深圳大学-数字集成电路(中文)第一第二章

1、EE141Digital Integrated CircuitsIntroductionEE141Digital Integrated CircuitsIntroduction2q参考教材：数字集成电路设计 电路、系统与设计Jan M. RabaeyAnantha ChandrakasanBorivoje Nikolic著周润德 译q学时：每周两节，实验单周两节q考核方式：开卷笔试 平时：30%（上机作业） 考试：70%EE141Digital Integrated CircuitsIntroduction3q数字集成电路的介绍数字集成电路的介绍 CMOS器件与工艺 导线模型 CMOS反相器和

2、逻辑门 传输延时、噪声和功耗 组合、时序逻辑电路 设计方法学q能学到什么能学到什么 数字集成电路的入门介绍，从物理器件层到系统整片层的概念。强化数字电路知识，了解基于不同层次的Digital IC Design的流程，具备一定的基本数字集成电路的设计能力EE141Digital Integrated CircuitsIntroduction4q数字集成电路设计进展q数字集成电路中亟待解决的问题q如何衡量设计质量EE141Digital Integrated CircuitsIntroduction5EE141Digital Integrated CircuitsIntroduction6qTh

3、e Babbage Difference Engine (1832)q25,000 零件qCost: 17,470磅EE141Digital Integrated CircuitsIntroduction7q电气计算机 磁控开关 真空管 1946年/18000q电子计算机 晶体管/集成电路q沿革的动力 功耗-可靠性-成本EE141Digital Integrated CircuitsIntroduction8第一个晶体管Bell Labs, 1948BardeenSchockleyEE141Digital Integrated CircuitsIntroduction9双极型逻辑1960sJa

4、ck KilbyECL 3输入逻辑门Motorola 1966EE141Digital Integrated CircuitsIntroduction1019711000 晶体管1 MHz 工作频率全定制人工设计EE141Digital Integrated CircuitsIntroduction112000年亿个晶体管GHz工作频率可复用设计 基于单元库/宏单元 层次化设计 设计自上而下 性能驱动设计 功耗-速度-面积EE141Digital Integrated CircuitsIntroduction12lIn 1965, Gordon Moore noted that the num

5、ber of transistors on a chip doubled every 18 to 24 months. lHe made a prediction that semiconductor technology will double its effectiveness every 18 monthsEE141Digital Integrated CircuitsIntroduction1316151413121110987654321019591960196119621963196419651966196719681969197019711972197319741975LOG2

6、OF THE NUMBER OFCOMPONENTS PER INTEGRATED FUNCTIONElectronics, April 19, 1965.EE141Digital Integrated CircuitsIntroduction14EE141Digital Integrated CircuitsIntroduction151,000,000100,00010,0001,00010100119751980198519901995200020052010808680286i386i486PentiumPentium ProKPentium IIPentium IIICourtesy

7、, IntelEE141Digital Integrated CircuitsIntroduction1640048008808080858086286386486Pentium procP60.0010.010.1110100100019701980199020002010YearTransistors (MT)2X growth in 1.96 years!Transistors on Lead Microprocessors double every 2 yearsCourtesy, IntelEE141Digital Integrated CircuitsIntroduction174

8、0048008808080858086286386486Pentium procP611010019701980199020002010YearDie size (mm)7% growth per year2X growth in 10 yearsDie size grows by 14% to satisfy Moores LawCourtesy, IntelEE141Digital Integrated CircuitsIntroduction18P6Pentium proc486386286808680858080800840040.111010010001000019701980199

9、020002010YearFrequency (Mhz)Lead Microprocessors frequency doubles every 2 yearsDoubles every2 yearsCourtesy, IntelEE141Digital Integrated CircuitsIntroduction19P6Pentium proc486386286808680858080800840040.1110100197119741978198519922000YearPower (Watts)Lead Microprocessors power continues to increa

10、seCourtesy, IntelEE141Digital Integrated CircuitsIntroduction205KW 18KW 1.5KW 500W 40048008808080858086286386486Pentium proc0.111010010001000010000019711974197819851992200020082012YearPower (Watts)能量的传递和耗散将变得不可能能量的传递和耗散将变得不可能Courtesy, IntelEE141Digital Integrated CircuitsIntroduction2140048008808080

11、858086286386486Pentium procP611010010001000019701980199020002010YearPower Density (W/cm2)Hot Plate核反应核反应温度温度火箭喷嘴火箭喷嘴的温度的温度t功率密度过高导致节温升高功率密度过高导致节温升高Courtesy, IntelEE141Digital Integrated CircuitsIntroduction22数字电话市场数字电话市场(出货量出货量)1996 1997 1998 1999 2000Units 48M 86M 162M 260M 435MAnalog BasebandDigit

12、al Baseband(DSP + MCU)PowerManagementSmall Signal RFPowerRF移动电话EE141Digital Integrated CircuitsIntroduction23 “微观问题微观问题” 超高速设计超高速设计 互连互连 噪声、串扰噪声、串扰 可靠性、可制造性可靠性、可制造性 功耗功耗 时钟分布时钟分布 “宏观问题宏观问题” 产品上市周期产品上市周期 千百万门级千百万门级 高层次抽象高层次抽象 可复用可复用IP: 可移植性可移植性 可预测性可预测性 等等.EE141Digital Integrated CircuitsIntroduction

13、241101001,00010,000100,0001,000,00010,000,000200319811983198519871989199119931995199719992001200520072009101001,00010,000100,0001,000,00010,000,000100,000,000Logic Tr./ChipTr./Staff Month.xxxxxxx21%/Yr. compoundProductivity growth ratex58%/Yr. compoundedComplexity growth rate10,0001,0001001010.10.01

14、0.001Logic Transistor per Chip(M)0.010.11101001,00010,000100,000Productivity(K) Trans./Staff - Mo.Source: Sematech复杂度超出了设计能力（产率）复杂度超出了设计能力（产率）！ComplexityCourtesy, ITRS RoadmapEE141Digital Integrated CircuitsIntroduction25q工艺特征尺寸每代降低0.7q芯片按照功能每代两倍增长 芯片成本却没有大幅增加 每个功能的成本降低两倍q但是 如何设计功能更强的芯片? 设计人员却没有按照每两

15、年增长翻倍的速度增加q因此 需要更有效的设计方法 开发不能级别的抽象 更多优秀的仿真综合工具EE141Digital Integrated CircuitsIntroduction26n+n+SGD+DEVICECIRCUITGATEMODULESYSTEMEE141Digital Integrated CircuitsIntroduction27q如何去评价一个数字电路的性能? 成本（Cost） 可靠性（Reliability） 可伸缩性（Scalability） 速度（延时、操作频率）Speed (delay, operating frequency) 功耗（Power dissipati

16、on） 完成某功能能量（Energy to perform a function）EE141Digital Integrated CircuitsIntroduction28q静态/稳态特性 鲁棒性可靠性q动态/瞬态特性 速度性能q功耗特性 热耗散/电源要求q芯片面积 制造成本EE141Digital Integrated CircuitsIntroduction29q 固定成本NRE (non-recurrent engineering) 设计时间和人工成本 一次性投入成本q 可变成本 Recurrent costs 芯片工艺、封装、测试成本 与芯片数量成正比 与芯片面积成正比EE141Di

17、gital Integrated CircuitsIntroduction30V(x)V(y)VOHVOLVM VOHVOLfV(y)=V(x)Switching ThresholdNominal Voltage LevelsVOH = f(VOL)VOL = f(VOH)VM = f(VM)EE141Digital Integrated CircuitsIntroduction31VILVIHVinSlope = -1Slope = -1VOLVOHVout“ 0”VOLVILVIHVOHUndefinedRegion“ 1”EE141Digital Integrated CircuitsI

18、ntroduction32Noise margin highNoise margin lowVIH VILUndefinedRegion10VOH VOLNMHNML逻辑门输出逻辑门输出逻辑门输入逻辑门输入NMH=VOH -VIHNML=VIL - VOL)EE141Digital Integrated CircuitsIntroduction33i(t) Inductive coupling Capacitive couplingPower and ground noisev(t)VDDEE141Digital Integrated CircuitsIntroduction34q噪声源: 电

19、源噪声、干扰、串扰和偏移q为预计产生的噪声源分配所允许的噪声容限q区分固定噪声和与信号幅度成比例噪声源EE141Digital Integrated CircuitsIntroduction35q噪声容限不能代表一切 相比由低阻抗驱动的节点，浮空节点更容易被干扰。q噪声抑制能力是更为重要的指标在系统噪声存在的情况下正确处理和传递信息的能力q 关键的指标: 噪声传递函数、驱动器输出阻抗和接收器输入阻抗。EE141Digital Integrated CircuitsIntroduction36 A chain of invertersv0v1v2v3v4v5v62V (Volt)4v0v1v2t

20、 (nsec)02 11356810 Simulated responseEE141Digital Integrated CircuitsIntroduction37q把一个输入电压Vin（Vin“0”）加在一条具有N个反相器的链上，反相器个数为偶数，当且仅当反相器具有再生性是输出电压Vout（N-）将等于VOL。当输入电压Vin（Vin“1”），输出电压Vout（N-）将等于VOHEE141Digital Integrated CircuitsIntroduction38v0v1v3finv(v)f(v)v3outv2inRegenerativeNon-Regenerativev2v1f(v

21、)finv(v)v3outv0inout=f(in)in=finv(out)EE141Digital Integrated CircuitsIntroduction39NFan-out NFan-in MMEE141Digital Integrated CircuitsIntroduction40Ri = Ro = 0Fanout = NMH = NML = VDD/2 g = VinVoutEE141Digital Integrated CircuitsIntroduction41NMHVin (V)Vout(V)NMLVM0.01.02.03.04.05.01.02.03.04.05.0通

22、过观察推导该结构的DC参数？VOH VOLVIH VILVMNMH NMLEE141Digital Integrated CircuitsIntroduction42VouttftpHLtpLHtrtVint90%10%50%50%EE141Digital Integrated CircuitsIntroduction43v0v1v5v1v2v0v3v4v5T = 2 tp N000111EE141Digital Integrated CircuitsIntroduction44EE141Digital Integrated CircuitsIntroduction45voutvinCR达到5

23、0%点的时间：tp = ln (2) = 0.69 RC=0.69从10%达到90% 的时间tp = ln (9) = 2.2RC=2.2反相器传播延时的重要模型EE141Digital Integrated CircuitsIntroduction46q数字集成电路设计方法的演变 手工制作设计自动化基于单元库和IP核、自上而下的层次化设计设计抽象是关键“黑盒子”或“模型”l参数简化，但足以精确到满足上一层设计需要“分而治之”方法降低处理复杂度l不直接面临众多晶体管，而是一组服用单元EE141Digital Integrated CircuitsIntroduction47q自上而下的层次化设

24、计流程 系统结构级 算法：C+，matlab 模块级 RTL（VHDL/Verilog语言）：Synopsys/Metor 门级（逻辑） 逻辑综合/时序/功耗分析：Synopsys 晶体管级（电路） 模拟电路分析：Cadence/Synopsys/Mentor 器件级（版图） 布局布线/验证/后仿真：Cadence/MentorEE141Digital Integrated CircuitsIntroduction48q模拟设计自动化？ 有效模型困难参数众多 工艺依赖性连续信号 单元电路结构各异单元库数目庞大，复用效率低EE141Digital Integrated CircuitsIntroduction49