PCBA可制造性设计规范ppt课件

SMTPCB/Panellayout,SMTTeam2015-03-22,PCBDesignGuideline,Revisionrecord,Purpose,Basedontherequirementsofproductionprocess,Inthelayoutandcircuitboarddesignprocess,Thereisastandardtofollow,Toachievehighefficiencyintheproductionofassembly,Easyassembly,lowcost,andhighqualitytarget.Thecontentisonlyapplicabletotherelateddatabase,someareforreferenceonly.,content,PCBlayoutrulesTextmarkingforsilkscreenlayerPCBFiducialMarkdesignPCBfixedpositionholeSMTcomponentPADdesignPTHcomponentPADdesignThrough-hole(Via)designTracedesignotherlimitation,PCBlayoutrules,V-Cutlayoutrule:ChipstoV-Cutlineshouldbemorethan1mm,otherwisewilldamagechipsorwillchangetouseStampCutdesign,willaddthePCBcostThedistancetoPCBedge0.5mm,cannotlayoutthetrace,ThedistancetoPCBedge1.0mm,cannotlayouttheanycomponentThedistancetoPCBedge5mm,cannotlayoutthecomponentsheightover25mm,otherwisecuterwilldamagecomponents,PCBlayoutrules,V-Cutlayoutrules:PCBtracetoV-CutshouldbemorethenS=0.5mmsafetybuffer,otherwisewillhavetherisktodamagethetrace.WhenweuseV-CutPCBthickness1.0mmto3mm(1.0mmto0.5mm+SMTpallet)PCBoutlineissquaretypeorrectangletype,irregularshapecannotusetheV-Cut,irregularshape,PCBlayoutrules,Stampdesign:StampdesignonlyforirregularPCB,PCBtoPCBlayoutdistanceis2mm,V-Cutonly0.3mmStampdesignparameters,PCBlayoutrules,V-CutVSStamplayout:PCStoPCSdistanceonly0.3mmforV-Cut,wecansavethePCBlayoutcostStampCutdesign,PCBPCStoPCSdistanceis2mmBaseonsamePCSdesignwithdifferentCuttype(stamp/VCut),thePCBcostwillimpact10-25%V-CutPCBwillbecutbymachine,butStampCutwillbrokenbyOPandhavestressthendamagethecomponents,V-Cutmachine,PCB/panellayout,WhydontchoosesinglePCBforSMTprocess:WeneedtoputtheeachsinglePCBoncarrierwhendoSMTprocessButcarriercaveandsinglePCBhavetolerance,soalwayshappensolderpasteprintingmisalignmentthenwillgettheshift/tombstoneprocessissueSometimeswillhappensinglePCBliftupfromSMTcarrierandwillhavethechipsmountingshift/missingprocessissues,PutthesinglePCBonthecarrier,PCB/panellayout,FactorsofimpactPCBCostPCBlayoutFinepitchcomponentsPanelV-Cut/StampCut/PCBconveyoredgesizePCBdrillholesize/quantityPCBmaterialcostPCBprocesseasy/complicated,processspecPCBsurfacefinishedprocessalsoimpactcost,OSP/IMS/EING/IMTPCBoutline,regularshapeischeaperthanirregularshape,Textmarkingforsilklayer,Thecurrentsituation:WereceivedthegerberfileforUKdesignteam,nosilklayerbefoundWecannotdirectlyconfirmPolarityofcomponentonthePCB,cannotconfirmthelocationofcomponent,easilytoconfirmICshiftornot.IntheproductionadjustmentX,Ycoordinateandconfirmationthelocationcompletelyrelyonengineeringdrawings,Bigwasteoftime.,Nosilklayersinthegerberfile,Notextmarkonthepcb,Textmarkingforsilklayer,Astheicontextmarkingdesignwecanaccept.Wecanquicklyinspectionlocationwherethereareproblems.,silkscreen,Textmarking,Textmarkingforsilklayer,ComponentoutlinePH=0.40.5Acceptable;PH320.,Otherlimitation,PIPpartslimitAllofthethroughholepartmustbedesignedinsecondtoavoidtheuseofhandsolderingprocessThefirstsurfaceisnecessarytousetheSMDTYPEpartorthroughholepartspinandpartsbodycannotoutstandPCBsecondsurfaceThespecofpinoutofpcbsurfaceinPIPprocess:pinlengthPCBthickness+0.30.6mmTheinsertpartsinPCBcannottilt,dumpingoreasytoloosestate.,Otherlimitation,Otherlimitation,Choosethecomponent:TheuseofchipcomponentsintheSMTstageasfaraspossible,reducethewasteofhumanaction.,PTHpartstoSMD,PTHpartstoSMD,PTHpartstoSMD,PTHpartstoSMD,Otherlimitation,Notracecuttingorjumpwiresprocessonmassproductionmodels.,PCBpadsizeshouldbematchwiththesizeofcomponents,Ifthesamepartshavedifferentappearancesize,theLayoutoraccordingtoprocessproposalstospecialLayout,mustconformtherule。Allofpaddesignneedtonon-soldermaskdesign.PassivecomponentpadsizeThegeneralRLCcomponent：placeoutlineareadonotoverlap,Donotoverlap,Otherlimitation,Forcomponenthigherthan5mm,needtokeepsamedistance/clearanceonpcbsurfacefreefromcomponenttoavoidshadoweffectandcausingAOIlimiation.,D=H,Otherlimitation,Gerberfilelayersrequirement,SMDlayer:componentPAD,referencethislayertodesignstencilaperture,Gerberfilelayersrequirement,Silklayer:SMDcomponenttextmarkingincludebodyoutline,pinassignment,componentname,polaritymarking,