ASM自动焊线机器介绍Auwirebondingrocess课件

1、Section 9.3 Basic Au Wire Bond Process9/27/20221 ASM Pacific Technology Ltd. 2009 Section 9.3 Basic Au Wire ContentsBasic IntroductionGold Wire BonderBonding SequenceMaterial & ToolsBond Quality9/27/20222 ASM Pacific Technology Ltd. 2009 ContentsBasic Introduction9/26Basic IntroductionUnderstand an

2、IC PackageIC Manufacturing FlowWire Bonding Introduction9/27/20223 ASM Pacific Technology Ltd. 2009 Basic IntroductionUnderstand aCross-section of an IC PackageDieGold WireLead Frame9/27/20224 ASM Pacific Technology Ltd. 2009 Cross-section of an IC PackageWafer GrindingDie BondingWafer SawToaster Wi

3、re Bonding Die Surface Coating Molding Laser MarkSolder BallPlacement SingulationPackingIC Manufacturing FlowDejunk TrimSolder PlatingSolder PlatingForming/SingulationTrim/Forming BGASURFACEMOUNTPKGTHROUGHHOLE PKG9/27/20225 ASM Pacific Technology Ltd. 2009 Wafer GrindingDie BondingWaferGold Wire Bon

4、dingDie PadLeadGold wireBall Bond( 1st Bond )Wedge Bond( 2nd Bond )9/27/20226 ASM Pacific Technology Ltd. 2009 Gold Wire BondingDie PadLeadGoWedge Bonding9/27/20227 ASM Pacific Technology Ltd. 2009 Wedge Bonding9/26/20227 ASM PaWhat technique is used in Gold Wire Bonding?9/27/20228 ASM Pacific Techn

5、ology Ltd. 2009 What technique is used in GoldWire Bonding TechniquesThere are three basic wire bonding techniques:Thermosonic bonding: utilizes temperature, ultrasonic and low impact force, and ball/ wedge methods.Ultrasonic bonding: utilizes ultrasonic and low impact force, and the wedge method on

6、ly.Thermocompression bonding: utilizes temperature and high impact force, and the wedge method only. 9/27/20229 ASM Pacific Technology Ltd. 2009 Wire Bonding TechniquesThere aThermocompression vs ThermosonicThermocompression welding usually requires interfacial temperature of the order of 300C. This

7、 temperature can damage some die attach plastics, packaging materials, and laminates, as well as some sensitive chips. Thermosonic welding, the interface temperature can be much lower, typically between 100 to 150C, which avoids such problems. The ultrasonic energy helps disperse contaminates during

8、 the early part of the bonding cycle and helps complete the weld in combination with the thermal energy. 9/27/202210 ASM Pacific Technology Ltd. 2009 Thermocompression vs ThermosonAdvantages of ThermosonicMetallurgical joining is more reliable than conductive particles and adhesive joining. Process

9、cycle time can be reduced from several minutes to less than 10 seconds.Lower manufacturing cost per unit. 9/27/202211 ASM Pacific Technology Ltd. 2009 Advantages of ThermosonicMetalWirebondingOperating TemperatureWire MaterialsPad MaterialsNoteThermo-compression300-500CAuAl, AuHigh pressure, no ultr

10、asonic energyUltrasonic25CAu, AlAl, AuLow pressure in ultrasonic energyThermosonic100-240CAu, CuAl, AuLow pressure in ultrasonic energyComparison of Different Wire Bonding Techniques9/27/202212 ASM Pacific Technology Ltd. 2009 WirebondingOperating TemperatWhat are the important parameters in Gold Wi

11、re Bonding?9/27/202213 ASM Pacific Technology Ltd. 2009 What are the important parametBonding ParametersThermosonic Bonding Pressure (Force)Amplify & Frequency (Power 138KHz)Welding Time (Bond Time)Welding Temperature (Heater) High Power3.2W maxLow Power1.6W maxUltra-Low Power0.8W maxPower-mWVib.-um

12、Power-mWVib.-umPower-mWVib.-um32003.2116002.268001.599/27/202214 ASM Pacific Technology Ltd. 2009 Bonding ParametersThermosonic SiO2Si Bonding PrincipleAlPressure(Force)Vibration(Power)ContaminationMoisture Al2O3GlassHeat9/27/202215 ASM Pacific Technology Ltd. 2009 SiO2Si Bonding PrincipleAlPresNext

13、 to Gold Wire Bonder9/27/202216 ASM Pacific Technology Ltd. 2009 Next to Gold Wire Bonder9/26/2Gold Wire BonderMachine RoadmapUnderstand Individual PartMachine SpecificationBonding Temperature9/27/202217 ASM Pacific Technology Ltd. 2009 Gold Wire BonderMachine RoadmaASM Gold Wire Bonder RoadmapMachi

14、ne Model (ATS)AB308AB309AB309AAB339AB339EagleEagle60 Eagle60AP Harrier Twin Eagle HummingBird Eagle50?9/27/202218 ASM Pacific Technology Ltd. 2009 ASM Gold Wire Bonder RoadmapMaASM Gold Wire Bonder Machine Model (ATS) DescriptionEagle60-00IC ApplicationsEagle60-01TO-92Eagle60-02Opto (Bent Leadframe)

15、 ApplicationsEagle60-03Vertical LED or Opto ApplicationsEagle60-08Power & Hybrid Device ApplicationsEagle60-09Power & Hybrid Device Applications9/27/202219 ASM Pacific Technology Ltd. 2009 ASM Gold Wire Bonder Machine MMatchingEagle60APEagle60-03HummningBirdHarrierTwin Eagle . . . . .ACEDB9/27/20222

16、0 ASM Pacific Technology Ltd. 2009 MatchingEagle60AP .ACEagle60AP Machine Introduction9/27/202221 ASM Pacific Technology Ltd. 2009 Eagle60AP Machine IntroductionEagle60 vs Eagle60APEagle60Eagle60APFine pitch 35 m.30 m.Speed 60+ ms.60 ms.BondheadDigital bondheadNew bondhead with 810% faster Bond Plac

17、ement Accuracy 3 m 3 sigma 2.5 m 3 sigmaLoop TypesStandard looping databaseAdditional Escargot, Flex, Bell loopOpticsProgrammableBall Formation MonitoringStandard8x fasterCapacitance non-stick detectionStandard10 x faster9/27/202222 ASM Pacific Technology Ltd. 2009 Eagle60 vs Eagle60APEagle60EaLow i

18、mpact forceReal time Bonding Force monitoringHigh resolution z-axis position with 0.4 micron per encoder stepFast contact detectionSuppressed Force vibration & Fast Force responseFast response voice coil wire clampBond Head ASSY9/27/202223 ASM Pacific Technology Ltd. 2009 Low impact forceBond Head A

19、SSYX Y TableLinear MotorHigh power AC Current AmplifierDSP based control platformHigh X-Y positioning accuracy of +/- 3 um3 sigmaResolution of 0.2 um per encoder step9/27/202224 ASM Pacific Technology Ltd. 2009 X Y TableLinear Motor9/26/2022W/H ASSYIndexing resolution of 1um per encoder stepFully pr

20、ogrammable indexer & tracksMotorized window clamp with soft close featureOutput indexer with leadframe jam protection featureTool less conversion window clamps and top plate enables fast device9/27/202225 ASM Pacific Technology Ltd. 2009 W/H ASSYIndexing resolution ofBonding SystemBonding Method The

21、rmosonic (TS)BQM ModeMulti-mode with programmable BQM BdWire Size15.2um up to 76.2um (Au, Cu)Wire Length0.6 to 8mmBonding Accuracy+/- 2.5um 3 sigmaBonding Area54mm X 65mm (LF Width 72mm) 54mm X (137-LF Width)mmBonding Speed+60ms for 2mm Wire (Q loop)Bond Force Range1400 gramLoop TypeQ-Auto, Square &

22、 PentaLoop Height Range316 milXY Resolution 0.2 umZ Resolution0.4 umFine Pitch Capability30 um pitch 0.6 mil wireNo. of Bonding Wiresup to 3000Program Storage1000 programs on Hard DiskTransducer System138KHZEagle60AP Machine Specifications (1)9/27/202226 ASM Pacific Technology Ltd. 2009 Bonding Syst

23、emEagle60AP MachinVision SystemPattern Recognition Time60 ms / pointPattern Recognition Accuracy 0.37 umLead Locator Detection12 ms / lead Minimum Lead Pitch80 umPost Bond Inspection1st , 2nd Bond and Wire TracingDepth of Field3.5X(320um) 8X(100um)FacilitiesSingle Phase 110 VAC (optional 100/120/200

24、/210/220/230/240 VACFloor Spacing 720mm (width) X 820mm (length) X 1600mm (height) Eagle60AP Machine Specifications (2)9/27/202227 ASM Pacific Technology Ltd. 2009 Vision SystemEagle60AP MachineMaterial Handling SystemIndexer Resolution1umLeadframe Position Accuracy2 milApplicable Leadframe W = 23 9

25、0 mm bonding area in Y = 65mm L = 140 295 mm T = 0.1 0.8 mmApplicable Magazine W = 16 100 mm (Maximum) L = 140 295 mm H = 180 mm (Maximum)Magazine Pitch 2.4 10 mm (0.09” 0.39 “)Device Changeover 4 minutes (within same LF type)Package Changeover 1000,490/1004,8,1175%)9/27/2022122 ASM Pacific Technolo

26、gy Ltd. 2009 Inter-metallic at Gold BallPooInter-metallic Layer ThicknessX= Kt1/2Where X is the inter-metallic layer thickness, t is the time and K is the rate constant which is calculated by following:K=Ce-E/KTWhere C is the rate constant, e is the activation energy, K is the Boltzman constant, and

27、 T is the temperature in absolute scale.9/27/2022123 ASM Pacific Technology Ltd. 2009 Inter-metallic Layer ThicknessCBall bondTest specimenSpecimen clampShearing ramWireBond shoulderInterfacial contactball bond weld areaBonding padh(A) UnshearedCLCBall bondCLTest specimenSpecimen clampBonding padFul

28、l ball attached to wire-except for regionsof intermetallic voidingBall separated at bonding pad-Ball interface-residual intermetallic (and sometimes portion of unalloyed ball and metal) on pad in bond interaction area(D) Ball bond-bonding pad interface separation (typical Au to Al)CTest specimenSpec

29、imen clampShearing ramWireMinor fragment of ballattached to wireBonding padCLBall sheared too high(off line, etc.)only aportion of shoulder andball top removedInterfacial contactball bond weld area(B) Wire (ball top and/or side) shearCBall bondCLTest specimenSpecimen clampShearing ramBonding padMajo

30、r portion of ball attached to wireInterfacial contact-ball bond weld area intact(C) Below center line shear, ball sheared through (typically Au to Au)CBall bondCLTest specimenSpecimen clampBonding padPad metallization separates fromunderlying surfaceResidual pad on ball ball-pad interfaceremains int

31、act(E) Bond pad liftsTest specimenSpecimen clampCBall bondCLBonding padBonding pad lifts, taking portion of underlying substrate material with it(F) CrateringResidual pad and substrate attachedto ball,ball-pad interface remainsintactShear Failure Modes9/27/2022124 ASM Pacific Technology Ltd. 2009 CB

32、all bondTest specimenSpecimeNormal Condition9/27/2022125 ASM Pacific Technology Ltd. 2009 Normal Condition9/26/2022125 AMaterial Problem9/27/2022126 ASM Pacific Technology Ltd. 2009 Material Problem9/26/2022126 AWith BallWirePad SizeMissing BallWire BrokenBonding Ball InspectionBall Detection 9/27/2

33、022127 ASM Pacific Technology Ltd. 2009 With BallWirePad SizeMissing BBall Size Pad CenterBall CenterBall Placement (X,Y)Ball Off Pad Bonding Ball Inspection (cont.)Ball Measurement 9/27/2022128 ASM Pacific Technology Ltd. 2009 Ball Size Pad CenterBall Cente Peeling1st Bond Fail ( 1 )Possible Causes

34、:Power too muchBase Force not enoughAl pad not fully cured or contamination between Al and oxide layer9/27/2022129 ASM Pacific Technology Ltd. 2009 Peeling1st Bond Fail ( 1 )Pos Ball Lift1st Bond Fail ( 2 )Ball LiftBall Lift With Pad PeelingPossible Causes:Base Power not enoughMaterial problem 9/27/

35、2022130 ASM Pacific Technology Ltd. 2009 Ball Lift1st Bond Fail ( 2 )B1st Bond Fail ( 3 )Neck CrackPossible Causes:RD too highRH too lowWrong / over used capillaryWire Clamp gap too smallWire problemEFO Current too large 9/27/2022131 ASM Pacific Technology Ltd. 2009 1st Bond Fail ( 3 )Neck CrackPOff

36、 Center BallPossible Causes:Tail Length too longWire or Wire Path contaminationEFO Box or cable connection problemAir Tensioner flow too low 1st Bond Fail ( 4 )Off Center Ball (Golf Ball)9/27/2022132 ASM Pacific Technology Ltd. 2009 Off Center BallPossible Causes1st Bond Fail ( 5 ) Smash BallPossibl

37、e Causes:Tail Length too shortWire or E-torch contaminationTip of tail length swing away from E-torch Smash Ball9/27/2022133 ASM Pacific Technology Ltd. 2009 1st Bond Fail ( 5 ) Smash Ball1st Bond Fail ( 6 )Missing BallPossible Causes:Tail Length too shortFire Level too low or too highE-torch tip di

38、rty2nd Bond Power / Force / Search Speed too high 9/27/2022134 ASM Pacific Technology Ltd. 2009 1st Bond Fail ( 6 )Missing BalWith WeldWireCapillary MarkMissing WeldBroken WedgeLeadSufficient Wedge Width & LengthSecure Tool ImpressionNo Fish TailNo Damage / Broken WedgeBonding Weld InspectionWeld De

39、tection9/27/2022135 ASM Pacific Technology Ltd. 2009 With WeldWireCapillary MarkMisBroken WedgePossible Causes:2nd Bond Power / Force too highLead clamping not enough2nd Bond Fail (1)Broken Wedge9/27/2022136 ASM Pacific Technology Ltd. 2009 Broken WedgePossible Causes:2nPossible Causes:Lead floating

40、 or contamination2nd bond time, power, force too smallOver used capillary2nd Bond Fail (2)Lift Stitch9/27/2022137 ASM Pacific Technology Ltd. 2009 Possible Causes:2nd Bond Fail Possible Causes:Capillary Geometry2nd bond time, power, force too smallOver used capillary2nd Bond Fail (3)Stitch Peeling9/

41、27/2022138 ASM Pacific Technology Ltd. 2009 Possible Causes:2nd Bond Fail Wire ShortPossible Causes:Capillary GeometryWire Path problemSecond Bond parametersAir Tensioner problem Looping Fail ( Wire Short 1 )Wire Sway9/27/2022139 ASM Pacific Technology Ltd. 2009 Wire ShortPossible Causes:LoopWire Sh

42、ortPossible Causes:Capillary GeometryWire Clamp Gap too bigTail BentAir Tensioner Force not enough Looping Fail ( Wire Short 2 )Loop Base Bent9/27/2022140 ASM Pacific Technology Ltd. 2009 Wire ShortPossible Causes:LoopWire ShortPossible Causes:Capillary GeometrySearch Delay setting not optimizedBase

43、 strength too weak, increase RD Looping Fail ( Wire Short 3 )Excessive Loop9/27/2022141 ASM Pacific Technology Ltd. 2009 Wire ShortPossible Causes:LoopPossible Causes:Floating leadsFriction along wire pathTrajectory selection is not goodWire on capillary is not good Looping Fail ( Inconsistent )Inco

44、nsistent Looping9/27/2022142 ASM Pacific Technology Ltd. 2009 Possible Causes:Looping Fail (Critical Parameters for Bonding Bond Parameter Contact Time、Power、Force (for 1st & 2nd Bond) Base Parameter Base Time、Power、Force (for 1st & 2nd Bond) Reference Parameter Search Height、Search Speed (for 1st & 2nd Bond) EFO Parameter Ball Size、FAB Size、EFO