微系统制造与实验― 无尘室简介 1

1、National Kaohsiung First University of Sci. & Tech.au tMicroSystem Fabrication Lab.L Introduction of CleanroomNKFUSTL GDSd dn du xA/SM b SEM990330430530280420280620Y300320u Pu200380350RMEMS Lab.3 NKFUSTMEMS Lab.5e NKFUST(Facility Dept.©t d c B t (System¥A F G1. ³t (Utility Supply

2、System¡G utilityW O t s PXUPW (Ultra Pure WaterGas Supply System, Clean Dry Air, Industrial Air, and Utility Air Chemical Supply System Electrical PowerPX (Process Cooling Water, Process Vacuum, Cleaning VacuumCW (City Water2. t (Environment System¡G :´v b t s t Clean Room Office Spac

3、e (¤, ª, ·Telephone System PA (Public Addresst tMEMS Lab.73. o B t (Waste Treatment System¡G B X o o G B o B WWT / WWC (Waste Water Treatment / Waste Chemical CollectionAAS (Air Abatement System4.u u P t (Pipe Engineering & Control System¡Gt (Piping¡B (Ducting¡

4、B (Wiring, ¤t t (FMCS¡F Facility Management Control System ±W I B B o B t p F (Wafer Production¬V b t t Ct t NKFUSTClean roomsystem Clean room system GassystemGas system UPWsystemUPW system ChemicalsystemChemical system AbatementAbatement PowersystemPower system WWT/WCCWWT/WCC sy

5、stem FABOperationFMCSPAPA Security Security PXPX TelephoneTelephone CWCW t t t t cMEMS Lab.9Clean RoomClean Room¥Wb C Clean RoomÀb b B s B A H b B b n D Y B G b Y D d A s v T CNKFUSTNKFUSTMEMS Lab.11SMIF: standard mechanical interfaceNKFUSTClean Room t :Clean Room¨t A s y W b A s B w

6、b,µL s y (FAB¡CA s y b (OUTSIDE AIRA g L CleanRoom¨t U B z B z i o W b C H UB z y Gg cMake-up Air Unit (MAUB L o L (particle(Mech. ChaseA N clean room P c R o (Dry Cooling CoilN D Clean Room n Fan FilterUnit (FFUa Clean Room y a particle o ultra-low penetration air (ULPA FilterL o A F

7、abNKFUSTMEMS Lab.131.·n D C n D b 25°C27 °C¤, ¬h b 55%70%¤µL b 22°C24 °C¤, ¬h b40%45% ¡C2.«b s j p P , ¬G b b j b ±1°C ¤±3% ¤C3.©h b u t , »s t j M r , ³o M r o M o H , ¬G j ,L O j O j

8、, ¦R H W Cb S NKFUST 4.ªt 24 ¤p B z b u t s ,¹P ,p Stepperx , ¨L B t , ¥t m b w w U , ¬G t 24 ¤p z C 5.¥b t L O j p b t L O , °F B B particle ¼v T L , ¨i L ULPAfilter ªR , ¦L W , ¦p N V h b W W B C6.®y G b a b L l H b G

9、F y t F w n D , ®y y u P b H A CNKFUSTMEMS Lab.15N l P Heat Absorption & RejectionP j N o N o B D P Y N l B B L c e B L e t Solar Loads OA Loads Internal LoadsB O NKFUSTz Xt B z t B z t g Internal loads t t H W dProcessToolsL t PCWSolar loadOA loadInternal loadDCCFFUBO MAUNKFUSTMEMS Lab.17E

10、LECTRICAL : Equipment Power Lighting Receptacles Grounding ELECTRICAL: Equipment Power Lighting Receptacles GroundingMECHANICAL : Recirculation Air System Makeup Air System Smoke Purge / Calamity Filter Fan Unit Chilled Water System Hot Water System Drainage Pipe Rack / Penetrations MECHANICAL :Reci

11、rculation Air System Makeup Air System Smoke Purge / Calamity Filter Fan Unit Chilled Water System Hot Water System DrainagePipe Rack / PenetrationsI. S. E. P. : Fire Alarm ºSmoke detector ºVESDA Fire Protection ºSprinkler /Extinguisher ºHydrant box I. S. E. P.: Fire Alarm º

12、Smoke detector ºVESDA Fire ProtectionºSprinkler /Extinguisher ºHydrant boxCONTROL : Clean Room Control FFU Control Public Address CONTROL: Clean Room Control FFU Control Public AddressCLEAN ROOM ENGINEERINGC.R. INTERIOR : HEPA Filter Ceiling Raised Floor Clean Room walls Clean Stairca

13、se Air Shower/ Tunnel Clean-up C.R. INTERIOR :HEPA Filter Ceiling Raised Floor Clean Room walls Clean Staircase Air Shower/ Tunnel Clean-upt EVIROMENT CONTROL AMC Control Electrostatic Particle,Temp,Humidity EVIROMENT CONTROLAMC Control ElectrostaticParticle,Temp,HumidityyNKFUSTClean Room System Con

14、figurationPenthouse¾Outside air intake ¾Smoke purge fan ¾Air washer Mezzanine Level¾Makeup air unit ¾Booster fan ¾Dry cooling coil Interstitial Level¾Filter fan unit ¾Catwalk Process Level¾Raised floor area ¾Gowning Clean Sub Fab¾Return air plen

15、umNKFUSTMEMS Lab.19MAU cMAU c Mech. Chase V X Mech. Chase V X Dry Cooling CoilL Dry Cooling Coil L FFUFFU FAB s FAB s Clean Sub FABClean Sub FAB EXH.& Pressurization t &¥EXH.& Pressurization t &¥AIR BALANCE DIAGRAMULPA Filter W b L o ULPA Filter W b L o NKFUSTTool FFUToolSe

16、e throughlight partitionCeiling gridRaised floorconcreteBracingClean room partitionSupply air ductL P Dt mMEMS Lab.21x 161K V /22.8K V D 22.8K V t o ot 22.8K V /480V-277V22.8K V /208V-120V480V/277V L(¾x t (¾x t L (¾x t 208V/120V L480V/208VBUSWAY (¾x (¿O SCADA O t NKFUSTO t x

17、 TPC i u22.8kv t 161kv/22.8kv 161kv Switch ToolsMEMS Lab.23(FMCS¥H b s v B t i ,¼t t U ,p L , ¼o t t , PCW(»s N o f O U w , n D o .e G o ., ¥H t t H t ,¥H F D ; ¨N t A i ,´tu v G B z O t ,.U C FMCS©t t G1.Clean Room µL t 7.Chemical ¤t2.PCW »

18、;s N o t 8.HVAC t3.AAS ¼o q t 9.Calamity °k t4.UPW ¶W t 10.PV s u t5.WWT ¼o B z t 11.CV b u tt NKFUSTController Backup Controller A I/O card DCS¸y v D I/O cardEngineer WorkStationI W P g ,¸g NI P U P x P t d v P .ConsoleI , -t d, ªA P ,¦P t d w .Controller &am

19、p; I/Oq l u sI/O card.t d I P .X T J T X T J T t Clean Room ,Water,Air-Abatement,HVAC,Utility µjt P P .(¹i/µL u W v zMEMS Lab.25 NKFUSTNKFUSTMEMS Lab.27A irborne M olecular C ontamination Class A,B,C,D(according to SEMI F21-95MC(Moecular CondensatesºB X NKFUSTNKFUSTMEMS Lab.29 NK

20、FUSTR O H k a l A aI o l A R i g w l j a AMEMS Lab.31NKFUSTt60GPM ¤O, ³j i F120GPM ¡GALLON PER MINUTE°a15¢J27 ¢J18M£-cm AT 25¢JTOC¡30ppb¡A PARTICLE<10pcs/ml(0.1um or greater¡A DISSOLVED OXYGEN ¡50ppb PRESSURE=2.8kg/cm2 Note: 1. TOC: tota

21、l organic carbon (Á 2. ppb: parts per billion¡A10-9MEMS Lab.33ITEMW1 Resistivity 18 M£.cm at 25oC2 Particles <10 pcs/ml, (0.1um or greater3 Bacterial <1 CFU/100ml , as determined by membrane filter after 72Hrs incubaloedet 30 o C4 TOC 30 ppb 5Dissolved oxygen50 ppb 6 Dissolved S

22、iO 2 3 ppb 7 Na 0.1 ppb 8 K +0.1 ppb 9 Cu 1.0 ppb 10 Zn 1 ppb 11 Fe 0.5 ppb 12 Cr 0.1 ppb 13 Mn 0.5 ppb 14 Cl - 3.0 ppb 15 Residue 10 ppb 16 Pressure 2.8 kg/cm 217 Flow RateAve.= 60 GPM, Peak= 120 GPM18 Temperature 15 27 o CW NKFUSTt (ultrapure water production system ¥t:(pretreatment system(pr

23、imary treatment system (ultrapure water system (piping system(waste water reclamation systemMEMS Lab.35(¤j 10¡A (coagulation¡B I (settlingB L o (filtration ªs (¤p 10¡A i L L o k (microflocfiltrationO (flocculant ªJ A V X L L o CNKFUSTt (primary treatment system

24、65;t:(1 Át (membrane system¡G f z (reverse osmosis¡A RO¡G L l B organicsB B M G colloid ³B W L o (ultrafiltration¡A UF B L o (membrane filter(2 Âl t (ion-exchange system¡Gf o W (two-bed ultrapure water unit¡A 2B towerB V X o l (mixed-bed ion-exchange towe

25、r¡A MB tower¡G B (oxidants¡B M L l (trace ions (3 °t (deaeration system¡G(degasifier¡A DG tower¡B u (vacuum degasifier A VDG tower¡G h b (¦p (4 ¨GB J B u O (ultraviolet sterilizer¡A UV:¥sterilization©M ®-Á¡B CMEMS Lab.37

26、(ultrapure water system¡A S t A subsystem¡AG B z t A the secondary treatment system(piping system:(point of use¡A POU¡A b M t n (circulating water ¥H (water entrapment ³y H k O b p s (piping bend¡A O M y (¤y A dead zone¡C10-20%ÀW s y t A H T O CNKFUS

27、Tt (§Y W ¦v F B o A i CMEMS Lab.39o G B z HF¤BOE¡Ct o G x s (¬t t ¡V¾I X µCP o G x s X y yµCµo G p B T A m B v B e B z CNKFUSTP o B z : 21 NKFUST íªÓ·ï¹Ùº²ÂéÅð®Î¥Ï&#

28、168;Ç«ç ê ̦© ¤Æ¾Ç¦¡ H2 N2 O2 He CF4 CH4 Ar NO NF3 S iF 4 W F6 S i2 H 6 PH3 B 2H 6 S iH 4 ¤¤¤å¦WºÙ ²B®ð ´á®ð ®ñ®ð ®ó®ð ¥

29、|¬t¤ÆºÒ ¥ÒÖJ ´ã®ð ¤®ñ¤Æ´á ¤T¬t¤ÆºÒ ¥|¬t¤Æª¿ ¤»¬t¤ÆÂë ¤Gª¿¤AÖJ ÁC¤Æ

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32、237;ªÓ·ï¹Ùº²ÂéÅð®Î¥Ï¨Ç«ç ê ̦© ¤ Æ ¾ ¦Ç ¡ GeH4 NH3 SF6 HCl Cl2 HBr N2 O SiCl4 BCl3 CHF3 C2F6 C4F8 D2 ¥|²B¤ëÆã ®

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36、9;Ƥñ® GkÊ© » » SiH2Cl2 ¤G´ªâÖ¿J MEMS Lab. 42 22 NKFUST oBzyϹµ ¼ ³ð® ² ¬ («e¬q¼o®ð³B²z¾¹ MEMS Lab. 43 NKFUST oBzþÃغ ¼ ³ð® ² (¦p :GRC¡B CS195SC ¦h¬°»sµ ±Æ®ð¥Î local scrubber ³B²z¤p¶q¼o®ð (¬ù local scrubber¦h«¬°¦¹ºØ