FloTHERM应用案例ppt课件

NAME,FloTHERMApplicationExamples,TITLEMechanicalAnalysisDivision,10June,2020,FluidFlowSimulationHelpsOvercomeToughTelecomThermalDesignChallenge,ElmaElectronicusedFloTHERMtooptimizethedesignofanewAdvancedTelecommunicationsComputingArchitecture(ATCA)platformthatisdesignedtodissipateupto300wattsineachofits14slots.ElmathermalengineersusedFloTHERMscapabilitytoautomaticallyrunaseriesofflowsimulationswhilevaryingvariousdimensionsandotherparameterstoachievedesigngoalssuchasmaximizingairflowovertheboards.,“AtElmawearestrongbelieversinthermalsimulationanduseitfrequentlytodesignthespacingforairintakeandexhaust,typesoffansandblowers,theplenumspaceaboveorbelowthefans,theplacementofairfiltersandtheuseofbafflestooptimizechassisthermalmanagement.WeevaluatedbothoftheleadingthermalsimulationsoftwarepackagesandusetheMentorGraphicsMechanicalAnalysisDivisionsFloTHERMbecauseitismoreuserfriendly,providessuperiorreportingtools,andourcustomershavegreaterconfidenceinitsaccuracy.”RamRajan,ThermalEngineer,ElmaElectronic,RedbackNetworksCreateFirstMillion-SubscriberPlatform,Redbacksperformedaconsiderablenumberofsimulationstoevaluatedifferentfailuremodes.Thesimulationresultsrevealedthatafanfailurecausedairflowrecirculation,whichreducedsystemairflowandoverheatedtheaffectedregion.Theyaddedalouverassemblytoeachfan,whichautomaticallyclosethefanopeningincaseoffanfailure.Thiseffectivelyeliminatedrecirculation.Afoamcoremodelofthenewplenumwascommissionedsothatphysicaltestscouldbeperformedquickly.Thelabmeasurementscloselymatchedthesimulationresultssonothermaldesignchangeswererequiredduringtheprototypephase.Thenewplatformisjustgoingintoproductionbutithasalreadybeenselectedbyoneofthetop20telephonecarriersintheworld,ChungHwaTelecom(CHT)ofTaiwan.,“Thepowerdissipationofthelinecardsinthenewplatformhadtobeincreasedby2Xrelativetothepreviousgenerationtoobtaintheplannedimprovementinperformanceandfunctionality,”saidWendyLu,MechanicalEngineerforRedbackNetworks.“Byfocusingonreducingthechassisstaticpressureviageometrychangesandusingahigherperformingfan,wewereabletodoubletheairflowinthechassis.”WendyLu,MechanicalEngineer,RedbackNetworks,SimclarDesignNewTelecomPlatformthatDelivers40GbpsBandwidth,WesucceededindevelopingaplatformthatgoeswellbeyondtheATCA3.0specificationbydelivering40Gbpsbackplanebandwidthand50CFMairflowperslotwithnear-perfectairflowdistribution.Thermalsimulationwasacriticalprocessinourproductdevelopment.ThermalsimulationislikehavingX-rayvision.Itletsyouseeinsidetheboxtolookatairflow,pressuresandtemperaturesatanypoint.Asinglethermalsimulationgivesyouadetailedunderstandingofwhatisgoingoninsidetheboxandhelpsyouquicklyidentifytherootcausesoftheproblem.”DaveWatson,ThermalDesignTeamLeader,SimclarGroup,ThermalSimulationReducesCostofStackedModulePottingCompoundby50%,C-MAC,anelectronicsdesignandmanufacturingcompanybasedinSouthDenes,GreatYarmouth,UnitedKingdom,recentlydevelopedastackedmoduleforacriticaldefenceapplication.Priortobuildingprototypes,C-MACengineersperformedthermalsimulationontheinitialconceptdesignanddiscoveredthatjunctiontemperaturesonthemodulerangedupto125C,wellabovethe100Cmaximum.Theyrealizedtheyneededapottingcompoundtoreducethermalresistanceandwantedtoselecttheleastexpensiveformulationthatwouldmeetthethermalrequirementsoftheapplication.,Withoutsimulationwewouldhavebeenfacedwithtwounattractivealternatives.Wecouldhaveundertakenamuchlengthierandmoreexpensivephysicaltestingprocesstoidentifythepottingcompoundthatprovidedthebestmixofperformanceandprice.”JonathanCrossley,SeniorEngineer,C-Mac,FloTHERMandFloEFDOptimizesThermalSolutionforCaltech,DesignChallengeDesignathermalsolutionthatmaintainedcomponenttemperaturesbelow85Cwithminimaltemperaturespreadacrossthehottestcomponents.SolutionandBenefitOurengineerswereabletorealizeanaveragereductioninjunctiontemperaturesof35Crelativetothebaselinecase,andwereabletoreducethetemperaturespreadofthefourFPGAsfrom17Cto9C.,“MentorGraphics-MechanicalAnalysisDivisionsconsultingservicewascommittedtodeliveringacoolingsolutionthatmetmythermalandmechanicalconstraintsonatimescalethemettheneedsoftheproject.DavidHawkins,CaltechOVROObservatory,Hewlett-PackardKeepsProcessorsCoolwithFloTHERM,DesignChallengeDissipatingheatfromhighpowercomponentssuchastheCPU.CPUsplacedback-to-backsofrontprocessorpreheatstheairbeforeitreachesthebackprocessor.SolutionandBenefitFloTHERM“slopingblock”smartfeaturewasusedtorepresenttheinclinedbaffleandtheparametricoptimizationtoolwasusedtodesignandoptimizetheheatsink.FloTHERMsubstantiallyreduceddesigntimeandcostandhelpedtomeettheweighttargetsoftheheatsinks.,“WeuseFloTHERMasourCFDanalysistoolbecauseFloTHERMiswell-structuredandeasytousecomparedtootherCFDtools,andprovidesthebesttechnicalsupport.Thesupportteamisveryknowledgeableandresponsesarealwayswellcoordinated.”ShaileshJoshi,ThermalAnalyst,Hewlett-PackardCompany,ThermalSimulationSpeedsDesignofVersatileVertical/HorizontalHeatsink,CraneAerospace&ElectronicsusedFloTHERMthermalsimulationsoftwaretodevelopanunusualheatsinkthatworksintheverticalorhorizontalorientation.,“Thermalsimulationallowedustooptimizetheheatsinkthermalperformanceandweightinaveryshorttimeperiod.Thermalsimulationalsoenabledustooptimizethedesigntoimproveitsperformancetoalevelthatwouldhavebeenimpossibletoachievewiththebuildandtestmethodwithinourscheduleconstraints.”MarkResler,MechanicalEngineer,CraneAerospace,ThermalSimulationValidatesMotorDesignandReducesHeatsinkWeight,AnJenSolutionsrecentlyusedFloTHERMtoassistMagneMotion,Iheirdesignofaverticalliftelevatormadeoflinearsynchronousmotors(LSM).AnJenSolutionsperformedaweightversusthermalperformanceanalysisoftheLSMrailheatsink.,“FloTHERMoffersawiderangeoffeaturessuchasanautomaticoptimizerandcompactmodelsthatmakeitpossibletoimprovecoolingperformanceandreduceengineeringtime,”Rigbysaid.“TheseandothercapabilitiesofthesoftwaremadeitpossibletooptimizethedesignoftheheatsinkwhichwasimportantbecausetheoverallweightoftheLSMwasacriticalconcerntoMagneMotionscustomer.”MichaelRigby,AnJenSolutions,AMCCUsesFloTHERMandFloTHERMPacktoReduceICPackageDevelopmentCost,AppliedMicroCircuitsCorporation(NASDAQ:AMCC)isusingFloTHERMthermalsimulationsoftwaretosignificantlyreducethecostofpackagingandtheprojectresourcecostforanewfamilyofICs.AMCCachievedtheseoutstandingresultsbycomparingflip-chipandwirebondthermalperformanceearlyinthedesignprocess.,“TheabilitytogeneratethermalmodelsofICsinlessthananhourremovedthebarriersofsimulationcomplexityandtime/resourceconstraintsattheearlystageofourdesignprocess.WeuseFloTHERMforthermalsimulationbecauseitmakesiteasyandconvenienttomodeldifferentpackagestylesandtypes.”MarkPatterson,PackagingEngineer,AMCC,SimulationHelpsSolveDifficultThermalChallengeinTowerMountedAmplifier,ThermacoreusedFloTHERMthermalsimulationsoftwaretosolveachallengingthermalmanagementprobleminatowermountedamplifier(TMA)foracellularbasestation.,“Whenwefirstdecidedtousethermalsimulationwepolledourcustomersandaskedthemwhichsoftwarepackagetheywouldliketohaveususe,theysaidthattheypreferredFloTHERMovertheotherleadingthermalsimulationpackages.TheyuseFloTHERMthemselvessotheyhaveconfidenceinitspredictionsandcaneasilyincorporateourmodelsintotheirfullsystemmodels.SincewebeganusingFloTHERMwehavebeenveryimpressedwithitsabilitytoaccuratelysimulatethermalmanagementchallenges.Onaverage,oursimulationresultspredictreal-worldmeasurementswithin5%.”MattConnors,ApplicationsEngineeringSupervisor,Thermacore,ThermalSimulationHelpsOvercomeChallengesof14Uchassiswith1700Watts,AmphenolTotalConnectionSolutions(TCS)usedFloTHERMsoftwaretoovercomethethermalmanagementchallengesofa14rackunit(U)chassisdissipating1700watts.,“FloTHERMgoesonemajorstepfurtherthanourinternalcodebymodelingtheentiregeometryofthechassis,”Heardsaid.“Icanspecifywherethepowerisdissipatedandthesimulationtrackstheflowofairandtransferofheatthroughoutthechassis.WehaveusedFloTHERMfor16yearsandhavedevelopedahighdegreeofconfidenceinitsaccuracy.Mostofourlargercustomersalsousethesoftwaresowecaneasilyexchangemodelswiththem.”ChrisHeard,Engineer,Amphenol,AlcatelSolvesThermalIssuesEarlywithFloTHERM,Withpowerconsumptionrunningatlevelsofupto2000Wpershelfandupto140Wforeachplug-incard,thermalmanagementpresentedamajordesignchallenge.TheuseofhighspeedopticaltransceiversandASICswithrestrictedtemperaturerangesincreasedthedifficultyofthedesignchallenge.,“Webelievethatitscriticaltoperformacarefulthermalanalysisatthebeginningofeverynewdesign.WehavesuccessfullyusedFlothermsoftwareasourthermalsimulationtoolformanyyears.ThecombinationofFlothermandFlopackenableustoquicklyexploredesignvariationsandfindtheoptimumsolutionatboththesystemandPCBlevels.”PavelValenta,HardwareEngineering,Alcatel,FloTHERMHelpsTecnobitEnsureReliabilityofAvionicsEquipment,Thepowerandheatdissipationofmodernavionicsequipmentisincreasingrapidly,anddesigningappropriatecoolingsystemsisnowanabsolutenecessitytoensurereliability.,“FloTHERMisofcrucialimportancetousinunderstandingandoptimizingthedifferentheattransferpathsandmechanismsbetweenelectroniccomponentsandtheambientsurroundingsintheharshenvironmentalconditionsfoundinaircrafts.ThewayFloTHERMrepresentselectroniccomponentsisakeyadvantage,enablinguseithertousesimplethermaldatafromcomponentdatasheetsorswitchtodetailed3Dmodelsforcriticalcomponentswhennecessary.”Jor