ACF材料介绍 1

1、1AUO Proprietary & ConfidentialACF材料介绍材料介绍2AUO Proprietary & ConfidentialAgenda:1.ACF简介简介2.ACF验证验证3.ACF分析分析 AUO Proprietary & Confidential3AUO Proprietary & ConfidentialACF简介简介1.异方性导电胶（Anisotropic Conductive Film）2.布满导电粒子之热硬化树脂胶带3.提供特定方向之导电功能4.具有良好连接效果PET FILM（50um）CFTFTACF：异方性导电膜（An

2、isotropic Conductive Film），采用高品质的树脂和导电粒子混合而成，主要用于连接IC与玻璃基板，具有上下导通、左右绝缘的特性，并且同时具有优良的防湿、接着功能。3.应用应用2.结构结构1.特性特性4AUO Proprietary & ConfidentialHeat and PressureCircuitConducting particleACFHigh conductance in Z-directionHigh insulation resistance in X-Y planeAdhesion between circuitsAdhesive（Epoxy）

3、Flow of Adhesive resin Cure AdhesionACF的导电原理的导电原理5AUO Proprietary & ConfidentialACF制作流程制作流程6AUO Proprietary & ConfidentialHeat and PressureCircuitConducting particleACFAdhesive film1. Lamination (Temporary Bonding)2. Peeling off the separator3. Circuit alignment4. Final BondingHeat and Press

4、ureHeating headSubstrateHeating head(Ex.80,10kgf/cm2,5s)(Ex.170,20kgf/cm2 , 20s)ACF的贴附及本压过程的贴附及本压过程7AUO Proprietary & Confidential本压后的本压后的ACF导电粒子观察导电粒子观察8AUO Proprietary & ConfidentialMeasurement of Bonding Temperature9AUO Proprietary & Confidential温度曲线及反应率温度曲线及反应率10AUO Proprietary &

5、 ConfidentialBonding fail due to bonding process11AUO Proprietary & ConfidentialOLB ACF介绍：介绍：HITACHI AC47131.宽度：1.2mm2.厚度：18um3.长度：200m4.粒子大小：3um5.粒子材质：Au/Ni6.粒子密度：9500pcs/mm27.最小接触面积：8100um28.最小接触宽度：8umITO3umMetal coated（plastic particle）Hitachi AC5311概况概况For fine PitchITO，IZO，Metal/COFFast cur

6、able（5s）ITO、IZO12AUO Proprietary & ConfidentialOLB ACF介绍：介绍：Sony CP18201.宽度：2mm2.厚度：18um3.长度：250m4.粒子大小：3um5.粒子材质：Au/Ni6.粒子密度：9500pcs/mm2ITO3umInsulated/PI/Au/Ni/EpoxySony CP1320G1概况概况For fine PitchNCF/ACFITO/IZOMetal Plated Plastic with insulation coating流动性：流动性：CP1320G1CP182013AUO Proprietary

7、& ConfidentialPCB ACF介绍：介绍：HITACHI AC98651.宽度：2mm2.厚度：35um3.长度：200m4.粒子大小：5um5.粒子材质：圆形纯镍6.粒子密度：2500pcs/mm25umPure Nickel particle（Sphere shape）PCBAC9866AC9866160度度Hitachi AC9866X2概况概况NiColoring（Pink）14AUO Proprietary & ConfidentialOLB ACF比较比较AC-4713AC-531110s ACF，单根单根pin需求导电粒子需求导电粒子最小为最小为4颗，

8、颗，最小接触面积最小接触面积8100um2Head与与SR干涉时，干涉时，有有Bonding fail5s ACF，单根单根pin需求导电粒子需求导电粒子最小为最小为2颗，颗，最小接触面积最小接触面积5700um2For fine pitch，克服克服Head与与SR干涉时干涉时之之Bonding failForFinePitchITO、IZOITO3um3umMetal coated（plastic particle）Metal coated（plastic particle）15AUO Proprietary & ConfidentialAC-2051AC-986510s ACF，星状，星状，易重工，易重工，溢胶量大，溢胶量大，本压后压痕易识别本压后压痕易识别5s ACF，球形，纯镍，球形，纯镍，切割、重工较困难，切割、重工较困难，溢胶量小，溢胶量小，本压后压痕不易识别本压后压痕不易识别PCB ACF比较比较AC-9865Y本压后：淡