PCB封装设计规范V1.0

1、PCB封装设计规范文件编号：受控标识：版本状态：发放序号：编制:日期:审核:日期:批准:日期:1、目的32、适用范围43、职责44、术语定义45、引用标准46、PCB封装设计过程框图 47、SMC （表面组装元件）封装及命名简介 58、SMD （表面组装器件）封装及命名简介 59、设计规则610、PCB封装设计命名方式 711、PCB封装放置入库方式 712、封装设计分类 712.1、 矩形元件（标准类） 712.2、 圆形元件（标准类） 1512.3、 小外形晶体管（SOT）及二极管（SOD）（标准类） 1712.4、 集成电路（IC）（标准类） 2412.5、 微波器件（非标准类） 341

2、2.6、 接插件（非标准类） 371、目的本规范是为电子元器件的表面属性提供模版信息，即为表面器件焊盘图形设计提供模版尺寸，外形以及公差,以便检查和测试，确保表面装配产品的可靠性，从而规范电子元器件的PCB封装设计2、适用范围本规范适用于研发中心PCB部所有PCB封装的设计。3、职责PCB封装库评审由PCB部门经理与工艺部门经理共同评审完成，特殊封装除外。PCB部门专职PCB封装设计人员负责PCB封装库的设计、评审和更新。4、术语定义PCB (Print circuit Board):印刷电路板Footprint :封装IC (integrated circuits ):集成电路SMC (Su

3、rface Mounted Components):表面组装元件SMD (Surface Mounted Devices ):表面组装器件5、引用标准下列标准包含的条文，通过在本规范中引用而构成本规范的条文。在规范归档时，所示版本均为有效。所有 规范都会被修订，使用本规范的各方应探讨，使用下列标准最新版本的可能性。IPC Batch Footprint Generator ReferenceIPC-7351Generic Requirements for Surface Mount Design and Land Pattern StandardIPC-SM-782ASurface Mount

4、 Design and Land Pattern Standard表面组装技术基础与可制造性设计6、PC的装设计过程框图图6.1 PCB封装设计过程框图7、SMC（表面组装元件）封装及命名简介SMC主要是指无源元件的机电元件，包括各种电阻器、陶瓷电容器、铝电解电容器、电感器、磁珠、陶瓷 振子、滤波器、电阻网络、电容网络、微调电容器、电位器、各种开关、继电器、连接器等，封装形状有矩形、 圆柱形、复合形和异形。SMC的封装是以元件的外形尺寸来命名的，其标称以3位或4位数字来表示，SMC的封装命名及标称已经标准化。SMC常用外形尺寸长度和宽度命名，来标志其外形大小，通常有公制（ mm）和英制（inc

5、h）两种表示方法。公制（mm） /英制（inch）转换式如下：25.4mmx英制（inch）尺寸=公制（mm）尺寸例如：0805 （0.08inchx 0.05inch）英制转换为公制元件长度=25.4mm X 0.08=2.032 = 2.0mm元件宽度=25.4mm X 0.05=1.27 1.25mm0805 的公制表示法为 2125 （2.0mmx 1.25mm）8、SMD（表面组装器件）封装及命名简介SMD主要是指有源器件，包括半导体分立器件（二极管、三极管和半导体特殊器件）、集成电路。SMD是贴在PCB表面的，而不是插在PCB通孔中；SMD的体积小、重量轻、速度快；SMD可以两面贴

6、装, 焊接质量好、可靠性高。SMD封装命名是以器件的外形命名的。SMD的引出脚有羽翼形（GULL）、J形、球形、和无引线引线框架形。SMD的封装形式有：SOP(Small Outline Packages)羽翼形小外形塑料封装，其中包括 SOIC (Small Outline Integrated Circuits )小外 形集成电路，SSOIC (Shrink Small Outline Integrated Circuits )缩小型小外形集成电路， TSOP (Thin Small Outline Package)薄型小外形封装；SOJ(Small Outline Integrated

7、Circuits) , J 形小外形塑料封装；PLCC(Plastic Leaded Chip Carriers)塑封 J 形引脚芯片载体；BGA(Ball Grid Array/Chip Scale Package)球形栅格阵列，根据材料和尺寸可分为六个类型： PBGA ( Plastic Ball Grid Array )塑料封装 BGA , CBGA (Ceramic Ball Grid Array )陶瓷封装 BGA , CCGA (Ceramic Column BGA ) 陶瓷柱状封装 BGA , TBGA (Tape Ball Grid Array )载带 BGA ,但GA (微型

8、 BGA)芯片级封装，FC-PBGA (Flip Chip Plastic Ball Grid Array )倒装芯片塑料封装 BGA;CSP(Chip Scale Package)又称 出GA ;QFN(Quad Flat No-lead)四方形扁平无引线引线框架封装。9、设计规则由RF或控制人员预先给出需要设计 PCB封装器件的DATASHEET至PCB封装设计人员，同时转给原理图 封装设计人员同步设计原理图封装，同步设计完成后需统一其命名方式，即PCB封装的命名与原理图封装载入PCB设计时的封装命名一致，否则无法导入 PCB设计。设计PCB时，必须使用我司标准的PCB封装库，不得自己创建

9、PCB封装库。PCB封装库在不同的项目设计里同种类型器件必须使用同种类型的PCB封装库，保证PCB封装库的唯一性与统一性，从而提高设计的正确率。非标准且无明显方向性的 PCB封装有输入输出要求的必须在相应管脚增加输入( IN )输出(OUT)标识，有 极性的器件PCB封装必须增加极性标识；标准且有方向性的 PCB封装必须给出1Pin标识。有引脚序号标识的器件按DATASHEET标明PCB封装焊盘的引脚顺号，DATASHEET引脚序号标识含糊不清或根本没有标识引脚序号的按IC管脚焊盘序号来标识，即逆时针顺序标识。同一个PCB封装里不能有相同的引脚序号出现。PCB封装保存时封装信息包含 PCB封装

10、“命名”，该封装“高度”等，如有其他的可增加“描述”等。属IPC标准封装的参考IPC标准封装来设计 PCB封装库；除IPC标准封装以外，DATASHEET有推荐封装 的采用推荐封装设计 PCB封装，特殊情况除外；非标准封装采用我司规定的标准来设计PCB封装。所有封装均用 PAD设计焊盘；用 PAD或keepout层设计定位孔；丝印与 PADS的距离10mil。设计PCB封装外形丝印要求其自身的最大尺寸，IC除外。设计IC PCB封装自动生成的 PAD上有过孔(VIA)时，其过孔的内径为 0.25mm,外径为1520mil。10、PC的装设计命名方式属于规则封装命名方式的统一用IPC的封装命名。

11、属于不规则的单一的命名统一用其型号的全称命名。设计人员完成PCB封装设计后，要及时与原理图封装设计同步。11、PC的装放置入库方式目前我司PCB封装库分类有：标识.lib, SMA .lib,电位器.lib ,电感.lib ,电容.lib ,晶体管.lib ,电源.lib , 开关.lib ,插件.lib ,微波.lib ,功放管.lib,芯片.lib,时钟.lib等等，设计人员根据 DATASHEET所属类型自行 判断放置入库，如分类不够或不全可适当增减种类，其中设计人员可设计一个“新器件.lib”类别以放置待评审类型或有疑问的 PCB封装。PCB封装放置入库时以它封装本身的1pin中心或器

12、件本身中心点为原点放置。12、封装设计分类电阻电容，晶体管，集成电路（IC）,功放管，隔离器与环形器，耦合器，接插件等，分为标准类与非标准 类。12.1、 矩形元件（标准类）图12.1贴片电阻封装实际尺寸表12.1贴片电阻封装实际尺寸mm(in)componentidentifierLSWTHminmaxminmaxminmaxminmaxmax1005 (0402)1.001.100.400.700.480.600.100.300.401608 (0603)1.501.700.701.110.700.950.150.400.602012 (0805)1.852.150.551.321.101

13、.400.150.650.653216 (1206)3.053.351.552.321.451.750.250.750.713225 (1210)3.053.351.552.322.342.640.250.750.715025 (2010)4.822.352.650.350.850.716332 (2512)6.156.454.455.223.053.350.350.850.71图12.2贴片电阻封装推荐尺寸表12.2贴片电阻封装推荐尺寸RLP No.ComponentIdentifier mm(in)Z(mm)G(mm)X(mm)Y(mm)C(mm)Placement

14、gridrefref100A1005(0402)2.200.400.700.901.302X6101A1608(0603)2.800.601.001.101.704X6102A2012(0805)3.200.601.501.301.904X8103A3216(1206)4.401.201.801.602.804X10104A3225(1210)4.401.202.701.602.806X10105A5025(2010)6.202.602.701.804.406X14106A6332(2512)7.403.803.201.805.608X16图12.3贴片电容封装实际尺寸表12.3贴片电容封装实

15、际尺寸ComponentIdentifier mm(in)LSWTHminmaxminmaxminmaxminmaxmax1005 (0402)0.901.100.300.650.400.600.100.300.601310 (0504)1.021.320.260.720.771.270.130.381.021608 (0603)1.451.750.450.970.650.950.200.500.852012 (0805)1.802.200.301.111.051.450.250.751.103216 (1206)3.003.401.502.311.401.800.250.751.353225

16、 (1210)3.003.401.502.312.302.700.250.751.354532 (1812)4.204.802.303.463.003.400.250.951.354564 (1825)4.204.802.303.466.006.800.250.951.10图12.4贴片电容封装实际尺寸表12.4贴片电容封装实际尺寸RLP No.ComponentIdentifier mm(in)Z(mm)G(mm)X(mm)Y(mm)C(mm)Placementgridrefref130A1005(0402)2.200.400.700.901.302X6131A1310(0504)2.400

17、.401.301.001.404X6132A1608(0603)2.800.601.001.101.704X6133A2012(0805)3.200.601.501.301.904X8134A3216(1206)4.401.201.801.602.804X10135A3225(1210)4.401.202.701.602.806X10136A4532(1812)5.802.003.401.903.908X12137A4564(1825)5.802.006.801.903.9014X12图12.5贴片电感封装实际尺寸表12.5贴片电感封装实际尺寸ComponentIdentifier(mm)L(

18、mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax2012 chip1.702.301.101.760.6001.203216 chip2.903.501.902.631.301.900.200.501.904516 chip4.204.802.603.530.601.200.300.801.902825 prec.w/w2.202.800.901.621.940.370.652.290.073225 prec.w/w2.903.500.901.831.

19、401.800.501.002.000.504532 prec.w/w4.204.8003.400.501.002.800.505038 prec.w/w4.354.952.813.512.462.623.413.810.510.773.800.763225/3230 molded3.003.401.602.181.802.002.302.700.400.702.400.514035 molded3.814.320.811.601.201.502.902.671.274532 molded4.204.802.303.152.002.203.003.

20、400.650.953.400.505650 molded5.305.503.304.323.804.204.705.300.501.005.801.008530 molded8.258.765.256.041.201.502.902.671.27图12.6贴片电感封装推荐尺寸表12.6贴片电感封装推荐尺寸RLP No.ComponentIdentifier(mm)Z(mm)G(mm)X(mm)C(mm)丫(mm)Placementgridrefrfe1602012 chip3.001.001.002.001.004X81613216 chip4.201.801.603

21、.001.206X101624516 chip5.802.601.004.201.604X121632825 Prec3.801.002.402.401.406X101643225 Prec4.601.002.002.801.806X101654532 Prec5.802.203.604.001.808X141665038 Prec5.803.002.804.401.408X141673225/3230 Molded4.4001.606X101684035 Molded5.401.001.403.202.208X121694532 Molded5.801.802.403.

22、802.008X141705650 Molded6.803.204.005.001.8012X161718530 Molded9.805.001.407.402.408X22图12.7锂电容封装实际尺寸图12.7锂电容封装实际尺寸ComponentIdentifier (mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxminmax32163.003.400.801.701.800.501.100.701.8035283.303.701.102.003.

23、000.501.100.702.1060325.706.302.503.503.501.001.601.002.8073437.007.603.804.842.392.414.004.601.001.601.003.10表12.8锂电容封装推荐尺寸RLP No.ComponentIdentifier(mm)Z(mm)G(mm)X(mm)Y(mm)C(mm)Placementgridrefref180A32164.800.801.202.002.806X12181A35285.001.002.202.003.008X12182A60327.602.402.202.605.

24、008X18183A73439.003.802.402.606.4010X20Gridplacementcourtyard图12.8铝电容封装推荐尺寸12.2、 圆形元件（标准类）图12.9贴片二极管封装实际尺寸表12.9贴片二极管封装实际尺寸ComponentIdentifierMm(in)L(mm)S(mm)W(mm)T(mm)ComponenttypeminmaxminmaxminmaxminmaxSOD-80/MLL343.303.702.202.651.601.700.410.55DiodeSOD-87/MLL414.805.203.804.252.442.540.360.50Dio

25、de2012(0805)1.9041.351.450.230.370.10mw resistor3216(1206)3.003.401.862.311.751.850.430.570.25mw resistor3516(1406)3.303.702.162.611.551.650.430.570.12w resistor5923(2309)5.706.104.364.812.402.500.530.670.25w resistor图12.10贴片二极管封装推荐尺寸表12.10贴片二极管封装推荐尺寸RLP No.ComponentIdentifierMm(in)Z(mm)G

26、(mm)X(mm)Y(mm)C(mm)ABPlacementgridrefref200ASOD-80/MLL344.802.001.801.403.400.500.506X12201ASOD-87/MLL416.303.402.601.454.850.500.506X14202A2012(0805)3.200.601.601.301.900.500.354X8203A3216(1206)4.401.202.001.602.800.500.556X10204A3516(1406)4.802.001.801.403.400.500.556X12205A5923(2309)01

27、.505.700.500.656X1812.3、 小外形晶体管（SOT及二极管（SOD （标准类）HVSee profiletable图12.11 SOT23封装实际尺寸表12.11 SOT23封装实际尺寸ComponentIdentifierL(mm)S(mm)W(mm)T(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxmaxnomSOT232.302.601.101.470.360.460.450.601.100.95SOT23封装推荐尺寸:RLP No.ComponentidentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)E(mm)Place

28、mentGirdrefrefref210SOT233.600.801.001.402.200.958X8SOT89封装实际尺寸:T Pp图12.13 SOT89封装实际尺寸表12.13 SOT89封装实际尺寸ComponentIdentifierL(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxnomSOT893.944.250.891.200.360.480.440.561.621.832.602.851.601.50SOT89封装推荐尺寸:图12.14 SOT89封装推荐尺寸表

29、12.14 SOT89封装推荐尺寸RLPComponentZY1X1X2(mm)X3(mm)Y2(mm)Y3(mm)E(mm)PlacementNo.Identifier(mm)(mm)(mm)min maxmin maxrefrefnomgrid215SOT895.401.400.800.801.001.802.002.404.601.5012X10SOD123封装实际尺寸:图12.15 SOD123封装实际尺寸表12.15 SOD123封装实际尺寸ComponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)Hminmaxminmaxminmaxminmaxm

30、inmaxmaxSOD1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173.311.962.213.303.940.761.522.41SOD123封装推荐尺寸:表12.16 SOD123封装推荐尺寸RLP No.ComponentZ(mm)G(mm)X(mm)Y(mm)C(mm)PlacementIdentifierrefrefgrid220ASOD1235.001.800.801.603.404X12221ASMB6.802.002.402.404.408X16SOT143封装实际尺寸:图12.17 SOT143封装

31、实际尺寸表12.17 SOT143封装实际尺寸ComponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)P1(mm)P2(mm)H(mm)minmaxminmaxminmaxminmaxminmaxnomnommaxSOT1432.102.641.001.690.370.460.760.890.250.551.921.721.20SOT143封装推荐尺寸:图12.18 SOT143封装推荐尺寸表12.18 SOT143封装推荐尺寸RLP NO.ComponentIdentifierZ(mm)G(mm)X1(mm)X2(mm)CE1E2YPlacementgri

32、dminmaxrefnomnomref225SOT1433.600.801.001.0001.701.408X8SOT223封装实际尺寸:图12.19 SOT223封装实际尺寸表12.19 SOT223封装实际尺寸ComponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P1(mm)P2(mm)minmaxminmaxminmaxminmaxminmaxmaxnomnomSOT2236.707.304.104.920.600.882.903.180.901.301.802.304.60SOT223封装推荐尺寸:Grid plac

33、ement courtyard图12. 20 SOT223封装推荐尺寸表12. 20 SOT223封装推荐尺寸RLP No.ComponentZGX1X2(mm)Y(mm)C(mm)E1(mm)E2(mm)PlacementIdentifier(mm)(mm)(mm)minmaxrefrefnomnomgrid230SOT2238.404.001.203.403.6004.6018X14特殊晶体管（DPAK）:图12.21 特殊晶体管（DPAK） -1表12.21 特殊晶体管（DPAK） -1ComponentIdentifierLW1W2T1T2P1P2Hminmaxm

34、inmaxminmaxminmaxminmaxbasicbasicMaxTS-003*9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005*14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO36818.70513.3013.602.402.7012.4012.705.4510.905.10表12.22 特殊晶体管（DPAK） -2RLP No.ComponentIdentifierZ(mm)Y1Y2X1X2CPlacementGridref23

35、5ATS-003*11.201.606.201.005.407.3024X16236TS-005*16.603.409.601.006.8010.1036X24237TO26819.803.4013.401.4013.6011.4042X34图12.22 特殊晶体管（DPAK） -2-+ 丁Y2Grid placement courtyard12.4、 集成电路（IC）（标准类）所有对称IC都需增加1 pin标识。SOIC系列封装实际尺寸:表12.23 SOIC系列封装实际尺寸Compo nentIdentifierJEDECL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm

36、)PminmaxminmaxminmaxminmaxminmaxminmaxminmaxnomSO8MS-012AA5.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27SO8W10.0010.657.468.850.330.510.401.277.407.605.055.452.352.651.27SO14MS-012AB5.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14W10.0010.657.468.850.330.510.401.277.407

37、.608.809.202.352.65SO16MS-012AC5.806.203.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16WMS-013AA10.0010.657.468.850.330.510.401.277.407.6010.1010.502.352.651.27SO20WMS-013AC10.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24WMO-119AA10.2910.648.219.010.360.510.531.047.407.6

38、015.5415.852.342.641.27SO24XMO-120AA11.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28WMO-119AB10.2910.648.219.010.360.510.531.047.407.6018.0818.392.342.641.27SO28XMO-120AB11.8112.179.7310.540.360.510.531.048.769.0218.0818.392.342.641.27SO32WMO-119AC10.2910.648.219.010.360.510.531

39、.047.407.6020.6220.932.342.641.27SO32XMO-120AC11.8112.179.7310.540.360.510.531.048.769.0220.6220.932.342.641.27SO36WMO-119AD10.2910.648.219.010.360.510.531.047.407.6023.1623.472.342.641.27SO36XMO-120AD11.8112.179.7310.540.360.510.531.048.769.0223.1623.472.342.641.27SOIC系列封装推荐尺寸:Gridplacementcourtyar

40、d表12.24 SOIC系列封装推荐尺寸RLP No.ComponentidentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)PlacementgridrefRefrefref300ASO87.403.000.6011.2716X12301ASO8W11.407.000.6011.2724X12302ASO147.403.000.6021.2716X20303ASO14W11.407.000.6021.2724X20304ASO167.403.000.602.205.20

41、8.891.2716X22305ASO16W11.407.000.6091.2724X22306ASO20W11.407.000.602.209.2011.431.2724X28307ASO24W11.407.000.602.209.2013.971.2724X32308ASO24X13.008.600.602.2010.8013.971.2728X32309ASO28W11.407.000.602.209.2016.511.2724X38310ASO28X13.008.600.602.2010.8016.511.2728X38311ASO32W11.407.000.60

42、2.209.2019.051.2724X44312ASO32X13.008.600.602.2010.8019.051.2728X44313ASO36W11.407.000.602.209.2021.591.2724X48314ASO36X13.008.600.602.2010.8021.591.2728X48SOPIC系列封装实际尺寸:表12.25 SOPIC系列封装实际尺寸ComponentidentifiertypeL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxmaxmaxnomSOP6I5.7

43、26.993.725.110.350.510.601.003.924.726.351.501.27SOP8I5.726.993.725.110.350.510.601.003.924.726.351.501.27SOP10I5.726.993.725.110.350.510.601.003.924.728.891.501.27SOP12I5.726.993.725.110.350.510.601.003.924.728.891.501.27SOP14I5.726.993.725.110.350.510.601.003.924.7211.431.501.27SOP16II7.628.895.62

44、7.010.350.510.601.005.026.2211.432.001.27SOP18II7.628.895.627.010.350.510.601.005.026.2213.972.001.27SOP20II7.628.895.627.010.350.510.601.005.026.2213.972.001.27SOP22III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP24III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP28IV11.4312.709.4310.820.350.510.601.008.2310.0319.053