PCB工程部专业英语词汇

1、PCB工程部专业英文词汇WOR/式31 .小于 3millessthan3mil32 .高于 3milmorethan3mil词汇 33.压合结构 stackingstructure 或者 stack_up1 .板料:material34.附件：attachedfile2 .最低限度：minimum 或者 min.35. 样品：sample3 .最大限度：maximum 或者 max.36.文档： Document4 .基准点(零点)datumpoint37. 答复： answer;reply5 .周期 Datecode38.规格：spec6 .V-cut 余厚 V-cutremainthic

2、kness39. 与. 同样的：thesameas7 .抢电铜皮 d段铜)dummycopper40.前版本： previousversion(oldversion)8 .实物板 actualboard41.生产：production9 .外形及尺寸错误 dimensionerror42. 确认：confirm10 .异常情形 errordatafile43.再次确认：confirmagain(EQ11 .焊锡面与零件面对位偏差misregistration44. 工程问题：engineeringquery12 .孔塞 plughole45. 尽快： assoonaspossible13 .要

3、求 requirement46. 生产文件： productionGerber14 .缺少 miss47.联系某人：contactsomebody15 .偏公差 uneventolerance48.提交样板： submitsample16 .补偿 compensation49. 交货期：deliverydate17 .表面处理 surfacetreatment50.电测成本：ET ( electricaltest ) cost18 .无铅喷锡 LeadfreeHAL51.通断测试：Openandshorttesting19 .金手指斜边 bevelofG/F52.参考：referto20 .制

4、程能力 processcapability53.IPC 标准：IPCstandard21 .建议，暗示 suggest54.IPC 二级：IPCclass222 .确保 ensure55.可接受的：acceptable23 .满足，达到meet56.允许：permit24 .为了 inorderto57.制造： manufacture 或者 fabricate25 .交货期 deliverydate58.修改：revision26. 绿油桥 soldermaskbridge 或者 soldermaskdam59.公差：tolerance27 .根据 accordingto60. 忽略：igno

5、re28 .单边 3milperside3mil61.工具孔：toolinghole29 .直径 diameter62.安装孔：mountinghole30 .半径 radius63.元件孔：componenthole专业资料整理WOR/式33 .槽孔：slothole97.单面开窗： singlesidemaskopening34 .邮票孑L: snapoffhole 或者 stamphole98. 补油：touchupsoldermask35 .导通孔：viahole99.补线：trackwelds36 .盲孔：blindviahole100. 毛刺：burrs37 .埋孔：buriedv

6、iahole101.去毛刺：deburr38 .金属化孔：PTH(platedthroughhole)102.镀层厚度：platingthickness39 .非金属化孔：NPTH(noplatedthroughhole)103. 清洁度：cleanliness40 .孔位：holelocation104. 离子污染：ioniccontamination41 .避免:avoid105.阻燃性等级:flammabilityretardantrating42 .原设计：originaldesign106. 黑化：blackoxidation43 .修改：modify107.棕化：brownoxid

7、ation44 .按原设计：followuporiginaldesign108. 红化：redoxidation45 .附边：wastetab,wastearea 或者 breakawaytab109.可焊性不良：poorsolderability46 .铜条：copperstrip110. 焊料：solder47 .拼板：paneldrawing111. 包装：packaging48 .板厚：boardthickness112. 角标：cornermark49 .删除：remove(delete)113.特性阻抗：characteristicimpedance50 .削铜：shavethec

8、opper114. 正像：positive51 .露铜：copperexposure 或者 exposedcopper115. 负片：negative52 .光标点:fiducialmark116.镜像：mirror53 .不同：bedifferentfrom(differfrom)117. 线宽：linewidth 或者 tracewidth54 .内弧：insideradius118.线品巨：linespacing 或者 tracespacing55 .焊环：annularring119. 做样：buildsample56 .单板尺寸：singlesize120. 按照：according

9、to57 .拼板尺寸：panelsize121.成品：finished58 .铳，锣：routing122. 做变更：makethechange59 .铳刀：router 或者 Routingbit123. 相类似：similarto60 .楔形掏槽 V-cut 或者 Vscoring124.规格：specification92. 哑光：matt125.下移：shiftdown26 .光亮的：glossy126.垂直地：vertically27 .锡珠：solderball(solderplugs)127. 水平的：horizontally28 .阻焊：soldermask(solderres

10、ist)128. 增大：increase29 .阻焊开窗：soldermaskopening129. 缩小：decrease专业资料整理WOR/式61 .表面处理：SurfaceFinishing163,刚性板：rigidboard62 .波峰焊：wavesolder164.挠性板：flexibleboard63 .钻孔数据：drillingdata165. 刚挠板：flex-rigidboard64 .标记 Logo166.铳：CNC(mill,routing)65 . Ul 标记 ULlogo,或者 UlMarking167.冲：punching66 .蚀刻标记 etchedmarking

11、168.倒角：beveling67 .周期：datecode169.斜面：chamfer68 .翘曲：bowandtwist170.倒圆角：fillet69 .外层： outerlayer 或者 externallayer171. 尺寸：dimension70 .内层：innerlayer 或者 internallayer172. 材料： material71 .顶层：toplayer173. 介电常数：Dielectricconstant72 .底层：bottomlayer174. 菲林：film73 .元件面： componentside175. 成像：Imaging74 .焊接面：sol

12、derside176. 板镀：PanelPlating75 .阻焊层：soldermasklayer177. 图镀：PatternPlating76 .字符层:legendlayer(silkscreenlayeroroverlayer)178.后清洗： FinalCleaning77 .兰胶层：peelableSMlayer179. 叠层：stackingstructure(stack-up)78 .贴片层：pastemasklayer180. 污染焊盘 contaminatepad79 .碳油层：carbonlayer181. 分孔图：drillchart 或者 drillmap80 .外

13、形层：outlinelayer(profilelayer)182.度数：degree81 .白油：whiteink183. 被？覆盖：becoveredwith82 .绿油：greenink184.负公差：minustolerance83 .喷锡：hotairleveling(HAL)185. 标靶盘 targetpad84 .电金，水金：flashgold186. 外形公差：routingtolerance85 .插头镀金：platedgoldedge-boardcontacts187. 芯板：core86 .金手指：Gold-finger188.半固化片 Prepreg87 .防氧化：En

14、tek(OSP)189.阻抗线：impedancetrace88 .沉金:89 .沉锡:90 .沉银:91 .单面板:92 .双面板:93 .多层板:Immersiongold(chem.Gold)190.ImmersionTin(chem.Tin)191.评佛timate玻纤 JUFiberExposureImmersionSilver(chem.silver)192.singlesidedboard193.doublesidedboard194.multilayerboard195.底触secopper工作搞 workingGerber 原稿 originalartwork放最lax专业资

15、料整理WOR/式94 .挖空 blanking 或者 cut-out229. 树脂含量 resincontent95 .一般性阻焊油墨 generalresistink230. 排列电阻 resistornetwork96 .孔位错误 misholelocation231. 锣刀（铳刀）routingbit97 .压合周期presscycle232. 孔内沾文字S/Lonhole98 .毛边 serratededges233.孔内绿漆 S/Monhole99 .跳印 skipprinting234.线路沾锡 solderontrace100 .气泡 blistering235.金手指沾锡 so

16、lderonG/F101 .隔离焊盘 isolatedpad236.废框 scrap102 .泪滴 teardrops237. 封孔处理 sealing103 .箭头 arrows238.间距不足 spacingnon-enough104 .加大 Enlarge239.靶位孔 targethole105 .压合周期 presscycle240.测试线路 testcircuit106 .毛边 serratededges241.热应力试验 thermalstress107 .跳印，漏印 skipprinting242. 厚度分布 thicknessdistribution108 .宽度与厚度的比值

17、 width-to-thicknessratio243, 薄基板，内层板thincore109 .调整 adjust244.线路缺口及针孔 tracknick&pinhole110 .铜箔基板 coppercladedlaminates245.裁切线 trimline111,线路露铜 copperexposure246.真平整 trueleveling112.孔内异物dirtyhole247.真正位置的孔trueposition113,椭圆形 ellipticalset248. 万用型 universal114.纤维突生 fiberprotrusion249.气化室 vaporizer115,

18、填充料 filler250. 仓库 warehouse116,互相连通 interconnection251.契尖角 wedgeangle117 .改善方案 implementation252, 线细 widthreduce118 .板料使用率 materialusefactor253, 良率 yield119 .回路,网络network254,渗铜，渗入，灯芯效应 wicking120 .缺口 nick255,允收 acceptable121 .氧化 oxidation256. 试样点 couponlocation122 .剥离（剥落）peelingoff257.经核准的，被认可的 appr

19、oved123.补线不良poortouch-up258.超越胜过，超过其他exceed124,品质等级 qualityclassification259, 牛皮纸 kraftpaper125,对位孔 registration260.孔壁破铜 Holevoid126,拒收 rejectable261.孔位破由 Holebreakout专业资料整理PCB生产一经典流程一英文培训教程A.开料(CutLamination)a-1 裁板(SheetsCutting)a-2 原物料发料(Panel)(ShearmaterialtoSize)B.钻孔(Drilling)b-1 内钻(InnerLayerDr

20、illing)b-2 一次孔(OuterLayerDrilling)b-3 二次孔(2ndDrilling)b-4 雷射钻孔(LaserDrilling)(LaserAblation)f-6 剥锡铅(Tin-LeadStripping)b-5 盲(埋)孔钻孔(Blind&BuriedHoleDrilling)f-7 微切片(Microsection)C.干膜制程(PhotoProcess(D/F)G.塞孔(PlugHole)c-1 前处理(Pretreatment)g-1 印刷(InkPrint)c-2 压膜(DryFilmLamination)g-2 预烤(Precure)c-3 曝光(Ex

21、posure)g-3表面刷磨(Scrub)c-4 显影(Developing)g-4 后烘烤(Postcure)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检(Touch-up)c-8化学前处理,化学研磨(ChemicalMilling)h-3 静电喷涂(SprayCoating)c-9 选择性浸金压膜(SelectiveGoldDryFilmLamination)WOR/式d-8 铳靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)e-1 薄化铜(CopperReduction)F.电镀(Horiz

22、ontalElectrolyticPlating)f-1 水平电镀(HorizontalElectro-Plating)(PanelPlating)f-2 锡铅电镀(Tin-LeadPlating)(PatternPlating)f-3 低于 1mil(Lessthan1milThickness)f-4 高于 1mil(Morethan1milThickness)f-5 砂带研磨(BeltSanding)H.防焊(绿漆/绿油):(SolderMask)h-1C 面印刷(PrintingTopSide)h-2S 面印刷(PrintingBottomSide)专业资料整理h-4 前处理(Pretr

23、eatment)c-10 显影(Developing)h-5 预烤(Precure)c-11 去膜(Stripping)h-6 曝光(Exposure)Developing,Etching&Stripping(DES)h-7 D.压合 Lamination显影(Develop)WOR/式h-8 后烘烤(Postcure)d-1 黑化(BlackOxideTreatment) h-9UV 烘烤(UVCure)d-2 微蚀(Microetching)d-3钢钉组合(eyelet)d-4 叠板(Layup)d-5 压合(Lamination)I.镀金 Goldplatingd-6 后处理(PostT

24、reatment)h-10 文字印刷(PrintingofLegend)h-11 喷砂(Pumice)(WetBlasting)h-12 印可剥离防焊(PeelableSolderMask)d-7 黑氧化(BlackOxideRemoval) i-2 电镀软金(SoftNi/AuPlating)i-1金手指镀银金(GoldFinger)5专业资料整理WOR/式i-3 浸锲金(ImmersionNi/Au)(ElectrolessNi/Au)N-5AOI检查及 VRS(AOIInspection&Verified&Repaired)J.喷锡(HotAirSolderLeveling)N-6BlaserAOI(afterDesmearandMicroetching)j-1 水平喷锡(HorizontalHotAirSolderLeveling)N-7 除胶渣(Desmear)j-2 垂直喷锡(VerticalHotAirSolderLeveling)N-8 微蚀(Microetching)j-3