Flextronics-禁止使用和限用物质规范

1、FLEXTRONICSSpecificati on of Banned and Restricted Substa nces for UseFlextr onics Best PracticeAPPROVALSDOCUMENT TITLEDEPTNAMETITLEDATESpecification of Banned and Restricted Substa nces for UseProcureme ntBill RicciProcureme nt Lead01-11-2006Desig n,Regulati onsPaula Saavala inenDesig n Lead, Regul

2、ati ons Lead01-11-2006Operati onsMario OchoaOperati ons Lead01-11-2006Tech no logyDon gkaiShangguanTech no logy Lead01-11-2006Global LeadSeb NardecchiaGlobal Lead01-11-2006DOCUMENT NUMBERFBP-RHS500REVISIONKSHEET1 OF 17REVISION HISTOR YREVISIONDESCRIPTION OF CHANGEORIGINATORRELEASE DATEAIn ter nal Dr

3、aftC Graat01-14-2004BMod. Version 01C Graat07-12-2004CMod. Version_02Regulati on sub team07-27-2004DUpdated versi onJ Jurisits08-09-2004EFinal versi onP Saavala inen; J Jurisits; C Graat08-10-2004FChange to Flex fact doc. Number ingC Graat08-20-2004GAdd level B substa nces (JIG Sep 03) and level A s

4、ubsta nee (JIG Sep 2004) updates accord ing to requireme nts of major customersP Saavala inen; C Graat02-03-2005HAdded homogeneous mat. definition as well as added colu mn with refere nee to the related law and deleted the non inten ti on ally addedP Saavala inen , C Graat06-07-2005IBattery requirem

5、e nts separated to other table, reportable substa nces deletedP Saavala inen10-17-2005JNew substa nces and exempti ons addedP Saavala inen, Mario Ochoa05-06-2006KProposal for new Substa nces, and new exempti onsP Saavala inen24-10-20061. Introduction1.1 PurposeThis specificati on provides gen eral r

6、equireme nts to suppliers and procureme nt teams as well as desig n teams regard ing Flextr onics sta ndard of banned substa nces used in comp onents as recordedin the BoM, materials used in producti on processes not being part of BoM, subassemblies, packagi ng materials and finished products, which

7、 are supplied to Flextronics, in order to fulfill the following targets:? To comply with legal and regulatory requireme nts? To preve nt the banned substa nces from being used and supplied to Flextr onics? To reduce the impact of hazardous substa nces to the en vir onment and preserve the n ature.1.

8、2 ScopeThe scope of this docume nt is to specify prohibiti ons and restricti ons on certa in substa nces and materials used in products and man ufacture, and is applicable to the follow in gs, which are supplied to or purchased by Flextr onics for in corporati on into products:? Semi or Fully assemb

9、led parts (e.g. module, functional units, board assemblies, and other assembled parts and accessories)? Parts (e.g. electrical parts, mecha ni cal parts, semic on ductor devices, PWB-s)? In direct Materials (e.g. adhesives, adhesive tapes, labels and solderi ng materials) used in producti on or for

10、products?Packagi ng materials (e.g. trays, reels, sticks, bags, cushi ons, staples, sheets, wraps, tapes,labels, corrugated cardboard, wooden frames, pallet, vinyl ties, and inks or paints for printing)For some specific applications (e.g. medical, military applications, monitoring and control instru

11、ments), this docume nt may not be applicable and can be exempted as long as a writte n approval is provided by customer.When regional or country laws and ordinances exist that set prohibitions or restrictions on certa in substa nces, the laws and ord inan ces must be observed, eve n though the subst

12、a nces are not clearly regulated in this specificati on. And the measureme nt should be based on the methodology set forth in those laws.1.3 Defin itionProductThe item that the resp ondent is suppl ying (e.g., assembly, subassembly, comp onent, raw material).Subpart MaterialA sub-u nit of a product.

13、A material is made up of one or more substa nces (e.g., copper alloy is a material, which in turn is made up of a number of defined substances, copper, ni ckel, silver, etc.).Substa ncesSubsta nces are chemical eleme nts and their compou nds. CAS n umbers are provided for these substa nces where kno

14、wn.Homoge neous materialHomoge neous material means a material that can not be mecha ni cally disjointed into different materials. Types of homogeneous material are : plastics; ceramics; alloys; paper ; res ins and coati ngs.Mecha ni cally disjoin tedMeans that the materials can be separated by mech

15、anical actions such as un screw ing ;cutt ing; crush ing; gri nding and abrasive processes.Threshold levelConcentration level, which defines the limit, above which the presence of a substance defined in Table 1 a in homogeneous materials in a product or subpart is not allowed ; above which the prese

16、nce of the material defined in table 1b must be declared .PPMparts per million, unit of measurement for weight percentage. 1 PPM = 1 mg/kg = 0.0001 % by weight. The parts per milli on thresholds listed in this specificati on refer to the weight of the homoge neous material in a specific part, not th

17、e weight of the material in an entire system.En d-of-life man ageme ntRecycli ng processes such as precious metals, plastic or other material recovery etc.Compou nds vs. Eleme ntsAll substances marked withan (x) occur as an element (e.g. metal) or as aspecific compou nd (e.g. metal oxide).For all th

18、ose substa nces the amou nt of the releva nt eleme nt has to be calculated.Also the threshold values of the marked substa nces refer to the amou nt of the releva nt eleme nt.For all substa nceswithout an (x)the amou nt of the compou nd has to begive n.2. Banned / Restricted Substanee Requirements Ta

19、ble 1,2 and 32.1 Table 1 showssubsta nces which arebanned / restricted for the use in products andproducti on. The threshold levels are based on legal requireme nts in EU. If in ter natio nal lawestablishes a new threshold for ban / restriction purpose or there is an update from customer srequireme

20、nts, the threshold levels will be revised accord in gly.2.2 Table 2 shows substances which are banned /restricted in product packaging.Packagi ng materials (e.g. cart ons to package products, cart ons for retur nable boxes, and packag ing for part tra nsportati on which in cludes han dles, reels, st

21、icks, magaz in es, bags, staples, sheets, wraps, pain ts, in ks, tapes, labels, cushi ons, woode n frames, corrugated cardboard, vinyl ties, cushioning materials, foil and trays) must not contain any amount of lead, mercury, cadmium, or hexavale nt chromium as an inten ti on ally added eleme nt. The

22、 total concen trati on of the four heavy metals (lead, mercury, cadmium and hexavale nt chromium) must not exceed 0.01% (100 PPM) by weight.2.3 Table 2 showssubstances which are banned /restricted batteriesBased on EU directive, there are substance bans in different type of batteries. These substanc

23、es are Cadmium, Lead and Mercury.3Resp on sibilities3.1 Flextro nics resp on sibilitiesIt is the resp on sibility of Flextro nics to in corporate restricti ons result ing from curre nt docume nt in all applicable draw ings and specificati ons. Draw ings and specificati ons have to be updated in case

24、 intern ati onal sta ndards are modified.(Note that some of our customers may have additi onal requireme nts on materials or substa nces not reflected in this docume nt, but will be han dled on an in dividual basis.)3.2 Supplier s responsibili tiesIt is the responsibility of all suppliers to comply

25、with the reporting requirements for all parts and substances sold to Flextronics. An initial declaration on meeting requirements is needed before starting deliveries of products or materials.Any change to the material content of an approved part has to be reported in written form to Flextronics (re-

26、declaration), indicating new limit level of material concerned, the reason for change and date of change. Deliveries of modified materials require a written approval by Flextro ni cs.Table 1 - Banned substa ncesThese substances are banned /restricted to the PPM threshold level in all applications. A

27、ll homogeneous material in purchased articles (i.e. materials, components, subassemblies, or products must be free from follow ing substa nces): cannot contain higher concen trati ons as defi ned in the ppm threshold levels.AsbestosCAS - no (Table A)0Plastics (mineral filler)83/ 478/EEC85/610/EEC91/

28、659/EEC 1999/77/EECUSA:CAprop65Azo-based dyes and colorantsCAS - no (Table B) in textiles and leathers only30Paints, dyes, pigments used for products contacting human skin continuouslyCarcinogenic2002/61/EC76/769/EEC(x) Cadmium and-compoundsCAS - no (Table C)75Accumulators, batteries, Relays (contac

29、t materials) Hard and soft solders Pigments in plastics Stabilized vinyl chloride polymers and copolymers (e.g. PVC) Metallic surface coating Motors (contact material) Switches (contact material) Zinc layers Pigments, in enamels and plastics.Toxic, some compounds (cadmium chloride, cadmium oxide and

30、 cadmium sulfate) are carcinogenicEU RoHSDirective (2002/96/EC) 91/338/EEC 91/157/EEC94/62/EC 1999/51/EC 2000/53/EC 76/769/EEC(x) Chromium VI (Cr6+) and -compoundsCAS -no (Table D) (Flextronics banns without exemption2006/692/EC)1000Coatings, pigments in plastics, industrial tubes Chromium pigments,

31、 chromate surfaces, corrosion inhibitorsCarcinogenic in exhalable formEU RoHSDirective 94/62/EEC 2000/53/ECFormaldehyde CAS no 50-00-00Formaldehyde must not be used in wooden materials, furniture, detergents, cleaning agents and polishesGermany: ChemverbotsV USA:CA prop65(x) L ead and -compoundsFor

32、Pb-free electrical / electronic components and interconnect materials, please refer to the document“ Procurement Guidelines for Lead (Pb)-Free Electronic Components and Assemblies“.CAS - no (Table E)1000Solder, hybrid circuits, stabilizers in plastics Lead as component in metals and alloys, cable in

33、sulation, production of pigments, corrosion inhibitors (fuel additive or in paints)Teratogenic BioaccumulativeEU RoHSDirective89/677/EEC91/157/EEC94/62/EEC2000/53/EC(x) Lead in PVCCAS -no (Table E)300PVC, cablesSame as aboveSee above(x) lead in Plastic100PigmentsSame as aboveCAS - no (Table E)See ab

34、ove(x) Mercury and-compoundsCAS - no ( Table F )1000Fluorescent light tubes, Barometers, Discharge lamps, Relays, Switches, High intensity discharge lampsMercury and its compounds. Acutely and chronically (very) toxic, accumulate in organismsEU RoHSDirective 89/667/EEC 94/62/EEC 98/101/EC 2000/53/EC

35、 2001-H6161AOzone depleting substances CFCs /Isomers CAS - no (Table G)BFCs/Isomers CAS - no (Table G)HCFCs/Isomers CAS - no (Table H)0Coolants and cleaning agents Blowing agent for plastics HCFCs replacement for CFCs Solvents and degreasing agentsContribute to global warming, ozone depleting Aquati

36、c pollutants, non- degradable, accumulate in organismsMontreal ProtocolClass1 EU:2037/2000 Japan/USA law.x) Nickel and-compounds inapplications where nickel compounds are likely to resultin prolonged skin exposure1000Metal alloysSkin allergyRequirement of some major customersPhthalatesin toys and ch

37、ildcare articles1000 by mass of the plasticized materialPlasticizer, particularly in PVCToxic to reproduction, aquatic pollutant2005/84/ECPolybrominated biphenyls (PBB)and derivatives including diphenyl ethers (PBDE) or biphenyl oxides (PBDO) Including DecaBDE CAS - no (Table I)900Plastics (flame re

38、tardant)EU RoHSDirective 2003/11/EC 76/769/EECPolychlorinated Biphenyls (PCBs), Terphenyls (PCTs) and Pentachlorophenol (PCPs)CAS - no (Table J)50Flame retardants in circuit boards and plastic parts Capacitors (liquid) PCP wood (durability treatment)Easily form very toxic polybrominated dioxins, the

39、reby rendering plastics non-recyclable wasteEU:850/200485/567/EEC89/677/EEC76/769/EECPolychlorinatedNaphthalenes (more than 3 chlori ne atoms0Japanese lawRadioactive Substances CAS -no (Table K)0Radioactive substances cannot be used in any materials except for usage in measuring systems or detectors

40、CarcinogenicShortchain Chlorinated paraffinsCAS -no (Table L)1000Softener or plasticizer in plastics, paints, coatings, flame retardants in plastics, rubbers Lubricants, paintsEu2000/60/EC2002/45/ECTributyl Tin, Triphenyl Tin and oxidesCAS -no (Table M)100Stabilizers Paints, inks, dyes, colorant, pr

41、eservatives, fungicides,Toxic,BioaccumulativeEU:89/677/EEC 99/51/EC 76/769/EECHalogenated (Brominated and Chlorinated) Flame Retardants (other than PBB or PBDE)CAS - no (Table N)All new Flextronics designed products from January 2007.900 ppm Br or Cl 1500 ppm combinedPrinted circuit boards,Plastics

42、(plastic part and enclosures)BioaccumulativeNoneVinyl Chloride Polymer (PVC)CAS - no 9002-86-20Packaging, electronic and mechanical equipmentCorrosion and/or risk of formation of chlorinated dibenzodioxins and -furans at uncontrolled fireNoneAll new Flextronics designed products from January 2007Ant

43、imony trioxide CAS -no 1309-64-40Flame retardants in plasticsToxic, negative for recyclingNoneAll new Flextronics designed products from January 2007.ArsenicCAS - no 7440-38-20Paints and fusion coatings, wood preservatives, leather and textile finishers, water treatment agents, flat glass, metal adh

44、esives, pyrotechnic objects, metal refinement, glass, metal bonding agents, coatings, LEDs, semiconductors (dopant, Gallium arsenide as substrate), photocouplers, fiberglass, insulating tapes, printed circuit boards, optical lensesToxicNoneAll new Flextronics designed products from January 2007.Bery

45、llium oxideCAS -no 1304-56-90Component heat sinkCarcinogenicNoneAll new Flextronics designed products from January 2007.Remark: The Legal regulati ons are provided for refere nee only, and are not inten ded to be a comprehe nsive list of all possible regulati ons .They should not be considered the s

46、ole referenee for material requirements or threshold limits.Exempti onsHere is the list of exempti ons for certa in applicati ons of lead, mercury, cadmium, hexavale ntchromium, polybromi nated biphe nyls (PBB) or polybromi nated diphe nyl ethers (PBDE) which are exempted from the requireme nts of R

47、oHS directive 2002/95/EC (ame nded withcommissi on decisi ons2005/618/EC, 2005/717/EC, 2005/747/EC and 2006/310/EC, 2006/691/EC, 2006/692/EC,2006/690/EC)1. Mercury in compact fluoresce nt lamps not exceed ing 5 mg per lamp.2. Mercury in straight fluoresce nt lamps for gen eral purposes not exceed in

48、g:halophosphate 10 mgtriphosphate with no rmal lifetime 5 mgtriphosphate with long lifetime 8 mg.3. Mercury in straight fluoresce nt lamps for special purposes.4. Mercury in other lamps not specifically men ti oned in this Ann ex.5. Lead in glass of cathode ray tubes, electr onic comp onents and flu

49、oresce nt tubes.6. Lead as an allo ying eleme nt in steel containing up to 0,35 % lead by weight, alum inium containingup to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.7. Lead in high melt ing temperature type solders (i.e. lead-based alloys containing 85 % by wei

50、ght or more lead),lead in solders for servers, storage and storage array systems, n etwork in frastructure equipme ntfor switchi ng, sig nalli ng, tran smissi on as well as n etwork man ageme nt for telecommu ni cati ons,lead in electr on ic ceramic parts (e.g. piezoelectro nic devices)8. Cadmium an

51、d its compou nds in electrical con tacts and cadmium plati ng except for applicati ons banned un der Directive 91/338/EEC (*) ame ndi ng Directive 76/769/EEC (*) relati ng to restrictio ns on the market ing and use of certa in dan gerous substa nces and preparati ons.9. Hexavale nt chromium as an an

52、 ti-corrosi on of the carb on steel cooli ng system in absorpti on refrigerators.9a. DecaBDE in polymeric applicati ons.(Flextro nics banns without exempti on)9b. Lead in lead-br onze beari ng shells and bushes.11. Lead used in complia nt pin conn ector systems.12. Lead as a coating material for the

53、 thermal conduction module c-ring.13. Lead and cadmium in optical and filter glass.14. Lead in solders con sisti ng of more tha n two eleme nts for the conn ecti on betwee n the pins and the package of microprocessors with a lead content of more tha n 80 % and less tha n 85 % by weight.15. Lead in s

54、olders to complete a viable electrical conn ecti on betwee n semic on ductor die and carrier with in in tegrated circuit Flip Chip packages.16. Lead in lin ear incan desce nt lamps with silicate coated tubes.17. Lead halide as radia nt age nt in High Inten sity Discharge (HID) lamps used for profess

55、i onal reprography applicati ons.18. Lead as activator in the fluoresce nt powder (1 % lead by weight or less) of discharge lamps whe nused as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as whe n usedas specialty lamps for diazo-pri nti ng reprography, lithography, in sec

56、t traps, photochemical and cur ing processes con ta ining phosphors such as SMS (Sr,Ba)2MgSi2O7:Pb).19. Lead with PbBiSn-Hg and PblnSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).20. Lead oxide in glass used for bonding

57、front and rear substrates of flat fluoresce nt lamps used forLiquid Crystal Displays (LCD).21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass.22. Lead as impurity in RIG (rare earth iron gar net) Faraday rotators used for fibre optic commu ni cati ons systems.23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or lesswith NiFe l