PCB印制电路板以及HDI生产流程详细介绍.英文版

1、1.2BACKBACK4Pre-engineeringPattern imagingEtchingLaminatingDrillingCu platingHole pluggingPattern imagingLaminationLaser AblationMechanical drillingPattern imagingCu platingSolder MaskSurface FinishedRoutingVisual inspectionElectric testShippingProcess Flow Chart (1)5Pre-engineeringPattern imagingEt

2、chingLaminatingDrillingProcess Flow Chart (2)6DesmearCu platingHole pluggingCu platingBelt SandingProcess Flow Chart (3)7LaminationLaser AblationMechanical drillingCu platingPattern imagingProcess Flow Chart (4)8Solder MaskGold platingRoutingElectrical testPattern imagingProcess Flow Chart (5)9Hole

3、counterShippingVisual inspectionProcess Flow Chart (6)10* Raw material (Thin Core,Copper,Prepreg.)Raw Material : FR-4 (Difuntional, Tetrafuntional)Supplier : Nan-Ya, Grace,EMCSheet size : 36.5”*48.8” , 40.5”*48.8” ,42.5”*48.8”Core Thickness : 0.003”,0.004”,0.005”,0.006” 0.008”,0.010”,0.012”,0.015” 0

4、.021”,0.031”,0.039”,0.047”Copper Foil : 1/3 oz,1/2 oz,1.0 oz,2 ozPrepreg type : 1080,2112,2116,1506,7628,7630,RCC111.內層基板 (THIN CORE)LaminateCopper Foil裁板裁板(Panel Size) COPPER FOILEpoxy Glass12Photo Resist2.內層線路製作(壓膜) (Dry Film Resist Coat)Etch Photoresist (D/F)13Photo Resist3. 內層線路製作(曝光)(Expose)A/W

5、Artwork(底片底片)Artwork(底片底片)After ExposeBefore Expose144. 內層線路製作(顯影)(Develop)Photo Resist155. 內層線路製作(蝕刻)(Etch)Photo Resist166. 內層線路製作(去膜)(Strip Resist)177.黑氧化 ( Oxide Coating)188. 疊板 (Lay-up)LAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6Layer 1Layer 2Layer 3Layer 4Copper FoilCopper FoilInner LayerPrepreg(

6、膠片)Prepreg(膠片)199. 壓合 (Lamination)20典型之多層板疊板及壓合結構典型之多層板疊板及壓合結構.COPPER FOIL 0.5 OZThin Core ,FR-4prepreg COMPS0LD.prepreg Thin Core ,FR-4prepreg COPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合用之鋼板疊合用之鋼板10-12層疊合層疊合壓合機之熱板壓合機之熱板壓合機之熱板壓合機之熱板COPPER FOIL 0.5 OZThin Core ,FR-4prepreg COMPS0LD.prepreg Thin Core ,FR-4prepre

7、g COPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合用之鋼板疊合用之鋼板21墊木板鋁板10. 鑽孔 (Drilling)2211. 電鍍Desmear & Copper Deposition2312. 塞孔(Hole Plugging)13. 去溢膠 (Belt Sanding)2414. 減銅 (Copper Reduction) Option15. 去溢膠 (Belt Sanding) Option2516. 外層壓膜 Dry Film Lamination (Outer layer)Photo Resist2617. 外層曝光 ExposeUV光源2718. Af

8、ter Exposed2819. 外層顯影 Develop2920. 蝕刻 Etch3020. 去乾膜 Strip Resist3121.壓合 (Build-up Layer Lamination)RCC(Resin Coated Copper foil)3221. 護形層製作 (壓膜)(Conformal Mask)Dry Film(乾膜乾膜)Dry Film(乾膜乾膜)33Artwork(底片底片)Artwork(底片底片)22. 護形層製作 (曝光)(Conformal Mask)Before ExposureAfter Exposure3423.護形層製作 (顯像)(Conformal

9、 Mask)3524. 護形層製作 (蝕銅) (Conformal Mask)3625.護形層製作(去膜) (Conformal Mask)3726. 雷射鑽孔 (Laser Ablation)及機械鑽孔38Mechanical Drill(P.T.H.)Laser Microvia(Blind Via)27. 機械鑽孔 (Mechanical Drill)3928. 電鍍(Desmear & Copper Deposition)4029. 外層線路製作 (Pattern imaging)壓膜壓膜(D/F Lamination) 41曝光曝光(Exposure)顯像顯像(D/F Dev

10、eloping) 42蝕銅蝕銅 (Etching)去膜去膜(D/F Stripping) 4330. 防焊(綠漆)製作 (Solder Mask)44DTI94V-0R10531. S/M 顯像 (S/M Developing)32. 印文字 (Legend Printing)4533. 浸金(噴錫)製作(Electroless Ni/Au , HAL)DTI94V-0R10546DTI94V-0R105Dedicate or universal Tester Flying Probe Tester 34. 成型 (Profile)35. 測試 (Electrical Testing)47DT

11、I94V-0R105DTI94V-0R10536. 終檢 (Final Inspection)37. O.S.P. (entek plus Cu_106A.) OptionBACKBACK49Equipment PhotoEquipment Photo50Equipment PhotoEquipment Photo51Equipment PhotoEquipment Photo52Equipment PhotoEquipment Photo53Equipment PhotoEquipment PhotoBACKBACKBACKBACK55LASER BLIND & BURIED VIA

12、 LAY-UPA = THROUGH Via Hole (導通孔導通孔) B = BURIED Via Hole (埋孔埋孔)C = STAGGER Blind Via (雷射雷射盲孔盲孔 ) D DC CC CD = TWO LEVEL Laser Via (雷射雷射盲孔盲孔 ) C CD DC CPrepregPrepregFR-4 CoreRCCRCCFR-4 CorePrepregPrepregRCCRCCA AB BB BA ABuried Via and Laser Blind Via56 4Ls MLB with Blind Via Process BVLAYER 1B-STAG

13、EPTHLAYER 2LAYER 3LAYER 4SHEARINGD/F PHOTO IMAGE( L2 , L3)LAMINATIONCNC DRILLPANEL PLATINGD/F PHOTO IMAGE(OUTER LAYER)LIQUID SOLDER MASKHOT AIR LEVELINGLASER DRILL57 8Ls MLB with Blind Via ProcessDRILLINGLAMINATIONPTHDRILLINGINNER LAYER IMAGEPTHINNER LAYER IMAGE ( L2 )INNER LAYER IMAGE ( L7 )D/S PRO

14、CESSL1-L2L3-L4L7-L8L5-L6BVPTHLAYER 1LAYER 2LAYER 3LAYER 4LAYER 5LAYER 6LAYER 7LAYER 858 6Ls MLB with Blind & Buried Via ProcessINNER LAYER IMAGE ( L3,L4 )D/S PROCESSL3-L4LAMINATIONDRILLINGPTHINNER LAYER IMAGE ( L2,L5 )LAMINATIONLASER DRILLING(L1-L2,L5-L6)DRILLING(MECHANICAL)PTHOUTER LAYER IMAGE

15、( L1,L6 )BVPTHL 1L 2L 3L 4L 5L 659 6Ls MLB with Blind & Buried Via ProcessINNER LAYER IMAGE ( L3,L4 )D/S PROCESSL3-L4LAMINATIONDRILLINGPTHINNER LAYER IMAGE ( L2,L5 )LAMINATIONLASER DRILLING(L1-L2,L5-L6)DRILLING(MECHANICAL)PTHBVPTHL 1L 2L 3L 4L 5L 6OUTER LAYER IMAGE ( L1,L6 )PLUGGINGPANELPLATIING

16、60 8Ls MLB with Laser Blind Via ProcessINNER LAYER IMAGE(L2-L7)AOI InspectionL4-L5L6-L7BVPTHL 1L 2L 3L 4L 5L 6L 7L 8L2-L3LAMINATION(L1-l8)LASER DRILLING(L1-L2,L7-L8)DRILLING (L1-L8)(MECHANICAL DRILL)PTHOUTER LAYER IMAGE ( L1,L8 )Double Side PROCESS61 8Ls MLB with Laser Blind Via ProcessBVLAYER 1LAYE

17、R 2LAYER 3LAYER 4LAYER 5LAYER 6LAYER 7LAYER 8PTHLASER ABLATION(L1-L2,L7-L8)INNER LAYER IMAGE ( L3 )D/S PROCESSL3-L4LAMINATION(L2-L4)DRILLING(L2-L4)INNER LAYER IMAGE ( L6 )OUTER LAYER IMAGE ( L1,L8 )L5-L6LAMINATION(L5-L7)DRILLING(L5-L7)PTHPTHLAMINATION(L2-L7)INNER LAYER IMAGE ( L4 )INNER LAYER IMAGE

18、( L5 )DRILLING(L2-L7)PTHINNER LAYER IMAGE ( L2,L7 )LAMINATION(L1-L8)62 8Ls MLB with Laser Blind Via ProcessBVPTHLAYER 1LAYER 2LAYER 3LAYER 4LAYER 5LAYER 6LAYER 7LAYER 88 Layers MLB with Laser Blind ViasPTHLASER ABLATION(L1-L2,L7-L8)INNER LAYER IMAGE ( L3 )D/S PROCESSL3-L4LAMINATION(L2-L4)DRILLING(L2

19、-L4)INNER LAYER IMAGE ( L6 )OUTER LAYER IMAGE ( L1,L8 )L5-L6LAMINATION(L5-L7)DRILLING(L5-L7)PTHPTHLAMINATION(L2-L7)DRILLING(L1-L8)INNER LAYER IMAGE ( L4 )INNER LAYER IMAGE ( L5 )DRILLING(L2-L7)PTHINNER LAYER IMAGE ( L2,L7 )LAMINATION(L1-L8)63 6Ls MLB with Laser Blind Via ProcessBVLAYER 1LAYER 2LAYER

20、 3LAYER 4LAYER 5LAYER 6PTHLASER ABLATION(L1-L2,L5-L6)D/S PROCESSL3-L4OUTER LAYER IMAGE ( L1,L6)LAMINATION(L2-L5)DRILLING(L1-L6)PTHDRILLING(L3-L4)PTHINNER LAYER IMAGE ( L3,L4)LASER ABLATION(L2-L3,L4-L5)INNER LAYER IMAGE ( L2,L5)LAMINATION(L1-L6)64 6Ls MLB with Laser Blind Via ProcessBVLAYER 1LAYER 2L

21、AYER 3LAYER 4LAYER 5LAYER 6PTHLASER ABLATION(L1-L2,L5-L6)(L1-L3,L4-L6)D/S PROCESSL3-L4OUTER LAYER IMAGE ( L1,L6)LAMINATION(L2-L5)DRILLING(L1-L6)PTHDRILLING(L3-L4)PTHINNER LAYER IMAGE ( L3,L4)LASER ABLATION(L2-L3,L4-L5)INNER LAYER IMAGE ( L2,L5)LAMINATION(L1-L6)65 6Ls MLB with Laser Blind Via Process

22、BVLAYER 1LAYER 2LAYER 3LAYER 4LAYER 5LAYER 6PTHLASER ABLATION(L1-L2,L5-L6)D/S PROCESSL3-L4OUTER LAYER IMAGE ( L1,L6)LAMINATION(L2-L5)DRILLING(L1-L6)Cu Filled Plating/PTHDRILLING(L3-L4)PTHINNER LAYER IMAGE ( L3,L4)LASER ABLATION(L2-L3,L4-L5)INNER LAYER IMAGE ( L2,L5)LAMINATION(L1-L6)DevelopedBACKBACK

23、LinkingBACKBACK67Technology Roadmap GZ PlantLayer Reg.Line/Spacing.20082007200520064 / 4 mil3.5 / 3.5 milImmersion Ni / AuPCMCIA 14 LayersBlind ViaLine/SpaceHDI 5 milBuried C. R.Surface FinishEntekMicro Via(D)3/3mil3/3 mil4 milSelective Ni / AuImmersion Silver&Tin2.5 milLayer Reg.2.5/2.5 milHalo

24、gen FreeLead Free4 mil3.5 mil3 milGreen Material2.5 mil3 milGold PlatingHASL68Stack ViaVia on Via Cu Filled Plating PluggingVia on PTHStagger Via2008200720052006PCMCIA 14 LayersBlind ViaHDI Plus OneBuried C. R.Via StructureMicro Via(D)Plus TwoVia on PTHStagger ViaVia on ViaStack ViaPlus Three5 mil4 mil2.5 mil3 milTechnology Roadmap GZ Plant69Capability GZ Plant (HDI)2006200720082009Max. build-up layer count per sideMin. build-up dielectric thickness Min. micro via diam