRecommendedsetting=2,11,3.6)Capillarymoveshorizontallyforascrubdistancetoweakenthewireatballneck.,Device1,Device2,Scrubonedirectionawayfromball,ActualScrubDistance=Settingx0.8umIfScrubDistanceSetting=10ThenActualScrubDistance=8um,CapillarymovetosetScrubDistanceOnedirectionONLY-Awayfromtheball,Recommendedsetting=8,12,3.7)Capillaryrisestotailheight,Device1,Device2,W/clampclose,CapillarymovestosetTailLength(AmountZmovementabovethebumpbeforethewireclampcloses),Recommendedsetting=35,13,3.8)Capillaryrisesandtearsthewire,asBHascendtoFireLevel.,Device1,Device2,W/cclose,14,15,3.10)Afterplacingallstandoffballs.Themachinecontinuetobondwires.,2ndBond(wedge),Device1,Device2,Device1,16,BumpballformationforBSOB/BBOS,MOTION,BO,LB,BT,SC,NormalLBBOBTScrub,FlatLBBOBTScrub=0,CONELBBOBT=LBScrub=0,LB,BO,BT,LB,BO,Thebumpballformationprocessisalmostlikebondinganormalwire,including1stbond,loopingand2ndbondparameters.,17,4.0)PARAMETERDEFINITIONINSTANDOFFBALLCONTROLMENU,4.1)LoopBaseThisparameterdeterminesthelooplevelofthebondheadwhichshouldbesufficienttoavoidtheball.Range:LoopBase05Setting:24.2)BallOffsetThissettingcontrolsthedistanceofthetablemoveinordertooffsetthecapillaryfromthestandoffball.Negativevaluecanbemovedtowardstothefirstbond.Positivevaluecanbemovedawayfromthefirstbond.Range:BallOffset-4020Setting:-ve35,18,4.4)ScrubDistanceThissettingcontrolsthecapillarymoveshorizontallywithaScrubamplitudetoweakenthewireatneck.Itisalwaysawayfromthefirstbond.Range:ScrubDist412Setting:84.5)TailLengthThissettingcontrolsthelengthofthetailwherethebondheadrisestothepresetheightbeforethewireclampisclosed.Range:TailLength3040Setting:35,4.3)BallThicknessThisparameterrefertotheballthicknesswhichcontrolsthelevelofthebondheadasitdescendstothetopoftheballRange:BallThickness05Setting:2,19,4.6)TimeBase1/2Thissettingcontrolsthebondtimeappliedtothestandoffballcontrolonly.Time1forthe1stbondandTime2forthe2ndbond.4.7)PowerBase1/2Thissettingcontrolstheultrasonicpowerappliedtothestandoffballcontrolonly.Power1forthe1stbondandTime2forthe2ndbond.4.8)ForceBase1/2Thissettingcontrolsthebondingforceappliedtothestandoffballcontrolonly.Force1forthe1stbondandForce2forthe2ndbond.,20,4.9)StandbyPower1/2Thissettingcontrolsthepoweractivatedwhenthebondingheadreachthesearchlevel,tothemomentthebondheadcontactsthebondsurface.Withthevibration,beforecontacttakeplace.Bondheadwillcleanupthepadsurfaceandremovewatervaporonthepad.Thisparameterusedforthestandoffballcontrolonly.4.10)ContactTime1/2RefertotheContacttime1/2definitioninBondParametermenu.ButthisparameterwillbeaffectedontheStandoffballcontrolonly.,21,4.11)ContactPower1/2RefertotheContactPower1/2definitioninBondParametermenu.ButthisparameterwillbeaffectedontheStandoffballcontrolonly.4.12)ContactForce1/2RefertotheContactForce1/2definitioninBondParametermenu.ButthisparameterwillbeaffectedontheStandoffballcontrolonly.,22,Figure4:StandoffBallControlParameterDisplay(page2),5.0BSOBWIREPARAMETERS,23,5.1)WireOffsetIn-MenuThisistheoffsetparameterthatisrequiredtoensuremaximumcontactareabetweenthestitchbondandball.Itisalwaysawayfromthefirstbond.Range:WireOffset1030Recommendedsetting=25,5.2)SecondBondSearchSpeedThisParametercontrolstheimpactforstitchonball.Range:SearchSpeed232256Recommendedsetting=32,2ndBondWedge,StandOffBall,Capillarypositionduringstitchbond,24,5.3)TimeBase1/2Thissettingcontrolsthebondtimeappliedtothedevice.Time1forthe1stbondandTime2forthe2ndbond.5.4)PowerBase1/2Thissettingcontrolstheultrasonicpowerappliedtothedevice.Power1forthe1stbondandTime2forthe2ndbond.5.5)ForceBase1/2Thissettingcontrolsthebondingforceappliedtothedevice.Fo