tpm全员生产管理专题教学英文讲座步骤PPT学习教案

1、会计学1tpm全员生产管理专题教学英文讲座步骤全员生产管理专题教学英文讲座步骤 Total Productive Manufacturing is not just a program. It is a long term production efficiency improvement process to attain a predictable manufacturing environment. Through total involvement of the entire workforce, the quality of product and machine uptime ca

2、n be improved by continuously improving the equipment performance. TPM can also reduce total production and maintenance costs.What is Total Productive Manufacturing (TPM) ?第1页/共77页EQUIPMENT EFFECTIVENESSMAXIMIZE SEVERE COMPETITION FOR DEVELOPING NEW PRODUCTS # CYCLE TIME # QUALITY # COSTINTERNAL NEE

3、DSREDUCE OPERATION COSTSREDUCTION OF QUALITY DEFECTSREDUCE PRODUCTION CYCLE TIMEREDUCE INVENTORIESSAFETY & CLEAN WORKPLACE OUTSIDE-COMPANY NEEDS TOTAL PRODUCTIVE MANUFACTURINGTHE NEED OF T.P.M.第2页/共77页I OPERATE - YOU FIX!I OPERATE AND I MAINTAIN IT! BREAKDOWN MAINTENANCE BREAKDOWN PREVENTIONTPM

4、requires a change in culture to embrace new disciplines !Old ThinkingNew Thinking第3页/共77页第4页/共77页ZEROZEROZEROZEROZEROZERO第5页/共77页E .H. S.Continuous ImprovementAutonomous MaintenancePlanned MaintenanceTraining & EducationInitial Flow ControlQuality MaintenanceOffice TPM不断改进自觉性维护计划性维护质量维护新产品研究发展系统

5、环境健康安全系统行政管理培训与教育第6页/共77页 OVERALL EQUIPMENT EFFECTIVENESS(O.E.E.)(O.E.E.)EQUIPMENTEQUIPMENT 6 BIG LOSSES 6 BIG LOSSESOVERALL EQUIPMENT EFFECTIVENESSOVERALL EQUIPMENT EFFECTIVENESSRUNNING TIMEOPERATINGTIMEDOWN TIMELOSSESNET OPERATING TIMESPEEDLOSSESVALUABLEOPERATINGDEFECTLOSS 1.- EQUIPMENT FAILURES2.

6、- SETUPS ANDADJUSTMENTS3.- IDLING ANDMINORSTOPPAGES4.-REDUCEDSPEED5.- DEFECTS INPROCESS6.- REDUCED YIELDAVAILABILITYRUNNING TIME - DOWNTIMERUNNING TIMEX 100=460 MIN. - 60MIN.460 MIN.X 100 = 87%AVAILABILITY =(e.g)X 100PROCESSED AMOUNT -DEFEC T AMOUNTPROCESSED AMOUNT(e.g)RATE OFQUALITYPRODUCTS=RATE OF

7、QUALITYPRODUCTS400 MIN. - 8 UNITS400 UNITSX 100 = 98%THEORETICAL CYCLE TIME XPROCESSED AMOUNTOPERATING TIMEPERFORMANCE EFFICIENCY =X 100(e.g)PERFORMANCE EFFICIENCY0.5 MIN./UNIT X400 UNITSPROCESSED AMOUNTX 100 = 50%O.E.E. = AVAILABILITY X PERFORMANCE X RATE OF EFFICIENCY QUALITY PRODUCTS第7页/共77页Work-

8、hourshours elapsed EffectiveEnergy# of non-defectiveproduct or weightInput EnergyMaterials(weight)Die/Jig/fixture Energy lossesYield lossesDie/Jig/Fixture losses3 Losses that can impede effective use of production resourcesOperating workerhoursOperating hoursLoading workerhoursLoading hoursNet worki

9、nghoursUtilization hoursEffectiveworker hrs.Net utilizationhoursValue-generating(output)worker hoursValue-generatinghoursManagementlossesMotion lossesArrangement lossesLosses resultingfrom lack ofauto systemMonitoring &Adjustment lossesDowntimelossesPerformancelossesDefectlossesScheduleddowntime

10、SD lossesFailure lossesSetting up &adjustment lossesCutting blade/Jigchange lossesStart -up lossesMinor stoppage/idling lossesSpeed lossesDefect/reworklosses7 majorlossesthat impedeequip.efficien-cyLosses thatcan impedeoperatingrate5 majorlossesthat canimpedehumanwork efficien-cy16 Major LossesO

11、ther D/T losses第8页/共77页第9页/共77页The primary aim of this pillar is to此 要 点 的 主 要 目 的 是determine the root cause of the problem 在 消 除 16 种 主 要 的 错 误 in eliminating the 16 major losses时 找 出 问 题 的 根 本 原 因第10页/共77页SCOPE OF C.I.持续改进的范围A.M.T&EP.M.Q.M.C.I.Continuous Improvement activities encompass all th

12、e 持续改进活动包括:在消除16 种主要的错误过程中8 TPM pillars in eliminating the 16 Major Losses.的所有 8 个TPM要点IFCEHSOTPM第11页/共77页Classification of Failures for AM/PM/CI Activities.AM/PM/CI活动失效分析Responsibility 责任Locations where failures occur 地点Causes of failures 失效原因70 % of Failures that can be preventedthrough A.M.70 % 的

13、失效可以通过防止发生Pneumatics 气体 Detector/sensor 探测器/传感器Driving system 操纵系统 Lubricating system 润滑系统Bolts and nuts 螺钉和螺母Jigs/tools 夹具/工具Electric systems 电子系统Electric/electronic equipment电动/电子设备Original conditions are not materialized初始条件没有实现Leaving deterioration unattended(No AM activity)恶化情况没有解决Shortage of s

14、kills 缺乏技能Non-observance study ofoperating conditions缺乏对操作条件的研究30% of remaining Failures that cannot besolved except through P.M. & C.I.其余的失效只有30不能通过 P.M.和 C.I. 来解决Electric/electronic equipment电动/电子设备Driving system 操纵系统Hydraulic system 水压系统Lubricating system 润滑系统Electric and air pressure systems

15、电动和气压系统Detectors/jigs/tools探测器/夹具/工具Leaving deterioration uncertified恶化最后造成停止Inherent design shortcomings内在的设计缺陷Shortage of skills缺乏技能Basic and operatingconditions are not kept不能保持基本的操作条件第12页/共77页Collaboration with AM /PM/ T&E /QM和AM/PM/T&E/QM的合作PM Pillar PM要点AM Pillar AM要点CI/QM Pillar CI/QM

16、要点for Continuous Team spirit Enhancement through OPL of Every Information每一条信息的OPL能提高持续改进小组的团体精神T&E Pillar T&E要点Maintenance维护* Planned Maintenance Activities*维护行动计划的制定- Periodic Maintenance-定期维护- Predictive Maintenance-预先性维护- Corrective Maintenance-纠正性维护-“Breakdown Maintenance Activities” -细

17、分维护计划Manufacturing 制造 *AM Activity AM行动 -Correct Operation 正确的操作 -Oiling - Inspection 检查润滑油-Cleaning 清洁 -Tightening ？- AM data analysis AM数据分析-Restoring 复位-dealing with 处理.-Minor Stoppages 不必要的停机 -Speed Loss 速度降低-Specification Review/Write ups-规范考评/报告-Zero Defect 零缺陷- 8 equipment & 5 manpower lo

18、sses & Zero Defects-零丢失和缺陷的8种设备因素和5种人力因素- Dust free root cause analysis-分析根本原因- One stop defect free changeover- Fan In / Fan Out第13页/共77页The 9-Steps CI Approach持续改进的九步曲123456789Theme / Reason For Selection主题/原因选择Understanding Current Situation了解目前状况Goal Setting & Plan目标设定和制订计划Outline Of Equ

19、ipment & Process Flow设备和工艺流程的概要Clarification Of Phenomenon / Problem识别现象/问题Root Cause Analysis分析根本原因Countermeasures对策Effectiveness Verification效果评估Prevent Recurrence & Standardization防止再发生和标准化第14页/共77页Step 1 of CI Approach CI步骤一11.Theme 主题 * Key point 1: Linkage to factory metric* 要点1: 连接工厂的

20、尺度 * Hints: How does it affect factory performance ? % impact to bottom line ? * 提示：它是如何影响工厂的绩效的？* Key point 2: How do you select the project ? * 要点2：如何选择方案？ * Hints: Line Balance Chart, Bottleneck Area, Work needed in the bottleneck operation * 提示：描出对比图，瓶颈区，* Key point 3: Evidence as Proof, Correla

21、tion, Mutual & Future Understanding *要点3：验证的根据，相互关系，共同的和将来的理解 * Hints: Visual Sample of Good product with relevant dimension (Valid for VM defect) * 提示：标注有相关尺寸的优良产品的样图（对VA 缺陷尤其有效) 第15页/共77页Situation: We faced Open/Short Defect in past three years, andthis issue often reduced our Test Yield and i

22、ncrease cost.0.00%0.05%0.10%0.15%0.20%0.25%0.30%0.35%0.40%0.45%May.1999Aug.Nov.Feb.May.Aug.第16页/共77页Step 2 of CI Approach CI步骤2122.Understand Current Situation 了解目前状况* Key point 1: Start with a Big Picture - Overall Trend*要点1：从一幅大图片开始总的趋势 * Performance or Defect Trend Charts by Months or Weeks * 绩效或

23、缺陷走向图以月或周计* Key point 2: Paretorise as detail as possible* 要点2： Paretorise 尽可能详细 * Ex1: Lifted bonds - 1. No bonding impression on pad 2. With bonding impression on pad 3. With bonding impression on die (which part of die from pad?) 4. With damaged post on previous wire 5. With discolored bond pad (

24、what discoloration: yellow, black?) * Ex2: Bent leads - 1. Leads bent sideways (left or right ?) 2. Leads bent downwards 3. Leads bent upwards 4. Leads bent inwards第17页/共77页12%6%53%29%ShortNo DieNo WireF/T ContactProblem &Wafer Problem01000020000300004000050000600007000080000Apr May JunJulAug Se

25、pOctNov Dec Jan. Feb.D ShiftC ShiftB ShiftA Shift第18页/共77页Step 3 of CI Approach CI 步骤31233.Goal Setting & Plan 目标设定和制定计划3.1 Goal: Zero within 3 months 目标：(三个月)之内达到（零)3.2 Time Frame: From month to month 时间制定：从月到月3.3 The various items paretorized Ex: Activities GoalTime Frame 1. No bonding impress

26、ion Zero in 1 mth1999 Sep 1 starts 2. With bonding impressionZero in 1 mth1999 Oct 1 starts 3. Bond impression on die Zero in 1 mth1999 Nov 1st starts 4. Damaged post Zero in 1 mth 1999 Dec 1st starts 5. Discolored pad 50% reduction in 2 mth 2000 Jan 1st starts第19页/共77页 To Reduce F/T Open Defect Los

27、s from 0.25% in April in 2000 to 0.14% by Apr. 2001.GOAL9-steps CI ApproachStep 1Theme/reason for Selection9 Mar.Step 2Understanding Current Situation22 Mar.Step 3Goal Setting and Plan5 Apr.Step 4Outline of Equipment and Process Flow19 Apr.Step 5Clarification of Phenomenon/Problem3 May.Step 6Root Ca

28、use Analysis9 Dec.Step 7Countermeasures31 Feb.Step 8Effectiveness Verification30 Mar.Step 9Prevent Recurrence and Standardization15 Apr.Completed by Date第20页/共77页Step 4 of CI Approach CI步骤四12344.Equipment & Process Flow (Genba Starts here till Step 8)设备和工艺流程(Genba 由此至步骤八) Genba=现场观察 * Key point:

29、 Outline major equipment/ process steps related to the problem *要点：描述出与问题相关的主要的设备/工艺步骤4.1List the Equipment and/or the process flow of the likely operations that may give rise to the problem. 列出那些能帮助解决问题的合适的操作中的设备和/或工艺流程Ex1: Lifted bonds - Type 1 to 4 defect Pareto modes Auto Index In - PR Recogniti

30、on - Bond - Auto Index Out Lifted wire - Type 5 defect Incoming Wfr - Saw - Die bond - Auto Index In - PR - Bond - Index Out Ex2: Bent Lead Manual Index In - Trim & Form - Manual Index Out to Tube第21页/共77页 Use Five Genes For Data Collection利用数据收集的五个因素Go to the shop floor, observe actual conditio

31、ns, collect/verify data and confirm Losses.亲临现场，实地观察，收集核实数据和确认损失 Do not depend on second-source data. 不依赖于二手资料JapaneseDefinitionGenbaOn-SiteGenbutsuActual ObjectGenshoPhenomenonGenriTheory / PrincipleGensokuRules & Standards第22页/共77页PHENOMENON = an OCCURRENCE or FACT that can be OBSERVED现象能观察到的事

32、件或事实To avoid action on assumptions, observe Phenomenon live on the shop floor.为了消除猜测，请亲临现场去观察“Clear understanding of problem = Half the problem solved”.“彻底地理解问题解决问题的一半”To help clarify the Phenomenon statement, ask为了阐明对现象的陈述，请问以下问题1) During what specific machine operation does the phenomenon occur? 现

33、象出现在机器运行的哪一个环节？2) Does it always occur under the same circumstances? 在同样的环境下此现象是否经常发生？3) Does it occur at regular or irregular intervals? 此现象发生的时间间隔是否有规律？4) Does it get better or worse over time? 此现象朝着好的方向还是坏的方向发展？5) Does it occur on more than one machine? 此现象是否在一台以上的机器发生？6) Does it occur only for c

34、ertain operators? 此现象是否只在某些员工身上发生？Step 5 of CI Approach CI步骤五12345第23页/共77页Step 5 of CI Approach CI步骤五Flow Validation Results123455.Clarification of Phenomenon/ Problem认清现象/问题* Key point: Matching “signature” of problem to the Equipment/ Process flow *要点：问题“信号”与设备/工艺流程的匹配5.1Post Mortem on Defective

35、units: 在有缺陷的管子上 找出真正原因a) Examine units for clue leading to root cause of problem 检查管子以找到根本原因的线索b) Items checked are: Scratch or Chip on Surface of package/ leads/ 检查项目:封装/管脚表面的划痕或碎裂 5.2Defect Mapping or Multi-Vari Study:a) Check Pattern/ Trend / Location for which defects occur 缺陷出现时检查图案/趋势/位置b) Dra

36、w conclusion 下结论5.3Prepare Table for Validation 准备确认表格a) List Equipment/ Process Flow in Column 1 第一栏列出设备/工艺流程b) List Content for Validation in Column 2 第二栏列出确认项c) List Validation Result in Column 3 第三项列出确认结果第24页/共77页Step 5 of CI Approach CI步骤五 Flow Validation ResultsManual Lead does not touch OKInd

37、ex in any part of the indexerTrim & Unit is pushed off the NGForm floater after trimEtc.123455.4Equipment/ Process Flow Validation:确认设备工艺流程 a) Validate evidence from 5.1 and 5.2 against each equipment/ process flow in Step 4 b) Enter result in Column 3 of which 在第三栏输入结果对应于 OK = No problem from t

38、his Equipment/ Process Step or Flow OK = 此设备/流程无任何问题 NG = Not Good, Problematic Area, To identify differences NG = 不好，有问题的地方，发现异样 P = Potential, To include as item for further validation in Step 6 P = 潜在的，有待在步骤六中进一步确认后作结论5.5Zoom in on problematic step/ flow缩小有问题的范围第25页/共77页Activity 1 - 60 mins1-60分种

39、的活动Divide into groups of 5 to 8 people按每组5至8人分组Select one current issue, and perform CI 9-Steps approach for Step 2, 3, 4 and 5.选择一个当前的问题，实践CI 九步法的第2,3,4和第5步After 45 mins, be prepared to share your teams result.45分钟后，做好与大家分享结果的准备第26页/共77页Step 6 of CI Approach CI步骤六1234566.Root Cause Analysis6.1Sub-P

40、rocess Analysis: 附属步骤分析a) Zoom in on the problematic sub-processes 缩小有疑问的附属步骤范围b) Identify all failure modes 识别所有的失效模式c) Perform Restoration for obvious failure modes detected during Genba 在Genba中，如发现明显的失效模式时采取恢复 行动6.2Perform Why-Why Analysis (or other analysis tools) for each Failure modeRefer Why-

41、Why Analysis Training Package进行 Why-Why 分析（或别的分析方法)-根据每一个失效模式参考相应的 Why-Why 分析材料6.3Restoration needed only when需复位的情况a) This is the Spec 它是一种规格b) This is what we found (not per spec) 它为我们所发现(不一定是每种规格)c) Corrective action: Restoration per spec (all dimension shall be quantified!) 纠正行动：复位每一种规格(所有的尺度都应量

42、化)d) Identify permanent corrective action to prevent recurrence 确定长期纠正行动以防止再发生第27页/共77页1Step 6 of CI Approach CI步骤六234566.4Result of Restoration: Validate result of restoration复位的结果：验证复位的结果a) Result 1 is the physical outcome of the restoration 结果1是复位的物理结果 a1) The restoration will bring back Accuracy

43、 to within +- 0.5 mil or force within +- 10 kg / cm square . mil或 每平方厘米小于10kg的压力 a2) Validate that the above is obtained 以上的复位是可行的 a3) If not obtainable, then identify “What has Changed?” before proceeding to Counter-Measures 如果不可行，在执行对策之前确定“什么发生了变化”b) Result 2 is the final outcome on defect elimina

44、tion 结果2是缺陷排除的最后结果 b1) If (a) is fully characterized, the result is GIVEN and we will definitely see the improvement. 如果(a)显示所有的特征，结果是特定的而且我们可以明确的看出其重要性 b2) If not, then identify “What has Changed ?” before Repeating Restoration 否则，则在重复复位之前明确“什么发生了变”第28页/共77页Understand operating functions and princi

45、ples of the equipment / process熟悉设备程序的操作功能和方法- perform step-by-step functional sequencing mapping of the equipment /process绘制设备程序的出按部就班的功能顺序图- perform detailed process mapping of the equipment / process 完成设备程序的详细的流程图Step 6 of CI Approach CI步骤六123456Press IndexbuttonSend signalto CPUEnergizesZ-motorM

46、otor turnsclockwiseTurns beltclockwiseTurns leadscrew c.wSlider assymoves upEXAMPLE第29页/共77页Self-teachDie patternDie positionClamperCannot findTest DieInk DieProbed DieNon-sticking第30页/共77页36%35%22%4%3%0%0%5%10%15%20%25%30%35%40%NVD UnitNo WireNo DiePull wireNon-stickingShort WireNVD Unit Short Wire

47、 No Die No Wire Pull wire Non-sticking TotalDual Die17051420424363Transistor30711524681737982Total477629446859411345Including:- F/T contact.- Wafer Open(N/A).- Wafer Short.(N/A)D/B& W/B problemF/T Open Defect Units Mapping第31页/共77页第32页/共77页1Step 7 of CI Approach CI步骤七2345677.Counter-Measures对策7.

48、1Improvement Proposals & Implementation改进建议和执行a) Define Problem Statement from “What has Changed?” 根据“什么发生了改变”详细说明问题b) Put up proposal to overcome the above problem 提出建议以克服以上问题c) Implement Proposal 执行建议7.2Results of Improvement 改进的结果a) Validate result of implemented action with respect to quanti

49、fiable data that is, Accuracy within +- 0.5 mil or force within +- 10 kg / cm square. mil或 每平方厘米小于10kg的压力第33页/共77页2. Standardize Touch Sensor wire setup method, standardize Touch Sensor wire spare parts make method. Resp: Guo Zhi Status: Done.3. Made some standard Touch sensor wire spare parts and i

50、ssue to 4 shifts. Resp: Guo Zhi Status: Done.4. Train related technicians in 4 shifts. Resp: Guo Zhi Status: Done.Upper Touch BlockLower Touch BlockSpringTouch Sensor WireLEDJPG(PCB)第34页/共77页5. Report Touch Sensor Audit Report every night shift. Related shift repair ASAP. Resp: Night shift superviso

51、r Status: DoneUpper Touch BlockLower Touch BlockSpringTouch Sensor WireLEDJPG(PCB)Touch Sensor AssignmentA Shift: Module 0, 1, 2; 3AB shift: Module 4, 5; 3B, 3X, 3Y, 3ZC shift: Module 6,7; 8A, 8B, 8CD shift: Module 9,10, 8X, 8Y, 8Z6. Related shift repair Touch Sensor ASAP according to above report.

52、Resp: Night shift supervisor Status: Done第35页/共77页1Step 8 of CI Approach CI步骤八23456788.Effectiveness Verification效果的确认8.1 Validate improvement in defect/ problem elimination 确认缺陷的改进/问题的解决8.2 Validate impact of improvement to factory indices 确认改进对工厂带来的影响8.3 Calculate Cost Saving or Avoidance计算节约或节省的成

53、本第36页/共77页Reduce by half0.19%0.17%0.16%0.14%0.11%55453826250.10%0.12%0.14%0.16%0.18%0.20%Jan. Feb.Mar. Apr.May. Jun010203040506070F/T Open defect rateCannot Find time/machineF/T Open rate vs F/E W/B PRS detect Error第37页/共77页F/T Open Defect Rate Trend Chart0.25%0.22% 0.22% 0.22%0.20%0.19%0.18%0.20%0.

54、19% 0.19%0.17%0.16%0.14%0.11%0.08%0.10%0.12%0.14%0.16%0.18%0.20%0.22%0.24%0.26%Apr.00May.Jun.Jul.Aug.Sep.Oct.Nov.Dec.Jan.01FebMar.Apr.May(MTW)Open RateOpen RateGoalGoalReturning High Open rate decrease from 1.0% to 0.08%Charge W/B PRS detect error Returning High Open rate decrease from 0.08% to 0.05

55、%Standard D/B touch sensorinstall method and train techniciansReturn the sample and informationof High Open lot (1.0%) to F/end daily.Charge it into performance.Send out touch sensor report everynight shift. Related shift repair it.第38页/共77页1Step 9 of CI Approach CI步骤九234567899.Prevent Recurrence &a

56、mp; Standardization 9.1 Fan-In/ Fan-Out through QM pillar 通过QM输入/输出 a) all machines within the departments/ sites部门/场所的所有机器 b) similar machines within departments/ sites 部门/场所相似的机器9.2 Maintenance Prevention Data to IFC PM数据 交给IFC 9.3 Sharing in Engineering Showcase/ Symposium/ CFM/ QER在工程橱窗/讨论会/ CFM

57、/ QER 展示 9.4 Recognition through TEA通过TEA得到公认第39页/共77页Why?Why?Why?Why?Why?Why?Why?Why?Why?Developed by :KA LimTraining DeptOrg. rel. date : Apr 1999第40页/共77页It is a TOOL to determine all PROBABLE CAUSES for each PHENOMENON.它是一种对现象发生的可能原因进行分析的方法。It is a refined variation of Cause & Effect analysi

58、s, that considers all factors instead of trying to decide the most influential factors.它是一种更进一步的因果分析法,它考虑了所有的因素而不是只找出最具影响的因素。In short, it is a .总而言之，它是.Problem问题Solving解决Tool工具PHENOMENON = an OCCURRENCE or FACT that can be OBSERVED现象一种能观察到事件或事实第41页/共77页Why?It is another tool that can help us determi

59、ne root causes.它是一种寻找根本原因的分析方法It is not a complicated tool, anyone can use it.more users, more benefits.它不是一个复杂的工具，人人都可能使用它，它带来更大的进步From JIPMs long experience, it has been proven to be EFFECTIVE!JIPM长期的经验已经证明它是有效的！第42页/共77页JIPM recommended methods to determine root causes JIPM 提倡找到根本原因的方法Defect Rate

60、5 - 1%=/ 1%10 - 5%Cause & EffectAnalysis因果分析法Why-WhyAnalysisPhenomena -Mechanism (P-M)AnalysisTraditionaltools (7 QCCtools)第43页/共77页Why-Why Analysisa tool to determine all root causes.寻找所有原因的分析工具based on actual physical facts.建立在所有事实上a tool that requires thorough knowledge of the part/unit/equipment being analyzed.需要对被分析部件/管子/设备充分了解的分析方法a tool to address problems with relatively low levels of f