BGA返修和工作原理介绍PPT课件

,BGA/SMDReworkCenter,ERSAIR500AandPL500A,BGARepair:abetterunderstandingcanreducefears,reducecosts,andguaranteeprocesscontrol,DensityandperformancerequirementsDrivingICpackingtowardthesizeofthebaredie,TrendsinFlipChipuse,TheGlobalTrendtoAreaArrayPackages,BGA,CSP,FlipChip:StructuralDesigns,BGAProduction-CollapsibleandNon-collapsibleAreaArrayPackages,Ingeneral,eutecticsolderballs(Sn63Pb37)arealwaysusedforareaarraypackagesexceptinthecasewheretheweightofthecomponentisgreaterthanthesurfacetensionofthemoltenballsduringreflow.ACBGA(ceramicBGA)isatypicalexampleofacomponentthatcouldnotbe“carried“bythesurfacetensionofthesolderballsduringthereflowprocess.Inthiscase,ahighmeltball,forexamplePb90Sn10,isusedbecauseitwillremainsolidduringthenormalreflowprocess.,BallComparisonPhotos,ComparisonofInstalledPBGAtoaCBGA,Theabovefiguresdetailthedifferentwettingzones,andwettinganglesbetweenaPBGAandCBGAandtheirrespectivejoints.,TheSolderingProcess-TheIntermetallicBondanditsRelationtoReflowTemperature,TheheartofthesolderjointSource:R.J.Kleinwassink,Solderingintheelectronics,Thelastingmechanicalconnectioncanonlybeachievedwhentin-lead(solder)isintroducedtoformalastingintermetallicbondbetweentheleadandlandandbothareheatedtoapprox.30Cabovethemeltingpointofsolder.,Scanningelectronmicrograph(SEM)offracturedintermetalliclayersofasolderjoint.Cu3Sn(e-phase)andCu6Sn5(n-phase)makeuptheintermetalliclayers.,TypicalReflowProfiles,Infrared-soldering.Temperature/time-profile(lead-temperature).Full-line:typicalprocess/dotted-line:processlimits,Temperature-timecurvesobtainedinahot-aircirculationoven.Source:R.J.Klein-Wassink,ReflowsolderprofileCECC00802:CECCStandardMethodfortheSpecificationofSurfaceMountingComponents(SMDs)ofAssessedQuality.,A.BGAsolderball(Sn63PB37)placedonpadbeforereflowprocessbegins.Stand-offheightis,forexample,1.0mm(ballshapeundercomponentisperfectlyspherical,surfaceissmoothanddull).,B.Reflowprocessbeginsuntilmeltingpointofsolderballisreached(183C),gravityactsoncomponentandcausesaninitialorsingledrop:Stand-offheightis0.8mm(ballshapeisverticallyelongated,surfaceisroughandmatt).,C.Peaktemperatureisreachedinthereflowprocessallowingforcompleteandproperwettingofentirepad.Asecondordoubledropoccurs:stand-offheightis0.5mm(ballshapeishorizontallypressedorsomewhatelliptical,surfaceissmoothandshiny).,BGAProduction-TypicalPhysicalEffectsduringaReflowProcess,ThetypicalphysicaleffectsduringthereflowprocessofaPBGAaregraphicallyshowninthefiguresbelowwithregardstothestand-offheightandwettingangle.,DoubleDropEffectbyBGA/CSP/FlipChip(Sn63Pb37Balls),1stDrop2ndDrop,Graphicdepictsanon-soldermaskdefined(NSMD)pad,Note:LifecycletestresultsshowthatNSMDpadonbothboardandpackagegivesuperiorperformancetowhensoldermaskdefined(SMD)padsareused.Source:ReliabilityofBGAPackagesinanAutomotiveEnvironment,RogerRrgren,Per-ErikTegehallandPerCarlsson,IVF-TheSwedishInstituteofProductionEngineeringResearch,www.ivf.se,BGADoubleDropEffectDocumentedbyPhilipsCFT,Source:BGAJointFormation,JanKolsters,PhilipsCFT,Eindhoven,Netherlands,May2000,VideoclipofBGAjointformationrevealingthedoubledropeffect.ThevideowasgeneratedusingtheERSASCOPEInspectionSystem.,Clickheretobeginvideo,Across-sectionofaPBGA225afteraproperreflowprocessrevealsthecompletewettingtothepadandtheproperwettingangleofthefluxresidue.,Cross-sectionofproperDoubleDropPBGA,Cross-sectionofPBGA225afterSoldering,BGASelf-AlignmentEffect,Theself-alignmenteffectasthesolderballsgointoreflow,BGASelf-AlignmentEffectDocumentedbyPhilipsCFT,Source:BGAJointFormation,JanKolsters,PhilipsCFT,Eindhoven,Netherlands,May2000,VideoclipofBGAjointformationrevealingtheself-alignmenteffect.ThevideowasgeneratedusingtheERSASCOPEInspectionSystem.,Clickheretobeginvideo,BGARepair:HotAirSystems,BGARepair:HotAirvs.IR,HeatdistributionacrosssurfaceofBGA-convectionanddarkIR,TypicalBGAProblems:X-rayInspection,Deformedballs,i.e.non-spherical,Missingball,solderbridging,Non-uniformsolderquantity,Voids,Misregistration,CBGAsolderedtoPCB,X-rayimageofCBGAaftersoldering,ERSASCOPEimageofCBGA.Crackingzoneisvisible,X-rayimageofPBGA225:AandBshowmistakesbutareunclearofsource,A.ERSASCOPErevealsfluxresiduebridgewithconductiveparticles,B.ERSASCOPEshowsincompletesoldermeltofpaste.,B,A,TypicalBGAProblems:VisualInspectionandX-raycombined,DarkIRvs.lightIRforPCB-reflowapplications,Wavelengthrangesofsomeradiationsourcesandtheirpositioninthespectrumofelectromagneticwaves.,ThetopandbottomERSAdarkIRradiatorsaremediumwavelength(2-8m),whichhasbeenproventohavetheoptimalabsorption/reflectionradiobetweenlightanddarkcolors.Thecomponentbody,substrate,andleadsaresafelyandevenlyheated,therebyreducinganyriskofdamageduringthereflowprocess.,ERSADarkIRBGARepair:UniformHeatDistribution,HeatdistributionacrosssurfaceofBGA169,BGARepair:ProductionlikeresultswithIR500A,Source:FraunhoferInstitutISIT,Itzehoe,Germany,ReworkEquipmentPurchaseDecisionFlowChart,2.Repeatability-User-Friendly?,3.Flexibility-Chips,Plastic,BGA,PTH,.?,-InitialInvestment?-CycleTime?-Nozzles,etc.?-SpareParts,e.g.heaters?,4.ReturnonInvest-OperationalCosts?,PL500A:OpticalBGA/SMDPlacementSystem,MotorizedZ-axis,Zoom,andFocusSplitOpticsAutoZoomPre-setsAutoVacPick-n-PlaceTwoCameraInputs/AutoSwitchStandaloneorfullyintegrated,BGA,CSP,FlipChipPrecisionPlacementandReflow,ERSAIR500AInternationalUsersList,ABBADIAGFAAIRSYSNavigationArabBritischDynamicsCo.ASGLuftfahrttechnikBertelsmannBlaupunktBORAQBoschBritishAerospaceCellstarCOMPAQComtechData-FaxDIALOGSemiconductorDigitrondaAmazoniaEFACECEFOREOyEIA-ElectronicaAvionicosELABOGmbHEricssonComponentsEricssonRadioSystemsFASTLinkFischerElektronmechanikFraunhoferInstitutGallyasS.A.GLOBALNETGrundig,HCLHeidelbergerDruckmaschinenI.S.T.-InstitutoIBMInstituteofComplexSystemsJastel,Lda.JutronOyKhimj