品质管理英文名词

1、Accuracy准确度Active主动Action评价.处理Activity 活动Add加Addition rule加法运算规则Analysis Covarianee 协方差分析Analysis of Varianee 方差分析Appraisal Variation 评价变差Approved 承认ASQC美国质量学会Attribute计数值Audit审核Automatic database recovery 数据库错误自动回复Average平均数bala nee 平衡Bala nee sheet资产负债对照表Binomial二项分配Body机构Brain storm ing Tech niq

2、ues 脑力风暴法Busi ness Systems Pla nning 企业系统规划Cable电缆Capability 能力Cause and Effect matrix 因果图.鱼骨图Center line 中心线check检杳Check Sheets 检杳表Chi-square Distributi on 卡方分布Clutch spring离合器弹簧Coining压印加工Common cause共同原因Complaint 投诉Compound factor 调合因素Concept新概念Condenser聚光镜Conformity 合格Connection 关联Consumer'

3、s risk消费者之风险Control 控制Control characteristic 管制特性Control chart 管制图Control plan管制计划Correction 纟纠正Correlation Methods 相关分析法Cost down降低成本CPI: continuouse Process Improvement 连续工序改善Creep渐变Cross Tabulati on Tables 交 * 表CS: customer Sevice 客户中心Cushion 缓冲Customer 顾客DSA: Defects Analysis System 缺陷分析系统Data数据

4、Data Collection 数据收集Data concentrator资料集中缓存器DCC: Docume nt Con trol Ce nter 文控中心Decision决策.判定Defects per unit单位缺点数Description 扌苗述Detection难检度Device装置Digital 数字Do执行DOE: Desig n of Experime nts 实验设计Element 兀素Else否则Engineering recbnology 工程技术Entropy 函数Environmental 环境Equipment 设备Estimated accumulative

5、frequency 计算估计累计数EV: Equipment Variation 设备变异Event事件External Failure外部失效，外部缺陷FA: Failure Analysis 坏品分析Fact control事实管理Fatique 疲劳FMEA: Failure Mode and Effect an alysis失效模式与效果分析FPY合格率FQA: Fi nal Quality Assura nee 最终品质保证FQC: Fi nal Quality con trol 最终品质控制Full-steer完全转向function 职能Gauge system量测系统Grade

6、等级Gum-roll橡皮滚筒Health meter 体重计Heat press冲压粘着Histogram直方图Hi-tech高科技hypergeometric超几何分酉己hysteresis磁滞现象Improvement 改善Inductanee 电感Information 信息In itial review 先期审查Inspection 检验Internal Failure内部失效，内部缺陷IPQC: In Process Quality Co ntrol 制程品质控制IQC: In commi ng Quality Co ntrol来料品质控制IS Intern ati onal Org

7、ani zatio n for Stan dardizati on国际标准组织Law of large number 大数法贝ULink连接LCL: Lower Control limit管制下限LQC: Line Quality Co ntrol生产线品质控制LSL: Lower Size Limit规格下限Machine 机械Man age管理Materials 物料Measurement 量测Median中位数Miss feed 漏送Module,sub-system,sub-unit 单位Momentum原动力Monte garlo method 原子核分裂热运动法MSA: Measu

8、reme nt System An alysis 量测系统分析Multiplication rule 乘法运算规则NIST美国:标准技术院Normal常态分布Occurrenee 发生率On .off system 开,关系统Operati on In struct ion 作业指导书Organization 组织Parameter 参数Parto柏拉图Parts零件Parts per million 不良率Passive消极地，被动地Plan计划Pulse脉冲Policy方针Population 群体Power力量，能源PQA: Process Quality Assuranee 制程品质保

9、证Practice 实务Preeision精密度preemptive先占式多任务Pressure 压缩Prevention 预防Probability 机率Probability den sity fun ction 机率密度函数Procedure 流程Process 过程Process capability analysis 制程能力分析图Process control and process capability 制程管制与制程能力Producer s risk生产者之风险Product 产品Product ion 生产Program 方案Projects 项目QA: Quality As

10、sura nee 品质保证QC: Quality Control 品质控制QE: Quality Engin eeri ng 品质工程QFD: Quality Fun ction Desg in 品质机能展开Quality 质量Quality manual 品质手册Quality policy 品质政策Random experiment 随机试验Random numbers 随机数Range全距Record记录Reflow回流Reject拒收Repair返修Repeatusility 再现性Reproducibility 再生性Requirement 要求Residual 误差Resp ons

11、e 响应Responsibilities 职责Review评审Reword返工Robust ness 稳健性Rolled yield 直通率RPN: Risk Priority Number 风险系数sample抽样,样本Sample space样本空间Sampling with replacement 放回扌由样Sampling without replacement 不放回扌由样Scatter diagram散布图分析Scrap报废Screw螺旋Severity严重度Shot-preening微粒冲击平面法Simple random sampling 简单随机取样Size规格SL: Siz

12、e Line 规格中心线Slip滑动Stratified random sampling 分层随机抽样SOP: Sta ndard Operatio n Procedure 标准作业书SPC: Statistical Process Control 统计制程管制Special cause特殊原因Specification 规范SQA: Source(Supplier) Quality Assura nee 供货商品质保证Stage sampli ng分段随机抽样Standard Deviation 标准差Sum of squares 统计表supplier平方和System供方systemat

13、ic sampling 系统,体系Statistical tables 系统抽样Taguchi-method 田口方法Technical committees 技术委员会Test piece测试片Theory原理Time stamp时间戳印Time-lag 延迟Title标题Torque转矩Total求和TQC: Total Quality Con trol 全面品质控制TQM: Total Quality Man ageme nt 全面品质管理Traceability 追溯Training 培训Transaction processing and logging 交易处理Trouble 困扰

14、Up and down 上和下UCL: Upper Control Limit管制上限USL: Upper Size Limit 规格上限Validation 确认Variable计量值Varianee变异禾口Vector向量Verifieation 验证Version 版本VOC: voice of Customer 客户需求VOE: V oiee of Engineer 工程需求GRR Gauge Repeatability Reproducibility 量测地再现性与再生性FPI First Piece In spection首件检查Sampling without replaceme

15、nt 不放回扌由样SQA: Source(Supplier) Quality Audit 供货商品质审核1. QC : quality con trol质量管理2. IQC : in comi ng quality con trol 进料质量管理3. OQC : output quality con trol出货质量管理4.PQC : process quality control 制程质量管理也称 IPQC : in process quality control .5. AQL : acceptable quality level允收标准6.CQA: customer quality as

16、sura nee客户品质保证7. MA : major defeat主要缺点8. MI : minor defeat次要缺点9. CR :critical defeat关键缺点10. SMT : surface mounting technology 表面粘贴技术11. SMD :surface mou nting device 表面粘贴程序SMC : surface mounting component 表面粘贴组件12.ECN : en gi neeri ng cha nge notice工程变更通知13.DCN : desig n cha nge notice 设计变更通知14.PCB

17、: printed circuit board 印刷电路板15.PCBA : printed circuit board assembly 装配印刷电路板16. BOM : bill of material材料清单17. BIOS : basically in put and output system 基本输入输出系统18. MIL-STD-105E :美国陆军标准，也称单次抽样计划.19. ISO : in ternatio nal sta ndard orga ni zatio n 国际标准化组织20. DRAM:内存条21.Polarity :电性22. Icicles :锡尖23.

18、No n-wetti ng :空焊24. Short circuit :短路25. Missing component : 缺件26. Wrong comp onent :错件27 . Excess comp onent :多件28. I nsufficie nt solder :锡少29 . Excessive solder :锡多30. Solder residue:锡渣31. Solder ball :锡球32. Tombst one :墓碑33 . Sideward :侧立34. Comp onent damage :零件破损35. Gold fin ger:金手指36. SOP :

19、standard operation process 标准操作流程37. SIP : sta ndard in spection process 标准检验流程38 .The good and not good segregation :良品和不良品区分39. OBW : on board writer 熸录 BIOS40 . Simple ran dom sampli ng :简单随机抽样41. Histogram :直方图42 . Standard deviation :标准差43. CIP : Con ti nu ous improveme nt program持续改善计戈 U44. SP

20、C : Statistical process control 制程统制45 . Sub-contractors :分包商46. SQE: Supplier quality engin eeri ng47. Sampli ng sample :抽样计划48. Loader :治具49. QTS: Quality tracki ng system 质量追查系统50. Debug :调试51. Spare parts:备用品52. Inven tory report for :库存表53. Manpower/Tact estimation 工时预算54. Calibration :校验55. S/

21、N :serial number 序号56. Corrugated pad :波纹垫57.Takeout tray:内包装盒58. Outer box :外包装箱59. Vericode :检验码60. Sum of square :平方和61. Range :全距62. Conductive bag :保护袋63. Preve ntive maintenance :预防性维护64. Base unit :基体65. Fixture :制具66. Probe :探针67. Host probe :主探针68. Golden card :样本卡69. Diagnostics program :

22、诊断程序70. Frame :屏面71. L in t-free gloves :静电手套72 .Wrist wrap :静电手环73. Target value :目标值74. Related departme nt :相关部门75. lifted solder浮焊76.plug hole 孔塞77. Wrong direction 极性反ponent damage or broken 零件破损79.Unmeleted solder 熔锡不良80.fluxresidue 松香未拭81.wrong label or upside down label 贝占反82. mixed parts 机种

23、混装83. poor solder mask 绿漆不良84. oxidize零件氧化85.stand off height 浮高86. IC reverse IC 反向87.supervisor 课长88. Forman 组长89. Wl=work in structio n 作业指导90. B.P.V:非擦除状态91. I nternal notificatio n:内部联络单92. QP :Quality policy 质量政策93. QT: Quality target 品质目标94. Trend:推移图95.Paret柏拉图96. UCL: Upper con trol limit 管

24、制上限97.L CL:Lower con trol limit管制下限98. CL: Center line 中心线99.R.T.Y: Rolled throughout yield 直通率100. PPM: Parts per millio n不良率101.DPU: Defects per unit 单位不良率102.Resistor:电阻103.Capacitor:电容104. Resistor array :排阻105. Capacitor array:排容106. DIODE:二极管107.SOT:三极管108. Crystal:震荡器109.Fuse 保险丝110.Bead:电感11

25、1.Connector:联结器112.ADM: Admi nistrati on Departme nt 行政单位113. CE: Compo nent En gi neeri ng零件工程114. CSD :Customer Service Departme nt 客户服务部115. ID: In dustrial Desig n 工业设计116.IE: In dustrialEngin eeri ng 工业工程117. IR: In dustrialRelationship工业关系118. ME: Mechanical Engineering 机构工程119. MIS :Managemen

26、t InformationSystem信息部120. MM: Material Management 资材121. PCC: ProjectCoordination/Control 专案协调控制122. PD: Production Department 生产部123. PE: Product Engineering 产品工程124. PM: Product Manager 产品经理125. PMC: ProductionMaterial Control生产物料管理126. PSC: Project Support & Control 产品协调127.Magnesium Alloy:镁

27、合金128. Metal Sheari ng:裁剪129.CEM:C on tract Electro nicsManufacturing 电子制造服务企业 EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企业资源规划SCM+CRM+ERP+EAI=Network direct TM links procureme nt, productio n. Logistics and sales采购，生产，后勤管理及市场营销地融合EAI: En terprise applicati on In

28、tegration企业应用系统整合CRM: Customer Relatio nship Pla nning 客户服务规划SCM : Supply chain management 供应链管理131. OJT: On job trai ning 在职培训132.Access Time:光盘搜寻时间133. B2CEC:Busi ness to con sumer electro nic commerce企业对消费者地电子商务B2BEC:Bus in ess to bus in ess electr onic Commerce企业间地电子商务134.CCL:Copper Clad Laminat

29、e 铜箔基板135. Intranet:企业内部通讯网路136. ISP: In ternet Service Provider 网络服务提供者ICP: In ternet Co ntent Provider网络内容提供者137. GSM: Global System for Mobile Com mun icatio n泛欧数子式行动电话系统GPS:全球卫星定位系统138. Home Page:网络首页139.Video Clip:影像文件140. HTML:超文标记语言141.Domainname:网域名称142. IP:网络网域通讯协议地址143.Notebook:笔记型计算机144.

30、VR: Virtual Reality 虚拟实境145. WAP: Wireless Applicati on Protocol 无线应用软件协议146. LAN : Local area network 局域网络WWW: World Wide Web 世域网WAN: Wide Area Network 广域网络147. 3C: Computer, Communication, Consumer electronic计算机，通讯，消费性电子三大产品地整合148.Information Supplier Highway:信息高速公路149.UPS:Uninterrupted powersyste

31、m不断电系统150.Processed material:流程性材料151.Entity/ltem:实体152.Quality loop:质量环 153.Quality losses:质量损失154.Corrective action:纠正措施155. Preventive action:预防措施156.PDCA:Plan/Do/Check/Action计划 / 实施 /检查 /处理157. Integratedcircuits(IC):集成电路158. Applicati onprogram:应用程序159. Utilities:实用程序160.Auxiliary storage/Secon

32、d storage:;辅助存储器161.Silicon chip:硅片162Diskette drive:软驱163.Display screen/Monitor:显示器164.Foreground:前面165.Montherboard:母板166.Mermory board:内存板167.Slot :插槽168.Bus:Data-bus/address-bus/Control bus:总线 /数据总线 /地址总线 /控制总线169. Plotter:绘图170. MPC:Multimedia personal computer 多媒体171.Oscillator:振荡器172.Automat

33、ic teller term in al:自动终端(出纳)机173.Joystick port:控制端口174.VGA: VideoGraphics Array 显示卡175.Resolution:分辨率176.Register:寄存器177.ISA: Industry Standard Architecture:工业标准结构178.EISA: Extended IndustryArchitecture179.Adapter:适配器180.Peripheral:外部设备181.Faxmodem:调制解调器181.NIC:Network in terface card 网络接口卡182. SCS

34、I: Small computer system in terface183.VESA: Video Electro nicStan dards Associati on184. SIMM: Single in-line memory module单排座存储器模块（内存条）185.Casing:外箱186.Aluminum:铝质187.Ceramic:陶瓷地188.Platter:圆盘片189.Actuator:调节器190.Spindle:轴心191.Actuation arm:存取臂192.Default code:缺省代码193.Auxiliary port:辅助端口194.Carria

35、ge return :回车195.L in efeed:换行196.ASCII: American Standard Code for Information Interchange197.Video analog:视频模拟198.TTL: Transistor- Transistor logic 晶体管-晶体管逻辑电路199. Three-pro ngplug:三芯电插头200. Female co nn ector:连接插座201.Floppy disk:软盘202.Output level:输出电平203.Vertical/Horizo ntal synchroni zati on:场

36、/ 行同步204.H(Horizontal)-Phase:行相位205.Compatible:兼容机2O6.Hardware Expansion Card:硬件扩充卡2O7.Buffer:缓冲208.CRM:Customer relatio nship Ma nageme nt 客户关系管理209.WIP: Work in process半成品21O.Waiver:特别采用211.CXO 系列一CEO Chief Executive Office 首COO :Chief Operating OfficeCFO Chief Finance OfficerCBO Chief Busi ness O

37、fficerCTO Chief Techn ology OfficerCIOChief In formation OfficerCGO Chief Governme nt Officer212. NASDAQ:纳斯达克证券市场NASDAQ Automated Quotati on system213.VC: Venture Capital 风险投资214. PDA: Perso nal Date Assista nt 个人数字助理PLA: Perso nal In formation Assista nt个人信息助理215. PPAP: Adva need Product Quality Pl

38、a nning and Con trol Pla n生产性零组件核准程序216. FMEA: Pote ntial Failure Mode and Effects An alysis失效模式与效应分析217. MSA: Measureme nt Systems An alysis 量测系统分析218. QAS: Quality System Assessment 质量系统评鉴219. Cusum:累计总合图220. Overall Equipment Effectiveness 设备移动率221. Benchmarking: 竞争标杆Analysis of motion/Ergonomics

39、 动作分析/人体工程学222. Roka Yoke 防错法MCR: machine capability ratio机器利用率223. Mistake Proofing防呆法Taguchi methods 田口式方法224, Vertical integration 垂直整合Surveillanee 疋期追踪审查225. EMS: Electr on ics Manu facturi ng Supply-cha in226. Cause & Effects charts 特性要因图227. Scatter:散布图Fool-Proof System 防呆系统228. VE: Value

40、Engineering 价值工程QFD: Quality FunctionDevelopment质量机能展开229. Arrow Chart箭头图法Affiliate Chart 亲和图法230. PDPC: Process Decision Program ChartSystem Chart 系统图法231. Relation Chart 关边图法 Matrix Chart 矩阵图法232. Matrix Data An alysis 矩阵数据分析法234. Brain-storm 脑风暴法JIT: Just In Time:及时性生产模拟235. Demi ng Prize:戴明奖Prot

41、otype 技术试作236. BPM: Business Process Management .业务流程管 MBO 目标管理237. MBP:方针管理FTA:故障树分析QSCV:服务质量238. IPPB: Information 情况planning 策划Programming 规划Budget预算239. EQ: Emotion Quotient:情商IQ: Intelligenee Quotient:智商240. Implied Needs:隐含要求Specified Requirement:规定要求241. Probati on:观察期Incoming Product release

42、d for urgent product ion 紧急放行242.Adva need quality pla nning先进地质量策划243. AOQ: Average Outgoi ng Quality平均检出质量AOQL: Average Outgoi ng Quality Limit平均检出质量界限244.Approved Supplier List经核准认可地供应商名单245.Attribute date 特征Benchmarking基准点Calibration校准246.C apable process 工序能力 Capability Index 工序能力指数Cap ability

43、ratio工序能力率247.CHANGE CYCLE TIME修改地时间周期Continuous improvement持续改进248. Control pla ns控制策划Cost of quality质量成本249. Cycle time reduction减少周期时间250. Design of experiments实验设计Deviation / Substitution偏差 / 置换251. ESD: Electrostatic discharge静电释放252. EH&S: Environmental, Health, and Safely环境，健康.安全253. ESS:

44、 Environmental Stress Scree ning环境应力筛选254. FMEA: Failure Mode Effect An alysis失误模式效应分析255. First Article approval产品地首次论证256. First pass yield一次性通过地成品率257. First sample in spection第一次样品检验258. FMECA: Failure mode effect and critically analysis失误模式，效应及后果分析259. Gauge control 测量仪器控制260. GR&R: Gauge repeatability and reproducibility测量仪器重复性和再现性261. HALT: Highly Accelerated Life Test高加速寿命试验262. HAST: Highly Accelerated Stress Test高加速应力试验263.