SMT中英文专业术语教程ppt课件

SMT中英文专业术语教程,更新日期：2011.09,1.印刷工艺专业英语2.贴片工艺专业英语3.回流工艺专业英语,针对新入职或有一定基础的职员,2小时,罗卫龙,使大家对SMT专业英语有所了解，能够看懂一些专业素材,培训目的,培训对象,培训讲师,学习重点,培训课时,PrintingProcessEnglish/印刷工艺英语,测试OK后转DIP插件,印刷（Printing）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,SMT：SurfaceMountTechnology/表面贴装技术,Definition：ProcessoftransferringsolderpasteontothepadsofaPCB,byforcingitthroughmatingaperturesonastencil,usingasqueegee,Boardloader/上板机：PCBstobetransportedtothescreenprinterusingconveyors,Printer/印刷机：depositssolderpasteontopadsonthecircuitboard,PCB（Printedcircuitboard）/印制线路板,Solderpaste/锡膏：Mixtureofsolderpowdersandfluxdepositedontopadsofcircuitboardonacontrolledvolume.Afterreflowprovideselectrical,mechanicalandthermalconnectionbetweencomponentandboard,Squeegee/刮刀:Criticaltoolusedto“push”pastethroughthedesignatedopenings,Stencil/钢网：Vehiclebywhichthevolumeandplacementlocationofsolderpastedepositioniscontrolled,Foil/钢片,Frame/外框,FlexMask/绷网,Aperture/开孔,MainElementsoftheScreenPrinter/印刷机要素,InputConveyor/输入导轨,Solventtank/容剂曹,Monitor/监控器,OutputConveyor/输出导轨,Lighttower/指示灯,Emergencystopbuttons/紧急制动开关,Visionsystem/视觉系统,Clamps/夹子,Boardsupport/支撑块OrsupportPins/支撑顶针,stencil/钢网,Squeegee/刮刀,PrintParameters/印刷参数,AngleofAttack(45or60withstencil)/角度：TheanglemadebythefrontofsqueegeebladeinrelationtothestencilSnap-Off(ContactorNon-Contact)/印刷间隙：ThedistancefromthetopsurfaceofthePCBtothebottomsurfaceofthestencilSqueegeePressure/刮刀压力：Controlstheshearstress，ThetotalforcewithwhichthesqueegeeispushingontotheboardSqueegeeSpeed/刮刀速度：Controlstheshearrate，ThevelocityatwhichthesqueegeetraversesacrossthestencilSeparationSpeed/分离速度：ThevelocityatwhichthePCBreleasefromthestencil,SeparationDistance/分离距离:ThedistancewhenthePCBreleasefromthestencilwhichkeeptheseparationspeedStencilAlignment/钢网对位:VisionBased:FullyautomaticwithfiducialsorSemi-automaticManualCleaningFrequency/清洗频率Cleaningmode/清洗模式:Dry/wet/vacuum,PrintDefects/印刷缺陷,Misalignment/偏位,BridgeorShort/短路,Icicle/拉尖,Scooping,Incompleteprint/少锡,Excessiveprint/多锡,Pasteresidue/锡膏脏污,Slump/坍塌,Componentplacementprocessenglish/元件贴装工艺英语,测试OK后转DIP插件,印刷（Printing）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,GenericSMDPlacementMachine/常用表面贴装设备,ComponentAlignment/器件对位,Userinterface/用户界面,Placementrobot,Componentfeeding/供料器,料车,feeder/飞达,Toolbitornozzle吸嘴,PCBtransport,Boardalignment,Boardalignment,Theotherprofessionalenglishusedinplacementprocess贴装工艺其他专业英语,Loadinglist/站位表Offset/偏差Pick/吸取Place/贴装PlacementAccuracy/贴装精度LinearMotor/线性马达BallScrew/丝杆Image/影像,Reflowprocessenglish/回流工艺英语,测试OK后转DIP插件,印刷（Printing）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,Soldering/焊接,1.Processofjoiningmetallicsurfaces(金属表面连接)throughthemassheating(加热)ofsolderorsolderpaste2.Createsamechanical(机械的)andelectrical(电的)connectionbetweenthecomponentsandPCB3.Solderalloymetal(焊料合金)ismelted(熔化)toformtheconnection4.Liquidsolderattachestothebasemetalsbyformingintermetalliccompounds(IMC:内部合金),throughtheprocessofwetting(润湿),SurfaceTension/表面张力:Surfacetensionisamolecularforce(分子作用力)existinginthesurfacefilmofallliquidsWetting/润湿:Theabilityofthemoltensolderalloy(熔融焊锡合金)toadheretothesurfacesbeingsolderedCapillaryAction/毛细作用：Interactionbetweenaliquid(solderorflux)andasmallopeningorsurfaceinasolid(Pad,componentLead)WettingAngle/润湿角IMC（Intermetalliccompounds）/内部合金层：WhenthemoltensolderalloymakescontactwiththePCBfinishorcomponentleadfinish,asmallamountofSninthesoldercombineswiththefinishmetalorthebasecoppertoformametallurgicalcompound,TypicalConvectionReflowOven/典型的热风回流炉,Lower/下温区,Upper/上温区,Typicalreflowprofile/典型回流曲线,Thereflowofsolderisachievedinafurnacewithpredeterminedthermalprofiles.Thedifferentstagesare:炉子里的回流焊接用预先设定的温度曲线来达到.温度曲线的阶段分为:1.PreheatZone/预热区2.Soak(dryout)Zone/衡温区3.ReflowZone/回流区4.Cooling/冷却区,Profileequipment/测温仪,Thermalcouplewire/感温线,(a),TypicalSolderingDefects/典型的焊接缺陷,SolderBalls/锡珠,SolderBridging/短路,Non-wetting/不润湿,(a),De-wetting/过润湿,Sold