半导体智能制造探索之路课件

Exploringtheway

tosmart

manufacturinginSemiconductor

industry半导体智能制造探索之路ExploringthewaytoinSemiconAgenda:IntroductionChallengeswewere/arefacingRoadmaptosmart

manufacturingWhatweare

nowNext

JourneyQ&AAgenda:IntroductionIntroductionAStorageSolutions

LeaderInastrongstrategicpositiontoleadglobal

evolutionofbroad-basedand

changingstorage

industryBroadstorageportfolio,includingHDDs,

SSDs,embeddedandremovableflashmemory,andstorage-related

systems17,000+activepatents

worldwideVerticallyintegratedbusinessmodel

tomaximizeoperational

efficiencyConsistentprofitableperformance,

strongfreecash

flowIntroductionAStorageSolutionBroadestPortfolioofProducts&

SolutionsBroadestPortfolioofProductsGlobal

OperationsGlobalOperationsOurManufacturing

ProcessWaferKGDDPAssemblyTestRetailOurManufacturingProcessWaferChallengeswewere/are

facingR&DKaizenChangeCostGlobalizeFlexibilityInnovationTime

tomarketDFMEquipmentConnectCustomizeAdoptSpeedVolumeQuality

&DeliveryLaborMaterialBig

DataStandardChallengeswewere/arefacingRRoadmapPhase

3Foundation

systemsMESERPPDMSPASMBOPhase

2Phase

1DigitalizationEAPRMSSPCYMSCIMWafer/Cell

MapLights

OffPT/SDTRTD(AM)ARVARSE-FormBig

DataPhase

4Smart

FactoryData

VirtualizationBig

DataEdge

computingEdge

AnalyticsB2BAPC(FDC/R2R)AIRoadmapPhase3FoundationsysteWhatweare

nowAchievement:LightOff

productionAutoWhatwearenowAchievement:3LayerFactory

Systems3LayerFactorySystemsSiemensCamstarSemiconductor

SuiteSiemensCamstarSemiconductorSiemensCamstarSemiconductorSuitemoduleImplemented

-1Product

ManagementProduct

DefinitionProcessSpec&BOM

ListBins&Grades

MappingProcess

ManagementProcessSpecs,Workflows,Specs,

Operations,Parameters,ReasonCodes,Limits,TimeWindow,MaskLayers,

etc.Recipe,Equipment,ToolandParameter

MatrixesforeaseofWorkflowandProcesscontrolsandmanagement.DefinesMulti-Processes/In-LineWIP

trackingModels,forSerialandParallel

processSupplementaryProcess

SpecCalendar

ManagementCalendar,

HolidaysShiftsSecurity

ManagementRole&User

DefinitionUser

AuthenticationSetupAccess,AttributeAccess,UserGroupAccess,Service

RulesMask/Film

ManagementMask,MaskSet,Mask

LayerProcessSpec-MaskLayer

AssociationMaintenanceManagement(Date-,

RecurringDate-,Throughput-based)on

MaskEquipment

ManagementEquipment

ClusteringEquipment-Tool

AssociationMaintenanceManagement(Date-,RecurringDate-,Throughput-based)onEquipment,

ToolJobsModel,State

ModelParts

ManagementPartInventory(Stock),Part

Preparation,WithdrawalRequest,Expiry

ControlMaintenance

ManagementJobsModel,State

ModelSiemensCamstarSemiconductorSiemensCamstarSemiconductorSuitemoduleImplemented

-2Material&Inventory

ControlMaterialLotCreateInventoryLocations&

MovementBOM-Material

DefinitionInter-factoryinventory

movementStaging,FG

locationsWIPPrepare,Start,Finish

(Schedule)Sourcefrommultiorpartialsource

lotsSourceInventory

ConstraintSupplementaryProcessSpec

assignmentOrder

associationCancellation,

modificationWIP&Equipment

TrackingMove-In/Out,Track-In/Outtracking(readyforEAP)Multiple

EquipmentReject/Scrap

recordingRescreen,

VariancePanel-Level,Single-Strip,PieceBatch(multi-lot)

transactionBinSplit&product

changeTracking

TypesLotand/orPanel,StripLevel

TrackingSort/Probe,BackGrind,Assembly

(Carrier,Sub-Lot,MotherLot),Test,FinalTest,PackCarrier

TrackingMulti-levelCarrierandType

ConfigurationFullhistorywithlotand

equipmentassociationfor

traceabilityCarrierSlot

MappingPanelIDs,StripScribeIDs,

SlotPositioningSupportMulti-lotsin

CarrierCarrier/LotSplittingandMergingManualor

AutomationGenealogyLotSplit&

CombineFulltrackingandhistoryforgenealogytracing.SiemensCamstarSemiconductorSiemensCamstarSemiconductorSuitemoduleImplemented

-3Data

CollectionEntry

enforcementPre-/In-/Post-

ProcessLot,Itemor

EquipmentService

attributesPanelSite,LocationorQuadrant

forDefectsBinandReject

RecordingProcess&Yield

ControlTimeWindowsBinning,Rejects,Combinationor

Overall- Bypercentageor

lot-size/quantityAutotrigger

exceptionDispatch

ControlLotSelection

HelperLotSelection

PrioritizationAll-In-1Operation

UIsMove-In,Track-In,Track-Outor

Move-OutDataCollection,DocumentViewingandmoreMultiflavors:EquipmentCentricorEquipmentType/Module

DispatchingProcess

AbilityConfigurablerequiredProcessAbilitiesforRecipeAssignmentofProcessAbilitiestoEquipment/ChildEquipmentFlexibleControlofEquipmentAbilitiesdependingonchamber/sink/unitabilitiesaswellasEquipmenthealth

andconditioningContamination

ControlConfigurableCarrier

TypesEquipment/ChildEquipmentFlagsFlexibleBusinessRulesforContaminationFlagsinheritanceand

ControlSiemensCamstarSemiconductorSiemensCamstarSemiconductorSuitemoduleImplemented

-4SPCEquipmentandtransaction

basedExceptiontriggersaction

planEmail

notificationHold

LotEquipment

DownOCAP

DocumentSPCMatrixallows1SetuptobeusedformanycombinationsofProductandEq