世界半导体生产机台安全设计验收标准

1、世界半导体生产机台安全设计验收标准精品汇编资料GlobalSemiconductorSafetyServices,LLCSEMIS2-93AProductSafetyAssessmentFinalReport世界半导体生产机台安全设计验收标准AppliedMaterialsChemicalMechanicalPolishingSystemModel:MirraTrakCMP：艺应用材料June19,1998Preparedfor:AppliedMaterials3111CoronadoDriveSantaClara,CA95054Preparedby:GlobalSemiconductorSa

2、fetyServices,LLC1313GenevaDriveSunnyvale,CA94089GS3JobNo.980029GS3DocumentNo.980029F2Client-Confidential保密合约TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterialsengineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.Thisinforma

3、tionwasgatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.Allobservationsandrecommendationsarebasedonconditionsa

4、nddescriptionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.Thisreport'ssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:MirraTra

5、k,andtothecomprehensivenessofthetests,examinationsand/orsurveysmade.ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServicesservicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServicesexpresswrittenconsent.Theserviceperformedhas

6、beenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServicesstaff.Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS

7、2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient.TABLEOFCONTENTS目录SectionPageNo.SectionMANAGEMENTSUMMARY摘要）SectionSCOPE（范围）SectionSYSTEMDESCRIPTIO湮统描述）SectionASSESSMENT&TESTINGMETHODOLOGffiS（?法）SectionSAFETYASSESSMENT（全评估）PURPOSE目的）SCOPE诡用范围）SAFETYPHI

8、LOSOPHYf全体系）GENERALGUIDELINES（旨导方针）SAFETY-RELATEDINTERLOCKS（全互锁）CHEMICALS化学品）IONIZINGRADIATIONNON-IONIZINGRADIATIONNOISE（噪音）VENTILATIONANDEXHAUST通风与排凤）ELECTRICALEMERGENCYSHUTDO蝌、停机）HEATEDCHEMICALBATHSHUMANFACTORSENGINEERINGROBOTICAUTOMATIONHAZARDWARNING（险警告）EARTHQUAKEPROTECTIONS警告）DOCUMENTATION（件）FI

9、REPROTECTION（消防保护）ENVIRONMENTALGUIDELINES（境方针）SectionRECOMMENDATIONSSection-ILLUSTRATIONSILLUSTRATION1-MirraTrakSystemLayoutATTACHMENTONE-SURFACELEAKAGECURRENTTES试）ATTACHMENTTWO-GROUNDINGRESISTANCE接EST阻测试）.ATTACHMENTTHREE-VERIFICATIONOFEMO长钮确认）ATTACHMENTFOUR-SOUNDPRESSURELEVELSUBVBY（）ATTACHMENTFIVE-

10、ERGONOMICCHECKLIST妁力检查表）ATTACHMENTSIX-MANUALHANDLINGLIFTANALYSIS作分析）ATTACHMENTSEVEINHAT-F”HAZARDANALYSIS（险分析）ATTACHMENTEIGHT-SEMIS10-1296RISKASSESSMENTGUIDELINEMETHO.D.O.L.OGYCONCLUSIO.N.SectionMANAGEMENTSUMMARYAfollow-upsafetyassessmentoftheAppliedMaterials'ChemicalMechanicalPolishingSystem,Mod

11、el:MirraTrak(hereafterreferredtoastheMirraTrak),wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthesystemwasperformedonJune3,1998.ApreliminaryevaluationofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996,andtheresultsofthisevaluationwerealsoutilizedinthisr

12、eport.Notethatthisreportcoversonlytheconcernsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra,whichtogetherformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS3Repor

13、tNo.970668TF,datedJanuary30,1998fortheFABSsystem;GSReportNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS3ReportNo.980094F,fortheOnTrakSynergyIntegra.)ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipmentandMaterialsInternationalSafetyGuidelinesforSemiconductorManufact

14、uringEquipment(SEMIS2-93AGuidelines).GShasusedtheSEMIS10-1296GuidelineMethodologytoperformaRiskAssessmentofanyIssuesremainingafterthereviewoftheinformationprovidedbyAppliedMaterials.NotethattheseveritywasrankedbyGS;theLikelihood(expectedrateofoccurrence)wasprovidedbyAppliedMaterials.Itemswhichwerera

15、nkedonlyasa接oWor搭light"riskassessmentcategorymaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10-1296Guidelines.DuringthesafetyassessmentofMirraTrak,GSidentifiedseveralpositiveengineeringdesigns,aswellasseveralissuesthatwillneedtobeaddressedinordertoachievefullcompl

16、iancewithSEMIS2-93AGuidelines.Thisdescriptionofbothpositiveengineeringdesignandnon-conformanceissuesarecomprehensivelydescribedinSectionofthisreport.ReferenceSectionforasummaryoftheoutstandingitems.SectionSCOPEGSwascontractedbyAppliedMaterialstoconductaSEMIS2-93AProductSafetyAssessmentoftheMirraTrak

17、.NotethatthisreportcoversonlytheadditionalconcernsraisedbyintegratingtheAppliedMaterialsFABSandMirraCMPandtheOnTrakSynergyIntegratogethertoformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS3ReportNo.970668T3F,datedJa

18、nuary30,1998fortheFABS;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMP;andGS3ReportNo.980094FfortheOnTrakSynergyIntegra).GSisajointventurepartnershipbetweenIntertekTestingServices,.,(ITS)andEnvironmentalandOccupationalRiskManagement,Inc.(EORM).GS3isfocusedonprovidingriskmanagement-basedequipme

19、ntsafetyconsultingandtestingservicestosupportabroadrangeofsafetyneedsspecifictosemiconductormanufacturingequipmentanddevicemanufacturers.TheMirraTrakwasevaluatedforcompliancewiththeapplicablecodesandrequirementsoftheUnitedStates.There-inspectionassessmentwasperformedbyMr.AndrewKileyandMr.MichaelVarg

20、aofGS3andreviewedbyMr.PavolBrederandMr.AndrewMcIntyre,CIH,alsoofGS3.Thesafetyassessmentwasbasedonanin-plantinspectionoftheMirraTrak,discussionswithMs.LisaPowellofAppliedMaterials,aswellasareviewofthesystem'smanuals.STANDARDSUSEDTheassessmentwasconductedinaccordancewiththeapplicableportionsofthef

21、ollowingcodesandstandards:A) SEMIS2-93A,SafetyGuidelinesForSemiconductorManufacturingEquipment(1996Edition)B) ANSI,MethodsfortheMeasurementofSoundPressureLevels(1986Edition)C)ANSI/UL1262,SafetyStandardforLaboratoryEquipment(ThirdEdition)D)ANSI/NFPA79,ElectricalStandardforIndustrialMachinery(1994Edit

22、ion)E)ANSI/NFPA70,NationalElectricalCode(1996Edition)F) UL50,SafetyStandardforEnclosuresforElectricalEquipment(TenthEdition)G) SEMIDoc.S8-95,SafetyGuidelineforErgonomics/HumanFactorsEngineeringofSemiconductorManufacturingEquipment.(1995Edition)H) SEMIS1-90,SafetyGuidelineforVisualHazardAlerts(1993Ed

23、ition)I) ANSI/UL73,SafetyStandardforMotor-OperatedAppliances(EighthEdition)J)ANSI/,SpecificationsforAcousticalCalibratorsK) 21CFR,CodeofFederalRegulations,Part1000to1050.L) ANSI/UL3101-1,SafetyStandardforElectricalEquipmentforLaboratoryUse(FirstEdition)M) SEMIS10-1296,SafetyGuidelinesforRiskAssessme

24、nt(1996Edition)TESTSPERFORMEDInordertoverifycompliancewithSEMIS2-93AGuidelinesandtheotherapplicablestandards,thefollowingtestswereperformed:A) SurfaceLeakageCurrentTestB) GroundingResistanceTestC) VerificationofEMOsD) SoundPressureLevelSurveyNotethatonlythetestsnotedabovewererepeated,asthetestingoft

25、heindividualassemblies(FABS,Mirra,andOnTrakSynergyIntegra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.SectionSYSTEMDESCRIPTIONTheMirraTrakconsistsofaFABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSynergyIntegra.Ano

26、peratorcanloaduptofour8”wafercassettesatthefrontoftheFABSmoduleatonetime.CassettesmaybemovedintopositionforhandlingbytheFABSusinganoptionalergoloaderorbymanualrotationofthecassette.TheFABSrobotthenpicksupthewafersfromthecassettes,placestheminanalignmenttool,andthenpassesthewaferstotheCMFPS.extendedr

27、obotwaferhandlingmoduleforconveyancetotheCMP.TheCMPsystemismodularandconsistsofawaferhandlingmodule(whichmovesbetweentheFABS,SynergyIntegra,andCMP),apolishingmodule,aslurrydeliverymodule,andacontrolsystemmodule.Thesystemusesde-ionizedwater,cleandryair(CDA),nitrogen,vacuum,andslurry.Theslurryisprovid

28、edbytheend-usertothesystemthroughabulkheadfacilityconnection.TheCMPisdesignedforoxideetchingandmetaletchingandisintendedforusewithavarietyofslurrychemistries,includingbasicandacidicslurries,butthissystemwasdesignedonlyfortheuseofapotassiumhydroxide(KOH)slurry,eventhoughotherchemistriescouldbeused.Th

29、ewaferhandlingmoduleisanexternalrobotictoolthatmanipulatesthewafercassettesfordeliverytothepolishingmodule.Thepolishingmoduleconsistsofthreepolishingheadsarrangedonamechanicalpositionercalledacarrousel.Apolishingheadpicksupawaferanddeliversittoapolishingpadwhereitispolished.Asthewaferispolished,thes

30、lurrydeliverymoduledispersesameasuredflowofslurry.Whenallpolishingstepsarecomplete,thecarouseltransfersthewaferbacktotheexternalCMProbotwhereitisdeliveredtotheOnTrakSynergyIntegra.TheOnTrakSynergyIntegraisadoublesidedwafercleanerusingoptionsforavarietyofchemicalprocesseswhichoperateinconjunctionwith

31、themechanicalprocesses.TheSynergyIntegrausesCDA,nitrogen,orargon.Italsouses.waterandammoniumhydroxide(NH4OH)ata2%or29%concentration.WhiletheSynergyIntegraisabletousehydrofluoricacid(HF)inoneofitsprocesses,thecurrentMirraTrakconfigurationisnotdesignedtouseHFandwasnotevaluatedforitsuse.TheSynergyInteg

32、raconsistsofaninputstation,twobrushstations,aspinstation,anunloadhandler,andanoutputstationwhichpassesthewafersbacktotheFABSwhichreturnsthewaferstotheiroriginalcassetteswheretheyareunloadedbytheoperator.FacilitiesRequirements:ElectricalPower:208VAC,200A,3phase,60Hz.ExternalFluids:Cleandryair:90-110p

33、si,cfmNitrogen:Vacuum:DI water:Slurry :90-110psi,1cfm25inch.Hg75psi,6gpm0-5psi,lpmSectionASSESSMENT&TESTINGMETHODOLOGIESThecriteriaforthisevaluationwasbasedupontheSemiconductorEquipmentandMaterialsInternationalSEMIS2-93AGuidelines.SEMIS2-93AGuidelinesareperformance-basedguidelinesdesignedtoident

34、ifypotentialhazardsduringtheoperationandmaintenanceofequipment,sothattheeffectivenessoftheAPPLICABLE SECTIONS Safety-Related Interlocks ChemicalsAudio NoiseVentilation and ExhaustNON-APPLICABLE SECTIONSengineeringcontrolsandfail-safesystemscanbemaximized.Theguidelinesaddressthefollowingaspects:Ioniz

35、ingRadiationNon-IonizingRadiationHeatedChemicalBathsRoboticsandAutomationElectricalEmergencyShutdownErgonomics/HumanFactorsHazardWarningEarthquakeProtectionDocumentationFireProtectionEnvironmentalThenon-applicablesectionsaresupportedbyengineeringrationaleprovidedwithinthisreport.Toverifycompliancewi

36、ththeapplicableguidelinesandstandards,thefollowingtestswereperformed.Thetestdatasheetsareincludedintheattachmentstothisreport.SurfaceLeakageCurrentTest(SectionofS2-93AandSectionofUL1262)-Surfaceleakagecurrentmeasurementsweremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximum

37、acceptablesurfaceleakagecurrentofmilliamperes.(AttachmentOne)GroundingResistanceTest(SectionofS2-93AandSectionofUL1262)-Groundingresistancemeasurementsweremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximumacceptablegroundpathresistanceofohm.(AttachmentTwo)VerificationofEMO/

38、Interlocks(Sectionsand-Withthesystemrunningatmaximumnormalload,theemergencyoffbuttonswereactivatedtoverifyproperoperation.(AttachmentThree)SoundPressureLevelSurvey(Section-SoundpressurelevelsweremeasuredperANSI(R1986),"MethodsfortheMeasurementofSoundPressureLevels."Soundpressurelevelswerer

39、ecordedwiththesystemrunningatmaximumnormalloadtoverifycompliancewiththemaximumacceptablenoiselevelof80dB(A).(AttachmentFour)Notethatonlythetestsnotedabovewererepeatedasthetestingoftheindividualassemblies(FABS,MirraandOnTrakSynergyIntegra)wasperformedasapartoftheindividualevaluationsforeach.Reference

40、theindividualreportsforeachfortestresults.SectionSAFETYASSESSMENTAnassessmentoftheMirraTrakwasperformedinaccordancewiththeSEMIS2-93AGuidelinesandotherapplicablestandardsnotedinSection(Scope).EXPLANATIONOFREPORTFORMATUnlessotherwisespecified,allreferencedsectionsbelowrefertotheSafetyGuidelinesforSemi

41、conductorManufacturingEquipment(SEMIS2-93AGuidelines).ThereportstructureismodeledafterthedocumentationrequirementsofSEMIS2-93AGuidelines.EachparagraphoftheSEMIS2-93AGuidelinesiseitherpresentedverbatimorparaphrasedinaboxontheleftofthepage.TheparagraphsfromtheSEMIS2-93AGuidelinesarepresentedwiththeirc

42、orrespondingnumbersfromtheGuidelines,withtheexceptionthatthesenumbersareproceededbya"5.".DirectlytotherightofthisboxisasecondboxwhichisusedtoindicatethestatusoftheequipmentwithrespecttothegivenrequirementoftheGuidelines.SEMIS2-93AParagraphNo.(precededby"5.")Statementoftherequirem

43、ent.MEETSISSUEINFOREQUIREDRESPONDEDN/AADD口REFBelowtheseboxes,anexplanationisgivenwhichexplainswhythatparticularstatusboxwaschecked.Thisexplanationtakesoneofthefollowingnineformswhichcorrespondtotheninestatusboxesabove.MEETSAsectionmarked"MEETS"withrespecttoagivenparagraphoftheGuidelinessig

44、nifiestheconstructionfeaturescriticaltocompliancewiththeSEMIS2-93Acriteriaweredirectlyobservedbytheengineerduringtheevaluation.Thesecriticalfeaturesareidentifiedanddescribed.ISSUESIfaconstructionfeaturedoesnotmeetthespecifiedparagraph,thewayinwhichitdeviatesfromtheGuidelinescriteriaisdescribed.ISSUE

45、SwererankedusingariskassessmentmethodologybaseduponSEMIS10-1296.EachitemwasassignedanoverallriskrankingbaseduponadeterminationoftheseverityofthehazardposedbytheIssueandthelikelihoodthatthehazardwouldoccurresultinginahazardousconsequence.,injury,equipmentdamageorenvironmentalhazard).Issueswith接oWor措l

46、ight"riskassessmentcategoriesmaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10-1296Guideline.AsummaryoftheriskassessmentmethodologyusedforthisevaluationisincludedinAttachmentEightofthisreport.INFORMATIONREQUIRED(INFOREQUIRED)Ifinadequateinformationisavailabletodet

47、erminecomplianceornon-compliance,then"INFORMATIONREQUIRE"Dismarked.Theadditionalinformationwhichisneededtoevaluatethesystemisalsoidentified.RESPONDEDIftheoriginalevaluationrevealedthatthesystemdoesnotmeetaparticularrequirementoftheGuidelinesandthemanufacturerhascommittedtomakingsuitablecha

48、ngeswhichwillbringthesystemintocompliance,thenthisparticularrequirementoftheGuidelinesismarked"RESPOND.E"DThe"RESPOND"EDdesignationrequiresthatthemanufacturer'scorrectiveactionadequatelyaddresstheissuesraisedintheoriginalevaluation.Also,themanufacturermustcommittoanactiondate

49、bywhichtheconstructionchangeswillbefullyimplemented.All"RESPOND"EDsectionswilldescribetheoriginalissuesraised,theconstructionchangesproposedbytheequipmentmanufacturer,andthedatebywhichthosechangeswillbeimplemented.NON-APPLICABLE(N/A)AnyrequirementsoftheGuidelineswhichdonotapplytoaparticula

50、rsystemareidentifiedas"NON-APPLICABL."EADDRESSED(ADD)IftherequirementsstatedinagivenparagraphoftheGuidelinesaremoreappropriatelydiscussedindetailunderanothersection,thenthissectionoftheGuidelinesisidentifiedas"ADDRESSE."DTheparagraphunderwhichtheseissuesarediscussediscitedforrefe

51、rencepurposes.REFERENCEONLY(REF)SomeparagraphsoftheGuidelinespresentdefinitionsonsafetyorphilosophyandareforreferenceonly.Therearenospecificrequirementsdesignatedbytheseparagraphs.Allsectionsofthistypearemarked"REFERENCEON."LYPURPOSE-Theseguidelinesareintendedasaminimumsetofperformancebase

52、denvironmental,healthandsafetyconsiderationsforequipmentinsemiconductormanufacturing.MEETSISSUEINFOREQUIREDRESPONDEDN/AADD口REFXREFERENCEONLYAnassessmentofAppliedMaterials'MirraTrak,wasconductedinaccordancewiththeSafetyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines)basedons

53、oundengineeringanddesignpractices.ReferenceswerealsomadetoanyknownapplicableIndustrySafetyStandards,Building,Fire,andElectricalCodes,aswellasanyGovernmentRegulatoryRequirements.SCOPE-Theseguidelinesapplytoequipmentinthemanufacturing,metrology,assemblyandtestingofsemiconductorproducts.MEETSISSUEINFOR

54、EQUIREDRESPONDEDN/AADD口REFXREFERENCEONLYTheintegrationoftheindividualmodules(FABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSynergyIntegra)wasevaluatedagainsttheSEMIS2-93AGuidelinesandotherapplicablestandards.SAFETYSAFETYSAFETYPHILOSOPHY-Theseguidelinesshouldbeusedtohelpeli

55、minateknownsafetyandhealthhazardsinherentintheoperationandmaintenanceofprocessequipment.Industrystandards,building,electricalandfirecodes,governmentregulatoryrequirements,andgoodpracticeshouldbeconsideredinallequipmentdevelopmentprograms.MEETSISSUEINFOREQUIREDRESPONDEDN/AADD口REFXREFERENCEONLYTheinte

56、ntofSEMIS2-93AGuidelinesistominimizeoreliminateknownsafetyandhealthhazardsbyhavingthemanufacturerdesigntheequipmentwiththeapplicableindustrialsafetystandards,codes,andregulatoryrequirementsinmind.Aspartofthissafetyassessment,GShasevaluatedtheMirraTrakagainstseveralapplicablestandards,codes,andregula

57、toryrequirements,asnotedinSection"SCOPEofthisreport.ResultsofourfindingsaresummarizedinthisS2-93AEngineeringReport.-Nosinglepointfailureoroperationalerrorshouldallowimmediateexposuresituationofpersonnel,facilitiesorcommunitytohazardsordirectlyresultininjury,deathorequipmentloss.Allequipmentshou

58、ldbefail-safeorofafault-tolerantdesign.MEETSISSUEINFOREQUIREDRESPONDEDN/AADDXREFADDRESSED-Thefollowingareasofconcernintheoperationandmaintenanceoftheequipmentareaddressed:Chemicalshazards/Radiationhazards/Electricalhazards/Physicalhazards/Mechanicalhazards/Environmentalhazards/Fireandexplosions/Seismicactivityhazards/VentilationandErgonomics.MEETSISSUEINFOREQUIREDRESPONDED口N/A.ADD.REFXREFERENCEONLYThisS2-93AEngineeringReportdocumentsanyapplicablesafetyconcernsrelatingtothesemicon