SeminarLORDDS Training 2012 _micro part_Cecilia

LORDEB&CApplicationTraining,July2009CeciliaKuo,EB&CProductLines,MicroBusinessThickFilmPotting,2,3,Focusisonmicroelectronicspackaging,4,limitedtoICpackaging,intosurfacemountdevices,5,Typicalpackageassemblyprocess,6,Ourproductsareusedintheback-endofelectronicpackaging.,ThermalInterfaceMaterialsfromLORD,AdvantageGreaseGooddispensingcharacteristicsLowthermalresistanceNocuringrequiredRemovable&RepairableGelease(Gel)ImprovedadhesionNopump-outEasilyDispensedSoftmaterialallowsreworkLowModulusAdhesivesMorecompliantforstressreliefSoftermaterialscanbereworkedEasilydispensedHighModulusAdhesivesHighadhesivestrengthSuperiorthermalperformance,DisadvantagePronetopump-outResinbleedovertimeMinimaladhesionCurerequiredrelativetoagreaseLowtomoderateadhesivestrengthNoteasilyreworkableLowthermal&mechanicalstressrelief,FrozenProductShippingandTransportation,MG121areshippedinJohnnyblueiceduringshipping.(-30C)MD-140areshippedbydryIce(-40C).Duringshipping,materialsarepackedinsideaninsulatedboxwhichcankeepfrozenatlowtemperatureupto6days.Atemperaturerecorder/indicatormaybeplacedinsidetheboxEachsyringesareheldverticaldown.,8,9,CrystallizationNon-appropriatestorage,Non-appropriatehandling,SyringeTypeThawingtime10c.c.90mins30c.c.120mins2.5oz2-4hrs,10,10,TIM1GeleaseMg-121&MT-322-InFlip-Chippackage,11,DirectLidAttachinFlip-ChipPackagePullstrengthfailuresample,Cohesivefailurewasfoundresidueremainedinlidsandsubstrate,12,Lidattachadhesives:ME430&MT-125OptimizedmodulustocontrolpackagecoplanarityandwithstandassemblyprocessesandMRTToohighmodulusmayleadtotracecrackingToolowmodulusmayresultininsufficientco-planarityduetoinsufficientstiffeningofsubstrateHighadhesiontosubstrateandlidsurfacesafterMRTChemicalcompatibilitywithTIMmaterialtoinsurenoadhesivecurepoisoning,4-Line,4-Corner,2-Corner,2-Line,CornerVent,13,ME430asnon-conductivetypeinthelidattachofBGA,GreasesTC-405Silicone,5.2W/mkTC-404Silicone,5.W/mkTC-501Silicone,4.0-6W/mK(Non-pump-outversion)GeleaseMG-121AlFilled,2.5W/mK,BLT=50micronMG-133AlFilled2KSystem,3.5W/mK,BLT=50micronAdhesivesMT-125AlFilledEpoxy,2.5W/mk,GoodAdhesionMT-315AgFilledEpoxy,12.0W/mKMT-322OxideFilledSilicone,1.5W/mKMT-815AgFilledEpoxy,12W/mk,Low,CommerciallyAvailableLORDThermalGreases,GelsandAdhesives,15,16,ThermalGrease-TIM2,17,LordGrease,18,19,20,LEDCar-LightingModule,WhatElseyoucouldapproach?ThermalmoduleDesktop/NB/GPU/CPUIPCServerNetworkServerCooler,21,DieAttachAgAdhesive,22,Pottingandencapsulatingmaterialsfor:ElectronicIgnitionandenginecontrolmodulesRidelevelandwheelspeedsensorsLightingballastsandHIDlightingCapacitors,switches,coils,connectorsandrelaysDC/DCconvertersCircuitboardsEngine/transmissioncontrollerSealingMaterialsfor:CarbatteriesLidsealingCircuitboardcomponentassembliesHeadlightlensadhesiveConformalcoatings,AutomotiveEncapsulants,AdhesivesandCoatingsProducts,DieAttach,DieAttachDispense,Die,DieAttachProcess,Dieattachpaste,Die,24,Example-MD-140ashighthermaldieattachbypintransfer&screenprint,25,Underfill,26,FlipChipvsWirebondFirst&SecondLevel,Firstlevel,Secondlevel,FC,PCBBoard,BGA,27,Whyunderfill:protectsolderballsfromcrackduringtemperaturecycling(poweron/off,orpowerfluctuation).StressisresultedfromCTEmismatch:Sidie3ppm,FR4substrate15ppm,solder21ppmWhoneedsUnderfill:CSP/BGAunderfill:regardlessfirstlevelconfigurationtype,WB/FC/RDLtypicallybiggerpitch150+microns,stand-offgap,150+microns,lessstringentrequirement,someskipunderfillstepduetolessrelirequirement.LORDoffering:ME-525,ME-531FCIP:smallergap(25-100micron)andpitch(150-),densesolderballs,tighterprocessingpropertyandhigherrelirequirementsLORDoffering:ME-532,ME-541,ME-542,28,Howtouse:Needledispenseorjetdispense,Dispensepattern:dot,line,orLshapeDispenseunderfillatroomtemp,substrateheatedat90-100C,capillaryactionforunderfilltoflowunderthechipandfillthegaptotheoppositesideheatcure,UnderfillProcess,Dispense:One-WayUnderfillwithoutvoid,UnderfillFlowing,30,Assupplied:Viscosity,25Cand90CShelflife,coldstoragestability-40CPotlife/worklife-roomtempstability,25CProcessingandCuringDispensable,jettable,Flowproperty,howfast?Flowcapability:howlargedie?Howsmallpitchandgap?Howmanysolderbumps,inwhatconfiguration,areaarray/perimeterAfterflow:selffilleting?Needasealpass?Curingcondition:boxoven,typical60min150C,UnderfillPropertyRequirements,31,CuredpropertiesAdhesion(betweenwhichtwosurfaces?)Modulus(howmeasured:DMA,tensile)Tg(typicallybyTMA)CTE1,coefficientofthermalexpansion,belowTg(at0C)CTE2,aboveTg,(at200C)Ratingofmoisturesensitivitylevel,MSL(=JEDEC)ComplytoJEDEC3and245Creflow(SnPb)or260C(leadfree)Reliability:alwaysahottopicandrequirementThermalconductivity:LORDpioneeringthefirstworkablethermalunderfill,dissipateheattorunchipcooler,asanauxiliaryTIMinadditiontoTIM1orastheonlyTIMifnoTIM1,LiquidEncapsulantCOBComponent-EP937/ME-430,32,33,ViscosityvsTemperatureforLiquidEncapsulants,34,OthersFixtureandsBondinginAssembly,35,36,BGASealingorunderfill,37,ThickFilm,38,LordTaMaterials,BodysilversChiptoLeadadhesivesInsulatorsSpecialtyFormulationsforinherentlyconductivepolymerTacaps,39,LordBodySilversforTaCapacitors,40,LordLeadFrameAdhesivesforTaCapacitors,41,CarbonPackagingMaterialsforTaCapacitors,ProcessTip,Silverbodycoating:2232Dip-dry(15min.RT)-Dip-dry(15min.RT)-cure(60C15min+120C15min+190C15minbyconveyoroven)BlottingbetweeneachdipmaybeusedtoreduceexcessivematerialsChipattachadhesive:6148SDispensingorpintransferandcureat125degCfor30-60minsCarbon-CK7971(candiluteifneeded)Somewherebetween3:2(paste:solvent)and1:1istherecommendedrange.Testaseriesofdilutionbetweenthatrangeandobservethemeasuredpickupthickness,uniformityandsurfaceroughnesstodefinethebestdilutionratioandviscosityrangefortheirdippingcondition.,42,43,44,AutomotiveElectronicsEncapsulants,AdhesivesandCoatings,Encapsulants,AdhesivesandCoatings,Pottingandencapsulatingmaterialsfor:ElectronicignitionandenginecontrolmodulesRidelevelandwheelspeedsensorsTirepressuresensorsLightingballastsandHIDlightingCapacitors,switches,connectorsandrelaysDC/DCconvertersCircuitboardsEngine/transmissioncontrollerAdhesivesandConformalCoatingsfor:LidsealingCircuitboardcomponentassembliesBatteryAssemblyRadioboards,Encapsulants,AdhesivesandCoatings,CurrentlySupplyingThermallyConductiveAdhesiveMT-220EpoxyLidSealAdhesiveEP-870SiliconeLidSealAdhesiveSC-242IgnitionCoils:Pencil-TypeIgnitionCoilEpoxyES-111DISIgnitionCoilEpoxyES-110TruckIgnitionCoil(GenIII,GenIV,L6,DCX)EpoxyES-115Approve