新产品开发整体流程介绍中英文课件

2023/7/23新产品开发整体流程介绍中英文Role&Responsibility

FunctionResponsibilityPM產品經理-ProductManager(或計畫專案經理-ProjectManager)為所負責計畫或產品線成敗之總負責人,將依產品線之性質指定專人負責某類產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的了解.並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場競爭策略,並在適當的時機推出適當之技術或產品.TMTMisresponsibletocoordinatetechnicalissuesconflictamongHW,SW,IDandMEanddecision-making.TMhastohandleallprojecttechnicalissues.

PCC為規劃推廣、連絡及控制專案進行的負責人,掌握專案進行之情況以協助處理異常狀況,使新產品能順暢切入工廠且如期推出,以提高產品競爭力.協助R&DRELEASE開發階段BOMCHANGENOTICE.R&DR&D包括電子部門及工業設計部門,若只寫HW(HardwareDesign)則指電子部門,若只寫ID(INDUSTRIALDESIGN)則指工業設計部門;包括ME,Thermal,Packingdesign.若只寫SW(Softwaredesign)則指軟體設計部門有負責BIOS,Driver及Pre-load不同工作性質之軟體開發功能.R&D人員負責產品之開發、設計、測試規劃，包括H/W、S/W及ID的開發、設計、提出新發明及著作權揭露書.

-WistronCaseRole&Responsibility

FunctionResponsibilityHW(HardwareDesign)*HardwareisresponsibleforElectronicEngineeringDesign*Co-workswithS/WandQTtomakesurethattheeveryfunctionworkswellaccordingtospec.*H/WshouldconducttechnicaltransfertoPE.*H/Wshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystem.SW(SoftwareDesign)*SoftwareisresponsibleforthedesignofBIOS,Driver,Utilities,andS/WPreload.*S/Wco-workswithH/WandQTtomakesurethateveryfunctionworkswellaccordingtothespecification.*S/WhastoreleasetheSCDandtheCert.TeamDocument.*S/WshouldconducttechnicaltransfertoTE.*S/Whastoinput/update/maintainthebugs/issuesinformationinthebugtrackingsystem.ID/ME(IndustrialDesign/MechanicalEngineering)*ID/MEisresponsibleforMechanicalEngineering,ThermalandPackingdesigns.*ID/MEshouldconducttechnicaltransfertoPME.*ID/MEshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystemused.-WistronCaseRole&Responsibility

FunctionResponsibilityPA(EMI/Safety,QT,CE/Reliability,PCB,OSCertification)為產品保證暨開發支援Function之總稱,主要負責根據MRS/PES執行各項產品之測試,諸如EMC/Safety:REGULATORYTEST,CE:RELIABILITYTEST及KEYCOMPONENTAPPROVAL,PCB:PCBLAYOUT,DC:BOM,OS:OS認證etc;…EMC/SafetyAllproductstomeetEMC/Safetyrequirementsandguaranteethelegalityintheinternationalmarketing.申請產品之安規、測試、Debug..QT為R&D轄下所屬之測試單位人員,主要負責各項產品之測試,諸如COMPATIBILITYTEST,SOFTWARETEST,S/WPRELOADTEST,DIAGNOSTICPROGRAMTEST,ETC.,CE/Reliability組件承認測試、不良品故障分析及其他附件等材料品質之管制及保證產品相關之可靠度與環境實驗，以及可靠度工程之研究與制定.PCBPCBLayout之申請、PCB之設計、Orcadlibrary&Mentorlibrary的建立與管理.信號品質CAE分析,PCBlayout外包廠商之管理，PCB製造廠商之管理.OSCertification執行公司各產品之OS相容性認證測試及LOGO申請.O.S.BetaSite測試PDM料號編碼及控管,BOM製作-WistronCaseRole&Responsibility

FunctionResponsibilityAM(AccountManager)1.爭取訂單與客戶合約協商.2.協調產品SPEC.工程變更SAMPLEAPPROVAL.3.適時反應市場需求與趨勢.MM(MaterialManagement)1.MMisresponsiblefornewsupplierdevelopment,partspurchasing2.Controllingmechanicaltoolingstatusincludingtheschedule,capacity,partsreadiness,concerns3.Managethedependencies,longlead-timeitems.4.MMalsoco-workswithSQMandCEforcomponentqualityimprovementandthekeycomponentQVLfinalversionSQM(SupplierQualityManagement)*零件品質管理及參與分包商之評鑑/管理(SQRCPlan/Status)*負責異常材料分析、追蹤與改善.*負責進行產品QVLCANDIDATEAPPROVAL作業系統ATmfg.

GCSD1.開發及推動全球客戶服務及支援計劃.2.各項售後服務及支援作業.3.參與Field品質改善作業(EWG)FI負責評估ProjectCost,決定Project是否可行以及Project所花費之Cost.

Legal合約及專利審核-WistronCaseRole&Responsibility

FunctionResponsibilityCFECFEactsonbehalfofWistronglobalmanufacturingoperationtodealwiththecustomer,andalsoactsasarepresentativeofthecustomerwhendealingwithinternalWistronteams.BasedontheC4/C5checklist,relatedreportsandprojectstatus,CFEisresponsibletoconcludetheexitjudgment(ReadyorNotready)duringC4/C5ExitmeetingstodeterminewhetheraproductcanmoveontoPDpilotrun/MPornotNPI1.負責規劃、協調、整合與提供各Site製造所需相關資訊與技術資料2.協調安排新產品轉移至海外生產工廠3.協調處理海外生產工廠發生之生產相關問題PE/PME1.產品設計審查,產品問題之發覺及產品移交.2.協助生產良率提昇,克服生產瓶頸,提高生產力.

3.協助訂定製造規格及引進新的製作技術,進行改善以確保產品品質.IE1.設計及管理一個高效率的整合製造系統.2.消除浪費、杜絕不合理，提高生產力

3.生產流程規劃、製程改善、標準工時製定

QA1.執行製程及產品之檢驗並反應品質報告請相關單位改善品質2.收集及處理市場及客戶品質回饋資料反應相關單位改善品質3.協助工程單位必要之驗證測試.

4.建立PCBA,FinalAssembly之檢驗標準QE1.執行DQA.FDI,MTBF,ORTTest2.執行產品開發過程之可靠度及環境測試(C4)3.協助工程測試驗證4.品質工程問題分析與解決-WistronCaseRole&Responsibility

FunctionResponsibilityPD(Production)PDhastoworkwithPE,PMEandIErespectivelytogettestingequipment&tools,assemblytools,andSOPreadybeforeC5Exit.PDisresponsibletoproducetheproduct.PDisnotjustforefficiencyonlybutalsoquality.PSE(ProcessEngineer)PSEisresponsibleforSMTprocessandforreleasingtheSMTpilotrunreport.PSEisalsoresponsiblefortheprocesscontinuousimprovement(CIP).FAE(FailureAnalysisEngineer)orREFAEisresponsibleforissuingthefailureanalysisreportandforwardingthistorelateddepartmentsforproductqualityimprovement.FAEisalsoresponsibleforpreparingrepairSOPifapplicable.TETEisresponsibleforprovidingandmaintainingTestPlanandTestProgram.TEalsoimplementallthepreloadtoproductionlineandreporttheproblemsrelatedtopreloadtopreloadteam.PMC/GPMC(PlanMaterialControl/GlobalPlanMaterialControl)GPMC/PMCisresponsibleforproductfulfillment,finalshippingmodel,supplysiteandcapacityplan,andrampupplanforallsites.-WistronCaseWistronC-SystemQualityControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseProductionPilot-runPhaseMassProductionPhaseC0C1C2C3C4C5CheckPointWistronC-PhaseNPIFDI/MTBFDQA/PQC/FQCCompatibility/DiagnosticSimulationTestLayout&drawing-SignalIntegrity-DFXCheck-AVL-C-TestPlansReliability/StressEMI/SafetyOS&Pre-LoadWIH/WPH/WZS/WKSMRSCheck-ServiceCostEstimate-Simulation-DesignPeerReview-LessonsLearnedAvailabilityDevelopPlanLaunchFAI&SPCMTBFDemoCIP/CLCAParetoAnalysisEWGReadyAFRTestReportsPre-QVLReadyDiagnosticsProgramBugList&ActionDCN/ECN/ECRFAIreportPFMEASQRCTrainingMTBFReviewQMP/QPA/QSAFPYRPPAPServiceability

DesignTestPlansIntegrateDesignReviewSignalQualityDFXIndexInitialSupplierAuditMemorandumDFMEASimulationMTBFEstimateMVPConcept/ProposalMRSDefinitionScopeSCEInvestigation&ProposalDesign&SourcingIntegrationValidationReleaseProductLifeCycleMDRR/C4Go/NoGo?MRR/C5Go/NoGo?C6OOB/OBAORT/StressEWG/FQHAFR/DOANewCSystemArchitectureProgressC0ExitC0ActivityC0EntryC1ExitC1ActivityC1EntryC2ExitC2ActivityC2EntryC3ExitC3ActivityC3EntryC4ExitC4ActivityC4EntryC5ExitC5ActivityC5EntryC6ExitC6ActivityC6EntryTimeDetailActivitiesSubjectScopeDefinitionProcedure….ActivitiesDefinitionRecord&ReportFormatDefinitionEscalationRuleMeasurementStandardProjectManagement&SystemMaintenanceNewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meeting C1meetingPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC0ChecklistMRSC0/PMC0Meeting 階段C0構想階段(ProposalPhase)負責單位計畫經理(ProjectManager)或產品經理(ProductManager)目的*確訂提案構想或市場需求規格書(MRS)*可行性分析工作重點

*相關提案之市場資料搜集*相關提案之關鍵技術資料搜集*R&D提出技術可行性分析*PM執行可行性及效益評估審核會議C0目的評估是否成立專案計畫，進行研發檢核項目計畫提案書或市場需求規格書(MRS)C0-工作重點及檢核項目NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meeting C1meeting PMC0ChecklistMRSC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC1/PMC1Meeting C1-工作重點及檢核項目階段C1規劃階段(PlanningPhase)負責單位計畫經理(ProjectManager)或產品經理(ProductManager)目的*規格的擬訂

*專案組織的成立*專案時程的規劃工作重點

*選任技術經理(TechnicalManager,簡稱TM)並成立專案組織*計畫專案經理(ProjectManager)或產品經理，規劃專案時程*召開C1審核會議*法務確認LegalConcern、如PotentialPatentList,InventionDisclosure*成立專案團隊審核會議C1目的成立專案團隊、確定開發時程檢核項目TimeScheduleProjectTeamInventionDisclosureGreenDesignCheckListSampleRequestForm

Case-bottleCocainEngland開採鋁礦一噸鋁土提鍊半噸氧化鋁半小時加工半噸氧化鋁熔煉成1/4噸金屬鋁再加工二週成鋁錠瑞典或梛威熔爐工廠澳大利亞澳大利亞化學還原工廠加熱至華氏900度壓延成1/8inch薄片瑞典和德國壓延廠船運一個月冷軋成1/80inch薄片冷軋廠英國易開罐廠成型，清洗，烘乾，防鏽裝填，印刷英國可樂廠消費鋁罐回收儘16%EcologicalRucksack(生態包袱)生產一片半導體晶片所產生之廢料為產品重量之十萬倍生產一台筆記型電腦所產生之廢料為產品重量之四千倍生產一公升佛羅里達橘子汁需要兩公升汽油及一千公升之水生產一噸紙需用掉九十八噸之其他資源

資料來源:綠色資本主義─天下出版社EURoHSDirective指令期程2003.01.27指令發布2003.02.13歐盟公報發行,指令生效2004.08.13轉為會員國當地法律,法規或行政指令2006.07.01新投入之產品不得含有禁用物質指令要求/禁用項目鉛(Pb)鎘(Cd)汞(Hg)六價鉻(Cr6+)多溴聯苯(PBB)多溴化二苯乙醚(PBDE)(Therestrictionoftheuseofcertainhazardoussubstancesinelectricalandelectronicequipment)EURoHS管制規格SubstancesE.U.建議值Lead(Pb)鉛;銲錫1000PPMLead(Pb)鉛;塑膠,線材,塗料1000PPMCadmium(Cd)鎘100PPMMercury(Hg)汞1000PPMHex.Chromium(Cr6+)六價鉻1000PPMPBB(聚溴聯苯)1000PPMPBDE(聚溴二苯醚)1000PPM重金屬：汞、鉛、鎘、六價鉻溴性耐燃劑：聚溴聯苯(PBBs)、溴聯苯醚(PBDEs)註：另有管制規範外的項目EUWEEEDirectiveDirective2002/96/EC期程2003.01.27指令發布2003.02.13歐盟公報發行，指令生效2004.08.13轉為會員國當地法律,法規或行政指令2005.08.13完成回收系統建構,製造商因應回收之

財務規劃就緒2006.12.31回收再利用率達每人每年4kg2008.12.31訂定下階段目標回收TargetofRecoveryandRecycling(WasteElectricalandElectronicEquipment)WEEECategory

Largehouseholdappliances

Smallhouseholdappliances

IT&telecommunicationsappliances

Consumerequipment

Lightingequipment

Electricalandelectronictools

Toys,leisure&sportsequipment

Medicaldevices

Monitoringandcontrolinstruments

Automaticdispensers

RateofRecovery

RateofRecycling

80%

75%

70%

50%

75%

65%

75%

65%

70%

50%

70%

50%

70%

50%

*

*

70%

50%

80%

75%

*Tobedeterminedby31December2006

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationC2/PMC2Meeting C2-工作重點及檢核項目階段C2設計階段(R&DDesignPhase)

負責單位技術經理(TechnicalManager)研發部門目的*軟、硬體、機構設計

*証實設計可行性*修正軟、硬體、機構規格工作重點

*電路設計並完成電路圖*機構設計並完成機構設計圖*機電整合設計並完成機電介面設計*軟體設計並完成初步版本*電路設計Review*機構設計Review*機電整合設計Review*建立初步之測試計畫(硬體、軟體、機構)審核會議C2目的*確定計畫規格*檢討設計階段之工作成效*決定是否進入樣品試作*查核是否發出專利之申請檢核項目Schematics(Preliminary)S/WSpecificationMechanical&ThermalTestPlanInventionDisclosureInventionDisclosureNewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/ArtworkpackingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreviewC3/PMC3Meeting C3-工作重點及檢核項目階段C3樣品試作階段(LabPilotRunPhase)

負責單位技術經理(TechnicalManager)研發部門目的*設計驗證

*依測試結果修改、變更設計工作重點

*樣品試作材料準備*樣品試作*針對樣品進行測試及驗證*搜集Project成本資料*擬定C3品質量化目標*機構設計問題檢討及除錯(Debug)，測試報告檢討*電路設計問題檢討及除錯(Debug)，測試報告檢討*軟體設計問題檢討除錯(Debug)，測試報告檢討*法務-稽核文件之形成要件是否符合法定要件或工程規範-專利著作權、商標等智慧財產權之申請準備

審核會議C3目的檢討樣品測試驗證之結果、並決定是否進入工程試作階段檢核項目*HWdesignverificationreport*Microprocessor/EEPROMdatalisting*Mechanicaltestreport*SWfunctionverificationtestreport*MechanicalDrawing(Preliminary)*C3TestReport*C4TestPlan

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreportPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2checklistPESEMC/Safety

RequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodule

specificationPMNPIC0C1C2C3C4C5C6C6meetingGCSDC6checklistProductphase

outnoticeC4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticreleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistC4/PMC4Meeting WistronMobileReliabilityTestPlanEnvironmentThermalProfileTestTemperatureandHumidityTestVibration,Shock,DropTestsAltitudeTest,AcousticsTestsMTBFPrediction

EMCLightning/SurgeTestVoltageDipTestEFT,ESDTestHarmonicTestIEC1000-4-XXEMI/EMSPowerLineInterferenceLineVoltage/FrequencyTestPowerSurgeTestVoltageDipandInterruptionPowerOn/OffTestEFT/BImmunityTestComplexMarginTestTransportationVibrationTestAltitudeTestShockTestDropTestUser

InclineOperationTestBenchHandlingTestPowerSavingTestPressureTestAudioQualityTortureTestReliabilityTest–LCDModuleWistronMobileReliabilityTestPlanItemTestConditionSampleSizeTimeResultHighTemp/HighHumidOp50℃80%RHDynamin20500HoursPassLowTempOp0℃,Dynamic5500HoursPassHighTempOp60℃,Dynamic10500HoursPassHighTemp/HighHumidstorage60℃,90%RH,Storage2240HoursPassLowTempstorage-20℃,Storage2240HoursPassT/C(Non-Op)-20℃(30Min)~60℃(30Min),Storage3100cyclePassAltitudetestOperating&Storage272HoursPassELP-20℃,Dynamic5072HoursPassVibration(Non-Op)5~500Hz,0.37Oct/min,1.5G,X/Y/Z3-PassShock(Non-Op)180G,2msec,HalfSine,±X,±Y,±Z3-PassBoxVibration5~500Hz,1.0G,0.5Oct/min15-PassBoxDrop76㎝drop15-PassESDOperatingTop_Case:±12kVPanelⅠ:±15kVPanelⅡ:±15kV5-PassNon-OperatingUserconnector:±2kVBottomcover:±12kV5-PassPanel(ref)±3kV5-PassPush5kgf(resultAfter24Hours)2-PassImageStickingMosaicPattern(8X6)104HoursPassWistronMobileReliabilityTest-LCDC4-工作重點及檢核項目階段C4工程試作階段(ENGPilotRunPhase)

負責單位技術經理(TechnicalManager)研發部門工程部門目的*工程試作與驗證

*依驗證結果改善設計*準備技術資料以便技術移轉、授權或移轉技術至相關生產單位工作重點

完成系統軟體或應用軟體之設計、測試及除錯提出軟體之程式碼(SourceCode)正式發出電路圖(Schematics)、料表清單(BOM)及已驗證料表供應商清單(QVL)進行工程試作階段之測試、驗證及除錯並提出測試驗證報告提出工程試作階段之試作報告及改善建議完成生產或技術移轉所需之相關測試程式及程序法務﹕完成專利、著作權、商標申請

審核會議C4目的檢討工程試作結果，並決定是否進入試產階段完成各項技術移轉或生產所需之文件，並進行系統殘留問題之檢討與對策驗證檢核項目*S/WFirmwarerelease*BOM*MEENGP/Rreport*EEENGP/Rreport*TestProgram*PCBartwork*C4Testreport*Schematics*SWsourcecode*Transferplan

NewCSystemProductDevelopmentProposalPhasePlanningPhaseR&D

DesignPhaseLabPilotRunPhaseEng.PilotRunPhaseProductionPilotrunPhaseMassproductionphaseC2meeting

C3meeting C4meeting C5meeting

C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytest

report(prel.)ME/Artwork

/packingdrawingPAL/ROM

datalistingC3manufacturability

reviewreportSampleapprove

status&buglist

reviewC4checklistBOMQVLTimestandardSystemBIOS/KBC

FWreleaseS/WDriver/AP/

Utility/Diagnostic

ReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslistPMPMC0meeting C1meeting PMC0ChecklistMRSPMC1checklistInvention

disclosureTimescheduleProjectteamModelnumber

defineGreendesign

guideandreview

checklistNonQVL/Sample

approvalrequestformC2c