smt表面安装技术缺陷市公开课一等奖省赛课获奖课件

/10/101SMTdefectsandcountermeasureSMT缺点及防范办法smt表面安装技术缺陷第1页/10/102IdentifySMTdefectsIdentifytheSMTdefectsaccordingtoIPC-A-610(Rev:D)依据IPC-A-610(Rev:D)确定缺点．

Thisstandardisacollectionofvisualqualityacceptabilityrequirementsforelectronicassemblies.IPC-A-610是关于电子组装外观质量验收条件要求文件．smt表面安装技术缺陷第2页/10/103Majorcontributortodefects

缺点主要分布Source:MPM’sAuser’sguidetomorePreciseSMTprintingsmt表面安装技术缺陷第3页/10/104Knowthecommondefect

了解常见缺点类型Analysizethepossiblecause

分析可能原因Countermeasureforthedefects

基于以上原因采取对策

LearningObjectives

学习目smt表面安装技术缺陷第4页/10/105•

Chip

components

standing

on

a

terminal

end

(tombstoning).片式元件末端翘起（墓碑）Tombstoning/立碑smt表面安装技术缺陷第5页/10/106Countermeasure/对策Mechanism:Surfacetensionincomponentterminalisuneveninreflow.原理:在回流过程中零件两末端表面张力不均衡.1.Componentterminalheatdistributedunevenly零件两末端受热分布不均衡.Insufficientsoaktime:Reflowprofileoptimization.

保温区时间太短:优化回流曲线参数.2.PCBPaddesignissue(thepadsdistanceistoobig):improvePCBpaddesign.PCB焊盘设计问题(焊盘间距太大):改进PCB焊盘设计.Tombstoning/立碑smt表面安装技术缺陷第6页/10/107Countermeasure/对策

3.Componentterminaloxidizationorcontamination:SolderabilitytestifnecessaryandRTVthedefectmaterial.

元件末端氧化或者受污染:依据情况做可焊性试验而且退还缺点物料.4.Printingmisalignment:adjustprintingmachineparameters.丝印偏位:校正丝印机参数.5.Placementmisalignment:OptimizetheP&Pmachineparameters.

贴片偏位:优化贴片机参数.6.Stencilaperturedesignissue:studyandimprovetheaperturedesign.

钢网开孔设计问题:研究而且改进开孔设计.

Tombstoning/立碑smt表面安装技术缺陷第7页/10/108•Asolderconnectionacrossconductorsthatwasjoined.焊锡在导体间非正常连接.•Solderhasbridgedtoadjacentnon-commonconductororcomponent.焊锡桥连到相邻非导体或元件.Solderbridge/桥联smt表面安装技术缺陷第8页/10/109Countermeasure/对策

1.Screenprintingissue/丝印问题:a)PasteheightoutofUCL:Adjusttheprintertocontrolthepasteheight.锡膏高度超出控制上线:校正丝印机,控制锡膏高度.b)Pasteprintingmisalignmentorbridging:Finetuneprintingmachine./锡膏印刷偏位或者桥联:优化丝印机.c)Icicleprinting:Finetuneprintingmachineorchangetolowerviscositypaste.丝印拉尖:优化丝印机或者使用低粘性锡膏.d)Solderpastecollapse:changetohigherviscositypaste./锡膏塌陷:使用高粘性锡膏.e)Nonstandardstencilapertureopening:Studyandimprovetheaperture./不标准钢网开孔:研究并改进开孔.Solderbridge/桥联Icicleprinting丝印拉尖Pastecollapse锡膏塌陷Bridging桥联Misalignment印刷偏位smt表面安装技术缺陷第9页/10/1010Countermeasure/对策2.Pick&Placement/贴片a)Componentplacingmisalignment:FinetunetheP&Pmachine.元件贴片偏位:优化贴片机参数.b)Highpressureforplacement:reducepressuretopropervalue.

贴片压力过大:降低压力到适当参数.3.Wavesoldering/波峰焊a)Lowconveyorramp:Raisetheconveyorrampperactualstatus.传送带角度过小:依据实际情况加大传送带角度b)Lessfluxonboard:Increasethefluxsprayvolumeonboardbeforegoingthroughwavesoldering.板上助焊剂较少:波峰焊接之前加大助焊剂喷射量Solderbridge/

桥联smt表面安装技术缺陷第10页/10/1011Componentdamaged(Nicks,cracks,orstressfractures)/元件损坏Nicks,cracks,orstressfractures.缺口，裂纹，压痕smt表面安装技术缺陷第11页/10/1012Countermeasure/对策1.Rawmaterialdamaged:purgethebatchmaterial./来料损坏:去除这批来料.2.DamagedduringSMTprocess(Fixtureormachinetouchit):Investigateandtakecorrectiveactionsfornonstandardoperation.

在SMT流程中损坏(夹具和设备接触):调查分析而且对不规范操作作出矫正行动.3.Fastcoolingrateonreflowprocess:Controlthecoolingratetobelow4degreepersecond.

在回流过程中冷却速率过快:控制冷却速度使斜率保持在每秒4度以下.Typicalreflowprofile/回流曲线典例:PreheatstageSoakstageReflowstagePeaktemp.Cooldown<4oC/sComponentdamaged(Nicks,cracks,orstressfractures)/元件损坏smt表面安装技术缺陷第12页/10/1013Misalignment偏位smt表面安装技术缺陷第13页/10/1014Countermeasure/对策1.P&Pmachinefunctionunstable:FinetunetheP&Pmachine.

贴片机性能不稳定:优化贴片机性能参数.a)FinetuneX,Ydata/调整X,Y坐标b)Optimizepickandplacementparameters./校正吸料和贴片参数.

2.Componentterminationoxidization:Solderabilitytestifnecessary.Purgethefailedmaterial/元件末端氧化:可焊性试验,去除不合格来料.

3.Operatortouchthecomponentpriortoreflow:Standardizetheoperatorhandling(documentcontrol)/在回流炉前目检操作员碰到贴片元件:标准化操作员操作(文件控制)4.Airflowrateinthereflowovenissohighthatthecomponentsaremoved.回流炉内空气流量太高以致吹偏了元件.Misalignment偏位smt表面安装技术缺陷第14页/10/1015Componentleadlifted元件引脚翘高One

leadorseriesofleadsoncomponentisoutofalign-ment

and

fails

to

make

contact

with

the

land.元件一个或多个引脚变形不能与焊盘正常接触．smt表面安装技术缺陷第15页/10/1016Componentleadlifted元件引脚翘高Countermeasure/对策1.Componentleadbentbeforeplacement:Sortthedefectivepartandreturnittovendor.贴片前元件引脚变形:挑选出缺点元件,退回供给商．2.Manualplacementtheloosepart:Inspectthepartbeforepassittoreflow.手放散料:回流前目检．smt表面安装技术缺陷第16页/10/1017Solderball锡珠Solderballsarespheresofsolderthatremainafterthesolderingprocess.Solderballsviolateminimumelectricalclearance.焊锡球是焊接后形成呈球状焊锡.

Solderfinesaretypicallysmallballsoftheoriginalsolderpastemetalscreensizethathavesplatteredaroundtheconnectionduringthereflowprocess.焊锡残渣是在回流中形成小球状或不规则状焊锡球.smt表面安装技术缺陷第17页/10/1018Solderball锡珠

Countermeasure/对策1.StencilAperturedonotfocustopad:improvestencilapertureopening.

钢网开孔没有对准焊盘中心:改进钢网开孔.2.Printingmisalignment:Finetuneprintmachine.

丝印偏位:调整丝印机状态.3.Excesspaste:Cpkcontrol.多锡:Cpk控制.4.DampPCB:BakethePCBbeforeloadingittoSMT.PCB焊盘受潮:SMT组装流程之前烘烤PCB.6.Stencilpolluted:cleanthestencil.钢网脏污:清洗钢网.7.Profilerampupistoofast:Optimizereflowprofile.

回流曲线升温速度过快:优化回流曲线.8.Pasteoxidized:exchangewithfreshsolderpaste.锡膏氧化:更换新锡膏.9.Chipwaveorsolderwaveheightistoohighcausedexcesssoldertotopside:adjustthewavesolderingheighttoproperlevel(wavesolder).

波峰高度设置太高致使多出焊锡到顶面:校正波峰焊设置到适当高度

(波峰焊接).smt表面安装技术缺陷第18页/10/1019Non-Wetting,Dewetting/虚焊，半润湿

•

Solder

has

not

wetted

to

the

land

or

termination

where

solderisrequired.

虚焊:需要焊接引脚焊盘不润湿．

•Solder

coverage

does

no

meet

requirements

for

the

termination

type.

•

Dewettingasaconditionresultswhenmoltensoldercoatsasurfaceandthenrecedestoleaveirregularly-shapedmoundsofsolderthatareseparatedbyareasthatarecoveredwithathinfilmofsolderandwiththebasismetalorsurfacefinishnotexposed.

半润湿:熔化焊锡浸润表面后收缩,留下一焊锡薄层覆盖部分区域,焊锡形状不规则.smt表面安装技术缺陷第19页/10/1020Non-Wetting,Dewetting/虚焊，半润湿1.Poorsolderabilityofcomponentorpad./元件或焊盘可焊性太低Rootcause:a)OlddatecomponentorPCB./陈旧元件或PCB板b)ContaminationoroxidationoncomponentorPCB.元件或焊盘污染或氧化Action:Purgethematerialforfurtherdisposition.

/去除来料2.Thepasteoutofitslifetime:/锡膏超出使用期Scrapthelotpasteandreplaceitwithfreshone报废有问题锡膏更换新锡膏smt表面安装技术缺陷第20页/10/1021Coldsolder/冷焊

•Incompletereflowofsolderpaste.焊锡回流不完全smt表面安装技术缺陷第21页/10/1022Coldsolder/冷焊

Countermeasure/对策1.Peaktemperatureistooloworreflowtime(dwelltime)

isnotenough:Re-setuptheprofiletofulfillthepastespecorcustomerprovidedspec.requirement.回流峰值温度太低或者回流时间不够:重设温度曲线图.Typicalreflowprofile:/经典回流曲线PreheatstageSoakstageReflowstagePeaktemp.Cooldown<4oC/ssmt表面安装技术缺陷第22页/10/1023Time时间Temp.温度230°C250°Ctc1–smallSMDtc1–mediumSMDtc3–largeSMD20°C20°CTooHot!TooCold!Peak:230–250°CColdsolder/冷焊smt表面安装技术缺陷第23页/10/1024Coldsolder/冷焊

Countermeasure/对策2.Thecomponentinsomelocationcoveredwithreflowpallet(Peaktemperatureistooloworreflowtime(dwelltime)

isnotenough):EnlargethepalletopenwindowforthedefectlocationstoreducetheΔT.一些元件位置被回流托盘遮挡造成该点峰值温度太低或回流时间不足:

对缺点位置放大托盘开口从而降低温差（ΔT）.

smt表面安装技术缺陷第24页/10/1025Solderhole/锡洞

•Blowholes,pinholes,voids吹孔,针孔,空洞smt表面安装技术缺陷第25页/10/1026Solderhole/锡洞

Countermeasure/对策1.Insufficientpreheat:Reflowprofileoptimize.预热时间不足:优化回流曲线设置.2.Rampupistoofast:Re-setupthereflowprofiletomakeitoptimize.

升温速率太快:重设回流曲线图使之最优化.3.Excessfluxinsolderpaste:properlytoincreasepreheattimeandtemperature.

锡膏助焊剂含量过多:适当增加预热时间和温度值.4.DampPCB:BakethePCBbeforeloading

ittoSMT.

PCB受潮:SMT组装前烘烤PCB板.5.Componentfeetoxidation:BakeitbeforeSMTorrequirevacuumpackingonincomingmaterial.元件脚氧化:烘烤或者来料真空包装.6.Attachedfluxresidueoncomponentfoot:Sortoutthedefectpart.

元件脚有助焊剂残渣:挑选出缺点来料.

smt表面安装技术缺陷第26页/10/1027DisturbedSolder/焊锡紊乱

•Disturbed

solderjointcharacterizedbystresslinesfrommovementintheconnection.在冷却时受外力影响,展现紊乱痕迹焊锡smt表面安装技术缺陷第27页/10/1028DisturbedSolder/焊锡紊乱Countermeasure1.Optimizereflowsoldering

profileespeciallyforcoolingzone.优化冷却区回流曲线2.ConveyorshakinginPCAcoolingdownphase:Repairthe

conveyorperactualstatus.冷却阶段传送带震动:依据实际情况调校传送带．smt表面安装技术缺陷第28页/10/1029SolderProjections/锡尖Solderprojectionviolatesassemblymaximumheightrequirementsorleadprotrusionrequirements.焊锡毛刺违反组装最大高度要求或引脚凸出要求.Solderprojectionviolatesminimumelectricalclearance.焊锡毛刺违反最小电气间隙.smt表面安装技术缺陷第29页/10/1030SolderProjections/锡尖Countermeasure1.Lessfluxonboard:Increasethefluxsprayrateonboardbeforegothroughwavesoldering(wavesolder).助焊剂不足:增加助焊剂喷射量

2.Lowconveyorramp:Raisetheconveyorrampperactualstatus(wavesolder).传送带角度过小:依据实际情况校正传送带角度3.Excesspreheattemperatureandtime(fluxdryoff):Optimizewavesolderingprofile.(Wavesolder)预热过分（助焊剂过分挥发）:优化波峰曲线(波峰焊)4.Causedbyrework:Standardizeoperatorhandlingandenhancevisualinspection.返修中产生:规范员工操作加强目检.smt表面安装技术缺陷第30页/10/1031NoSolder/无锡

Nosolder

to

the

land

or

termination

where

solderisrequired.焊点无锡smt表面安装技术缺陷第31页/10/1032NoSolder/无锡

Countermeasure/对策1.Missingprinting/漏印Rootcause:a)Stencilaperturewasjammed./钢网堵孔b)Highviscosityofsolderpaste./锡膏粘性过高Action:a)Cleanstencil;/清洗钢网b)Replacetherecycledpastewithfreshone./更换新锡膏c)Printingmachineparameteradjustment./校正丝印机参数2.Poorsolderabilityofcomponentorpad./元件或焊盘可焊性太低Rootcause:a)OlddatecomponentorPCB./陈旧元件或PCB板b)ContaminationoncomponentorPCB./元件或焊盘受污染Action:Purgethematerialforfurtherdisposition.

/去除来料3.Insufficientfluxvolume:increasefluxsprayrate(wavesolder).

助焊剂量不足:增加助焊剂喷射量(波峰焊接)4.Preheatexcess:lowerpreheattemperatureproperly(wavesolder).预热过分:适当降低预热温度(波峰焊)5.Chipwaveorsolderwaveheightislow:properheight(wavesolder).波峰高度过低:调整到适当高度(波峰焊)smt表面安装技术缺陷第32页/10/1033InsufficientSolder/少锡Insufficientsolder焊锡不足smt表面安装技术缺陷第33页/10/1034InsufficientSolder/少锡

Countermeasure/对策1.Stencilaperturecloggingcauseincompletesolderprinting):Automaticormanualcleanthestencil.钢网孔堵塞造成锡膏不完全印刷:自动或者手工清洗钢网2.Noenoughsolderpastevolume(PasteheightunderLCL):VisualinspectionandCpkcontrol.锡膏量不足(锡膏高度在LCL以下):目检和Cpk控制3.Solderpasteprintmisalignment:Finetuneprintingmachine锡膏印刷偏位:校正丝印机使之最优

4.PoorsolderabilityofcomponentorPCBpad:元件或PCB焊盘可焊性差a)Optimizereflowprofile.优化回流曲线b)Exchangethepoorsolderabilitycomponent.更换掉低可焊性元件5.Excessglueorgluemisalignment:Finetunescreenprint(wavesolder).点胶过多或点胶偏位:优化丝印参数6.Lessflux:Increasethefluxsprayonboardbeforeitpasswavesoldering(wavesolder).助焊剂不足:增加助焊剂喷射量

smt表面安装技术缺陷第34页/10/1035•Solderfilletextendsontothetopofthecomponentbody.焊锡接触元件体．ExcessSolder/多锡smt表面安装技术缺陷第35页/10/1036ExcessSolder/多锡

Countermeasure/对策1.Excesssolderpaste:锡膏量过多a).SolderpasteheightoutofUCL:Adjustprintingmachinetocontrolthepasteheight.锡膏高度超出UCL:校正丝印机控制锡膏高度b).Nonstandardofstencilapertureopening:standardizethestencilapertureopeningfordifferenttypecomponents.钢网开孔不标准:为不一样类型元件设置对应钢网开孔标准2.Wavesoldering/波峰焊接a)Lowconveyerramp,longwavesolderingtime:Adjustconveyorrampangleto5~7degreeandsolderingtimeto3~5second.

传送带角度过小,波峰焊接时间变长:校正传送带角度到5~7度,焊接时间3~5秒b)Highpreheattemperaturetodryofftheflux:Accordingtofluxspectocontrolthepreheattemperature,normallythePCBsurfacepreheattemperatureshouldbeunder100oC.高预热温度造成助焊剂过分挥发:按照助焊剂规格控制预热温度,通常,PCB表面温度普通低于100oCsmt表面安装技术缺陷第36页/10/1037WrongOrientation/Polarity反向,极性反

Correctpolarity/正